IT8667613A0 - Lega di rame cromo titanio silicio - Google Patents

Lega di rame cromo titanio silicio

Info

Publication number
IT8667613A0
IT8667613A0 IT8667613A IT6761386A IT8667613A0 IT 8667613 A0 IT8667613 A0 IT 8667613A0 IT 8667613 A IT8667613 A IT 8667613A IT 6761386 A IT6761386 A IT 6761386A IT 8667613 A0 IT8667613 A0 IT 8667613A0
Authority
IT
Italy
Prior art keywords
silicon alloy
titanium silicon
copper chromium
chromium titanium
copper
Prior art date
Application number
IT8667613A
Other languages
English (en)
Other versions
IT1195108B (it
Inventor
Wolfgang Durrschnabel Fr Stuer
Max Bletschacher
Original Assignee
Wieland Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3527341A external-priority patent/DE3527341C1/de
Application filed by Wieland Werke Ag filed Critical Wieland Werke Ag
Publication of IT8667613A0 publication Critical patent/IT8667613A0/it
Application granted granted Critical
Publication of IT1195108B publication Critical patent/IT1195108B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
IT67613/86A 1985-07-31 1986-07-30 Lega di rame cromo titanio silicio IT1195108B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3527341A DE3527341C1 (de) 1985-07-31 1985-07-31 Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung

Publications (2)

Publication Number Publication Date
IT8667613A0 true IT8667613A0 (it) 1986-07-30
IT1195108B IT1195108B (it) 1988-10-12

Family

ID=6277213

Family Applications (2)

Application Number Title Priority Date Filing Date
IT8653710U IT8653710V0 (it) 1985-07-31 1986-07-30 Lega di rame cromo titanio silicio
IT67613/86A IT1195108B (it) 1985-07-31 1986-07-30 Lega di rame cromo titanio silicio

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IT8653710U IT8653710V0 (it) 1985-07-31 1986-07-30 Lega di rame cromo titanio silicio

Country Status (7)

Country Link
US (1) US4678637A (it)
JP (1) JPS6260837A (it)
CH (1) CH669211A5 (it)
FR (1) FR2585727B1 (it)
GB (1) GB2178448B (it)
IT (2) IT8653710V0 (it)
SE (1) SE458450B (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3527341C1 (de) * 1985-07-31 1986-10-23 Wieland-Werke Ag, 7900 Ulm Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung
DE19600864C2 (de) 1996-01-12 2000-02-10 Wieland Werke Ag Verwendung einer Kupfer-Chrom-Titan-Silizium-Magnesium-Legierung
GB2316685B (en) * 1996-08-29 2000-11-15 Outokumpu Copper Oy Copper alloy and method for its manufacture
ES2142747B1 (es) * 1998-03-05 2000-12-16 Farga Lacambra S A Cobre poli-microaleado con elevada conductividad electrica y propiedads termicas y mecanicas superiores a las de las aleaciones base cobre convencionales.
US6749699B2 (en) 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
TWI502696B (zh) * 2010-02-06 2015-10-01 Ind Tech Res Inst 接合結構及其製造方法
JP5818724B2 (ja) * 2011-03-29 2015-11-18 株式会社神戸製鋼所 電気電子部品用銅合金材、めっき付き電気電子部品用銅合金材
JP5867859B2 (ja) * 2012-02-24 2016-02-24 株式会社神戸製鋼所 銅合金
WO2013125623A1 (ja) * 2012-02-24 2013-08-29 株式会社神戸製鋼所 銅合金
JP5867861B2 (ja) * 2012-03-27 2016-02-24 株式会社神戸製鋼所 銅合金
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
JP5952726B2 (ja) * 2012-12-10 2016-07-13 株式会社神戸製鋼所 銅合金
JP5981866B2 (ja) * 2013-03-27 2016-08-31 株式会社神戸製鋼所 銅合金
JP6133178B2 (ja) * 2013-09-06 2017-05-24 古河電気工業株式会社 銅合金板材およびその製造方法
JP2016211054A (ja) * 2015-05-12 2016-12-15 株式会社神戸製鋼所 銅合金

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1930956A (en) * 1933-01-18 1933-10-17 Hazeltine Reginald Acid resisting alloy
US2086604A (en) * 1935-05-17 1937-07-13 Titanium Alloy Mfg Co Copper-titanium-silicon alloys
US2189198A (en) * 1938-06-28 1940-02-06 Titanium Alloy Mfg Co Copper-titanium alloy
GB522008A (en) * 1938-11-28 1940-06-06 Mallory Metallurg Prod Ltd Improvements in and relating to the production of copper base alloys
US2212017A (en) * 1940-01-05 1940-08-20 Fletcher James Cuprous alloy
US3072508A (en) * 1961-02-15 1963-01-08 Ampco Metal Inc Method of heat treating copper base alloy
DE1533179A1 (de) * 1966-06-08 1970-02-19 Battelle Institut E V Warmfeste und verschleissbestaendige Kupferlegierung hoher Leitfaehigkeit fuer Elektrizitaet und Waerme
US4007039A (en) * 1975-03-17 1977-02-08 Olin Corporation Copper base alloys with high strength and high electrical conductivity
JPS59145745A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS59145746A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS60181250A (ja) * 1984-02-28 1985-09-14 Mitsubishi Metal Corp 半導体機器のリ−ド材用銅合金

Also Published As

Publication number Publication date
JPH057450B2 (it) 1993-01-28
FR2585727B1 (fr) 1988-06-17
GB2178448B (en) 1988-11-02
FR2585727A1 (fr) 1987-02-06
CH669211A5 (de) 1989-02-28
SE8603194L (sv) 1987-02-01
SE8603194D0 (sv) 1986-07-23
IT1195108B (it) 1988-10-12
JPS6260837A (ja) 1987-03-17
SE458450B (sv) 1989-04-03
IT8653710V0 (it) 1986-07-30
GB2178448A (en) 1987-02-11
US4678637A (en) 1987-07-07
GB8615133D0 (en) 1986-07-23

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970530