IT8721109A0 - Elemento di quarzo fuso da impiegare nella fabbricazione di semiconduttori. - Google Patents

Elemento di quarzo fuso da impiegare nella fabbricazione di semiconduttori.

Info

Publication number
IT8721109A0
IT8721109A0 IT8721109A IT2110987A IT8721109A0 IT 8721109 A0 IT8721109 A0 IT 8721109A0 IT 8721109 A IT8721109 A IT 8721109A IT 2110987 A IT2110987 A IT 2110987A IT 8721109 A0 IT8721109 A0 IT 8721109A0
Authority
IT
Italy
Prior art keywords
felted
semiconductors
manufacturing
quartz element
quartz
Prior art date
Application number
IT8721109A
Other languages
English (en)
Other versions
IT1205214B (it
Inventor
Peter Paul Bihuniak
Gordon Ernest Dogunke
Robert Ducan Shelley
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8721109A0 publication Critical patent/IT8721109A0/it
Application granted granted Critical
Publication of IT1205214B publication Critical patent/IT1205214B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • C03B19/066—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction for the production of quartz or fused silica articles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
    • C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C11/00—Multi-cellular glass ; Porous or hollow glass or glass particles
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10—Crucibles or containers for supporting the melt
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10—Crucibles or containers for supporting the melt
    • C30B15/12—Double crucible methods
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
    • C30B35/002—Crucibles or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/90—Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032—Seed pulling
    • Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Glass Melting And Manufacturing (AREA)
IT21109/87A 1986-07-24 1987-06-30 Elemento di quarzo fuso da impiegare nella fabbricazione di semiconduttori IT1205214B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/889,142 US4911896A (en) 1986-07-24 1986-07-24 Fused quartz member for use in semiconductor manufacture

Publications (2)

Publication Number Publication Date
IT8721109A0 true IT8721109A0 (it) 1987-06-30
IT1205214B IT1205214B (it) 1989-03-15

Family

ID=25394578

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21109/87A IT1205214B (it) 1986-07-24 1987-06-30 Elemento di quarzo fuso da impiegare nella fabbricazione di semiconduttori

Country Status (5)

Country Link
US (2) US4911896A (it)
JP (1) JPS6355190A (it)
KR (1) KR930005016B1 (it)
DE (1) DE3723810A1 (it)
IT (1) IT1205214B (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676274B2 (ja) * 1988-11-11 1994-09-28 東芝セラミックス株式会社 シリコン単結晶の製造装置
JP2830987B2 (ja) * 1994-07-19 1998-12-02 信越石英株式会社 石英ガラスルツボ及びその製造方法
JP3011866B2 (ja) * 1994-11-30 2000-02-21 信越石英株式会社 枚葉式ウエーハ熱処理装置
US5651827A (en) * 1996-01-11 1997-07-29 Heraeus Quarzglas Gmbh Single-wafer heat-treatment apparatus and method of manufacturing reactor vessel used for same
JP4285788B2 (ja) * 1996-03-14 2009-06-24 信越石英株式会社 単結晶引き上げ用大口径石英るつぼの製造方法
DE19723070A1 (de) * 1997-06-02 1998-12-03 Siemens Ag Vorrichtung und Verfahren zum Schmelzen und Kristallisieren von Stoffen
US5913975A (en) * 1998-02-03 1999-06-22 Memc Electronic Materials, Inc. Crucible and method of preparation thereof
US6183553B1 (en) * 1998-06-15 2001-02-06 Memc Electronic Materials, Inc. Process and apparatus for preparation of silicon crystals with reduced metal content
TW505710B (en) * 1998-11-20 2002-10-11 Komatsu Denshi Kinzoku Kk Production method for silicon single crystal and production device for single crystal ingot, and heat treating method for silicon single crystal wafer
US6187089B1 (en) * 1999-02-05 2001-02-13 Memc Electronic Materials, Inc. Tungsten doped crucible and method for preparing same
AUPR054000A0 (en) * 2000-10-04 2000-10-26 Austai Motors Designing Pty Ltd A planetary gear apparatus
JP4300333B2 (ja) * 2002-03-14 2009-07-22 ジャパンスーパークォーツ株式会社 リング状アークによる石英ガラスルツボの製造方法と装置およびその石英ガラスルツボ
JP4300334B2 (ja) * 2002-08-15 2009-07-22 ジャパンスーパークォーツ株式会社 石英ガラスルツボの再生方法
US6879777B2 (en) 2002-10-03 2005-04-12 Asm America, Inc. Localized heating of substrates using optics
US6720531B1 (en) 2002-12-11 2004-04-13 Asm America, Inc. Light scattering process chamber walls
US20050120945A1 (en) * 2003-12-03 2005-06-09 General Electric Company Quartz crucibles having reduced bubble content and method of making thereof
US7993556B2 (en) * 2007-08-08 2011-08-09 Heraeus Shin-Etsu America, Inc. Method for making a silica glass crucible
DE102008061871B4 (de) * 2008-12-15 2012-10-31 Heraeus Quarzglas Gmbh & Co. Kg Schmelztiegel für den Einsatz in einem Tiegelziehverfahren für Quarzglas
US9957431B2 (en) * 2013-11-11 2018-05-01 Heraeus Quarzglas Gmbh & Co. Kg Composite material, heat-absorbing component, and method for producing the composite material
US20260028745A1 (en) * 2024-07-25 2026-01-29 Globalwafers Co., Ltd. Crucibles with transmission modification and methods for using such crucibles

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370921A (en) * 1965-11-22 1968-02-27 Frank E. Wagstaff Crystallization resistant vitreous silica formed by the addition of silicon to silica
DE1544292C3 (de) * 1966-06-13 1976-01-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen stabförmiger Siliciumeinkristalle mit über die gesamte Stablänge homogener Antimondotierung
US3472667A (en) * 1966-07-06 1969-10-14 Frank E Wagstaff Elemental boron-containing vitreous silica bodies and method
US3776809A (en) * 1968-02-22 1973-12-04 Heraeus Schott Quarzschmelze Quartz glass elements
US3615261A (en) * 1969-04-02 1971-10-26 Motorola Inc Method of producing single semiconductor crystals
BE788026A (fr) * 1971-08-26 1973-02-26 Siemens Ag Procede et dispositif d'introduction dirigee de matieres de dopage dansdes cristaux semiconducteurs lors d'une fusion par zones sans creuset
DE2336234A1 (de) * 1973-07-17 1975-01-30 Licentia Gmbh Anordnung und verfahren zum ziehen eines einkristalls
US4207293A (en) * 1974-06-14 1980-06-10 Varian Associates, Inc. Circumferential error signal apparatus for crystal rod pulling
US4010064A (en) * 1975-05-27 1977-03-01 International Business Machines Corporation Controlling the oxygen content of Czochralski process of silicon crystals by sandblasting silica vessel
CH613129A5 (it) * 1975-06-11 1979-09-14 Prolizenz Ag
US4042361A (en) * 1976-04-26 1977-08-16 Corning Glass Works Method of densifying metal oxides
US4033780A (en) * 1976-04-26 1977-07-05 Corning Glass Works Method of enhancing the refractoriness of high purity fused silica
US4033870A (en) * 1976-07-01 1977-07-05 J. I. Case Company Dual oil filter automatic switching system
US4116642A (en) * 1976-12-15 1978-09-26 Western Electric Company, Inc. Method and apparatus for avoiding undesirable deposits in crystal growing operations
US4221754A (en) * 1977-12-29 1980-09-09 Nowak Welville B Method for producing solid ribbons
US4238274A (en) * 1978-07-17 1980-12-09 Western Electric Company, Inc. Method for avoiding undesirable deposits in crystal growing operations
DE2928089C3 (de) * 1979-07-12 1982-03-04 Heraeus Quarzschmelze Gmbh, 6450 Hanau Verbundtiegel für halbleitertechnologische Zwecke und Verfahren zur Herstellung
DE3014311C2 (de) * 1980-04-15 1982-06-16 Heraeus Quarzschmelze Gmbh, 6450 Hanau Verfahren zur Herstellung von Quarzglastiegeln und Vorrichtung zur Durchführung dieses Verfahrens
US4515755A (en) * 1981-05-11 1985-05-07 Toshiba Ceramics Co., Ltd. Apparatus for producing a silicon single crystal from a silicon melt
US4478676A (en) * 1982-09-07 1984-10-23 Litton Systems, Inc. Method for decreasing radial temperature gradients of crystal growth melts utilizing radiant energy absorptive materials and crystal growth chambers comprising such materials
JPS5957986A (ja) * 1982-09-24 1984-04-03 Sumitomo Electric Ind Ltd 単結晶引上方法

Also Published As

Publication number Publication date
JPS6355190A (ja) 1988-03-09
US4911896A (en) 1990-03-27
KR930005016B1 (ko) 1993-06-11
DE3723810A1 (de) 1988-01-28
IT1205214B (it) 1989-03-15
US5308446A (en) 1994-05-03
KR880002244A (ko) 1988-04-29

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