IT8919242A0 - Processo e apparecchiatura per tagliare le barre di semiconduttori in rondelle con almeno una superficie piana. - Google Patents

Processo e apparecchiatura per tagliare le barre di semiconduttori in rondelle con almeno una superficie piana.

Info

Publication number
IT8919242A0
IT8919242A0 IT8919242A IT1924289A IT8919242A0 IT 8919242 A0 IT8919242 A0 IT 8919242A0 IT 8919242 A IT8919242 A IT 8919242A IT 1924289 A IT1924289 A IT 1924289A IT 8919242 A0 IT8919242 A0 IT 8919242A0
Authority
IT
Italy
Prior art keywords
washers
equipment
flat surface
cutting semiconductor
semiconductor bars
Prior art date
Application number
IT8919242A
Other languages
English (en)
Other versions
IT1228021B (it
Inventor
Hubert Hinzen
Original Assignee
Ubere Bayreuther Strabe Nurnbe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ubere Bayreuther Strabe Nurnbe filed Critical Ubere Bayreuther Strabe Nurnbe
Publication of IT8919242A0 publication Critical patent/IT8919242A0/it
Application granted granted Critical
Publication of IT1228021B publication Critical patent/IT1228021B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/547—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9317—Endless band or belt type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IT8919242A 1988-02-17 1989-01-30 Processo e apparecchiatura per tagliare le barre di semiconduttori in rondelle con almeno una superficie piana. IT1228021B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3804873A DE3804873A1 (de) 1988-02-17 1988-02-17 Verfahren und vorrichtung zum zerteilen von halbleiter-barren in halbleiter-ronden mit zumindest einer planen oberflaeche

Publications (2)

Publication Number Publication Date
IT8919242A0 true IT8919242A0 (it) 1989-01-30
IT1228021B IT1228021B (it) 1991-05-27

Family

ID=6347558

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8919242A IT1228021B (it) 1988-02-17 1989-01-30 Processo e apparecchiatura per tagliare le barre di semiconduttori in rondelle con almeno una superficie piana.

Country Status (8)

Country Link
US (1) US4967725A (it)
JP (1) JPH029564A (it)
KR (1) KR890013718A (it)
CH (1) CH677627A5 (it)
DE (1) DE3804873A1 (it)
FR (2) FR2627113A1 (it)
GB (1) GB2216441B (it)
IT (1) IT1228021B (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9001537U1 (de) * 1990-02-12 1990-04-19 Baumunk, Heinz, 6147 Lautertal Vorrichtung für die Steinbearbeitung
DE4134110A1 (de) * 1991-10-15 1993-04-22 Wacker Chemitronic Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens
DE4136566C1 (it) * 1991-11-07 1993-04-22 Gmn Georg Mueller Nuernberg Ag, 8500 Nuernberg, De
US6067976A (en) * 1994-01-10 2000-05-30 Tokyo Seimitsu Co., Ltd. Wafer cut method with wire saw apparatus and apparatus thereof
US5553429A (en) * 1994-08-10 1996-09-10 Schuster; Jerry W. Bi-directional building arrangement
JP3055401B2 (ja) * 1994-08-29 2000-06-26 信越半導体株式会社 ワークの平面研削方法及び装置
US5609148A (en) * 1995-03-31 1997-03-11 Siemens Aktiengesellschaft Method and apparatus for dicing semiconductor wafers
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
DE102006020824B3 (de) * 2006-05-04 2007-06-28 Siltronic Ag Verfahren zum Trennläppen eines Werkstückes
US7406905B2 (en) * 2006-07-28 2008-08-05 Oceaneering International, Inc System for driving a wire loop cutting element
KR101580924B1 (ko) * 2009-08-25 2015-12-30 삼성전자주식회사 웨이퍼 분할 장치 및 웨이퍼 분할 방법
JP5610976B2 (ja) * 2010-10-22 2014-10-22 トーヨーエイテック株式会社 ワイヤソー
CN102615725B (zh) * 2012-04-16 2015-11-04 浙江昀丰新能源科技有限公司 多线切割机及多线切割机布线装置
JP5996308B2 (ja) * 2012-07-10 2016-09-21 コマツＮｔｃ株式会社 ワイヤソー
CN115972414A (zh) * 2023-02-09 2023-04-18 青岛高测科技股份有限公司 线切割机的控制方法及介质、控制装置、线切割机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1282144A (fr) * 1960-12-07 1962-01-19 Electronique & Automatisme Sa Machine perfectionnée pour le sciage par rodage d'échantillons en matériaux fragiles, notamment cristallins
US3831576A (en) * 1971-11-22 1974-08-27 Motorola Inc Machine and method for cutting brittle materials using a reciprocating cutting wire
US3824982A (en) * 1971-12-20 1974-07-23 Motorola Inc Machine for cutting brittle materials
GB1415240A (en) * 1973-11-27 1975-11-26 Motorola Inc Machine for cutting brittle materials
DE3144482A1 (de) * 1981-11-09 1983-05-19 Maschinenfabrik Korfmann Gmbh, 5810 Witten Maschine zum antrieb eines diamantdrahtseiles fuer das schneiden von steinen
DE3209164C2 (de) * 1982-03-13 1983-12-22 Messner, Caspar O.H., Prof.Dr.sc.techn., Zürich Drahtsäge
DE3532717A1 (de) * 1985-09-13 1987-03-26 Heckler & Koch Gmbh Drahtsaege mit spannvorrichtung
DE3613132A1 (de) * 1986-04-18 1987-10-22 Mueller Georg Nuernberg Verfahren zum zerteilen von harten, nichtmetallischen werkstoffen

Also Published As

Publication number Publication date
GB2216441A (en) 1989-10-11
US4967725A (en) 1990-11-06
IT1228021B (it) 1991-05-27
JPH029564A (ja) 1990-01-12
GB8903700D0 (en) 1989-04-05
CH677627A5 (it) 1991-06-14
DE3804873C2 (it) 1993-05-27
FR2627113A1 (fr) 1989-08-18
GB2216441B (en) 1992-01-15
DE3804873A1 (de) 1989-08-31
FR2632661A1 (it) 1989-12-15
KR890013718A (ko) 1989-09-25

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