IT941784B - Sistema di costruzione frazionata di circuiti stampati a piu strati - Google Patents

Sistema di costruzione frazionata di circuiti stampati a piu strati

Info

Publication number
IT941784B
IT941784B IT3168271A IT3168271A IT941784B IT 941784 B IT941784 B IT 941784B IT 3168271 A IT3168271 A IT 3168271A IT 3168271 A IT3168271 A IT 3168271A IT 941784 B IT941784 B IT 941784B
Authority
IT
Italy
Prior art keywords
construction system
printed circuits
layer printed
fractional
fractional construction
Prior art date
Application number
IT3168271A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT941784B publication Critical patent/IT941784B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT3168271A 1970-12-02 1971-11-26 Sistema di costruzione frazionata di circuiti stampati a piu strati IT941784B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702059425 DE2059425A1 (de) 1970-12-02 1970-12-02 Partieller Aufbau von gedruckten Mehrlagenschaltungen

Publications (1)

Publication Number Publication Date
IT941784B true IT941784B (it) 1973-03-10

Family

ID=5789821

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3168271A IT941784B (it) 1970-12-02 1971-11-26 Sistema di costruzione frazionata di circuiti stampati a piu strati

Country Status (6)

Country Link
BE (1) BE776073A (it)
DE (1) DE2059425A1 (it)
FR (1) FR2117172A5 (it)
IT (1) IT941784B (it)
LU (1) LU64374A1 (it)
NL (1) NL7116101A (it)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH576739A5 (it) 1972-08-25 1976-06-15 Ciba Geigy Ag
GB1535813A (en) * 1975-07-03 1978-12-13 Ncr Co Multi-layer circuit board
FR2340620A1 (fr) * 1976-02-06 1977-09-02 Ibm Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane
US4284468A (en) * 1977-12-16 1981-08-18 Llewelyn Stearns Patterned chemical etching of high temperature resistant metals
DE3013667C2 (de) * 1980-04-09 1983-01-20 Wilhelm Ruf KG, 8000 München Leiterplatte und Verfahren zu deren Herstellung
US4663497A (en) * 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board
WO1983003944A1 (en) * 1982-05-05 1983-11-10 Hughes Aircraft Company High density printed wiring board
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
FR2656493A1 (fr) * 1989-12-21 1991-06-28 Bull Sa Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.
ATE154259T1 (de) * 1991-02-28 1997-06-15 Heinze Dyconex Patente Verfahren zur herstellung eines aus mikrosieben bestehenden verbundkörpers
US5698299A (en) * 1991-02-28 1997-12-16 Dyconex Patente Ag Thin laminated microstructure with precisely aligned openings
DE59309575D1 (de) * 1992-06-15 1999-06-17 Heinze Dyconex Patente Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung
FR2713139B1 (fr) * 1993-12-03 1995-12-29 Loic Demeure Support métallisé à base de mousse organique, assemblage d'au moins deux de ces supports et procédé de fabrication de ce support.
DE4438777A1 (de) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
WO1997000598A1 (de) 1995-06-15 1997-01-03 Dyconex Patente Ag Verbindungssubstrat
EP1318704A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Printed circuit board micro hole processing method
JP2005150263A (ja) * 2003-11-13 2005-06-09 Nitto Denko Corp 両面配線回路基板

Also Published As

Publication number Publication date
FR2117172A5 (en) 1972-07-21
BE776073A (fr) 1972-03-16
NL7116101A (it) 1972-06-06
DE2059425A1 (de) 1972-06-22
LU64374A1 (it) 1972-06-19

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