IT978507B - Dispositivo di raffreddamento per componenti a semicondutto ri piatti - Google Patents

Dispositivo di raffreddamento per componenti a semicondutto ri piatti

Info

Publication number
IT978507B
IT978507B IT1965673A IT1965673A IT978507B IT 978507 B IT978507 B IT 978507B IT 1965673 A IT1965673 A IT 1965673A IT 1965673 A IT1965673 A IT 1965673A IT 978507 B IT978507 B IT 978507B
Authority
IT
Italy
Prior art keywords
semiconduct
flat
components
cooling device
cooling
Prior art date
Application number
IT1965673A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2204589A external-priority patent/DE2204589A1/de
Priority claimed from DE2208937A external-priority patent/DE2208937A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT978507B publication Critical patent/IT978507B/it

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT1965673A 1972-02-01 1973-01-26 Dispositivo di raffreddamento per componenti a semicondutto ri piatti IT978507B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (de) 1972-02-01 1972-02-01 Kuehlanordnung fuer flache halbleiterbauelemente
DE2208937A DE2208937A1 (de) 1972-02-25 1972-02-25 Waermerohr-kuehlanordnung fuer flache halbleiterbauelemente

Publications (1)

Publication Number Publication Date
IT978507B true IT978507B (it) 1974-09-20

Family

ID=25762653

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1965673A IT978507B (it) 1972-02-01 1973-01-26 Dispositivo di raffreddamento per componenti a semicondutto ri piatti

Country Status (8)

Country Link
AT (1) AT324436B (de)
BE (1) BE794501A (de)
CH (1) CH550485A (de)
FR (1) FR2170040B1 (de)
GB (1) GB1427624A (de)
IT (1) IT978507B (de)
LU (1) LU66933A1 (de)
NL (1) NL7300759A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359329A (ja) * 2001-05-30 2002-12-13 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
BE794501A (fr) 1973-05-16
GB1427624A (en) 1976-03-10
CH550485A (de) 1974-06-14
FR2170040B1 (de) 1978-02-10
FR2170040A1 (de) 1973-09-14
NL7300759A (de) 1973-08-03
AT324436B (de) 1975-08-25
LU66933A1 (de) 1973-04-02

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