IT979383B - Complesso di supporto per circui ti elettrici integrati - Google Patents

Complesso di supporto per circui ti elettrici integrati

Info

Publication number
IT979383B
IT979383B IT20733/73A IT2073373A IT979383B IT 979383 B IT979383 B IT 979383B IT 20733/73 A IT20733/73 A IT 20733/73A IT 2073373 A IT2073373 A IT 2073373A IT 979383 B IT979383 B IT 979383B
Authority
IT
Italy
Prior art keywords
electrical circuits
integrated electrical
support complex
complex
support
Prior art date
Application number
IT20733/73A
Other languages
English (en)
Original Assignee
Plessey Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Ag filed Critical Plessey Ag
Application granted granted Critical
Publication of IT979383B publication Critical patent/IT979383B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT20733/73A 1972-02-23 1973-02-22 Complesso di supporto per circui ti elettrici integrati IT979383B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB825772A GB1383297A (en) 1972-02-23 1972-02-23 Electrical integrated circuit package

Publications (1)

Publication Number Publication Date
IT979383B true IT979383B (it) 1974-09-30

Family

ID=9849039

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20733/73A IT979383B (it) 1972-02-23 1973-02-22 Complesso di supporto per circui ti elettrici integrati

Country Status (6)

Country Link
US (1) US3825801A (it)
DE (1) DE2306288C2 (it)
FR (1) FR2173192B1 (it)
GB (1) GB1383297A (it)
IT (1) IT979383B (it)
SE (1) SE380421B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
US4064356A (en) * 1976-03-11 1977-12-20 Sander Associates, Inc. Soldered joint
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
US4295181A (en) * 1979-01-15 1981-10-13 Texas Instruments Incorporated Module for an integrated circuit system
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
JPS61203695A (ja) * 1985-03-06 1986-09-09 シャープ株式会社 片面配線基板の部品実装方式
US4829362A (en) * 1986-04-28 1989-05-09 Motorola, Inc. Lead frame with die bond flag for ceramic packages
DE3723209A1 (de) * 1987-07-14 1989-01-26 Semikron Elektronik Gmbh Halbleiteranordnung
GB2213319B (en) * 1987-12-04 1991-03-06 Marconi Electronic Devices A method of forming electrical conductors
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
DE10006445C2 (de) * 2000-02-14 2002-03-28 Infineon Technologies Ag Zwischenrahmen für einen Gehäuserahmen von Halbleiterchips
US7993092B2 (en) * 2007-08-14 2011-08-09 Samsung Electronics Co., Ltd. Moving carrier for lead frame and method of moving lead frame using the moving carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205408A (en) * 1964-04-14 1965-09-07 Boehm Josef Components for printed circuits
US3407925A (en) * 1965-03-19 1968-10-29 Elco Corp Microelectronic carrier
US3381372A (en) * 1966-07-13 1968-05-07 Sperry Rand Corp Method of electrically connecting and hermetically sealing packages for microelectronic circuits

Also Published As

Publication number Publication date
DE2306288A1 (de) 1973-08-30
US3825801A (en) 1974-07-23
GB1383297A (en) 1974-02-12
SE380421B (sv) 1975-11-03
FR2173192A1 (it) 1973-10-05
FR2173192B1 (it) 1977-04-22
DE2306288C2 (de) 1982-09-09

Similar Documents

Publication Publication Date Title
IT1001280B (it) Pannello di connessioni elettriche
JPS53127277A (en) Semiconductor memory
IT993823B (it) Dispositivo di collegamento elettrico
JPS5386181A (en) Semiconductor
IT979383B (it) Complesso di supporto per circui ti elettrici integrati
CH554082A (de) Elektrische klemmenanordnung.
HK16877A (en) Integrated circuit arrangement
IT998662B (it) Dispositivo di intercollegamento elettrico
AT376844B (de) Halbleiterbauteil
IT996899B (it) Componente elettrico microminia turizzato preferibilmente com ponente semiconduttore
IT984157B (it) Piastra portante per pacchi di circuiti integrati
AT334662B (de) Hochintegrierter halbleiterspeicher
IT972928B (it) Dispositivo per la rimozione di punti metallici
IT978033B (it) Circuito integrato
AU6136473A (en) Semiconductor component
IT972993B (it) Supporto per laapada elettrica
AT324481B (de) Schaltungsanordnung
CH541869A (de) Halbleiterbauelement
SE389783B (sv) Halvledare-invertare
IT984059B (it) Interruttore elettronico di prossimita
AT325696B (de) Elektrische leitung
IT987932B (it) Dispositivo semiconduttore integrato
SE385171B (sv) Elektriskt stellverk
NL184814C (nl) Geintegreerde halfgeleiderschakeling.
IT1059111B (it) Telaietto di supporto per semiconduttore