ITMI20022567A1 - Dispositivo a circuito integrato e modulo con circuiti integrati - Google Patents

Dispositivo a circuito integrato e modulo con circuiti integrati

Info

Publication number
ITMI20022567A1
ITMI20022567A1 IT002567A ITMI20022567A ITMI20022567A1 IT MI20022567 A1 ITMI20022567 A1 IT MI20022567A1 IT 002567 A IT002567 A IT 002567A IT MI20022567 A ITMI20022567 A IT MI20022567A IT MI20022567 A1 ITMI20022567 A1 IT MI20022567A1
Authority
IT
Italy
Prior art keywords
module
circuit device
integrated
integrated circuit
integrated circuits
Prior art date
Application number
IT002567A
Other languages
English (en)
Inventor
Seong-Jin Jang
Young-Hyun Jun
Chang-Man Khang
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of ITMI20022567A1 publication Critical patent/ITMI20022567A1/it

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
IT002567A 2001-12-06 2002-12-04 Dispositivo a circuito integrato e modulo con circuiti integrati ITMI20022567A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0076944A KR100454123B1 (ko) 2001-12-06 2001-12-06 반도체 집적 회로 장치 및 그것을 구비한 모듈

Publications (1)

Publication Number Publication Date
ITMI20022567A1 true ITMI20022567A1 (it) 2003-06-07

Family

ID=19716708

Family Applications (1)

Application Number Title Priority Date Filing Date
IT002567A ITMI20022567A1 (it) 2001-12-06 2002-12-04 Dispositivo a circuito integrato e modulo con circuiti integrati

Country Status (6)

Country Link
US (1) US6667895B2 (it)
JP (1) JP4361724B2 (it)
KR (1) KR100454123B1 (it)
DE (1) DE10258722A1 (it)
IT (1) ITMI20022567A1 (it)
TW (1) TW569381B (it)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791555B1 (en) 2000-06-23 2004-09-14 Micron Technology, Inc. Apparatus and method for distributed memory control in a graphics processing system
US7133972B2 (en) 2002-06-07 2006-11-07 Micron Technology, Inc. Memory hub with internal cache and/or memory access prediction
US6998870B1 (en) 2002-07-31 2006-02-14 Advanced Micro Devices, Inc. Method and apparatus for impedance matching in systems configured for multiple processors
US7200024B2 (en) 2002-08-02 2007-04-03 Micron Technology, Inc. System and method for optically interconnecting memory devices
US7117316B2 (en) 2002-08-05 2006-10-03 Micron Technology, Inc. Memory hub and access method having internal row caching
US7254331B2 (en) 2002-08-09 2007-08-07 Micron Technology, Inc. System and method for multiple bit optical data transmission in memory systems
US7149874B2 (en) 2002-08-16 2006-12-12 Micron Technology, Inc. Memory hub bypass circuit and method
US6820181B2 (en) 2002-08-29 2004-11-16 Micron Technology, Inc. Method and system for controlling memory accesses to memory modules having a memory hub architecture
US7836252B2 (en) 2002-08-29 2010-11-16 Micron Technology, Inc. System and method for optimizing interconnections of memory devices in a multichip module
US7102907B2 (en) 2002-09-09 2006-09-05 Micron Technology, Inc. Wavelength division multiplexed memory module, memory system and method
US6876562B2 (en) * 2002-10-17 2005-04-05 Micron Technology, Inc. Apparatus and method for mounting microelectronic devices on a mirrored board assembly
US7592829B2 (en) 2002-12-02 2009-09-22 Silverbrook Research Pty Ltd On-chip storage of secret information as inverse pair
KR100481184B1 (ko) * 2003-03-26 2005-04-07 삼성전자주식회사 반도체 메모리 집적회로
US7245145B2 (en) 2003-06-11 2007-07-17 Micron Technology, Inc. Memory module and method having improved signal routing topology
US7120727B2 (en) 2003-06-19 2006-10-10 Micron Technology, Inc. Reconfigurable memory module and method
US7260685B2 (en) 2003-06-20 2007-08-21 Micron Technology, Inc. Memory hub and access method having internal prefetch buffers
US7107415B2 (en) 2003-06-20 2006-09-12 Micron Technology, Inc. Posted write buffers and methods of posting write requests in memory modules
US7428644B2 (en) 2003-06-20 2008-09-23 Micron Technology, Inc. System and method for selective memory module power management
TW576614U (en) * 2003-06-30 2004-02-11 Yi-Chen Tang Low-voltage driven high-brightness LED
US7389364B2 (en) 2003-07-22 2008-06-17 Micron Technology, Inc. Apparatus and method for direct memory access in a hub-based memory system
US7210059B2 (en) 2003-08-19 2007-04-24 Micron Technology, Inc. System and method for on-board diagnostics of memory modules
US7133991B2 (en) 2003-08-20 2006-11-07 Micron Technology, Inc. Method and system for capturing and bypassing memory transactions in a hub-based memory system
US20050050237A1 (en) * 2003-08-28 2005-03-03 Jeddeloh Joseph M. Memory module and method having on-board data search capabilities and processor-based system using such memory modules
US7136958B2 (en) 2003-08-28 2006-11-14 Micron Technology, Inc. Multiple processor system and method including multiple memory hub modules
US7310752B2 (en) 2003-09-12 2007-12-18 Micron Technology, Inc. System and method for on-board timing margin testing of memory modules
US7194593B2 (en) 2003-09-18 2007-03-20 Micron Technology, Inc. Memory hub with integrated non-volatile memory
US7120743B2 (en) 2003-10-20 2006-10-10 Micron Technology, Inc. Arbitration system and method for memory responses in a hub-based memory system
US7023719B1 (en) * 2003-10-23 2006-04-04 Lsi Logic Corporation Memory module having mirrored placement of DRAM integrated circuits upon a four-layer printed circuit board
US7234070B2 (en) 2003-10-27 2007-06-19 Micron Technology, Inc. System and method for using a learning sequence to establish communications on a high-speed nonsynchronous interface in the absence of clock forwarding
US7409572B1 (en) 2003-12-05 2008-08-05 Lsi Corporation Low power memory controller with leaded double data rate DRAM package arranged on a two layer printed circuit board
US7330992B2 (en) 2003-12-29 2008-02-12 Micron Technology, Inc. System and method for read synchronization of memory modules
KR100541655B1 (ko) * 2004-01-07 2006-01-11 삼성전자주식회사 패키지 회로기판 및 이를 이용한 패키지
JP4826058B2 (ja) * 2004-01-07 2011-11-30 セイコーエプソン株式会社 マクロセル、集積回路装置、及び電子機器
US7759967B2 (en) * 2004-01-09 2010-07-20 Conexant Systems, Inc. General purpose pin mapping for a general purpose application specific integrated circuit (ASIC)
US7188219B2 (en) 2004-01-30 2007-03-06 Micron Technology, Inc. Buffer control system and method for a memory system having outstanding read and write request buffers
US7412574B2 (en) 2004-02-05 2008-08-12 Micron Technology, Inc. System and method for arbitration of memory responses in a hub-based memory system
US7181584B2 (en) * 2004-02-05 2007-02-20 Micron Technology, Inc. Dynamic command and/or address mirroring system and method for memory modules
US7788451B2 (en) 2004-02-05 2010-08-31 Micron Technology, Inc. Apparatus and method for data bypass for a bi-directional data bus in a hub-based memory sub-system
US20050195629A1 (en) * 2004-03-02 2005-09-08 Leddige Michael W. Interchangeable connection arrays for double-sided memory module placement
US7366864B2 (en) 2004-03-08 2008-04-29 Micron Technology, Inc. Memory hub architecture having programmable lane widths
US7257683B2 (en) 2004-03-24 2007-08-14 Micron Technology, Inc. Memory arbitration system and method having an arbitration packet protocol
US7120723B2 (en) 2004-03-25 2006-10-10 Micron Technology, Inc. System and method for memory hub-based expansion bus
US7213082B2 (en) 2004-03-29 2007-05-01 Micron Technology, Inc. Memory hub and method for providing memory sequencing hints
US7447240B2 (en) 2004-03-29 2008-11-04 Micron Technology, Inc. Method and system for synchronizing communications links in a hub-based memory system
US6980042B2 (en) 2004-04-05 2005-12-27 Micron Technology, Inc. Delay line synchronizer apparatus and method
US7590797B2 (en) 2004-04-08 2009-09-15 Micron Technology, Inc. System and method for optimizing interconnections of components in a multichip memory module
US7162567B2 (en) 2004-05-14 2007-01-09 Micron Technology, Inc. Memory hub and method for memory sequencing
US7222213B2 (en) 2004-05-17 2007-05-22 Micron Technology, Inc. System and method for communicating the synchronization status of memory modules during initialization of the memory modules
US7230450B2 (en) * 2004-05-18 2007-06-12 Intel Corporation Programming semiconductor dies for pin map compatibility
KR100689812B1 (ko) * 2004-05-20 2007-03-08 삼성전자주식회사 반도체 장치, 이 장치의 미러 모드 설정 방법, 및 이장치를 이용한 모듈
DE102005022687A1 (de) * 2004-05-20 2005-12-29 Samsung Electronics Co., Ltd., Suwon Speichersystem, Halbleiterspeicherbauelement und Betriebsverfahren hierfür
US7363419B2 (en) 2004-05-28 2008-04-22 Micron Technology, Inc. Method and system for terminating write commands in a hub-based memory system
US7519788B2 (en) 2004-06-04 2009-04-14 Micron Technology, Inc. System and method for an asynchronous data buffer having buffer write and read pointers
US7310748B2 (en) 2004-06-04 2007-12-18 Micron Technology, Inc. Memory hub tester interface and method for use thereof
DE102004041731B3 (de) * 2004-08-28 2006-03-16 Infineon Technologies Ag Speichermodul zum Bereitstellen einer Speicherkapazität
US7392331B2 (en) 2004-08-31 2008-06-24 Micron Technology, Inc. System and method for transmitting data packets in a computer system having a memory hub architecture
US7652896B2 (en) * 2004-12-29 2010-01-26 Hewlett-Packard Development Company, L.P. Component for impedance matching
KR100702016B1 (ko) * 2005-02-02 2007-03-30 삼성전자주식회사 양면 실장 메모리 모듈의 인쇄 회로 기판 및 이를이용하는 양면 실장 메모리 모듈
US7545651B2 (en) * 2005-04-18 2009-06-09 Hewlett-Packard Development Company, L.P. Memory module with a predetermined arrangement of pins
US7202701B1 (en) * 2005-12-06 2007-04-10 Micrel, Inc. Input/output circuit for handling unconnected I/O pads
US7352602B2 (en) 2005-12-30 2008-04-01 Micron Technology, Inc. Configurable inputs and outputs for memory stacking system and method
KR100735527B1 (ko) * 2006-02-13 2007-07-04 삼성전자주식회사 2개의 패드 행을 포함하는 반도체 메모리 장치
DE102006042775B3 (de) * 2006-09-12 2008-03-27 Qimonda Ag Schaltungsmodul und Verfahren zur Herstellung eines Schaltungsmoduls
US7433229B2 (en) * 2006-12-19 2008-10-07 Phison Electronics Corp. Flash memory device with shunt
JP4776564B2 (ja) * 2007-02-22 2011-09-21 株式会社東芝 半導体装置の製造方法、及び半導体装置
KR100795027B1 (ko) * 2007-03-12 2008-01-16 주식회사 하이닉스반도체 반도체 집적 회로 및 이를 포함하는 반도체 패키지 모듈
KR100909969B1 (ko) 2007-06-28 2009-07-29 삼성전자주식회사 반도체 소자 및 그 제조 방법, 및 반도체 소자를 포함하는스택 모듈, 카드 및 시스템
US7925844B2 (en) * 2007-11-29 2011-04-12 Micron Technology, Inc. Memory register encoding systems and methods
KR100899568B1 (ko) * 2007-12-26 2009-05-27 주식회사 하이닉스반도체 반도체 소자와 그의 구동 방법
JP2009164263A (ja) * 2007-12-28 2009-07-23 Nec Electronics Corp 配線モジュール及び半導体集積回路装置
EP2608207A1 (en) 2010-06-17 2013-06-26 Mosaid Technologies Incorporated Semiconductor device with through-silicon vias
US10389235B2 (en) 2011-05-05 2019-08-20 Psemi Corporation Power converter
US8502390B2 (en) 2011-07-12 2013-08-06 Tessera, Inc. De-skewed multi-die packages
US8513817B2 (en) 2011-07-12 2013-08-20 Invensas Corporation Memory module in a package
US8823165B2 (en) 2011-07-12 2014-09-02 Invensas Corporation Memory module in a package
US8653646B2 (en) 2011-10-03 2014-02-18 Invensas Corporation Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
US8525327B2 (en) 2011-10-03 2013-09-03 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
US8441111B2 (en) 2011-10-03 2013-05-14 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US8659143B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization for wirebond assemblies without windows
EP2769409A1 (en) 2011-10-03 2014-08-27 Invensas Corporation Stub minimization for multi-die wirebond assemblies with orthogonal windows
KR20140081856A (ko) * 2011-10-03 2014-07-01 인벤사스 코포레이션 패키지 기판으로의 와이어 본드 없이 어셈블리에서 신호 단자의 복제 세트를 이용한 스터브 최소화
US8436477B2 (en) * 2011-10-03 2013-05-07 Invensas Corporation Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
US8436457B2 (en) 2011-10-03 2013-05-07 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
TWI515864B (zh) 2011-10-03 2016-01-01 英帆薩斯公司 具有自封裝中心偏移之端子格柵之短線最小化
KR101894823B1 (ko) 2011-10-03 2018-09-04 인벤사스 코포레이션 평행한 윈도우를 갖는 다중-다이 와이어 본드 어셈블리를 위한 스터브 최소화
US9003221B1 (en) * 2012-04-03 2015-04-07 Xilinx, Inc. Skew compensation for a stacked die
CN103383543B (zh) * 2012-05-02 2017-08-15 飞思卡尔半导体公司 片上系统及其控制模块
US8848392B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support module and microelectronic assembly
US8848391B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support component and microelectronic assembly
US9368477B2 (en) 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
US8787034B2 (en) 2012-08-27 2014-07-22 Invensas Corporation Co-support system and microelectronic assembly
US9070423B2 (en) 2013-06-11 2015-06-30 Invensas Corporation Single package dual channel memory with co-support
US9230653B2 (en) * 2013-09-10 2016-01-05 Kabushiki Kaisha Toshiba Semiconductor memory device
US9123555B2 (en) 2013-10-25 2015-09-01 Invensas Corporation Co-support for XFD packaging
US9129956B2 (en) 2013-12-11 2015-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Device having multiple-layer pins in memory MUX1 layout
US9281296B2 (en) 2014-07-31 2016-03-08 Invensas Corporation Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design
US9691437B2 (en) 2014-09-25 2017-06-27 Invensas Corporation Compact microelectronic assembly having reduced spacing between controller and memory packages
US9484080B1 (en) 2015-11-09 2016-11-01 Invensas Corporation High-bandwidth memory application with controlled impedance loading
US10310547B2 (en) * 2016-03-05 2019-06-04 Intel Corporation Techniques to mirror a command/address or interpret command/address logic at a memory device
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications
JP2018032141A (ja) 2016-08-23 2018-03-01 東芝メモリ株式会社 半導体装置
EP3333852B1 (en) * 2016-12-06 2019-04-24 Axis AB Memory arrangement
JP6847797B2 (ja) * 2017-09-21 2021-03-24 キオクシア株式会社 半導体記憶装置
US11043246B2 (en) 2019-04-18 2021-06-22 Samsung Electronics Co, Ltd. Memory modules including a mirroring circuit and methods of operating the same
JP2021140837A (ja) * 2020-03-02 2021-09-16 キオクシア株式会社 半導体記憶装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898636A (en) * 1993-06-21 1999-04-27 Hitachi, Ltd. Semiconductor integrated circuit device with interleaved memory and logic blocks
JPH07147386A (ja) * 1993-09-29 1995-06-06 Toshiba Micro Electron Kk 半導体装置とその製造方法およびそれに用いる器具
US5889327A (en) 1996-10-04 1999-03-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices
JPH10303366A (ja) * 1997-04-30 1998-11-13 Mitsubishi Electric Corp 半導体装置
US6163459A (en) * 1997-07-25 2000-12-19 Matsushita Electric Industrial Co., Ltd. Semiconductor mounting system and semiconductor chip
JP2000340737A (ja) 1999-05-31 2000-12-08 Mitsubishi Electric Corp 半導体パッケージとその実装体
US6307769B1 (en) * 1999-09-02 2001-10-23 Micron Technology, Inc. Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices
JP4427847B2 (ja) * 1999-11-04 2010-03-10 エルピーダメモリ株式会社 ダイナミック型ramと半導体装置
JP2001185680A (ja) * 1999-12-22 2001-07-06 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
KR20030046715A (ko) 2003-06-18
JP2003264240A (ja) 2003-09-19
DE10258722A1 (de) 2003-06-26
TW569381B (en) 2004-01-01
JP4361724B2 (ja) 2009-11-11
US6667895B2 (en) 2003-12-23
KR100454123B1 (ko) 2004-10-26
US20030107908A1 (en) 2003-06-12

Similar Documents

Publication Publication Date Title
DE60143643D1 (de) Integriertes halbleiterschaltungsbauelement
AU2003291199A8 (en) Package having exposed integrated circuit device
DE69827863D1 (de) Integriertes Halbleiterschaltkreisbauelement
DE60223298D1 (de) Wärmestabilisierte polyethylennaphthalat-Folie für flexible Elektronische und Optoelektronische Vorrichtungen
DE60232945D1 (de) Elektronisches Gerät
DE60130065D1 (de) Elektronisches Bauteil und Halbleitervorrichtung
EP1355267A4 (en) IC CARD AND IC CARD ADAPTER
ITMI20041636A1 (it) Modulo di memoria con schede circuitali a chip di memoria
DE50113130D1 (de) Elektronische schalteinrichtung
AU2002365422A8 (en) Wearable biomonitor with flexible thinned integrated circuit
DE60228914D1 (de) Hochfrequenz-Schaltvorrichtung mit eingefügter Inverter-Schaltung
DE60135728D1 (de) Integrierte Halbleiterschaltung
DE60239698D1 (de) Modul mit einer keramischen Leiterplatte
SG96600A1 (en) Semiconductor device and semiconductor module using the same
EP1477990A4 (en) INTEGRATED SEMICONDUCTOR SWITCHING
DE60321866D1 (de) Halbleiter integrierte Schaltungsvorrichtung
DE60133851D1 (de) Leistungshalbleiterbauelement mit Schutzschaltkreis
DE50203196D1 (de) Integrierte schaltung mit elektrischen verbindungselementen
DE50206963D1 (de) Pyrotechnische Zündeinrichtung mit integrierter Elektronikbaugruppe
EP1688957A4 (en) INTEGRATED SEMICONDUCTOR CIRCUIT ELEMENT
DE10164240B4 (de) Schaltungsschutzvorrichtung
DE50112691D1 (de) Elektronisches leistungsmodul
DE60212222D1 (de) Elektronische Bauteile-Bestückungsvorrichtung
DE60221625D1 (de) Integrierte Halbleiterschaltung
DE60239246D1 (de) Elektronischer Leistungsmodul und Leistungsbauelement für diesen Modul