ITMI20041695A1 - Disposizione di sensori in particolare per la misurazione di accelerazioni o velocita' di rotazione - Google Patents
Disposizione di sensori in particolare per la misurazione di accelerazioni o velocita' di rotazioneInfo
- Publication number
- ITMI20041695A1 ITMI20041695A1 IT001695A ITMI20041695A ITMI20041695A1 IT MI20041695 A1 ITMI20041695 A1 IT MI20041695A1 IT 001695 A IT001695 A IT 001695A IT MI20041695 A ITMI20041695 A IT MI20041695A IT MI20041695 A1 ITMI20041695 A1 IT MI20041695A1
- Authority
- IT
- Italy
- Prior art keywords
- accelerations
- measurement
- rotation speed
- sensors arrangement
- sensors
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Air Bags (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10340938A DE10340938A1 (de) | 2003-09-05 | 2003-09-05 | Sensoranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ITMI20041695A1 true ITMI20041695A1 (it) | 2004-12-02 |
Family
ID=34177749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT001695A ITMI20041695A1 (it) | 2003-09-05 | 2004-09-02 | Disposizione di sensori in particolare per la misurazione di accelerazioni o velocita' di rotazione |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE10340938A1 (it) |
| FR (1) | FR2859533A1 (it) |
| IT (1) | ITMI20041695A1 (it) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4534912B2 (ja) * | 2005-08-30 | 2010-09-01 | 株式会社デンソー | 角速度センサの取付構造 |
| JP4839747B2 (ja) * | 2005-09-20 | 2011-12-21 | 三菱電機株式会社 | 静電容量型加速度センサ |
| JP4595779B2 (ja) * | 2005-10-12 | 2010-12-08 | 株式会社デンソー | 角速度センサ |
| DE102009019063A1 (de) * | 2009-04-27 | 2010-10-28 | Trw Automotive Gmbh | Bauteil und Verfahren zur Herstellung |
| DE102010039063B4 (de) | 2010-08-09 | 2024-01-18 | Robert Bosch Gmbh | Sensormodul mit einem elektromagnetisch abgeschirmten elektrischen Bauteil und Verfahren zur Herstellung eines solchen Sensormoduls |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5345823A (en) * | 1991-11-12 | 1994-09-13 | Texas Instruments Incorporated | Accelerometer |
| JP3278363B2 (ja) * | 1996-11-18 | 2002-04-30 | 三菱電機株式会社 | 半導体加速度センサ |
| JP4701505B2 (ja) * | 2001-01-29 | 2011-06-15 | パナソニック株式会社 | 慣性トランスデューサ |
| JP2003004450A (ja) * | 2001-06-25 | 2003-01-08 | Matsushita Electric Ind Co Ltd | 角速度および加速度検出用複合センサ |
-
2003
- 2003-09-05 DE DE10340938A patent/DE10340938A1/de not_active Withdrawn
-
2004
- 2004-09-02 IT IT001695A patent/ITMI20041695A1/it unknown
- 2004-09-02 FR FR0451958A patent/FR2859533A1/fr active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE10340938A1 (de) | 2005-03-31 |
| FR2859533A1 (fr) | 2005-03-11 |
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