ITMI20042389A1 - Procedimento per la fabbricazione di un componente micromeccanico e componente micromeccanico fabbricato in particolare con il procedimento - Google Patents

Procedimento per la fabbricazione di un componente micromeccanico e componente micromeccanico fabbricato in particolare con il procedimento

Info

Publication number
ITMI20042389A1
ITMI20042389A1 IT002389A ITMI20042389A ITMI20042389A1 IT MI20042389 A1 ITMI20042389 A1 IT MI20042389A1 IT 002389 A IT002389 A IT 002389A IT MI20042389 A ITMI20042389 A IT MI20042389A IT MI20042389 A1 ITMI20042389 A1 IT MI20042389A1
Authority
IT
Italy
Prior art keywords
procedure
micromechanical component
manufacture
manufactured
component manufactured
Prior art date
Application number
IT002389A
Other languages
English (en)
Inventor
Hubert Benzel
Stefan Finkbeiner
Julian Gonska
Christoph Schelling
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20042389A1 publication Critical patent/ITMI20042389A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT002389A 2003-12-17 2004-12-15 Procedimento per la fabbricazione di un componente micromeccanico e componente micromeccanico fabbricato in particolare con il procedimento ITMI20042389A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10359217A DE10359217A1 (de) 2003-12-17 2003-12-17 Elektrische Durchkontaktierung von HL-Chips

Publications (1)

Publication Number Publication Date
ITMI20042389A1 true ITMI20042389A1 (it) 2005-03-15

Family

ID=34672844

Family Applications (1)

Application Number Title Priority Date Filing Date
IT002389A ITMI20042389A1 (it) 2003-12-17 2004-12-15 Procedimento per la fabbricazione di un componente micromeccanico e componente micromeccanico fabbricato in particolare con il procedimento

Country Status (3)

Country Link
US (1) US7572660B2 (it)
DE (1) DE10359217A1 (it)
IT (1) ITMI20042389A1 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080283944A1 (en) * 2007-05-18 2008-11-20 Geefay Frank S PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE
JP2008304218A (ja) 2007-06-05 2008-12-18 Mitsubishi Electric Corp 加速度センサおよびその製造方法
DE102007026445A1 (de) 2007-06-06 2008-12-11 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
DE102008042258A1 (de) 2008-09-22 2010-04-01 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Chips sowie ein Bauelement mit einem derartigen Chip
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
DE102016206549A1 (de) * 2016-04-19 2017-10-19 Robert Bosch Gmbh Sensorelement für thermische Anemometrie
US12044646B2 (en) * 2021-05-14 2024-07-23 Taiwan Semiconductor Manufacturing Company Ltd. Fluid sensor system

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258175A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp シリコン半導体加速度センサの製造方法
US6030851A (en) * 1995-06-07 2000-02-29 Grandmont; Paul E. Method for overpressure protected pressure sensor
DE69627645T2 (de) * 1996-07-31 2004-02-05 Stmicroelectronics S.R.L., Agrate Brianza Integrierter piezoresistiver Druckwandler und Herstellungsverfahren dazu
US5879572A (en) * 1996-11-19 1999-03-09 Delco Electronics Corporation Method of protecting silicon wafers during wet chemical etching
US5994161A (en) * 1997-09-03 1999-11-30 Motorola, Inc. Temperature coefficient of offset adjusted semiconductor device and method thereof
US6287885B1 (en) * 1998-05-08 2001-09-11 Denso Corporation Method for manufacturing semiconductor dynamic quantity sensor
US6682649B1 (en) * 1999-10-01 2004-01-27 Sophion Bioscience A/S Substrate and a method for determining and/or monitoring electrophysiological properties of ion channels
DE10042945A1 (de) 2000-08-31 2002-03-28 Siemens Ag Bauelement für Sensoren mit integrierter Elektronik und Verfahren zu seiner Herstellung, sowie Sensor mit integrierter Elektronik
DE10058864B4 (de) 2000-11-27 2009-06-25 Pyreos Ltd. Mikromechanikstruktur für integrierte Sensoranordnungen und Verfahren zur Herstellung einer Mikromechanikstruktur
JP4486289B2 (ja) * 2001-03-30 2010-06-23 株式会社デンソー フローセンサ及びその製造方法
US20040104454A1 (en) * 2002-10-10 2004-06-03 Rohm Co., Ltd. Semiconductor device and method of producing the same
JP3920247B2 (ja) * 2003-07-02 2007-05-30 三菱電機株式会社 感熱式流量検出素子およびその製造方法

Also Published As

Publication number Publication date
US20050133880A1 (en) 2005-06-23
US7572660B2 (en) 2009-08-11
DE10359217A1 (de) 2005-07-28

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