ITRM910186A0 - Procedimento per riscaldare in modo selettivo un film su un substrato. - Google Patents
Procedimento per riscaldare in modo selettivo un film su un substrato.Info
- Publication number
- ITRM910186A0 ITRM910186A0 IT91RM186A ITRM910186A ITRM910186A0 IT RM910186 A0 ITRM910186 A0 IT RM910186A0 IT 91RM186 A IT91RM186 A IT 91RM186A IT RM910186 A ITRM910186 A IT RM910186A IT RM910186 A0 ITRM910186 A0 IT RM910186A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- substrate
- film
- selectively heating
- selectively
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3428—Sulfides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/382—Scanning of a beam
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
- H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/498,670 US5073698A (en) | 1990-03-23 | 1990-03-23 | Method for selectively heating a film on a substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITRM910186A0 true ITRM910186A0 (it) | 1991-03-21 |
| ITRM910186A1 ITRM910186A1 (it) | 1992-09-21 |
| IT1246117B IT1246117B (it) | 1994-11-15 |
Family
ID=23982021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITRM910186A IT1246117B (it) | 1990-03-23 | 1991-03-21 | Procedimento per riscaldare in modo selettivo un film su un substrato. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5073698A (it) |
| JP (1) | JP3086489B2 (it) |
| DE (1) | DE4109165A1 (it) |
| IT (1) | IT1246117B (it) |
| NL (1) | NL9100518A (it) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446824A (en) * | 1991-10-11 | 1995-08-29 | Texas Instruments | Lamp-heated chuck for uniform wafer processing |
| US5234484A (en) * | 1992-02-24 | 1993-08-10 | Itt Corporation | Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor |
| US5336641A (en) * | 1992-03-17 | 1994-08-09 | Aktis Corporation | Rapid thermal annealing using thermally conductive overcoat |
| US5561735A (en) * | 1994-08-30 | 1996-10-01 | Vortek Industries Ltd. | Rapid thermal processing apparatus and method |
| JP3507600B2 (ja) * | 1995-10-05 | 2004-03-15 | 理想科学工業株式会社 | 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物 |
| US6177127B1 (en) * | 1995-12-15 | 2001-01-23 | Micron Technology, Inc. | Method of monitoring emissivity |
| US5751896A (en) * | 1996-02-22 | 1998-05-12 | Micron Technology, Inc. | Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition |
| JPH1086545A (ja) * | 1996-09-13 | 1998-04-07 | Riso Kagaku Corp | 感熱孔版原紙製版用組成物及び製版方法 |
| US5904566A (en) * | 1997-06-09 | 1999-05-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reactive ion etch method for forming vias through nitrogenated silicon oxide layers |
| US5960158A (en) | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
| US6080965A (en) * | 1997-09-18 | 2000-06-27 | Tokyo Electron Limited | Single-substrate-heat-treatment apparatus in semiconductor processing system |
| US5930456A (en) | 1998-05-14 | 1999-07-27 | Ag Associates | Heating device for semiconductor wafers |
| US5970214A (en) | 1998-05-14 | 1999-10-19 | Ag Associates | Heating device for semiconductor wafers |
| US6236021B1 (en) * | 1998-07-01 | 2001-05-22 | Intevac, Inc. | Substrate transport assembly for rapid thermal processing system |
| US6210484B1 (en) | 1998-09-09 | 2001-04-03 | Steag Rtp Systems, Inc. | Heating device containing a multi-lamp cone for heating semiconductor wafers |
| US6771895B2 (en) | 1999-01-06 | 2004-08-03 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
| US6303411B1 (en) | 1999-05-03 | 2001-10-16 | Vortek Industries Ltd. | Spatially resolved temperature measurement and irradiance control |
| CN1363116A (zh) * | 2000-02-08 | 2002-08-07 | 松下电器产业株式会社 | 灯泡退火装置和显示元件用基片 |
| US6376806B2 (en) * | 2000-05-09 | 2002-04-23 | Woo Sik Yoo | Flash anneal |
| US6337467B1 (en) * | 2000-05-09 | 2002-01-08 | Wafermasters, Inc. | Lamp based scanning rapid thermal processing |
| SE0004296D0 (sv) * | 2000-11-23 | 2000-11-23 | Gyros Ab | Device and method for the controlled heating in micro channel systems |
| TWI313059B (it) * | 2000-12-08 | 2009-08-01 | Sony Corporatio | |
| US7255899B2 (en) | 2001-11-12 | 2007-08-14 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus and heat treatment method of substrate |
| KR20030052833A (ko) * | 2001-12-21 | 2003-06-27 | 동부전자 주식회사 | 반도체 소자 제조방법 |
| JP2005515425A (ja) | 2001-12-26 | 2005-05-26 | ボルテック インダストリーズ リミテッド | 温度測定および熱処理方法およびシステム |
| ES2282657T3 (es) | 2002-05-17 | 2007-10-16 | Jason E. Schripsema | Modulo fotovoltaico con disipador de calor ajustable y procedimiento de fabricacion. |
| JP2004031557A (ja) * | 2002-06-25 | 2004-01-29 | Ushio Inc | 光加熱装置 |
| KR20120045040A (ko) | 2002-12-20 | 2012-05-08 | 맷슨 테크날러지 캐나다 인코퍼레이티드 | 피가공물 지지 방법 |
| US20040253839A1 (en) * | 2003-06-11 | 2004-12-16 | Tokyo Electron Limited | Semiconductor manufacturing apparatus and heat treatment method |
| WO2005059991A1 (en) | 2003-12-19 | 2005-06-30 | Mattson Technology Canada Inc. | Apparatuses and methods for suppressing thermally induced motion of a workpiece |
| TWI249588B (en) * | 2004-08-11 | 2006-02-21 | Ind Tech Res Inst | One kind of cavity apparatus of energy wave reflection device |
| DE102005010005A1 (de) * | 2005-03-04 | 2006-12-28 | Nunner, Dieter | Vorrichtung und Verfahren zur Beschichtung von Kleinteilen |
| JP5967859B2 (ja) | 2006-11-15 | 2016-08-10 | マトソン テクノロジー、インコーポレイテッド | 熱処理中の被加工物を支持するシステムおよび方法 |
| CN102089873A (zh) | 2008-05-16 | 2011-06-08 | 加拿大马特森技术有限公司 | 工件破损防止方法及设备 |
| IN2012DN01719A (it) * | 2009-08-21 | 2015-06-05 | First Solar Inc | |
| JP5559656B2 (ja) * | 2010-10-14 | 2014-07-23 | 大日本スクリーン製造株式会社 | 熱処理装置および熱処理方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2824943A (en) * | 1954-06-28 | 1958-02-25 | Myron P Laughlin | Bakery product heater |
| US3249741A (en) * | 1963-05-20 | 1966-05-03 | Reflectotherm Inc | Apparatus for baking by differential wave lengths |
| SE8200685L (sv) * | 1982-02-05 | 1983-08-06 | Electrolux Ab | Med infrarod stralning arbetande hushallsugn |
| US4665306A (en) * | 1985-04-04 | 1987-05-12 | Kimberly-Clark Corporation | Apparatus for activating heat shrinkable ribbon on disposable garments and other articles |
| US4680450A (en) * | 1985-07-30 | 1987-07-14 | Kimberly-Clark Corporation | Apparatus for controlling the heating of composite materials |
| US4820906A (en) * | 1987-03-13 | 1989-04-11 | Peak Systems, Inc. | Long arc lamp for semiconductor heating |
| US4755654A (en) * | 1987-03-26 | 1988-07-05 | Crowley John L | Semiconductor wafer heating chamber |
-
1990
- 1990-03-23 US US07/498,670 patent/US5073698A/en not_active Expired - Lifetime
-
1991
- 1991-03-20 DE DE4109165A patent/DE4109165A1/de not_active Withdrawn
- 1991-03-21 IT ITRM910186A patent/IT1246117B/it active IP Right Grant
- 1991-03-22 NL NL9100518A patent/NL9100518A/nl not_active Application Discontinuation
- 1991-03-22 JP JP03058766A patent/JP3086489B2/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| IT1246117B (it) | 1994-11-15 |
| JP3086489B2 (ja) | 2000-09-11 |
| ITRM910186A1 (it) | 1992-09-21 |
| DE4109165A1 (de) | 1991-09-26 |
| NL9100518A (nl) | 1991-10-16 |
| US5073698A (en) | 1991-12-17 |
| JPH0594995A (ja) | 1993-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ITRM910186A1 (it) | Procedimento per riscaldare in modo selettivo un film su un substrato. | |
| DE69106225D1 (de) | Integrierte Schaltungseinheit mit flexiblem Substrat. | |
| DE69021799D1 (de) | Druckfilm. | |
| DE68909620D1 (de) | Dünnschichtmusterstruktur. | |
| DE69019051D1 (de) | Dünnfilm-Elektrolumineszenzvorrichtung. | |
| DE59106843D1 (de) | Walze mit Heizeinrichtung. | |
| NO911477L (no) | Elektronisk oppvarmet slange. | |
| DE69111284D1 (de) | Druckvorrichtung. | |
| DE68915288D1 (de) | Epitaktischer supraleitender ba-y-cu-o-film. | |
| DE68903504D1 (de) | Maskenfilm. | |
| NO910946L (no) | Fremgangsmaate for estimering av poretrykk i en undergrunnsformasjon. | |
| NL194687B (nl) | Antireflectiefilm. | |
| FI901153A0 (fi) | Foerfarande foer boejning av roer. | |
| DE59101308D1 (de) | Solarkarussell. | |
| ITRM910187A1 (it) | Metodo per effettuare in modo selettivo l'indurimento di un film su un substrato. | |
| FI914140A0 (fi) | Mellanlagringsanordning foer film. | |
| AR244465A1 (es) | Un disipador termico. | |
| IT1242156B (it) | Complesso pedivella-pedale perfezionato. | |
| DE69110746D1 (de) | Gasbeheiztes Gerät. | |
| FI893784A0 (fi) | Med en diskontinuerlig film foersedda optiska minnesmedia. | |
| DE69007412D1 (de) | Folienträger. | |
| KR910020491A (ko) | 전사용 볼록판 및 이 전사용 볼록판에 의한 전사방법 | |
| FI872440A7 (fi) | Kalvo, jossa on kiinnisulatettava kerros | |
| IT1235478B (it) | Dorso con elementi riscaldanti per pellicola a sviluppo immediato. | |
| GB9003815D0 (en) | Stick on d.x.rerating labels for 35mm films |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted |