ITRM910186A0 - Procedimento per riscaldare in modo selettivo un film su un substrato. - Google Patents

Procedimento per riscaldare in modo selettivo un film su un substrato.

Info

Publication number
ITRM910186A0
ITRM910186A0 IT91RM186A ITRM910186A ITRM910186A0 IT RM910186 A0 ITRM910186 A0 IT RM910186A0 IT 91RM186 A IT91RM186 A IT 91RM186A IT RM910186 A ITRM910186 A IT RM910186A IT RM910186 A0 ITRM910186 A0 IT RM910186A0
Authority
IT
Italy
Prior art keywords
procedure
substrate
film
selectively heating
selectively
Prior art date
Application number
IT91RM186A
Other languages
English (en)
Inventor
Timothy J Stultz
Original Assignee
Peak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23982021&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ITRM910186(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Peak Systems Inc filed Critical Peak Systems Inc
Publication of ITRM910186A0 publication Critical patent/ITRM910186A0/it
Publication of ITRM910186A1 publication Critical patent/ITRM910186A1/it
Application granted granted Critical
Publication of IT1246117B publication Critical patent/IT1246117B/it

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2922Materials being non-crystalline insulating materials, e.g. glass or polymers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H10P14/3428Sulfides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/382Scanning of a beam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0436Apparatus for thermal treatment mainly by radiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/543Solar cells from Group II-VI materials
ITRM910186A 1990-03-23 1991-03-21 Procedimento per riscaldare in modo selettivo un film su un substrato. IT1246117B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/498,670 US5073698A (en) 1990-03-23 1990-03-23 Method for selectively heating a film on a substrate

Publications (3)

Publication Number Publication Date
ITRM910186A0 true ITRM910186A0 (it) 1991-03-21
ITRM910186A1 ITRM910186A1 (it) 1992-09-21
IT1246117B IT1246117B (it) 1994-11-15

Family

ID=23982021

Family Applications (1)

Application Number Title Priority Date Filing Date
ITRM910186A IT1246117B (it) 1990-03-23 1991-03-21 Procedimento per riscaldare in modo selettivo un film su un substrato.

Country Status (5)

Country Link
US (1) US5073698A (it)
JP (1) JP3086489B2 (it)
DE (1) DE4109165A1 (it)
IT (1) IT1246117B (it)
NL (1) NL9100518A (it)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US5234484A (en) * 1992-02-24 1993-08-10 Itt Corporation Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor
US5336641A (en) * 1992-03-17 1994-08-09 Aktis Corporation Rapid thermal annealing using thermally conductive overcoat
US5561735A (en) * 1994-08-30 1996-10-01 Vortek Industries Ltd. Rapid thermal processing apparatus and method
JP3507600B2 (ja) * 1995-10-05 2004-03-15 理想科学工業株式会社 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物
US6177127B1 (en) * 1995-12-15 2001-01-23 Micron Technology, Inc. Method of monitoring emissivity
US5751896A (en) * 1996-02-22 1998-05-12 Micron Technology, Inc. Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition
JPH1086545A (ja) * 1996-09-13 1998-04-07 Riso Kagaku Corp 感熱孔版原紙製版用組成物及び製版方法
US5904566A (en) * 1997-06-09 1999-05-18 Taiwan Semiconductor Manufacturing Company, Ltd. Reactive ion etch method for forming vias through nitrogenated silicon oxide layers
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US6080965A (en) * 1997-09-18 2000-06-27 Tokyo Electron Limited Single-substrate-heat-treatment apparatus in semiconductor processing system
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers
US5970214A (en) 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US6236021B1 (en) * 1998-07-01 2001-05-22 Intevac, Inc. Substrate transport assembly for rapid thermal processing system
US6210484B1 (en) 1998-09-09 2001-04-03 Steag Rtp Systems, Inc. Heating device containing a multi-lamp cone for heating semiconductor wafers
US6771895B2 (en) 1999-01-06 2004-08-03 Mattson Technology, Inc. Heating device for heating semiconductor wafers in thermal processing chambers
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
CN1363116A (zh) * 2000-02-08 2002-08-07 松下电器产业株式会社 灯泡退火装置和显示元件用基片
US6376806B2 (en) * 2000-05-09 2002-04-23 Woo Sik Yoo Flash anneal
US6337467B1 (en) * 2000-05-09 2002-01-08 Wafermasters, Inc. Lamp based scanning rapid thermal processing
SE0004296D0 (sv) * 2000-11-23 2000-11-23 Gyros Ab Device and method for the controlled heating in micro channel systems
TWI313059B (it) * 2000-12-08 2009-08-01 Sony Corporatio
US7255899B2 (en) 2001-11-12 2007-08-14 Dainippon Screen Mfg. Co., Ltd. Heat treatment apparatus and heat treatment method of substrate
KR20030052833A (ko) * 2001-12-21 2003-06-27 동부전자 주식회사 반도체 소자 제조방법
JP2005515425A (ja) 2001-12-26 2005-05-26 ボルテック インダストリーズ リミテッド 温度測定および熱処理方法およびシステム
ES2282657T3 (es) 2002-05-17 2007-10-16 Jason E. Schripsema Modulo fotovoltaico con disipador de calor ajustable y procedimiento de fabricacion.
JP2004031557A (ja) * 2002-06-25 2004-01-29 Ushio Inc 光加熱装置
KR20120045040A (ko) 2002-12-20 2012-05-08 맷슨 테크날러지 캐나다 인코퍼레이티드 피가공물 지지 방법
US20040253839A1 (en) * 2003-06-11 2004-12-16 Tokyo Electron Limited Semiconductor manufacturing apparatus and heat treatment method
WO2005059991A1 (en) 2003-12-19 2005-06-30 Mattson Technology Canada Inc. Apparatuses and methods for suppressing thermally induced motion of a workpiece
TWI249588B (en) * 2004-08-11 2006-02-21 Ind Tech Res Inst One kind of cavity apparatus of energy wave reflection device
DE102005010005A1 (de) * 2005-03-04 2006-12-28 Nunner, Dieter Vorrichtung und Verfahren zur Beschichtung von Kleinteilen
JP5967859B2 (ja) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
CN102089873A (zh) 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
IN2012DN01719A (it) * 2009-08-21 2015-06-05 First Solar Inc
JP5559656B2 (ja) * 2010-10-14 2014-07-23 大日本スクリーン製造株式会社 熱処理装置および熱処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2824943A (en) * 1954-06-28 1958-02-25 Myron P Laughlin Bakery product heater
US3249741A (en) * 1963-05-20 1966-05-03 Reflectotherm Inc Apparatus for baking by differential wave lengths
SE8200685L (sv) * 1982-02-05 1983-08-06 Electrolux Ab Med infrarod stralning arbetande hushallsugn
US4665306A (en) * 1985-04-04 1987-05-12 Kimberly-Clark Corporation Apparatus for activating heat shrinkable ribbon on disposable garments and other articles
US4680450A (en) * 1985-07-30 1987-07-14 Kimberly-Clark Corporation Apparatus for controlling the heating of composite materials
US4820906A (en) * 1987-03-13 1989-04-11 Peak Systems, Inc. Long arc lamp for semiconductor heating
US4755654A (en) * 1987-03-26 1988-07-05 Crowley John L Semiconductor wafer heating chamber

Also Published As

Publication number Publication date
IT1246117B (it) 1994-11-15
JP3086489B2 (ja) 2000-09-11
ITRM910186A1 (it) 1992-09-21
DE4109165A1 (de) 1991-09-26
NL9100518A (nl) 1991-10-16
US5073698A (en) 1991-12-17
JPH0594995A (ja) 1993-04-16

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