ITTO20010540A0 - Dispositivo elettronico e relativo processo di fabbricazione. - Google Patents

Dispositivo elettronico e relativo processo di fabbricazione.

Info

Publication number
ITTO20010540A0
ITTO20010540A0 IT2001TO000540A ITTO20010540A ITTO20010540A0 IT TO20010540 A0 ITTO20010540 A0 IT TO20010540A0 IT 2001TO000540 A IT2001TO000540 A IT 2001TO000540A IT TO20010540 A ITTO20010540 A IT TO20010540A IT TO20010540 A0 ITTO20010540 A0 IT TO20010540A0
Authority
IT
Italy
Prior art keywords
electronic device
manufacturing process
related manufacturing
electronic
manufacturing
Prior art date
Application number
IT2001TO000540A
Other languages
English (en)
Inventor
Eugenio Faggioli
Riccardo Groppo
Mario Palazzetti
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Priority to IT2001TO000540A priority Critical patent/ITTO20010540A1/it
Publication of ITTO20010540A0 publication Critical patent/ITTO20010540A0/it
Priority to EP02741171A priority patent/EP1412983A2/en
Priority to AU2002314532A priority patent/AU2002314532A1/en
Priority to PCT/IT2002/000367 priority patent/WO2002099883A2/en
Publication of ITTO20010540A1 publication Critical patent/ITTO20010540A1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
IT2001TO000540A 2001-06-05 2001-06-05 Dispositivo elettronico e relativo processo di fabbricazione. ITTO20010540A1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT2001TO000540A ITTO20010540A1 (it) 2001-06-05 2001-06-05 Dispositivo elettronico e relativo processo di fabbricazione.
EP02741171A EP1412983A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method
AU2002314532A AU2002314532A1 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method
PCT/IT2002/000367 WO2002099883A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2001TO000540A ITTO20010540A1 (it) 2001-06-05 2001-06-05 Dispositivo elettronico e relativo processo di fabbricazione.

Publications (2)

Publication Number Publication Date
ITTO20010540A0 true ITTO20010540A0 (it) 2001-06-05
ITTO20010540A1 ITTO20010540A1 (it) 2002-12-05

Family

ID=11458933

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2001TO000540A ITTO20010540A1 (it) 2001-06-05 2001-06-05 Dispositivo elettronico e relativo processo di fabbricazione.

Country Status (4)

Country Link
EP (1) EP1412983A2 (it)
AU (1) AU2002314532A1 (it)
IT (1) ITTO20010540A1 (it)
WO (1) WO2002099883A2 (it)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
JP2001183080A (ja) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The 圧縮メッシュウイックの製造方法、および、圧縮メッシュウイックを備えた平面型ヒートパイプ

Also Published As

Publication number Publication date
WO2002099883A2 (en) 2002-12-12
AU2002314532A1 (en) 2002-12-16
ITTO20010540A1 (it) 2002-12-05
WO2002099883A3 (en) 2004-03-04
EP1412983A2 (en) 2004-04-28

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