ITTO20020277A0 - Dispositivo di rilevazione della temperatura di componenti elettronici. - Google Patents

Dispositivo di rilevazione della temperatura di componenti elettronici.

Info

Publication number
ITTO20020277A0
ITTO20020277A0 IT2002TO000277A ITTO20020277A ITTO20020277A0 IT TO20020277 A0 ITTO20020277 A0 IT TO20020277A0 IT 2002TO000277 A IT2002TO000277 A IT 2002TO000277A IT TO20020277 A ITTO20020277 A IT TO20020277A IT TO20020277 A0 ITTO20020277 A0 IT TO20020277A0
Authority
IT
Italy
Prior art keywords
detecting
temperature
electronic components
electronic
components
Prior art date
Application number
IT2002TO000277A
Other languages
English (en)
Inventor
Luciano Marchitto
Wilmer Giorgis
Gaetano Siciliano
Original Assignee
Btm S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Btm S R L filed Critical Btm S R L
Priority to IT2002TO000277A priority Critical patent/ITTO20020277A1/it
Publication of ITTO20020277A0 publication Critical patent/ITTO20020277A0/it
Priority to EP03006548A priority patent/EP1349209A3/en
Publication of ITTO20020277A1 publication Critical patent/ITTO20020277A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
IT2002TO000277A 2002-03-28 2002-03-28 Dispositivo di rilevazione della temperatura di componenti elettronici. ITTO20020277A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT2002TO000277A ITTO20020277A1 (it) 2002-03-28 2002-03-28 Dispositivo di rilevazione della temperatura di componenti elettronici.
EP03006548A EP1349209A3 (en) 2002-03-28 2003-03-24 Surveying device for the temperature of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2002TO000277A ITTO20020277A1 (it) 2002-03-28 2002-03-28 Dispositivo di rilevazione della temperatura di componenti elettronici.

Publications (2)

Publication Number Publication Date
ITTO20020277A0 true ITTO20020277A0 (it) 2002-03-28
ITTO20020277A1 ITTO20020277A1 (it) 2003-09-29

Family

ID=27638962

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2002TO000277A ITTO20020277A1 (it) 2002-03-28 2002-03-28 Dispositivo di rilevazione della temperatura di componenti elettronici.

Country Status (2)

Country Link
EP (1) EP1349209A3 (it)
IT (1) ITTO20020277A1 (it)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476943A (ja) * 1990-07-18 1992-03-11 Nec Corp 半導体素子
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
DE19708653C2 (de) * 1997-03-04 1999-07-08 Telefunken Microelectron Vorrichtung zur Bestimmung der Temperatur mindestens eines auf einem Trägerkörper mit geringer Wärmeleitfähigkeit angeordneten Halbleiterbauelements

Also Published As

Publication number Publication date
EP1349209A3 (en) 2006-05-24
ITTO20020277A1 (it) 2003-09-29
EP1349209A2 (en) 2003-10-01

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