ITTO20040517A1 - Struttura dissipatrice del calore per dispositivi elettronici e simili - Google Patents

Struttura dissipatrice del calore per dispositivi elettronici e simili

Info

Publication number
ITTO20040517A1
ITTO20040517A1 IT000517A ITTO20040517A ITTO20040517A1 IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1 IT 000517 A IT000517 A IT 000517A IT TO20040517 A ITTO20040517 A IT TO20040517A IT TO20040517 A1 ITTO20040517 A1 IT TO20040517A1
Authority
IT
Italy
Prior art keywords
electronic
heat dissipating
similar devices
dissipating structure
similar
Prior art date
Application number
IT000517A
Other languages
English (en)
Inventor
Luciano Marchitto
Original Assignee
Johnson Electric Moncalieri Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Electric Moncalieri Srl filed Critical Johnson Electric Moncalieri Srl
Priority to IT000517A priority Critical patent/ITTO20040517A1/it
Publication of ITTO20040517A1 publication Critical patent/ITTO20040517A1/it
Priority to PCT/EP2005/053553 priority patent/WO2006008315A2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
IT000517A 2004-07-23 2004-07-23 Struttura dissipatrice del calore per dispositivi elettronici e simili ITTO20040517A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT000517A ITTO20040517A1 (it) 2004-07-23 2004-07-23 Struttura dissipatrice del calore per dispositivi elettronici e simili
PCT/EP2005/053553 WO2006008315A2 (en) 2004-07-23 2005-07-21 A heat-sink structure for electronic devices and the like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000517A ITTO20040517A1 (it) 2004-07-23 2004-07-23 Struttura dissipatrice del calore per dispositivi elettronici e simili

Publications (1)

Publication Number Publication Date
ITTO20040517A1 true ITTO20040517A1 (it) 2004-10-23

Family

ID=34972894

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000517A ITTO20040517A1 (it) 2004-07-23 2004-07-23 Struttura dissipatrice del calore per dispositivi elettronici e simili

Country Status (2)

Country Link
IT (1) ITTO20040517A1 (it)
WO (1) WO2006008315A2 (it)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2902771A1 (de) * 1978-07-21 1980-01-31 Bbc Brown Boveri & Cie Kuehlvorrichtung fuer halbleiterbauelemente
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
JPH09312361A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
DE19908749A1 (de) * 1999-02-20 2000-08-31 Daimler Chrysler Ag Verfahren zur Erzielung einer gleichmäßigen Temperaturverteilung bei auf einen Träger aufgelöteten Halbleiter-Elementen
US6942025B2 (en) * 2000-09-20 2005-09-13 Degree Controls, Inc. Uniform heat dissipating and cooling heat sink

Also Published As

Publication number Publication date
WO2006008315A2 (en) 2006-01-26
WO2006008315A8 (en) 2006-05-11
WO2006008315A3 (en) 2006-08-10

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