ITTO920613A1 - Supporto rivestito con diamante. - Google Patents
Supporto rivestito con diamante.Info
- Publication number
- ITTO920613A1 ITTO920613A1 IT000613A ITTO920613A ITTO920613A1 IT TO920613 A1 ITTO920613 A1 IT TO920613A1 IT 000613 A IT000613 A IT 000613A IT TO920613 A ITTO920613 A IT TO920613A IT TO920613 A1 ITTO920613 A1 IT TO920613A1
- Authority
- IT
- Italy
- Prior art keywords
- diamond
- support coated
- coated
- support
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H10P72/155—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterised by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73479491A | 1991-07-23 | 1991-07-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITTO920613A0 ITTO920613A0 (it) | 1992-07-17 |
| ITTO920613A1 true ITTO920613A1 (it) | 1994-01-17 |
| IT1257386B IT1257386B (it) | 1996-01-15 |
Family
ID=24953096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITTO920613A IT1257386B (it) | 1991-07-23 | 1992-07-17 | Supporto rivestito con diamante. |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH05198664A (it) |
| KR (1) | KR930003300A (it) |
| DE (1) | DE4223326A1 (it) |
| FR (1) | FR2679524A1 (it) |
| GB (1) | GB2257986A (it) |
| IT (1) | IT1257386B (it) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4300205A1 (de) * | 1993-01-07 | 1994-07-14 | Deutsche Bundespost Telekom | Probenhalterung in Kassettenform |
| US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
| JP3282584B2 (ja) * | 1998-06-02 | 2002-05-13 | 信越ポリマー株式会社 | 精密部材用収納容器 |
| JP2002046793A (ja) * | 2000-04-26 | 2002-02-12 | Asahi Glass Co Ltd | 光学部材用収納ケース |
| DE10149037A1 (de) * | 2001-10-05 | 2003-04-24 | Infineon Technologies Ag | Waferhorde und Verfahren |
| DE10215283B4 (de) * | 2002-04-05 | 2004-06-03 | Astec Halbleitertechnologie Gmbh | Vorrichtung zur Aufnahme von Substraten |
| JP4616086B2 (ja) * | 2005-06-14 | 2011-01-19 | 東芝物流株式会社 | パネル状物品の収納トレイ |
| DE102010041230A1 (de) * | 2010-09-23 | 2012-03-29 | Evonik Degussa Gmbh | Verwendung von Diamond Like Carbon Schichten bei der Aufbringung metallionenfreier Halbleitertinten |
| CN111270218B (zh) * | 2020-01-23 | 2021-07-06 | 电子科技大学 | 化学气相沉积碳修饰片状FeSiAl合金的制备方法 |
| EP3929969B1 (de) * | 2020-06-22 | 2023-12-06 | Siltronic AG | Verfahren zum herstellen eines prozessbehälters für halbleiterwerkstücke und prozessbehälter |
| EP4068343A1 (de) * | 2021-04-01 | 2022-10-05 | Siltronic AG | Vorrichtung zum transport von halbleiterscheiben |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2514743B1 (fr) * | 1981-10-21 | 1986-05-09 | Rca Corp | Pellicule amorphe a base de carbone, du type diamant, et son procede de fabrication |
| US4872554A (en) * | 1987-07-02 | 1989-10-10 | Fluoroware, Inc. | Reinforced carrier with embedded rigid insert |
| JPH01201095A (ja) * | 1988-02-04 | 1989-08-14 | Idemitsu Petrochem Co Ltd | ダイヤモンド状炭素膜とその製造方法 |
| JPH01259172A (ja) * | 1988-04-09 | 1989-10-16 | Idemitsu Petrochem Co Ltd | 粉砕機 |
| JPH02186656A (ja) * | 1989-01-13 | 1990-07-20 | Hitachi Ltd | 低発塵装置 |
| JP2816864B2 (ja) * | 1989-07-07 | 1998-10-27 | 大塚化学株式会社 | 搬送用ウエーハバスケット及び収納ケース |
-
1992
- 1992-07-09 KR KR1019920012200A patent/KR930003300A/ko not_active Withdrawn
- 1992-07-10 GB GB9214697A patent/GB2257986A/en not_active Withdrawn
- 1992-07-16 DE DE4223326A patent/DE4223326A1/de not_active Withdrawn
- 1992-07-17 IT ITTO920613A patent/IT1257386B/it active IP Right Grant
- 1992-07-22 JP JP21642692A patent/JPH05198664A/ja active Pending
- 1992-07-22 FR FR9209037A patent/FR2679524A1/fr active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR930003300A (ko) | 1993-02-24 |
| GB9214697D0 (en) | 1992-08-19 |
| DE4223326A1 (de) | 1993-01-28 |
| JPH05198664A (ja) | 1993-08-06 |
| FR2679524A1 (fr) | 1993-01-29 |
| IT1257386B (it) | 1996-01-15 |
| ITTO920613A0 (it) | 1992-07-17 |
| GB2257986A (en) | 1993-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted |