ITTO991144A0 - Piatra di vetro ceramica. - Google Patents

Piatra di vetro ceramica.

Info

Publication number
ITTO991144A0
ITTO991144A0 IT99TO001144A ITTO991144A ITTO991144A0 IT TO991144 A0 ITTO991144 A0 IT TO991144A0 IT 99TO001144 A IT99TO001144 A IT 99TO001144A IT TO991144 A ITTO991144 A IT TO991144A IT TO991144 A0 ITTO991144 A0 IT TO991144A0
Authority
IT
Italy
Prior art keywords
glass plate
ceramic glass
ceramic
plate
glass
Prior art date
Application number
IT99TO001144A
Other languages
English (en)
Inventor
Hideaki Nakai
Hirofumi Sunahara
Sadaaki Sakamoto
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of ITTO991144A0 publication Critical patent/ITTO991144A0/it
Publication of ITTO991144A1 publication Critical patent/ITTO991144A1/it
Application granted granted Critical
Publication of IT1311273B1 publication Critical patent/IT1311273B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/20—Glass-ceramics matrix
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
  • Glass Compositions (AREA)
  • Table Devices Or Equipment (AREA)
IT1999TO001144A 1998-12-24 1999-12-23 Piatra di vetro ceramica. IT1311273B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36701598A JP3528037B2 (ja) 1998-12-24 1998-12-24 ガラスセラミック基板の製造方法

Publications (3)

Publication Number Publication Date
ITTO991144A0 true ITTO991144A0 (it) 1999-12-23
ITTO991144A1 ITTO991144A1 (it) 2001-06-23
IT1311273B1 IT1311273B1 (it) 2002-03-12

Family

ID=18488258

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999TO001144A IT1311273B1 (it) 1998-12-24 1999-12-23 Piatra di vetro ceramica.

Country Status (5)

Country Link
US (1) US6414247B1 (it)
JP (1) JP3528037B2 (it)
CN (1) CN1181710C (it)
DE (1) DE19961537B4 (it)
IT (1) IT1311273B1 (it)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020091785A (ko) * 2001-05-31 2002-12-06 니혼도꾸슈도교 가부시키가이샤 전자부품 및 이것을 사용한 이동체 통신장치
US7417001B2 (en) 2004-03-01 2008-08-26 Murata Manufacturing Co., Ltd Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
CN1826299B (zh) 2004-03-01 2010-06-16 株式会社村田制作所 绝缘体陶瓷组合物、绝缘性陶瓷烧结体及层叠型陶瓷电子部件
US7368408B2 (en) 2004-03-01 2008-05-06 Murata Manufacturing Co., Ltd. Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
US7439202B2 (en) 2004-03-01 2008-10-21 Murata Manufacturing Co., Ltd. Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
JP4145262B2 (ja) * 2004-03-23 2008-09-03 三洋電機株式会社 積層セラミック基板
KR100624943B1 (ko) * 2004-10-28 2006-09-15 삼성에스디아이 주식회사 배터리 팩의 보호회로기판
JP4701761B2 (ja) * 2005-03-15 2011-06-15 パナソニック株式会社 セラミック多層基板およびそれを用いたパワーアンプモジュール
JP4843823B2 (ja) * 2005-07-29 2011-12-21 田中貴金属工業株式会社 絶縁ペースト
EP1921904B1 (en) * 2005-08-29 2013-06-12 Murata Manufacturing Co., Ltd. Ceramic electronic component and method for manufacturing the same
JP4814703B2 (ja) * 2006-06-20 2011-11-16 京セラ株式会社 回路基板
US20080311360A1 (en) * 2006-12-18 2008-12-18 Koa Corporation Thick film circuit component and method for manufacturing the same
US7749592B2 (en) * 2007-02-06 2010-07-06 Tdk Corpoation Multilayer ceramic substrate
RU2384027C2 (ru) * 2008-02-20 2010-03-10 Государственное образовательное учреждение высшего профессионального образования "Новосибирский государственный технический университет" Способ изготовления микросхем
CN102186792B (zh) * 2008-10-14 2014-12-31 松下电器产业株式会社 陶瓷层叠部件及其制造方法
JP2011040604A (ja) * 2009-08-12 2011-02-24 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
CN103971866B (zh) * 2014-05-20 2017-04-12 立昌先进科技股份有限公司 一种具滤波结构的变阻器
WO2017094335A1 (ja) * 2015-11-30 2017-06-08 株式会社村田製作所 多層セラミック基板及び電子部品
EP3421437A4 (en) * 2016-02-25 2019-11-13 Agc Inc. GLASS WITH EXCEPTIONAL RISK RESISTANCE
CN109156083B (zh) * 2016-05-17 2021-04-02 株式会社村田制作所 多层陶瓷基板及电子装置
TW201817280A (zh) 2016-07-06 2018-05-01 亮銳公司 用於整合式發光二極體驅動器之印刷電路板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3015356A1 (de) * 1980-04-22 1981-10-29 Robert Bosch Gmbh, 7000 Stuttgart Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen
US4882212A (en) * 1986-10-30 1989-11-21 Olin Corporation Electronic packaging of components incorporating a ceramic-glass-metal composite
US4986945A (en) * 1987-01-07 1991-01-22 Lanxide Technology Company, Lp Method for producing mold-shaped ceramic bodies
JP2610487B2 (ja) * 1988-06-10 1997-05-14 株式会社日立製作所 セラミック積層回路基板
US5167271A (en) * 1988-10-20 1992-12-01 Lange Frederick F Method to produce ceramic reinforced or ceramic-metal matrix composite articles
US4906514A (en) * 1988-11-21 1990-03-06 Corning Incorporated Metallized substrate for electronic device
US5194196A (en) * 1989-10-06 1993-03-16 International Business Machines Corporation Hermetic package for an electronic device and method of manufacturing same
US5216207A (en) * 1991-02-27 1993-06-01 David Sarnoff Research Center, Inc. Low temperature co-fired multilayer ceramic circuit boards with silver conductors
JP2624149B2 (ja) 1993-11-09 1997-06-25 住友金属鉱山株式会社 低温焼成ガラスセラミック基板用組成物
DE19500235A1 (de) * 1995-01-05 1996-07-11 Roth Technik Gmbh Abdeckschicht für elektrische Leiter oder Halbleiter
JPH09283654A (ja) * 1996-04-17 1997-10-31 Nec Corp ガラスセラミック基板とその製造方法

Also Published As

Publication number Publication date
CN1181710C (zh) 2004-12-22
DE19961537A1 (de) 2000-06-29
US6414247B1 (en) 2002-07-02
ITTO991144A1 (it) 2001-06-23
DE19961537B4 (de) 2006-02-09
IT1311273B1 (it) 2002-03-12
JP2000185978A (ja) 2000-07-04
JP3528037B2 (ja) 2004-05-17
CN1258188A (zh) 2000-06-28

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