ITUB20169901A1 - Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente - Google Patents

Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente

Info

Publication number
ITUB20169901A1
ITUB20169901A1 ITUB2016A009901A ITUB20169901A ITUB20169901A1 IT UB20169901 A1 ITUB20169901 A1 IT UB20169901A1 IT UB2016A009901 A ITUB2016A009901 A IT UB2016A009901A IT UB20169901 A ITUB20169901 A IT UB20169901A IT UB20169901 A1 ITUB20169901 A1 IT UB20169901A1
Authority
IT
Italy
Prior art keywords
lighting
procedure
carrying
case
corresponding envelope
Prior art date
Application number
ITUB2016A009901A
Other languages
English (en)
Inventor
Alessio Sagliocco
Fabrizio Cacchione
Original Assignee
Osram Gmbh
Osram Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh, Osram Spa filed Critical Osram Gmbh
Priority to ITUB2016A009901A priority Critical patent/ITUB20169901A1/it
Priority to EP16207382.9A priority patent/EP3190339B1/en
Publication of ITUB20169901A1 publication Critical patent/ITUB20169901A1/it

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
ITUB2016A009901A 2016-01-11 2016-01-11 Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente ITUB20169901A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITUB2016A009901A ITUB20169901A1 (it) 2016-01-11 2016-01-11 Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente
EP16207382.9A EP3190339B1 (en) 2016-01-11 2016-12-29 A method of providing a housing for lighting devices and corresponding housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUB2016A009901A ITUB20169901A1 (it) 2016-01-11 2016-01-11 Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente

Publications (1)

Publication Number Publication Date
ITUB20169901A1 true ITUB20169901A1 (it) 2017-07-11

Family

ID=55861077

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUB2016A009901A ITUB20169901A1 (it) 2016-01-11 2016-01-11 Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente

Country Status (2)

Country Link
EP (1) EP3190339B1 (it)
IT (1) ITUB20169901A1 (it)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006017718A1 (de) * 2005-10-27 2007-05-16 Kromberg & Schubert Gmbh & Co Leuchte
WO2011155851A1 (en) * 2010-06-07 2011-12-15 Velu Pannirselvam A L Led lamp and method of manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2464153A1 (en) 2003-04-14 2004-10-14 Integral Technologies, Inc. Low cost lighting circuits manufactured from conductive loaded resin-based materials
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
JP4920288B2 (ja) 2005-12-23 2012-04-18 帝国通信工業株式会社 電子部品の回路基板への取付構造及び取付方法
US7489761B2 (en) 2006-03-27 2009-02-10 Hologic, Inc. Breast compression for digital mammography, tomosynthesis and other modalities
IT1396077B1 (it) 2009-10-16 2012-11-09 Automotive Lighting Italia Spa Dispositivo di illuminazione per veicoli, in particolare autoveicoli, utilizzante diodi led
WO2011050256A1 (en) 2009-10-22 2011-04-28 Thermal Solution Resources, Llc Overmolded led light assembly and method of manufacture
EP2432038A1 (en) 2010-09-17 2012-03-21 Liang Meng Plastic Share Co. Ltd. Light emitting diode package structure
EP2827687B1 (en) 2013-07-15 2019-03-13 OSRAM GmbH A method of producing a support structure for lightning devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006017718A1 (de) * 2005-10-27 2007-05-16 Kromberg & Schubert Gmbh & Co Leuchte
WO2011155851A1 (en) * 2010-06-07 2011-12-15 Velu Pannirselvam A L Led lamp and method of manufacturing the same

Also Published As

Publication number Publication date
EP3190339A1 (en) 2017-07-12
EP3190339A8 (en) 2017-10-18
EP3190339B1 (en) 2018-10-31

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