JP1643025S - - Google Patents

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Publication number
JP1643025S
JP1643025S JPD2019-5629F JP2019005629F JP1643025S JP 1643025 S JP1643025 S JP 1643025S JP 2019005629 F JP2019005629 F JP 2019005629F JP 1643025 S JP1643025 S JP 1643025S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-5629F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-5629F priority Critical patent/JP1643025S/ja
Priority to US29/705,412 priority patent/USD904991S1/en
Application granted granted Critical
Publication of JP1643025S publication Critical patent/JP1643025S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-5629F 2019-03-15 2019-03-15 Active JP1643025S (2)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-5629F JP1643025S (2) 2019-03-15 2019-03-15
US29/705,412 USD904991S1 (en) 2019-03-15 2019-09-11 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-5629F JP1643025S (2) 2019-03-15 2019-03-15

Publications (1)

Publication Number Publication Date
JP1643025S true JP1643025S (2) 2019-10-07

Family

ID=68095649

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-5629F Active JP1643025S (2) 2019-03-15 2019-03-15

Country Status (2)

Country Link
US (1) USD904991S1 (2)
JP (1) JP1643025S (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1643024S (2) * 2019-03-15 2019-10-07
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
JP1682283S (2) * 2020-07-31 2021-03-29
JP1680788S (2) * 2020-07-31 2021-03-08

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
JP5041798B2 (ja) * 2006-12-15 2012-10-03 三菱電機株式会社 半導体装置
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
JP6382097B2 (ja) * 2014-12-24 2018-08-29 株式会社 日立パワーデバイス 半導体パワーモジュールおよびそれを用いた電力変換装置
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
JP6362560B2 (ja) * 2015-03-24 2018-07-25 三菱電機株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
JP1632173S (2) * 2018-06-01 2019-05-27

Also Published As

Publication number Publication date
USD904991S1 (en) 2020-12-15

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