JP1717341S - 基板保持リング - Google Patents
基板保持リングInfo
- Publication number
- JP1717341S JP1717341S JP2020027291F JP2020027291F JP1717341S JP 1717341 S JP1717341 S JP 1717341S JP 2020027291 F JP2020027291 F JP 2020027291F JP 2020027291 F JP2020027291 F JP 2020027291F JP 1717341 S JP1717341 S JP 1717341S
- Authority
- JP
- Japan
- Prior art keywords
- retaining ring
- board retaining
- substrate
- board
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Abstract
本物品は、例えば、「使用状態を示す参考図」に示すように、半導体等の製造における基板研磨工程において、ウエハ等の基板をリング内に保持し、基板の片面を研磨するために用いるものである。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020027291F JP1717341S (ja) | 2020-12-18 | 2020-12-18 | 基板保持リング |
| TW110303146F TWD215851S (zh) | 2020-12-18 | 2021-06-17 | 基板保持環 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020027291F JP1717341S (ja) | 2020-12-18 | 2020-12-18 | 基板保持リング |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1717341S true JP1717341S (ja) | 2022-06-14 |
Family
ID=81988394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020027291F Active JP1717341S (ja) | 2020-12-18 | 2020-12-18 | 基板保持リング |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1717341S (ja) |
| TW (1) | TWD215851S (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1781446S (ja) | 2024-06-13 | 2024-10-03 | 半導体ウェハ研磨用リテーナリング | |
| JP1781445S (ja) | 2024-06-13 | 2024-10-03 | 半導体ウェハ研磨用リテーナリング |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1639752S (ja) | 2018-09-26 | 2019-08-26 | 基板保持リング | |
| JP1643942S (ja) | 2018-12-10 | 2019-10-21 | 基板保持リング |
-
2020
- 2020-12-18 JP JP2020027291F patent/JP1717341S/ja active Active
-
2021
- 2021-06-17 TW TW110303146F patent/TWD215851S/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD215851S (zh) | 2021-12-01 |
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