JP1728449S - 基板処理装置 - Google Patents

基板処理装置

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Publication number
JP1728449S
JP1728449S JP2022006811F JP2022006811F JP1728449S JP 1728449 S JP1728449 S JP 1728449S JP 2022006811 F JP2022006811 F JP 2022006811F JP 2022006811 F JP2022006811 F JP 2022006811F JP 1728449 S JP1728449 S JP 1728449S
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JP
Japan
Prior art keywords
substrate processing
lifter
processing equipment
showing
product
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JP2022006811F
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English (en)
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Priority to JP2022006811F priority Critical patent/JP1728449S/ja
Priority to TW111304308F priority patent/TWD234071S/zh
Priority to US29/866,426 priority patent/USD1098056S1/en
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Publication of JP1728449S publication Critical patent/JP1728449S/ja
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Abstract

本物品は、シリコンウェハ等を洗浄するために用いられるもので、使用状態を示す参考図１に示すように複数個並べて使用することができ、処理プロセスに応じて設置個数を自由に増減することができる。 また、使用状態を示す参考図２に示すように、アームにシリコンウェハ等を収納するためのリフターを取り付けることができ、アームが前後・上下に移動して、リフターに収納したシリコンウェハ等を、前後に配置された「薬液の入った槽」及び「純水の入った槽」に順に浸すことで、シリコンウェハ等を洗浄することができる。 さらに、隣り合う別の基板処理装置間を左右に往来移動できる別の搬送機構によって、シリコンウェハ等を隣り合う別の基板処置装置のリフターに移載させることができる。
JP2022006811F 2022-03-30 2022-03-30 基板処理装置 Active JP1728449S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022006811F JP1728449S (ja) 2022-03-30 2022-03-30 基板処理装置
TW111304308F TWD234071S (zh) 2022-03-30 2022-08-30 基板處理裝置
US29/866,426 USD1098056S1 (en) 2022-03-30 2022-09-12 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022006811F JP1728449S (ja) 2022-03-30 2022-03-30 基板処理装置

Publications (1)

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JP1728449S true JP1728449S (ja) 2022-10-27

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ID=83721384

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JP2022006811F Active JP1728449S (ja) 2022-03-30 2022-03-30 基板処理装置

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US (1) USD1098056S1 (ja)
JP (1) JP1728449S (ja)
TW (1) TWD234071S (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1098056S1 (en) * 2022-03-30 2025-10-14 Daikin Fintech, Ltd. Substrate processing apparatus

Family Cites Families (16)

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DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
US6520727B1 (en) * 2000-04-12 2003-02-18 Asyt Technologies, Inc. Modular sorter
JP2001300445A (ja) 2000-04-27 2001-10-30 Smt:Kk 基板の洗浄装置、洗浄方法および洗浄システム
WO2003009347A2 (en) * 2001-07-16 2003-01-30 Asyst Technologies, Inc. Integrated system for tool front-end workpiece handling
US7537425B2 (en) * 2002-12-30 2009-05-26 Tdk Corporation Wafer processing apparatus having dust proof function
TWD119731S1 (zh) * 2006-03-30 2007-11-01 東京威力科創股份有限公司 晶圓輸送機
TWD125940S1 (zh) * 2007-05-16 2008-11-11 東京威力科創股份有限公司 晶圓搬出入機
JP2013529383A (ja) * 2010-05-07 2013-07-18 ナノセミコン カンパニー リミテッド 一体型半導体処理装置
USD652395S1 (en) * 2010-06-01 2012-01-17 Hitachi Kokusai Electric Inc. Semiconductor manufacturing equipment
TWD143036S1 (zh) * 2010-06-01 2011-10-01 日立國際電氣股份有限公司 半導體製造機
WO2022009402A1 (ja) 2020-07-09 2022-01-13 東邦化成株式会社 基板処理装置
TWD216934S (zh) 2021-02-05 2022-02-01 矽碁科技股份有限公司 微型化半導體製程裝置之部分
CN117981054A (zh) * 2021-12-27 2024-05-03 大金优科股份有限公司 基板处理模块和具备基板处理模块的基板处理装置
KR102905038B1 (ko) * 2021-12-27 2025-12-29 다이킨 파인테크 가부시키가이샤 기판 처리 모듈 및 그것을 구비하는 기판 처리 장치
JP1728449S (ja) * 2022-03-30 2022-10-27 基板処理装置
TWD225667S (zh) * 2022-06-30 2023-06-01 大陸商杭州眾硅電子科技有限公司 拋光研磨裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1098056S1 (en) * 2022-03-30 2025-10-14 Daikin Fintech, Ltd. Substrate processing apparatus

Also Published As

Publication number Publication date
USD1098056S1 (en) 2025-10-14
TWD234071S (zh) 2024-10-11

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