JP2000200332A - Manufacturing method of non-contact IC card - Google Patents

Abstract

(57) [Problem] To produce a high-quality non-contact IC card with high productivity by preventing current leakage caused by sinking of an IC chip into a substrate sheet during a laminating step. SOLUTION: A conductive paste is applied to a substrate sheet 1a using a conductive paste.
A circuit pattern 5 including an antenna coil pattern 2 electrically connected to the electrode portions 4a and 4b of the C chip 3 is printed, and the IC chip 3 is mounted so that the electrode portions 4a and 4b are connected to the circuit pattern 5, After the conductive paste is cured, the cover sheet 1b is overlaid on the substrate sheet 1a, and the IC chip 3 is mounted on the substrate sheet 1a. In the range, the electrode portion 4a,
4b and not electrically connected to the IC during the lamination process
In order to prevent the chip 3 from sinking into the substrate sheet 1a, a backup pattern 9 for backing up the IC chip 3 is formed by printing using a conductive paste.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact IC card, for example, a non-contact IC card used for a railway commuter pass, a ski resort lift ticket, a door entry / exit management card, electronic money, and the like. It relates to a manufacturing method.

[0002]

2. Description of the Related Art A non-contact IC card has many advantages such as a large storage capacity and a security function, as well as the convenience that it is not necessary to insert a card into a slot of a card reader. In recent years, it has been widely used for railway commuter passes, ski lift tickets, door entry / exit management cards, electronic money, and the like.

[0003] Non-contact IC cards are classified into contact type, proximity type, proximity type and the like according to the difference in data communication distance, and data communication is generally performed by electromagnetic induction.
Among them, a proximity type non-contact IC card using a short wave having a frequency of 13.56 MHz is expected to be adopted in railway commuter tickets, telephone cards, and the like, and become the mainstream of non-contact IC cards.

[0004] This non-contact IC card has a built-in antenna coil and an IC chip and transmits and receives data to and from the outside via the antenna coil. The coil may be a metal foil such as a silver foil etched or the like. There are copper winding coils and those printed with a conductive paste such as a silver paste, and those printed with a conductive paste to form a circuit pattern are widely used.

Hereinafter, a conventional method for manufacturing a non-contact IC card is specifically shown in FIGS.

As shown in FIG. 14, a conventional non-contact IC card 1 has a circuit pattern 5 (coil pattern 2 and connection circuit pattern 5b) including an antenna coil pattern for transmitting and receiving signals to and from the outside, which is made of polyethylene terephthalate. Is printed with a conductive paste on a substrate sheet 1a made of The electrode part 4a of the IC chip 3 is mounted and connected to the mounting part 7a formed at the inner end of the coil pattern 2, while the mounting part 7b formed on the connection circuit pattern 5b is connected to the other end of the IC chip 3. One electrode part 4b is mounted and connected. The mounting portion 7b is provided at the outer end 5 of the coil pattern 2.
a through a jumper wire 6.

FIG. 1 shows a manufacturing process of the non-contact IC card 1.
5 will be described below with reference to FIGS. 16 and 17.

In step # 1, a circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a using a conductive paste. In the IC chip 3, bumps or plated bumps formed by a wire bonding method are often applied to the electrode portions 4a and 4b provided on the back surface. The line width of the mounting portions 7a and 7b formed so as to correspond to the electrode portions 4a and 4b of the IC chip 3 is formed to be 1: 1 or wider than the width of the electrode portions 4a and 4b. For example, when the electrode portions 4a and 4b are 100 μm square, the thickness is 100 to 150 μm. Silver paste is preferably used as the conductive paste. The conductive paste is printed by screen printing, offset printing, gravure printing, or the like, and is formed, for example, by a method in which the thickness of the emulsion is 10 μm through a 165 mesh / inch mask.

In step # 2, components such as the IC chip 3 and the jumper wire 6 are mounted. The electrode portions 4a and 4b of the IC chip 3 are respectively provided on the substrate sheet 1 as shown in FIG.
It is mounted on the mounting portions 7a and 7b of the circuit pattern formed on the line a.

In step # 3, the conductive paste is cured, and the components mounted in step # 2 are fixed.

In step # 4, a cover sheet 1b made of polyethylene terephthalate is opposed to the substrate sheet 1a constructed as described above as shown in FIG. 17, and carding is performed by a laminating step of applying heat and pressure.

FIG. 18 shows the finished shape of the non-contact IC card 1 manufactured as described above. The jumper wire 6 has a covering portion 6a in which an intermediate portion of a conducting portion made of a conductor is covered with an insulator, and a conducting portion 6b is exposed at both ends, and the thickness thereof is about 0.1 mm. Things are used.

The non-contact IC card 1 usually does not have a built-in battery, receives an external radio wave by the antenna coil pattern 2, and processes information by the IC chip 3 using the induced power. Information is exchanged with the card reader.

[0014]

However, the conventional method for manufacturing a non-contact IC card has the following problems.

As shown in FIGS. 17 and 18, the cover sheet 1b is opposed to the substrate sheet 1a on which components such as the IC chip 3 and the jumper wires 6 are mounted, and the card is formed by the laminating process as described above. In this case, the IC chip 3 sinks into the softened substrate sheet 1a due to heat and pressure, and the mounting portions 7a and 7b of the circuit pattern formed by the conductive paste are deformed and come into contact with the end surfaces 3a and 3a of the IC chip 3. Resulting in. Therefore, the mounting unit 7a,
7b, a current leaks to the end face 3a of the IC chip 3, so that there is a problem that the card becomes inoperable or malfunctions.

Accordingly, the present invention solves the above-mentioned problems and prevents the occurrence of current leakage caused by sinking of an IC chip into a substrate sheet during a laminating step.
An object of the present invention is to manufacture a high-quality non-contact IC card with high productivity.

[0017]

According to a first aspect of the present invention, there is provided a circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip by a conductive paste on a substrate sheet. After mounting the IC chip so that the electrode portion is connected to the circuit pattern, and curing the conductive paste, the cover sheet is overlaid on the substrate sheet, and a carding process is performed by applying heat and pressure. In the non-contact IC card manufacturing method to be performed, in the mounting range of the IC chip on the substrate sheet,
A backup pattern that is not electrically connected to the electrode portion and backs up the IC chip in order to prevent the IC chip from sinking into the substrate sheet during the laminating process is printed and formed with a conductive paste. .

According to the first aspect, even if the cover sheet presses the substrate sheet during the laminating step, the back surface of the cover sheet is supported by the backup pattern formed on the substrate sheet. It is possible to easily manufacture a high-quality card that does not sink into the IC chip and does not cause leakage of current from the circuit pattern to the end face of the IC chip.

According to a second aspect of the present invention, in order to achieve the above object, an IC chip is mounted after the circuit pattern is printed on a substrate sheet, a conductive paste is cured, and then a card is formed by the laminating step. In the method of manufacturing a contact IC card, when a circuit pattern is printed on a substrate sheet, mounting of the IC chip on the substrate sheet is performed so that both ends of the circuit pattern corresponding to a pair of electrode portions of the IC chip do not contact each other. It is characterized in that printing is performed over a wide area in each area.

According to the second aspect of the present invention, even if the cover sheet presses the substrate sheet during the laminating step, the cover is formed by the pair of circuit pattern ends formed in a wide area substantially corresponding to the mounting range of the IC chip. Since the back surface of the sheet is supported, the IC chip does not sink into the substrate sheet softened by heat, and a high-quality card free of current leakage from the circuit pattern to the end surface of the IC chip can be easily manufactured.

According to a third aspect of the present invention, in order to achieve the above object, an IC chip is mounted after the circuit pattern is printed on a substrate sheet, a conductive paste is cured, and then a card is formed by the laminating step. In a method for manufacturing a contact IC card, after printing a circuit pattern, an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic is applied to a mounting area of an IC chip on a substrate sheet. Then, after the IC chip is mounted so that the electrode portions are connected to the circuit pattern, the insulating resin is simultaneously cured when the conductive paste is cured.

In order to achieve the above object, in the fourth invention, an insulating adhesive sheet is similarly arranged instead of applying the insulating resin.

According to a fifth aspect of the present invention, in order to achieve the above object, an IC chip is mounted after the circuit pattern is printed on a substrate sheet, a conductive paste is cured, and then a card is formed by the laminating step. In the method for manufacturing a contact IC card, after the conductive paste is cured, a thermosetting system,
Alternatively, by applying an insulating resin made of thermoplastic resin or a mixed resin of thermosetting and thermoplastic, the insulating resin is filled into a gap between the substrate sheet and the IC chip, and then the insulating resin is cured. It is characterized by doing.

According to a sixth aspect of the present invention, to achieve the above object, an IC chip is mounted after the circuit pattern is printed on a substrate sheet, a conductive paste is cured, and then a card is formed by the laminating step. In the method for manufacturing a contact IC card, an IC chip is mounted so that an electrode portion is connected to a circuit pattern, and then the IC chip on the substrate sheet is
By applying an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic to the mounting area of the C chip, the insulating resin is applied between the substrate sheet and the IC chip. The method is characterized in that the insulating resin is cured at the same time as filling the gap and curing the conductive paste.

According to the third to sixth aspects of the present invention, even if the cover sheet presses the substrate sheet during the laminating step, the insulating material filled in the IC chip mounting area supports the back surface of the cover sheet. The chip does not sink into the substrate sheet softened by heat, there is no leakage of current from the circuit pattern to the IC chip end face, and even if sinking occurs, there is no gap between the circuit pattern and the IC chip. Due to the intervening insulating material, I
It is possible to easily manufacture a high-quality card in which current leakage does not occur at the end face of the C chip.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to FIGS.

The basic configuration of the non-contact IC card 11 of the present embodiment other than the printing of the backup pattern 9 for backing up the IC chip 3 in order to prevent the IC chip 3 from sinking into the substrate sheet 1a during the laminating step is as follows. This is common to the non-contact IC card 1 shown in the conventional example.
In other words, as shown in FIG.
Is composed of an IC chip 3 and an antenna coil for transmitting and receiving to and from the outside, and includes an antenna coil pattern electrically connected to the electrode portions 4a and 4b of the IC chip 3 by a conductive paste on the substrate sheet 1a. The circuit pattern 5 (the coil pattern 2 and the connection circuit pattern 5b) is printed, the IC chip 3 is mounted so that the electrode portions 4a and 4b are connected to the mounting portions 7a and 7b of the circuit pattern 5, and the conductive paste is cured. After that, the cover sheet 1b is overlaid on the substrate sheet 1a and carded by a laminating step of applying heat and pressure.

The substrate sheet 1a and the cover sheet 1b are made of polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene or the like and have a thickness of about 0.1 mm to 0.5 mm. Silver paste is preferably used as the conductive paste. The printing of the conductive paste is performed by screen printing, offset printing, gravure printing, or the like.
Emulsion thickness of 10 through a 5 mesh / inch mask
It is formed by a method having a thickness of μm. The jumper wire 6 has a covering portion 6a in which an intermediate portion of a conducting portion made of a conductor is covered with an insulator, and a conducting portion 6b is exposed at both ends, and the thickness thereof is about 0.1 mm. used.

FIGS. 1 to 6 show a first embodiment of the present invention. The first embodiment is characterized in that the mounting area of the IC chip 3 on the substrate sheet 1a is
The backup pattern 9 that is not electrically connected to the two electrode portions 4a and 4b is formed of a conductive paste.

FIG. 2 shows a manufacturing process of the non-contact IC card 11. Steps other than the formation of the backup pattern 9 are the same as those in the conventional example.

In step # 1, a circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a with a conductive paste. As shown in FIG. 3, the IC chip 3 often has bumps or plated bumps formed by a wire bonding method on the electrode portions 4a and 4b provided on the back surface. An electrode portion 4a of the IC chip 3,
The line width of the mounting portions 7a and 7b on the substrate sheet 1a formed so as to correspond to the width of the electrode portions 4a and 4b is 1:
One or more are formed.

In step # 2, as shown in FIG. 4, the backup pattern 9 which is not electrically connected to the electrode portions 4a, 4b is formed in a range inside the mounting portions 7a, 7b by a method such as potting or dispensing with a conductive paste. In a rectangular shape. The process of step # 2 may be performed at the time of step # 1, that is, simultaneously with the printing of the circuit pattern 5.

In step # 3, components such as the IC chip 3 and the jumper wire 6 are mounted.

The electrode portions 4a and 4b of the IC chip 3 are mounted on mounting portions 7a and 7b formed on the substrate sheet 1a as shown in FIG.

In step # 4, the conductive paste is cured, and the components mounted in step # 3 are fixed.

In step # 5, the cover sheet 1b is made to face the substrate sheet 1a configured as described above, and carding is performed by a laminating step of applying heat and pressure.

FIG. 6 shows the finished shape of the non-contact IC card 11 manufactured as described above. In addition, the first
The non-contact IC card 11 shown in the embodiment differs from the conventional example shown in FIG. 17 in that the backup pattern 9 that is not electrically connected to the electrode portions 4a and 4b has a pressure applied to the IC chip 3 during the laminating step. The IC chip 3 after carding does not sink, and a high-quality, no current leaks from the mounting portions 7a, 7b of the circuit pattern to the end surfaces 3a, 3a of the IC chip 3. The non-contact IC card 11 can be manufactured.

FIG. 7 shows a second embodiment of the present invention. The feature of the second embodiment is that when the circuit pattern 5 is printed on the substrate sheet 1a, the inner end of the antenna coil pattern 2 having the mounting portion 7a and the inner end of the connection circuit pattern 5b having the mounting portion 7b. The extended patterns 8, 8 are printed and formed in a wide area substantially corresponding to the mounting range of the IC chip 3 on the substrate sheet 1a in a range where they do not contact each other. In the second embodiment, since the expansion patterns 8 and 8 play a role of receiving the pressure applied to the IC chip 3 during the laminating step, the IC chip 3 after carding does not sink, and the circuit pattern mounting portion 7a , 7b to the end face 3a of the IC chip 3 without leaking current.

FIGS. 8 to 10 show a third embodiment of the present invention. The feature of the third embodiment is that after the circuit pattern 5 is printed, the mounting area of the IC chip 3 on the substrate sheet 1a and the vicinity thereof are made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic. That is, an insulating resin is applied and cured after mounting the IC chip 3. still,
Instead of applying the insulating resin, an insulating adhesive sheet made of the same mixed resin may be provided.

FIG. 9 illustrates a manufacturing process when the insulating resin is applied. In step # 1, substrate sheet 1
The circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of a with a conductive paste. In step # 2, the insulating resin 10 as described above is applied by a method such as potting or dispensing. In step # 3, components such as the IC chip 3 and the jumper wire 6 are mounted. In step # 4, conductive paste and insulating resin 1
Then, the component mounted in step # 3 is fixed by curing the component No. 0. In step # 5, carding is performed by laminating the cover sheet 1b on the substrate sheet 1a configured as described above and applying heat and pressure. FIG. 10 shows the finished shape of the non-contact IC card 1 manufactured as described above.

FIGS. 11 and 13 (same for the fifth embodiment)
Shows a fourth embodiment of the present invention. In the fourth embodiment, as shown in FIG. 13, after the IC chip 3 is mounted, the insulating resin 10 is applied to the mounting area of the IC chip 3 and its vicinity so as to cover the entire outer surface thereof. I do. The material of the insulating resin 10 is the same as that of the third embodiment.

The manufacturing process will be described with reference to FIG. In step # 1, a circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a using a conductive paste. In step # 2, components such as the IC chip 3 and the jumper wire 6 are mounted. In step # 3, the conductive paste is cured, and in step # 4, the insulating resin 10 is applied by a method such as potting or dispensing. In step # 5, the insulating resin 10 is cured, and the components mounted in step # 2 are fixed. In step # 6, the substrate sheet 1a thus configured
The card is formed by a laminating step in which heat and pressure are applied by superposing the cover sheet 1b on the cover. In the fourth embodiment, the curing of the insulating resin 10 in step # 5 is performed as follows.
It can be performed at the same time as the laminating step, and the productivity is improved.

As in the fifth embodiment of the present invention shown in FIG. 12, the hardening of the conductive paste is performed simultaneously with the hardening of the insulating resin 10 in step # 4 after the application of the insulating resin 10 in step # 3. Can be performed, and productivity is improved.

FIG. 13 shows the finished shape of the non-contact IC card 11 manufactured in the fourth and fifth embodiments.

[0045]

According to the present invention, when a cover sheet is overlaid on a substrate sheet and a card is formed by a laminating step, the back-up pattern and the end of the circuit pattern formed in a wide area support the back surface of the cover sheet. In addition, it is possible to easily manufacture a high-quality card in which the IC chip does not sink into the substrate sheet softened by heat and current does not leak from the circuit pattern to the end surface of the IC chip. Also, by applying an insulating resin or arranging an insulating adhesive sheet on the mounting area of the IC chip on the substrate sheet, even if the sinking described above occurs during the laminating process, the circuit pattern and the IC chip can be used. Since an insulating material is interposed therebetween, it is possible to completely prevent the above-described current leakage.

[Brief description of the drawings]

FIG. 1 is a plan view showing a substrate sheet side of a non-contact IC card according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a manufacturing process of the embodiment.

FIG. 3 is an exemplary plan view showing the back surface of the IC chip according to the embodiment;

FIG. 4 is an exemplary plan view showing a pattern on a substrate sheet according to the embodiment;

FIG. 5 is an exemplary plan view of an essential part showing a mounted state of the IC chip in the embodiment;

FIG. 6 is a vertical side view of the non-contact IC card according to the embodiment;

FIG. 7 is a plan view showing a main part of a second embodiment of the present invention.

FIG. 8 is a plan view showing a main part of a third embodiment of the present invention.

FIG. 9 is a flowchart showing a manufacturing process of the embodiment.

FIG. 10 is a vertical side view of the non-contact IC card according to the embodiment;

FIG. 11 is a flowchart showing a manufacturing process according to a fourth embodiment of the present invention.

FIG. 12 is a flowchart showing a manufacturing process according to a fifth embodiment of the present invention.

FIG. 13 is a vertical sectional side view of a non-contact IC card according to the fourth and fifth embodiments.

FIG. 14 is a plan view showing a substrate sheet side of a non-contact IC card in a conventional example.

FIG. 15 is a flowchart showing a manufacturing process in a conventional example.

FIG. 16 is a plan view of a main part showing a mounted state of an IC chip of a non-contact IC card in a conventional example.

FIG. 17 is a vertical sectional side view showing a superposed state of a conventional non-contact IC card.

FIG. 18 is a vertical side view of a conventional non-contact IC card.

[Explanation of symbols]

 Reference Signs List 1a Board sheet 1b Cover sheet 2 Antenna coil pattern 3 IC chip 4a, 4b Electrode part 5 Circuit pattern 5b Connection circuit pattern 6 Jumper wire 7a, 7b Mounting part 8 Expansion pattern 9 Backup pattern 10 Insulating resin 11 Non-contact IC card

Continuation of the front page (72) Inventor Mitsumasa Oku 1-1, Sachimachi, Takatsuki-shi, Osaka Prefecture Inside Matsushita Electronics Corporation (72) Inventor Yutaka Harada 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation (72) Inventor Shinji Murakami 1-1, Yukicho, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd.F-term (reference) 2C005 MA19 NA08 NA09 NB06 RA04 RA18 RA19 5B035 AA04 AA08 BA05 BB09 BC00 BC02 CA03 CA08

Claims (9)

[Claims] 1. A circuit pattern including a coil pattern for an antenna electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected to the circuit pattern so that the electrode portion is connected to the circuit pattern. After the conductive paste is cured and the conductive paste is cured, the cover sheet is superimposed on the substrate sheet and heat and pressure are applied to form a card by a lamination process. In addition, a backup pattern for backing up the IC chip in order to prevent the IC chip from sinking into the substrate sheet during the laminating step without being electrically connected to the electrode portion is formed by printing with a conductive paste. Non-contact IC card manufacturing method. 2. The method for manufacturing a non-contact IC card according to claim 1, wherein the printing of the backup pattern is performed simultaneously with the printing of the circuit pattern on the substrate sheet. 3. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet using a conductive paste, and the IC chip is connected to the circuit portion so that the electrode portion is connected to the circuit pattern. In the method for manufacturing a non-contact IC card in which a conductive sheet is cured and a conductive sheet is cured, a cover sheet is stacked on a substrate sheet, and heat and pressure are applied to form a card, a circuit pattern is printed on the substrate sheet. In this case, both ends of the circuit pattern corresponding to a pair of electrode portions of the IC chip are formed by printing over a wide area in a mounting area of the IC chip on the substrate sheet so as not to contact each other. A method for manufacturing an IC card. 4. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected to the circuit pattern so that the electrode portion is connected to the circuit pattern. After curing the conductive paste, a method for manufacturing a non-contact IC card in which a cover sheet is overlaid on a substrate sheet and carding is performed by a laminating step of applying heat and pressure, wherein the circuit pattern is printed on the substrate IC in sheet
After applying an insulating resin made of thermosetting resin, thermoplastic resin, or mixed resin of thermosetting and thermoplastic to the mounting area of the chip, and mounting the IC chip so that the electrode part is connected to the circuit pattern, A method for manufacturing a non-contact IC card, comprising simultaneously curing an insulating resin when curing a conductive paste. 5. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected to the circuit pattern so that the electrode portion is connected to the circuit pattern. After curing the conductive paste, a method for manufacturing a non-contact IC card in which a cover sheet is overlaid on a substrate sheet and carding is performed by a laminating step of applying heat and pressure, wherein the circuit pattern is printed on the substrate IC in sheet
An insulative adhesive sheet made of thermosetting resin, thermoplastic resin, or mixed resin of thermosetting and thermoplastic was placed in the mounting area of the chip, and the IC chip was mounted so that the electrode section was connected to the circuit pattern. Thereafter, when the conductive paste is cured, the insulating adhesive sheet is cured at the same time. 6. A circuit pattern including a coil pattern for an antenna that is electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. After curing the conductive paste, in a method for manufacturing a non-contact IC card in which a cover sheet is overlaid on a substrate sheet and carding is performed by a laminating step of applying heat and pressure, after curing the conductive paste, I in the substrate sheet
By applying an insulating resin composed of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic to the mounting area of the C chip, the insulating resin is applied between the substrate sheet and the IC chip. A method for manufacturing a non-contact IC card, comprising curing an insulating resin after filling a gap. 7. The non-contact IC according to claim 6, wherein the curing of the insulating resin is performed simultaneously with the laminating step of forming the card.
Card manufacturing method. 8. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet using a conductive paste, and the IC chip is connected to the circuit pattern so that the electrode portion is connected to the circuit pattern. In the method for manufacturing a non-contact IC card in which a conductive sheet is hardened and a conductive sheet is cured, and a cover sheet is overlaid on a substrate sheet and carding is performed by a laminating step of applying heat and pressure, the electrode portion is connected to a circuit pattern. After the IC chip is mounted as described above, an insulating resin composed of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic is applied to the mounting area of the IC chip on the substrate sheet to thereby make the insulation. Filling the gap between the substrate sheet and the IC chip with the conductive resin, and simultaneously curing the insulating resin when curing the conductive paste Contactless IC card manufacturing method, characterized in that. 9. The non-contact I according to claim 6, wherein the insulating resin is applied so as to cover an outer surface of the IC chip.
Manufacturing method of C card.