JP2000200543A - Sealed panel device and manufacturing method thereof - Google Patents

Abstract

[PROBLEMS] To provide a highly reliable sealing panel device capable of improving the degree of vacuum in a vacuum space and maintaining a high degree of vacuum for a long period of time. In a sealing panel device, a first panel (P1) and a second panel (P2) facing each other have an adhesive layer (A) at a peripheral portion.
m, the first panel P1 and the second panel P2
A sealing panel device in which a space surrounded by the adhesive layer Am and the adhesive layer Am is evacuated, and the adhesive layer Am is made of a low melting point metal material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing panel device and a method of manufacturing the same, and more particularly, to a panel device in which the space between two opposed panels is evacuated to improve the degree of vacuum. The present invention relates to a sealing panel device capable of being maintained and a manufacturing method thereof.

[0002]

2. Description of the Related Art For example, in the field of image display devices,
A sealing panel device is used in which a space between two panels arranged opposite to each other is evacuated. In a general configuration of a sealing panel device, a member that defines a vacuum space includes two panels and a bonding material layer interposed between the two panels, or the two panels at a predetermined separation distance. This is a combination of a frame, which is a support member for holding, and a bonding material layer. Since the frame is usually made of a rigid material, the member that determines whether or not the degree of vacuum in the vacuum space is maintained is substantially a bonding material layer.

As a specific example of such a sealing panel device, there is a flat image display device, for example, a cold cathode field emission display device (hereinafter simply referred to as a display device). This display device has an anode panel in which a phosphor layer and an anode electrode are formed on a transparent support, and a plurality of cold cathode field emission devices (hereinafter simply referred to as field emission devices) on the support. The cathode panel thus formed has a configuration in which the cathode panel is arranged to face the vacuum panel. The field emission device has an electron emission portion formed in a size on the order of microns, and when the electron emission portion is placed in an electric field of a certain strength or more, the electron emission portion is directed to a vacuum. Then, electrons are emitted, and the electrons are attracted to the anode electrode and collide with the phosphor to obtain light emission.

In a sealing panel device represented by the above-described display device, a low-melting glass material, so-called frit glass, is widely used as a constituent material of a bonding material layer. Frit glass is a high-viscosity paste-like material in which glass fine particles are dispersed in an organic binder. After being applied in a predetermined pattern, the organic binder is removed by firing to form a solid bonding material layer.

In Japanese Patent Application Laid-Open No. 7-122189, a glass spacer 13 is interposed between two panels 1 and 2 and directly joined to each other without using a joining material such as frit glass. A technique for hermetically sealing is disclosed. This direct bonding is specifically performed by anodic bonding. That is, two panels 1 and 2 and glass
Electrodes are formed on the spacers 13 and both panels are
While heating to about 0 ° C., a DC voltage is applied between these electrodes so that the panels 1 and 2 are positive and the glass spacer 13 is negative, and the contact surface between the panels 1 and 2 and the glass spacer 13 is applied. Are fused together.

[0006]

However, the conventional sealing method has problems. First, a sealing panel device formed using frit glass has excellent insulation performance between both panels, but is liable to cause contamination of a vacuum space and deterioration of the degree of vacuum. The contamination of the vacuum space is mainly caused by the organic binder contained in the frit glass paste. Further, the deterioration of the degree of vacuum is caused by degassing during frit glass firing at a high temperature. Since frit glass paste generally has a high viscosity, bubbles are easily formed in a coating film when applied in a predetermined pattern on a panel, and gas contained in the bubbles is transferred to a space between panels. It is released and deteriorates the degree of vacuum.

If any gas is present in the space between the panels, for example, in a cold cathode field emission display, ions generated from this gas sputter a minute electron emission portion, and the electron emission efficiency is reduced. There is a problem that the lifetime of the display device is shortened due to change or damage to the electron-emitting portion. Further, the control of the application amount, the application thickness, the application width, and the like of the frit glass is complicated, and it is difficult to form a uniform coating film. Further, since a high temperature of about 450 ° C. or more is required for baking, it takes time to perform heating and cooling steps, and it is difficult to significantly improve productivity.

On the other hand, in anodic bonding, contamination of the vacuum space and deterioration of the degree of vacuum are relatively unlikely to occur, but it is necessary to previously form electrodes for anodic bonding on the panel and the glass spacer. In addition, there is a problem that a high voltage on the order of several hundred V is required, and the selection range of the constituent material of the panel is limited.

Accordingly, the present invention provides a highly reliable sealing panel device capable of improving the degree of vacuum in a vacuum space and maintaining a high degree of vacuum for a long period of time. It is an object of the present invention to provide a manufacturing method that can be manufactured with high productivity without any need.

[0010]

According to a first aspect of the present invention, there is provided a sealing panel device comprising: a first panel and a second panel which are opposed to each other; Wherein the space surrounded by the first panel, the second panel, and the adhesive layer is evacuated, wherein the adhesive layer is made of a low melting point metal material. The thickness of the adhesive layer is such that the space surrounded by the first panel, the second panel, and the adhesive layer is reliably maintained in a vacuum state. What is necessary is just to determine based on the facing distance of a panel and a 2nd panel, and 0.1 mm-0.2 mm can be illustrated.

In the sealed panel device according to the first aspect of the present invention, the gap maintaining member for keeping the gap between the first panel and the second panel constant is provided between the first panel and the second panel. It is also possible to adopt a configuration sandwiched between them. The gap maintaining member can be typically made of a rigid material such as glass or ceramic having an insulating property. By using the gap maintaining member, it is possible to more accurately control the facing distance between the first panel and the second panel as compared with the case where the gap maintaining member is used only for the adhesive layer. The constituent material, shape, and dimensions of the gap maintaining member are not particularly limited, but are preferably spherical or cylindrical having a diameter selected according to a desired facing distance. Note that the same applies to the case where a spacing maintaining member is used in a method of manufacturing a sealed panel device according to a first embodiment of the present invention described below. The gap maintaining member may be held in a space surrounded by the first panel, the second panel, and the adhesive layer, or may be held outside the space.

The second object of the present invention for achieving the above object.
The sealing panel device according to the aspect of the present invention comprises a frame, and a first panel and a second panel which are arranged to face each other with the frame interposed therebetween, and the frame and the first panel are bonded by a first adhesive layer. The frame and the second panel are adhered by a second adhesive layer, and the first panel, the first adhesive layer, the frame, the second adhesive layer, and the second
A sealed panel device in which a space surrounded by the panel is evacuated, wherein the second adhesive layer is made of a low-melting metal material.

[0013] In the sealed panel device according to the second aspect of the present invention, the height of the frame is selected, so that the panel is compared with the sealed panel device according to the first aspect of the present invention. It is possible to set the facing distance between them longer. The frame can be made of a rigid material such as glass or ceramic having an insulating property. It should be noted that the same applies to a frame in a method of manufacturing a sealed panel device according to second and third embodiments of the present invention described later.

In the sealing panel device according to the second aspect of the present invention, one of the two adhesive layers (ie, the second adhesive layer) is always made of a low melting point metal material. Therefore, 2
As compared with a conventional sealing panel device that uses frit glass for both layers, the degree of vacuum is more reliably maintained, and the life of the sealing panel device can be extended. The sealing panel device according to the second aspect can be further divided into the following four configurations depending on the constituent material of the first adhesive layer.

That is, in the sealing panel device according to the second aspect of the present invention, the first adhesive layer is made of a low-melting-point metal material, and the melting point of the low-melting-point metal material constituting the first adhesive layer and the second adhesive layer are different from each other. The melting point of the low-melting metal material forming the adhesive layer can be substantially equal to the melting point (may be referred to as a first structure). With such a configuration, the first panel and the frame, and the second panel and the frame can be simultaneously bonded in one heating process, so that the residual thermal distortion of the manufactured sealing panel device can be reduced. Alternatively, the first adhesive layer is made of a low-melting metal material, and the melting point of the low-melting metal material forming the first adhesive layer is higher than the melting point of the low-melting metal material forming the second adhesive layer (second melting point). In some cases). With such a configuration,
Since the bonding of the first panel and the frame and the bonding of the second panel and the frame can be performed by independent heating processes, the assembly accuracy of the manufactured sealing panel device can be improved. Further, the first adhesive layer may have a configuration (may be referred to as a third configuration) made of frit glass (also referred to as glass paste). Frit glass has high insulating properties that cannot be expected from low melting point metal materials. Therefore, a configuration using frit glass is extremely effective, for example, when the first panel has a high-voltage specification and the insulating properties are insufficient with only a thin insulating layer such as a passivation film formed on the first panel. Alternatively, a part of the first adhesive layer may be made of frit glass, and the remaining part of the first adhesive layer may be made of a low-melting metal material (sometimes referred to as a fourth structure). A part of the first adhesive layer made of frit glass and a remaining part of the first adhesive layer made of the low melting point metal material are the first adhesive layer.
Any arrangement may be adopted in the formation region of the adhesive layer. For example, a plurality of "parts" may be scattered in the rest.

For example, when the first panel includes an electrode drawn out of the sealing panel device, a configuration in which only the periphery of the electrode is covered with frit glass is possible. Also,
When the first panel or the second panel includes an electrode drawn out of the sealing panel device, an insulating layer is formed on the electrode, and the first adhesive layer or the second adhesive layer is formed on the insulating layer. Or it may be arranged. In such a configuration, the first
The panel and the second panel include such an insulating layer. Alternatively, in some cases, an insulating film (for example, an oxide film of a material forming the electrode) may be formed on a portion (surface) of the electrode in contact with the first adhesive layer or the second adhesive layer.

The first object of the present invention for achieving the above object is as follows.
The method for manufacturing the sealed panel device according to the aspect of the present invention is a method for manufacturing the sealed panel device according to the first aspect of the present invention, and (a) the peripheral portion of the first panel and / or the second panel. Forming or disposing an adhesive layer made of a low-melting metal material on the substrate, and (b) heating the adhesive layer to a temperature higher than the melting point of the low-melting metal material constituting the adhesive layer.
Bonding the first panel and the second panel with an adhesive layer.

In the step (a) of the method for manufacturing the sealed panel device according to the first aspect of the present invention, the formation or arrangement of the adhesive layer is performed on one or both of the first panel and the second panel. Can be done against If the wettability of the adhesive layer with respect to the first panel or the second panel is sufficiently high, it may be formed on either one of the panels.

In the step (a) of the method for manufacturing a sealed panel device according to the first aspect of the present invention, the first panel and the second panel
It is preferable that an interval maintaining member for maintaining the interval with the panel constant is previously arranged on the first panel or the second panel. The spacing member can be placed by simply placing it on the first panel or the second panel, or it can be placed by any method such as coating, spraying, spraying, etc. It may be random or regular. From the viewpoint of facilitation of the process, it is preferable that the timing of disposing the interval maintaining member in the step (a) be after forming the adhesive layer.
Alternatively, it is preferable that the timing of disposing the interval maintaining member in the step (a) be before or after disposing the adhesive layer.

The second object of the present invention for achieving the above object is as follows.
The method for manufacturing the sealed panel device according to the aspect of the present invention is a method for manufacturing the sealed panel device according to the second aspect of the present invention, and includes a frame, A method of manufacturing a sealed panel device including a first panel and a second panel, wherein (a) forming a first adhesive layer made of a low melting point metal material on a peripheral portion and / or a frame of the first panel; or Disposing, on the other hand, forming or disposing a second adhesive layer made of a low-melting metal material on the periphery and / or the frame of the second panel; and (b) the low-melting metal forming the first adhesive layer By heating the first adhesive layer and the second adhesive layer to a temperature higher than the melting point of the material and the melting point of the low-melting metal material forming the second adhesive layer, the frame and the first panel are connected to the first adhesive layer. And the frame and the second panel are bonded by the second bonding layer. That process, and having a.

In the method for manufacturing a sealed panel device according to the second aspect of the present invention, the first panel, the frame, and the second panel are simultaneously bonded by one heating process. Therefore, it is assumed that both the first adhesive layer and the second adhesive layer are made of a low melting point metal material. Here, the first
When the melting point of the low melting point metal material forming the adhesive layer is different from the melting point of the low melting point metal material forming the second bonding layer, the heating temperature in step (b) is set in accordance with the higher melting point. There is a need. However, if the melting point of the low-melting metal material forming the first adhesive layer is significantly different from the melting point of the low-melting metal material forming the second adhesive layer, at a temperature at which the higher-melting adhesive layer can be melted. The adhesive layer having a lower melting point may be excessively deformed or run off. Therefore, for example, the temperature difference is 0 ° C. to 100 ° C. so that the melting point of the low melting point metal material constituting the first adhesive layer is substantially equal to the melting point of the low melting point metal material constituting the second adhesive layer.
It is particularly preferable to select a low-melting metal material forming the first adhesive layer and a low-melting metal material forming the second adhesive layer so as to be about ゜ C.

In the step (a) of the method for manufacturing a sealed panel device according to the second aspect of the present invention, the formation or arrangement of the first adhesive layer is performed by using one of the first panel and the frame.
Or both. When the wettability of the adhesive layer with respect to the first panel or the frame is sufficiently high, it may be formed on either one of them. Further, formation or arrangement of the second adhesive layer can be performed on one or both of the second panel and the frame. If the wettability of the adhesive layer with respect to the second panel or the frame is sufficiently high, it may be formed on either one of them.

The third object of the present invention to achieve the above object.
The method for manufacturing a sealed panel device according to the aspect of the present invention is a method for manufacturing the sealed panel device according to the second aspect of the present invention, and includes a frame, and an opposing arrangement with the frame interposed therebetween. A method of manufacturing a sealed panel device including a first panel and a second panel, wherein (a) a step of bonding a peripheral portion of the first panel and a frame with a first adhesive layer; and (b) a second panel. Forming or arranging a second adhesive layer made of a low-melting metal material on the periphery and / or the frame of (a), and (c) reducing the temperature to a temperature higher than the melting point of the low-melting metal material constituting the second adhesive layer. A step of heating the second adhesive layer to bond the frame and the second panel with the second adhesive layer.

In the step (b) of the method for manufacturing a sealed panel device according to the third aspect of the present invention, the formation or arrangement of the second adhesive layer is performed by using one of the second panel and the frame.
Or both. If the wettability of the adhesive layer with respect to the second panel or the frame is sufficiently high, it may be formed on either one of them.

In the method for manufacturing a sealed panel device according to the third aspect of the present invention, the first panel and the frame are first bonded, and then the frame and the second panel are bonded. Therefore, the first
Compared with the manufacturing method according to the second aspect of the present invention in which the panel, the frame body, and the second panel are simultaneously bonded, the positioning of the three members becomes easier, and the positioning accuracy can be improved. However, the constituent material of the first adhesive layer has a higher melting point and the like than the constituent material of the second adhesive layer so as not to deform the already formed first adhesive layer when the frame body and the second panel are bonded. Need to be.

That is, in the method for manufacturing a sealing panel device according to the third aspect of the present invention, the first adhesive layer has a melting point higher than the melting point of the low melting point metal material forming the second adhesive layer. In the step (a), the first adhesive layer is heated at a temperature higher than the melting point of the low-melting metal material forming the first adhesive layer. In the step (c), the second adhesive layer is heated. The second adhesive layer may be heated to a temperature higher than the melting point of the low melting point metal material constituting the first adhesive layer and lower than the melting point of the low melting point metal material constituting the first adhesive layer. In this case, prior to the step (a), a first adhesive layer made of a low-melting metal material may be formed or arranged on the peripheral portion and / or the frame of the first panel. Alternatively,
The first adhesive layer is made of frit glass having a firing temperature (also referred to as a sealing temperature or a fixing temperature) higher than the melting point of the low-melting metal material constituting the second adhesive layer. By sintering, the peripheral portion of the first panel and the frame are bonded to each other.
The second bonding layer may be heated to a temperature higher than the melting point of the low-melting metal material forming the second bonding layer and lower than the firing temperature of the frit glass forming the first bonding layer. it can. In this case, prior to the step (a), the first adhesive layer made of frit glass may be formed on the peripheral portion and / or the frame of the first panel. Alternatively, a part of the first adhesive layer is made of frit glass having a firing temperature higher than the melting point of the low-melting metal material constituting the second adhesive layer, and the remainder of the first adhesive layer constitutes the second adhesive layer. In the step (a), the frit glass is fired and the low-melting metal material constituting the first adhesive layer is melted by melting the low-melting metal material constituting the first adhesive layer. The peripheral portion of the first panel and the frame are adhered to each other. In the step (c), the temperature is higher than the melting point of the low-melting metal material constituting the second adhesive layer, and constitutes the rest of the first adhesive layer. The second adhesive layer may be heated to a temperature lower than the melting point of the low melting point metal material. In this case, prior to the step (a), a part of the first adhesive layer made of frit glass is formed on the periphery and / or the frame of the first panel, and the remaining part of the first adhesive layer made of a low melting point metal material is formed. May be formed or arranged.

Unlike the frit glass used in the form of a high-viscosity paste, the low-melting-point metal material does not contain air bubbles in the layer even when formed as an adhesive layer.
Excellent in dimensional accuracy such as width and thickness of the adhesive layer. Therefore, the use of an adhesive layer made of a low-melting metal material prevents deterioration of the degree of vacuum in the sealing panel device over time due to degassing or poor adhesion, and greatly improves the performance and long-term reliability of the sealing panel device. be able to.

Here, the temperature range defined by the term “low melting point” is generally 400 ° C. or less. Since the softening temperature of general frit glass is around 600 ° C. and the firing temperature is around 450 ° C., the melting point of the low melting point metal material is even lower than these temperatures. The lower limit of the melting point is not particularly limited. However, if the temperature is too low, moisture adsorbed on the surface of the adhesive layer during heating for bonding cannot be removed, so that the temperature is preferably about 120 ° C. or more. In addition, depending on the manufacturing method of the sealing panel device described later, since the heating for forming the adhesive layer is performed in a vacuum,
The moisture adsorbed on the surface of the adhesive layer can be removed even at less than 100 ° C. Therefore, considering only from the viewpoint of water removal, a low melting point metal material having a melting point of less than 100 ° C. can be used,
In consideration of the reliability of the sealing panel device under a normal use environment, the lower limit of the melting point is preferably about 120 ° C. or more.

In the method for manufacturing a sealed panel device according to the present invention, “forming” the adhesive layer means that the adhesive layer is formed on the first panel or the second panel.
Refers to the state of being in close contact with the surface of a panel or frame by an atomic force. The formation of such an adhesive layer can be achieved, for example, by using a vacuum thin film forming technique such as a vapor deposition method, a sputtering method, an ion plating method, or on the first panel, the second panel, or the frame. Can be achieved by once melting the adhesive layer. On the other hand, “arrangement” of the adhesive layer refers to a state in which the adhesive layer is held on the surfaces of the first panel, the second panel, and the frame by gravity or frictional force. Such “arrangement” is achieved by placing or sticking a wire or foil made of a low melting point metal material on the surfaces of the first panel, the second panel, and the frame. When using an adhesive layer that can be held on the surface of the panel or frame body with a certain degree of adhesion like a foil, and in some cases, has an adhesion that does not fall off even when the holding surface faces down, An adhesive layer can be arranged on both the first panel and the second panel, both the first panel and the frame, and both the second panel and the frame. However, when using an adhesive layer such as a wire rod that is simply held on the surface of the first panel, the second panel, or the frame by gravity, the arrangement of the adhesive layer may be any of the first panel and the second panel. On the other hand, it is preferable to perform the operation on only one of the first panel and the frame, or only one of the second panel and the frame.

The step (b) in the method for manufacturing the sealed panel device according to the first embodiment of the present invention, the step (b) in the method for manufacturing the sealed panel device according to the second embodiment of the present invention, The heating in the step (a) or (c) in the method for manufacturing the sealed panel device according to the third embodiment is performed by a known heating method such as heating using a lamp, heating using a laser, and heating using a furnace. It can be carried out.

A space surrounded by the first panel, the second panel, and the adhesive layer, or the first panel, the first adhesive layer, the frame, and the second adhesive layer in the sealed panel device or the method of manufacturing the same according to the present invention. The degree of vacuum in a space surrounded by the first panel and the second panel (hereinafter, these spaces may be collectively simply referred to as a space) differs depending on the configuration of the sealing panel device. Assuming a cold cathode field emission display device as the sealing panel device, the required degree of vacuum is approximately 1
It is on the order of 0 ^-2 Pa or higher (ie, lower pressure).

In the method of manufacturing a sealed panel device according to the present invention, two more modes are included depending on the timing at which this space is evacuated. That is, the step (b) in the method for manufacturing the sealed panel device according to the first embodiment of the present invention, the step (b) in the method for manufacturing the sealed panel device according to the second embodiment of the present invention, In the step (c) in the method for manufacturing a sealed panel device according to the third aspect, the heating is performed in a vacuum atmosphere, and thus the space is evacuated.
Note that such an aspect in the method for manufacturing a sealed panel device according to the first aspect of the present invention is referred to as an aspect 1A of the present invention,
Such an aspect in the method for manufacturing a sealed panel device according to the second aspect of the present invention is referred to as an aspect 2A of the present invention, and such an aspect in the method for manufacturing a sealed panel device according to the third aspect of the present invention is described. This is referred to as the 3A aspect of the present invention. Also,
Step (b) in the method for manufacturing a sealed panel device according to the first aspect of the present invention, step (b) in the method for manufacturing a sealed panel device according to the second aspect of the present invention, The step (c) in the method for manufacturing the sealed panel device according to the embodiment may be collectively referred to as a heating / adhering step.
In the heating and bonding step, first, the atmosphere was replaced with an inert gas, and then the temperature of the atmosphere was increased.
Preferably, the atmosphere is vacuum, or, after replacing the atmosphere with an inert gas, the atmosphere is vacuum,
Thereafter, it is preferable to raise the temperature of the atmosphere, or it is preferable to replace the atmosphere with an inert gas and then raise the temperature of the atmosphere while evacuating the atmosphere.

Alternatively, after the step (b) in the method for manufacturing a sealed panel device according to the first embodiment of the present invention, the step (b) in the method for manufacturing a sealed panel device according to the second embodiment of the present invention. After the step (c) in the manufacturing method of the sealed panel device according to the third embodiment of the present invention, that is, after the heating and bonding step, the space is evacuated to evacuate the space. Note that such an aspect in the method for manufacturing a sealed panel device according to the first aspect of the present invention is referred to as an aspect 1B of the present invention, and such an aspect in the method for manufacturing a sealed panel device according to the second aspect of the present invention is referred to. The embodiment is referred to as a second embodiment of the present invention, and such an embodiment in the method of manufacturing a sealed panel device according to the third embodiment of the present invention is referred to as a third embodiment of the present invention.
This is referred to as an embodiment. In these embodiments 1B to 3B, it is not necessary to perform heating in the heating / adhering step under vacuum,
It can be carried out under normal pressure or under reduced pressure. Further, the atmosphere under normal pressure or reduced pressure may be the atmosphere, or may be nitrogen gas or a gas belonging to Group 0 of the periodic table (for example, Ar gas).
Gas). As a specific exhaust method, an exhaust pipe made of, for example, glass is inserted into one of the first panel and the second panel and does not affect the function of the sealing panel device. For example, a method in which the exhaust pipe is connected to a vacuum exhaust device and exhausted until a desired degree of vacuum is obtained, and then the exhaust pipe is sealed by heat fusion can be exemplified. If the entire sealing panel device is once heated and then cooled before the sealing, the residual gas can be released into the space, and the residual gas can be removed from the space by exhaustion. It is suitable. Performing the heating in the heating / adhesion step in an inert gas atmosphere is more effective in reducing the residual gas.

In the above-described method for manufacturing the sealing panel device according to the first or second aspect of the present invention and the method for manufacturing the sealing panel device according to the first to third aspects of the present invention, the low melting point metal material is used. In (indium: melting point: 157 ° C.); indium-gold based low melting point alloy; Sn ₈₀ Ag
₂₀ (melting point 220-370 ° C.), Sn ₉₅ Cu ₅ (melting point 2
27-370 ° C.) Tin (Sn) based high temperature solder; Pb
Lead (Pb) -based high-temperature solder such as _97.5 Ag _2.5 (melting point 304 ° C.), Pb _94.5 Ag _5.5 (melting point 304-365 ° C.), Pb _97.5 Ag _1.5 Sn _1.0 (melting point 309 ° C.); Zn ₉₅ A
l ₅ (melting point 380 ° C) zinc such as (Zn) based high-temperature solder; Sn ₅ Pb ₉₅ (melting point 300-314 ° C), Sn ₂ P
b ₉₈ (melting point 316 to 322 ° C) tin, such as - lead-based standard solder; be exemplified Au ₈₈ Ga _{1 2} (melting point 381 ° C) brazing material, such as (or more subscript represents all atomic%) it can.

In the sealing panel device or the method of manufacturing the same according to the present invention, a wettability improving layer for improving the wettability with respect to the low melting point metal material may be formed at the portion where the adhesive layer is to be formed. In the method for manufacturing the sealing panel device according to the first aspect of the present invention or the sealing panel device according to the first aspect of the present invention, the portion where the adhesive layer is to be formed is provided on the first panel and / or the second panel. Exists. In the method for manufacturing a sealed panel device according to the second aspect of the present invention, the first
Present on any of the panel, frame, and second panel. Furthermore, in the method for manufacturing the sealed panel device according to the second aspect of the present invention or the sealed panel device according to the third aspect of the present invention, the second panel and / or the frame (the first
Depending on the material of the adhesive layer, it is further present on the first panel and / or the frame. When the wettability of the low melting point metal material on the surfaces of the first panel, the second panel, and the frame is poor, by providing such a wettability improving layer, the positioning accuracy between the wettability improving layer and the adhesive layer before heating can be improved. Even if it ’s not that expensive,
When the final bonding is completed after heating, the low-melting metal material converges on the wettability improving layer in a self-aligned manner due to its own surface tension, and finally the wettability improving layer and the adhesive layer are accurately formed. The advantage of alignment is also obtained. The constituent materials of the wettability improving layer include titanium (Ti), nickel (N
i), copper oxide (CuO). The thickness of the wettability improving layer may be about 0.1 μm. Since a natural oxide film may grow on the surface of the wettability improving layer, it is preferable to remove the natural oxide film immediately before forming the adhesive layer, the first adhesive layer, and the second adhesive layer. . The removal of the natural oxide film can be performed by a known method such as an etching method and an ultrasonic wave application method. Examples of the method for forming the wettability improving layer include a sputtering method and a plating method.

In the manufacturing method of the present invention, a natural oxide film may grow on the surface of the adhesive layer, the first adhesive layer, and the second adhesive layer. It is preferred to do so. Removal of the native oxide film
For example, it can be performed by a known method such as a wet etching method using diluted hydrochloric acid, a dry etching method using a chlorine-based gas, and an ultrasonic wave application method.

The first panel or the second panel according to the present invention may have at least a surface made of an insulating member. Can be used, and a semiconductor substrate having an insulating film formed on the surface thereof can be used.

In the method for manufacturing the sealed panel device according to the first or second embodiment of the present invention and the sealed panel device according to the first to third embodiments of the present invention, the sealed panel device may be, for example, , The first panel includes a transparent support, and an anode electrode and a phosphor layer formed on the transparent support, and the second panel includes a support, and the anode electrode formed on the support. And a plurality of cold cathode field emission devices (hereinafter, simply referred to as field emission devices) facing the phosphor layer, and display based on light emission caused by electrons emitted from the field emission devices colliding with the phosphor layer. Is performed. Note that the sealing panel device having such a structure is hereinafter referred to as a cold cathode field emission display device, and in some cases, is simply referred to as a display device.

In this case, in the sealed panel device according to the first aspect of the present invention and the method for manufacturing the sealed panel device according to the first aspect of the present invention, the first panel and the second panel are interchangeable. It is. Further, in the sealed panel device according to the second aspect of the present invention and the method for manufacturing the sealed panel device according to the second or third aspect of the present invention, the first panel and the second panel are exchanged at the same time. The first and second adhesive layers may be exchanged.

As the field emission device which is a component of the display device, any known type of field emission device can be used. For example, a so-called Spindt type, a flat type, an edge type and the like can be exemplified. it can.

Examples of the transparent support constituting the first panel of the display device include a glass substrate, a glass substrate having an insulating layer formed on its surface, a quartz substrate, and a quartz substrate having an insulating layer formed on its surface. . Further, the support constituting the second panel of the display device may have at least a surface formed of an insulating member, and may include a glass substrate, a glass substrate having an insulating layer formed on the surface, a quartz substrate, and an insulating layer formed on the surface. Can be used, and a semiconductor substrate having an insulating film formed on the surface thereof can be used.

The gate electrode and the anode electrode constituting the display device are made of tungsten (W), niobium (Nb), tantalum (Ta), titanium (Ti), molybdenum (Mo),
Chrome (Cr), aluminum (Al), copper (Cu),
It can also be formed using a metal layer such as silver (Au), an alloy layer containing these metal elements, or a semiconductor layer such as silicon containing impurities. Further, as a constituent material of the insulating layer, SiO ₂ , SiN, SiON, or a cured glass paste can be used alone or appropriately laminated. Known processes such as a CVD method, a coating method, a sputtering method, and a printing method can be used for forming the insulating layer.

[0043]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a sealing panel device according to the present invention;

(Embodiment 1) Embodiment 1 is directed to a sealing panel device according to the first embodiment of the present invention, and a sealing panel device according to the first embodiment of the present invention including Embodiments 1A and 1B. The present invention relates to a method for manufacturing a stop panel device. FIG. 1 is a conceptual diagram of a sealing panel device according to Embodiment 1, and FIG. 2 is a schematic cross-sectional view of a cold cathode field emission display device configured by applying the sealing panel device. FIG. 3 is an exploded perspective view schematically showing an enlarged part of the display device. FIG. 4 shows a process chart of the method for manufacturing the sealed panel device according to the first embodiment, and FIG. 5 shows a process diagram of the method for manufacturing the sealed panel device according to the first embodiment 1A. 6 is a process chart of a method for manufacturing the sealing panel device according to the first embodiment.

FIG. 1 shows a conceptual configuration of the sealing panel device according to the first embodiment. 1A is a schematic sectional view, and FIG. 1B is a schematic perspective view. The first panel P1 and the second panel P2 each having a rectangular shape are bonded by an adhesive layer Am at a peripheral edge, and a space surrounded by the first panel, the second panel, and the adhesive layer is evacuated (VAC). I have. The adhesive layer Am is made of a low melting point metal material. In FIG. 1B, for simplicity of illustration, the thickness of the adhesive layer Am is omitted, and only the formation site is indicated by hatching.
In the present specification, the subscript m of the symbol A representing the adhesive layer
Is used to indicate that it is made of a low melting point metal material. The facing distance between the first panel P1 and the second panel P2 is determined by the thickness of the adhesive layer Am.

FIG. 2 shows an example in which the sealing panel device according to the first embodiment is applied to a display device. FIG. 3 shows an enlarged part of the display device. The first panel P1 includes a transparent support 10, an anode electrode 13 formed on the transparent support 10, and phosphor layers 12R, 12G, 1 of three primary colors.
2B. Individual phosphor layers 12R, 12G, 12B
Have a rectangular shape as an example, and are arranged according to a predetermined regular pattern. Adjacent phosphor layer 12
The space between R, 12G, and 12B is filled with a black matrix 11 made of a light-absorbing material such as carbon to prevent a displayed image from being turbid. 2 and 3, the phosphor layers 12R, 12G, 12
Although B is coated on the anode electrode 13, the stacking order may be reversed. However, in the case of the opposite, since the anode electrode 13 is located in front of the phosphor layer 12 when viewed from the observation surface side of the display device, the anode electrode 13 is made of a transparent conductive material such as ITO (indium tin oxide). Must be configured.

The second panel P2 includes a support 20 and
A plurality of field emission devices are formed on the support 20 and face the anode electrode 13 and the phosphor layers 12R, 12G, and 12B. The field emission element includes a strip-shaped cathode electrode 21 provided in one direction, an insulating layer 22, a gate electrode 23 formed on the insulating layer 22 and formed in a strip shape in a direction orthogonal to the cathode electrode 21, and a cathode. In the overlapping region of the electrode 21 and the gate electrode 23, the gate electrode 23 and the electron emission portion disposed in the circular opening 25 provided in the insulating layer 22. In the display device shown in FIG. 2, a so-called flat field emission device in which a portion of the cathode electrode 21 exposed on the bottom surface of the opening 25 functions as an electron emission portion is illustrated. Of course, it may be an element. For example, if a conical electron emission portion made of a conductive material is formed on the cathode electrode 21, it is a so-called Spindt-type field emission device. If a conductive material layer is embedded in the insulating layer and an exposed end in the opening of the conductive material layer is an electron emission portion, this is a so-called edge type field emission device.

Although only one opening is shown in FIG. 2 in the area of one pixel, actually, as shown in FIG.
In many cases, a plurality of openings 25 are formed. However, the sealing panel device of the present invention is not limited to FIGS. 2 and 3 at all. For example, in FIG. 3, 16 openings 25 are formed in one pixel region. However, this is merely an example, and may be as many as thousands in actuality. The direction in which the anode electrode 13, the cathode electrode 21, and the gate electrode 23 are formed, and the shape of the opening 25 are also arbitrary.

A relatively negative voltage is applied to the cathode electrode 21 from the scanning circuit 53, and a relatively positive voltage is applied to the gate electrode 23 from the control circuit 52.
A positive voltage higher than that of the gate electrode 23 is supplied to the acceleration power source 5.
Applied from 1. When displaying on a display device,
A video signal is input to the control circuit 52, and a scanning signal is input to the scanning circuit 53. Electrons e are emitted from the electron emitting portion by an electric field generated when a voltage is applied to the cathode electrode 21 and the gate electrode 23. The electrons e are supplied to the anode electrode 1
When the phosphor layers 12R, 12G, and 12B collide with the phosphor layers 12R, 12G, and 12B, the phosphor layers 12R, 12G, and 12B emit light, and a desired display can be obtained. The operation of the display device is basically controlled by the voltage applied to the gate electrode 23. An insulating layer 14 for insulating the adhesive layer Am made of a low melting point metal material and the anode electrode 13 is formed at a portion where the anode electrode 13 is drawn out to form a connection terminal for the acceleration power supply 51. I have.
In order to form a connection terminal for the control circuit 52, a portion where the gate electrode 23 is drawn out is provided with an adhesive layer Am.
An insulating layer 24 for insulating the gate electrode 23 from the gate electrode 23 is formed. The structure of the other part can be the same as the structure of the adhesive layer 30m shown on the right side of the display device shown in FIG.

Hereinafter, a method of manufacturing the above-described sealing panel device will be described with reference to FIG. This manufacturing method is a manufacturing method according to the first embodiment of the present invention, and FIGS. 4A to 4C show the bonding of a low melting point metal material to the peripheral portions of the first panel P1 and the second panel P2. FIG. 4D shows a heating and bonding step when forming or arranging the layer Am. In FIG. 4A, the adhesive layer Am before heating is formed or arranged only on the first panel P1 side, and in FIG. 4B, only the second panel P2 side is formed or arranged. As long as the low melting point metal material to be formed has sufficient wettability to the first panel P1 or the second panel P2, such a formation or arrangement on only one of the panels may be performed. On the other hand, when the adhesive layer Am before heating is formed or arranged on both the first panel P1 and the second panel P2 as shown in FIG. 4C, the panel in the case where the wettability of the low melting point metal material is insufficient. Adhesion failure can be reduced, and the facing distance between panels can be ensured to some extent.

In the manufactured sealing panel device, as shown in FIG. 4D, the space surrounded by the first panel P1, the adhesive layer Am and the second panel P1 is a vacuum (VAC).
However, hereinafter, two manufacturing methods for achieving the vacuum, that is, the manufacturing method of the sealed panel device according to the first embodiment and the first embodiment will be described with reference to FIGS. Will be explained.

FIG. 5 shows a heating and heating method in which the first panel P1 and the second panel P2 are bonded by the adhesive layer by heating the adhesive layer Am to a temperature higher than the melting point of the low-melting metal material forming the adhesive layer Am. FIG. 9 is a process diagram of a manufacturing method in which the atmosphere in the bonding step is vacuum, and the space surrounded by the first panel, the second panel, and the bonding layer is vacuum. That is, as shown in FIG. 5A, the first panel P1 and the second
An adhesive layer Am is formed or arranged on the periphery of the panel P2. In FIG. 5A, the adhesive layer Am is formed or arranged on both the first panel P1 and the second panel P2.
It may be formed or arranged on only one of the panels. Next, as shown in FIG. 5B, the first panel P1 and the second panel P2 on which the adhesive layer Am is formed are aligned in the vacuum vessel VC, and the low melting point forming the adhesive layer Am is formed. By bonding while heating to a temperature higher than the melting point of the metal material (for example, 400 ° C. or lower), and bonding the first panel P1 and the second panel P2 with the bonding layer Am,
A sealing panel device can be obtained. In the obtained sealing panel device, as shown in FIG. 5C, the space is made vacuum (VAC) at the same time as the bonding.

FIG. 6 shows a heating and heating method in which the first panel P1 and the second panel P2 are bonded by the adhesive layer by heating the adhesive layer Am to a temperature higher than the melting point of the low-melting metal material forming the adhesive layer Am. After completion of the bonding step, the first panel P1
FIG. 10 is a process diagram of a manufacturing method for evacuating a space surrounded by the second panel P2 and the adhesive layer Am by bonding and exhausting the space after bonding. That is, as shown in FIG. 6A, an adhesive layer Am is formed or arranged on the peripheral portions of the first panel P1 and the second panel P2. An exhaust pipe E made of, for example, glass is inserted into a portion of the second panel P2 that does not affect its function. However, the exhaust pipe E may be inserted through the first panel P1. In FIG. 6A, the adhesive layer Am is formed or arranged on both the first panel P1 and the second panel P2, but may be formed or arranged on only one of the panels. Next, as shown in FIG. 6B, the first panel P1 and the second panel P2 on which the adhesive layer Am is formed are aligned, and are bonded while heating at, for example, a temperature of 400 ° C. or less. Heating and bonding can be performed under normal pressure or under reduced pressure that does not reach the final degree of vacuum required for the sealing panel device, and the atmosphere is air or an inert gas. At this point, the space surrounded by the first panel P1, the second panel P2, and the adhesive layer Am is not yet a vacuum. Next, the exhaust pipe E is connected to an exhaust device (not shown) to perform exhaust. When the space reaches a desired degree of vacuum, the exhaust pipe E is fused by heating.
A sealed panel device in which the space is evacuated (VAC) is obtained (see FIG. 6C).

In the sealing panel device manufactured by the manufacturing method according to the first and second embodiments, since the adhesive layer is made of a low-melting metal material, the conventional adhesive panel device is made of frit glass. Compared with the sealing panel device, the deterioration with time of the degree of vacuum is greatly suppressed. Further, since the temperature of the entire manufacturing process can be reduced to, for example, 400 ° C. or less, the throughput and the economic efficiency can be improved as compared with the conventional method.

(Embodiment 2) Embodiment 2 is a modification of Embodiment 1. In the sealing panel device according to the second embodiment, as shown in FIG.
An interval maintaining member S for maintaining a constant interval between the first panel P2 and the second panel P2 is sandwiched between the first panel P1 and the second panel P2. The gap maintaining member S is made of a rigid material having an insulating property, for example, a glass ball. In the sealing panel device having such a configuration, the facing distance between the panels is substantially determined by the size of the gap maintaining member S.
Therefore, a sealing panel device excellent in dimensional accuracy can be obtained even if the burden of controlling the size and shape of the adhesive layer Am in the stage of forming or disposing the adhesive layer Am is reduced.

In order to manufacture such a sealing panel device, as shown in FIG. 7A, an adhesive layer Am is formed or arranged on the periphery of the first panel P1 and the second panel P2, and then the first panel P1 and the second panel P2 are formed. The interval maintaining member S is disposed on the surface of the second panel P2 by a method such as coating, spraying, or spraying. In FIG. 7A, an adhesive layer A is provided on both the first panel P1 and the second panel P2.
Although m is formed or arranged, it may be formed or arranged only on one of the panels. Next, the first panel P1 and the second panel P2 are bonded. In FIG. 7B, the first panel P1 and the second panel P2 on which the adhesive layer Am has been formed are aligned in the vacuum vessel VC, for example, 4
Although the manufacturing method according to the first embodiment in which the bonding is performed while heating to a temperature of 00 ° C. or less is shown as an example, the manufacturing method according to the first embodiment in which the air is exhausted after the bonding may be applied.

(Third Embodiment) A third embodiment is still another modification of the first embodiment. In the sealing panel device of the third embodiment, as shown in FIG. 8C, between the adhesive layer Am and the first panel P1, and between the adhesive layer Am and the second panel P2.
A wettability improving layer W is formed between the panel and the panel P2.
In FIG. 8A, the first panel P1 and the second panel P2
Although the wettability improving layer W is formed on both of them, the wettability improving layer W may be formed on only one of the panels. In the sealing panel device having such a configuration, the adhesive layer Am made of a low melting point metal material is aligned with the wettability improving layer W in a self-aligning manner, and the shape accuracy and the dimensional accuracy of the adhesive layer Am are improved.

In order to manufacture such a sealing panel device, before forming the adhesive layer Am, the wettability to the low-melting metal material is applied to the portion of the first panel P1 and / or the second panel P2 where the adhesive layer is to be formed. A wettability improving layer W for improvement is formed beforehand, and thereafter, an adhesive layer Am is formed on the wettability improving layer W as shown in FIG. At this stage, the positioning accuracy between the wettability improving layer W and the adhesive layer Am may not be so high. Next, the first panel P1 and the second panel P2 are bonded. FIG. 8B shows an adhesive layer Am
The first panel P1 and the second panel P2 on which are formed are aligned in a vacuum vessel VC, and the manufacturing method according to the first embodiment A in which the first panel P1 and the second panel P2 are bonded to each other while being heated to, for example, 400 ° C. or lower is shown as an example. However, it goes without saying that the manufacturing method according to the 1B mode in which exhaust is performed after bonding is applied. Further, the sealing panel device described in Embodiment 2 can be applied to the sealing panel device in Embodiment 3.

(Embodiment 4) Embodiment 4 is directed to a sealing panel device according to the second aspect of the present invention and a sealing panel device according to the second aspect of the present invention including the aspects 2A and 2B. The present invention relates to a method for manufacturing a stop panel device. FIGS. 9, 10, and 11 show conceptual diagrams of the sealing panel device according to the fourth embodiment, and schematically show a cold cathode field emission display device configured by applying these sealing panel devices. FIG. 12 shows a cross-sectional view.
FIG. 13 is a conceptual diagram of a method of manufacturing the sealed panel device according to the second embodiment, and FIG. 14 is a process diagram of the method of manufacturing the sealed panel device according to the second embodiment A, and FIG. FIG. 15 shows a process chart of the method for manufacturing the sealing panel device according to the above. Note that reference numerals used in these drawings are partially common to those in FIGS. 1 to 8, and detailed description of common portions is omitted.

FIG. 9 shows a conceptual diagram of the sealing panel device according to the first and second configurations. FIG. 9A is a schematic sectional view, and FIG. 9B is a schematic perspective view. The first panel P1 having a rectangular shape has a first adhesive layer A1 at a peripheral portion.
m, the frame F is bonded to the second adhesive layer A2.
m and the second panel P2. First panel P1, first adhesive layer A1m, frame F, and second adhesive layer A2m
And a space surrounded by the second panel P2 is a vacuum (V
AC). In the sealing panel device having such a configuration, the facing distance between the panels is substantially determined by the height of the frame F. Therefore, by selecting the height of the frame F, compared to the sealing panel device according to the first aspect,
It is possible to set the facing distance between the panels longer.

In the sealing panel device shown in FIG.
Each of the first adhesive layer A1m and the second adhesive layer A2m is made of a low-melting metal material, and the melting point of the low-melting metal material constituting the first adhesive layer A1m and the low-melting metal constituting the second adhesive layer A2m. The melting points of the materials are substantially equal (first configuration), or the melting point of the low melting point metal material forming the first adhesive layer A1m is higher than the melting point of the low melting point metal material forming the second bonding layer A2m. High (second configuration).

FIG. 10 is a conceptual diagram of a sealing panel device according to the third configuration. FIG. 9A is a schematic sectional view, and FIG.
(B) is a schematic perspective view. In the third configuration, the first adhesive layer A1f is made of frit glass. still,
In the present specification, the subscript f of the symbol A1 representing the first adhesive layer
Is used to indicate that it is made of frit glass.
When there is no suffix in the reference A1 representing the first adhesive layer,
This is the case where the first adhesive layer may be formed of either a low melting point metal material or frit glass. Further, FIG.
The conceptual diagram of the sealing panel apparatus concerning a 4th structure is shown. 4th
In the configuration of (1), a part of the first adhesive layer is made of a low melting point metal material (first adhesive layer A1m), and the remainder is made of frit glass (first adhesive layer A1f). In FIG. 11, the first adhesive layer A1f made of frit glass is formed at the center of the short side of the rectangular frame F, but the formation site is not limited to this.

FIG. 12 shows an example in which the sealing panel device of the fourth embodiment is applied to a display device. In this display device, the first panel P1 has the first adhesive layer 31 at the peripheral portion.
Is bonded to the frame 40 by the second bonding layer 3
It is bonded to the second panel P2 by 2 m. First panel P1, first adhesive layer 31, frame body 40, second adhesive layer 32
The space surrounded by m and the second panel P2 is a vacuum. In the configuration of such a display device, the anode electrode 1
3 is applied with a higher voltage than the second panel P2 having the field emission elements. Therefore, only the insulating layer 14 formed on the lead-out portion of the anode electrode 13 has sufficient insulation. In some cases, it cannot be secured. In such a case, the third or fourth configuration may be applied, and at least a part of the first adhesive layer formed between the insulating layer 14 and the frame portion 40 may be made of frit glass. It is possible to ensure excellent insulation.

Hereinafter, a method of manufacturing the sealed panel device according to the fourth embodiment will be described with reference to FIG. 13. The periphery of the first panel P1 and / or the second panel P2 is made of a low melting point metal material. In the step of forming or arranging the adhesive layer, there are nine types (A) to (I) as patterns for forming or arranging the first and second adhesive layers. Which pattern is selected depends on the wettability of the low melting point metal material to each of the first panel P1, the frame F, and the second panel P2. After forming or disposing the first adhesive layer A1m and the second adhesive layer A2m according to any of the patterns shown in FIG. 13, the melting point of the low-melting metal material constituting the first adhesive layer A1m and the second adhesive layer A2m are formed. The first adhesive layer A1m is heated to a temperature higher than the melting point of the low melting metal material.
And by heating the second adhesive layer A2m, the frame F and the first panel P1 are adhered to each other by the first adhesive layer A1m,
Further, the frame F and the second panel P2 are bonded by the second bonding layer A2m.

As shown in FIGS. 9 (A), 10 (A) and 11 (A), the manufactured sealing panel device has a first panel P1, a first adhesive layer A1m, a frame F and the second
The space surrounded by the adhesive layer A2m and the second panel P1 is a vacuum (VAC). Hereinafter, two manufacturing methods for achieving the vacuum, namely, the second manufacturing method and the second manufacturing method, will be described.
The method for manufacturing the sealed panel device according to the embodiment B will be described with reference to FIGS. 14 and 15, respectively.

FIG. 14 shows a process of the manufacturing method according to the second embodiment A in which the atmosphere in the heating / bonding step is vacuum, and the space surrounded by the first panel, the second panel, and the bonding layer is vacuum. FIG. In this manufacturing method, it is possible to manufacture the sealing panel device according to the first configuration, that is, the sealing panel device in which the first adhesive layer A1m and the second adhesive layer A2m are made of a low melting point metal material having substantially the same melting point. it can. Further, even in the sealing panel device according to the second configuration, the difference in melting point between the first adhesive layer A1m and the second adhesive layer A2m is approximately 10%.
If it is about 0 ° C, it can be manufactured.

First, as shown in FIG.
A first adhesive layer A1m is formed or arranged on the peripheral portion of the panel P1 and the frame F, and a second adhesive layer A2m is formed on the peripheral portion of the frame F and the second panel P2. In FIG. 14A, the first adhesive layer A1m and the second adhesive layer A2 according to the pattern (H) in FIG.
m is formed or arranged, but may be formed or arranged according to other patterns (A) to (G) or pattern (I). Next, as shown in FIG. 14B, the first panel P1 on which the adhesive layers A1m and A2m are formed.
The frame body F and the second panel P2 are aligned in the vacuum vessel VC, and are bonded while being heated to, for example, a temperature of 400 ° C. or less, to obtain a sealed panel device. The heating temperature at this time is set to a temperature equal to or higher than the melting point of the low-melting metal material forming the first adhesive layer A1m and the second adhesive layer A2m when the melting points are substantially equal to each other.
The temperature is higher than the higher melting point. In the obtained sealing panel device, as shown in FIG. 14C, the space is made vacuum (VAC) at the same time as the bonding.

On the other hand, FIG. 15 shows that after the heating and bonding step, the space surrounded by the first panel P1, the first bonding layer A1m, the frame F, the second bonding layer A2m, and the second panel P2 is evacuated. It is process drawing of the manufacturing method which concerns on the 2B aspect of making a vacuum by doing. That is, similar to FIG.
A first adhesive layer A1m and a second adhesive layer A2m are formed or arranged on the periphery of the panel P1, the frame F, and the periphery of the second panel P2. However, the exhaust pipe E is inserted through the second panel P2. Next, as shown in FIG. 15B, the first panel P1, the frame body F, and the second panel P2 are aligned, and the first panel P1 is aligned with the first panel P1.
The bonding layer A1m and the second bonding layer A2m are bonded while being heated at a temperature of, for example, 400 ° C. or less. Heating and bonding
It can be performed under normal pressure or under reduced pressure that does not reach the final degree of vacuum required for the sealing panel device, and the atmosphere is air or an inert gas. At this point, the first panel P1, the first adhesive layer A1m, the frame F, and the second adhesive layer A2
The space surrounded by m and the second panel P2 is not yet a vacuum. Subsequent evacuation and fusion of the exhaust pipe E are as described in the first embodiment, and finally, as shown in FIG. 15C, the above space is sealed with a vacuum (VAC). A stop panel device is obtained.

The wettability improving layer W described in the third embodiment can be applied to the sealing panel device of the fourth embodiment. In this case, the wettability improving layer W for the first adhesive layer A1m is formed on the adhesive surface of the first panel P1, the adhesive surface of the frame F, or the adhesive surface of both the first panel P1 and the frame. Just fine. On the other hand, if the wettability improving layer W for the second adhesive layer A2m is formed on the adhesive surface of the second panel P2, the adhesive surface of the frame F, or the adhesive surface of both the second panel P2 and the frame. Good. Therefore, the wettability improving layer W for the first adhesive layer A1m and the wettability improving layer W for the second adhesive layer A2m have, for convenience, nine patterns. In addition, there are conveniently nine patterns for forming or disposing the first adhesive layer and the second adhesive layer. Therefore, the wettability improving layer W for the first adhesive layer A1m
There are a total of 81 combinations of the formation pattern of the wettability improving layer W with respect to the second adhesion layer A2m and the formation or arrangement pattern of the first adhesion layer and the second adhesion layer. First
Panel P1, second panel P2, frame F, first adhesive layer A1
An optimum combination may be selected from these combinations depending on the material constituting m and the second adhesive layer A2m.

(Embodiment 5) Embodiment 5 relates to a sealed panel device according to the second aspect of the present invention and a method for manufacturing the sealed panel device according to the third aspect of the present invention. FIG. 16 is a conceptual diagram of a method for manufacturing the sealed panel device according to the third embodiment, and FIG. 17 is a process diagram of the method for manufacturing the sealed panel device according to the third embodiment, and FIG. FIG. 18 shows a process chart of a method for manufacturing the sealing panel device. Note that a schematic cross-sectional view of the cold cathode field emission display device configured by applying the sealing panel device is the same as the schematic cross-sectional view of the cold cathode field emission display device illustrated in FIG. It is.

In the method for manufacturing a sealed panel device according to the third aspect, a step of forming or disposing a second adhesive layer A2m made of a low melting point metal material on the peripheral portion and / or the frame F of the second panel P2. There are three types (A) to (C) as patterns for forming or disposing the second adhesive layer A2m. Which pattern is selected depends on the wettability of the low-melting metal material to both the frame F and the second panel P2. After forming or disposing the first adhesive layer and the second adhesive layer according to any of the patterns shown in FIG. 16, the second adhesive layer is heated to a temperature higher than the melting point of the low-melting metal material forming the second adhesive layer. Thereby, the frame and the second panel are
It is adhered by the adhesive layer A2m.

The wettability improving layer W described in the third embodiment can be applied to the sealing panel device of the fifth embodiment. In this case, the wettability improving layer W for the second adhesive layer A2m is formed on the adhesive surface of the second panel P2, the adhesive surface of the frame F, or the adhesive surface of both the second panel P2 and the frame. I just need. On the other hand, in the case where at least a low melting point metal material is used as the first adhesive layer A1m, the wettability improving layer W for the first adhesive layer A1m is provided on the first panel P1.
Adhesive surface, or the adhesive surface of the frame F, or the first
What is necessary is just to form on the adhesion surface of both the panel P1 and the frame. Therefore, in such a case, the wettability improving layer W for the first adhesive layer A1m and the wettability improving layer W for the second adhesive layer A2m have, for convenience, nine patterns. In addition, there are conveniently nine patterns for forming or disposing the first adhesive layer and the second adhesive layer. Therefore, the wettability improving layer W and the second adhesive layer A2m for the first adhesive layer A1m
There are a total of 81 combinations of the formation pattern of the wettability improving layer W and the patterns of formation or arrangement of the first adhesive layer and the second adhesive layer. 1st panel P1, 2nd
An optimum combination may be selected from these combinations depending on the materials constituting the panel P2, the frame F, the first adhesive layer A1m, and the second adhesive layer A2m.

As shown in FIGS. 17C and 18C, the manufactured sealing panel device has a first panel P
1, the first adhesive layer A1, the frame body F, the second adhesive layer A2m, and the second
The space surrounded by the panel P1 is a vacuum (VAC). Hereinafter, two types of manufacturing methods for achieving the vacuum, that is, the sealing panel device according to the 3A and 3B modes will be described. The manufacturing method will be described with reference to FIGS.

FIG. 17 shows a process of the manufacturing method according to the mode 3A in which the atmosphere in the heating / adhering step is vacuum, and the space surrounded by the first panel, the second panel, and the adhesive layer is vacuum. FIG. With this manufacturing method, the sealing panel devices according to the second, third, and fourth configurations can be manufactured.

When the first adhesive layer A1 is made of a low-melting metal material having a melting point higher than that of the low-melting metal material forming the second adhesive layer (second configuration), first, FIG. As shown in the figure, the periphery of the first panel P1 and the frame F
Then, the first adhesive layer A1 is formed or arranged. Next, FIG.
(B), by heating the first adhesive layer A1 at a temperature higher than the melting point of the low-melting metal material forming the first adhesive layer A1, the first panel P1 and the frame F are separated from each other. Glue. The heating at this time is higher than the heating temperature of the second adhesive layer A2m described later. On the other hand, as shown in FIG. 17C, the second adhesive layer A2
m is formed or arranged. Next, as shown in FIG. 17D, the first panel P1 already bonded to the frame F is
Align the second panel P2 in the vacuum vessel VC,
By heating the second bonding layer A2m to a temperature higher than the melting point of the low melting point metal material forming the bonding layer A2m and lower than the melting point of the low melting point metal material forming the first bonding layer A1, A sealing panel device can be obtained.
In the obtained sealing panel device, as shown in FIG. 17E, the space is evacuated (VAC) simultaneously with the bonding. In this case, before forming or arranging the first adhesive layer A1 on the peripheral portion of the first panel P1 and the frame F, the peripheral portion of the first panel P1 and / or a portion where the first adhesive layer is to be formed on the frame F. In addition, a wettability improving layer for improving wettability to a low melting point metal material as described in Embodiment 3 may be formed.

Alternatively, when the first adhesive layer A1 is made of frit glass having a firing temperature higher than the melting point of the low melting point metal material constituting the second adhesive layer A2m (third configuration), first, FIG. As shown in (A), a first adhesive layer A1 is formed from a frit glass on the peripheral portion of the first panel P1 and the frame F by a coating method or the like, dried at about 100 ° C., and then dried at 350 ° C. C. Preliminary firing is performed before and after the first panel P1 on the peripheral portion and the frame body F from the frit glass.
An adhesive layer A1 is formed. Next, as shown in FIG. 17B, the peripheral portion of the first panel P1 and the frame F are bonded by firing the frit glass. On the other hand, as shown in FIG. 17C, a second adhesive layer A2m is formed or arranged on the peripheral portion of the frame F and the second panel P2. Next, FIG.
(D), the second panel P2 is positioned in the vacuum vessel VC with respect to the first panel P1 already bonded to the frame F, and the low melting point metal material forming the second bonding layer A2m is formed. To a temperature lower than the melting point of the frit glass constituting the first adhesive layer A1.
By heating the adhesive layer A2m, a sealing panel device can be obtained. In the obtained sealing panel device, as shown in FIG. 17E, the space is evacuated (VAC) simultaneously with the bonding.

Alternatively, part of the first adhesive layer A1 is made of frit glass having a firing temperature higher than the melting point of the low-melting metal material forming the second adhesive layer A2m, and the remaining part of the first adhesive layer A1 is made of the second adhesive layer A2. When the adhesive layer A2m is made of a low-melting metal material having a melting point higher than the melting point of the low-melting metal material (fourth configuration), first, the peripheral portion of the first panel P1 and the frame F are formed of frit glass. First adhesive layer A
Part 1 is formed based on a coating method or the like, and is dried and calcined. Next, a low-melting-point metal material is formed or arranged in a region of the first panel P1 where the remainder of the first adhesive layer is to be formed. Thus, as shown in FIG. 17A, the first panel P1
A part of the first adhesive layer A1 made of frit glass and a low melting point metal material having a melting point higher than the melting point of the low melting point metal material forming the second adhesive layer A2m on the peripheral portion and the frame body F The remainder of the first adhesive layer A1 can be formed. Next, as shown in FIG. 17B, the frit glass is fired, and the low melting point metal material forming the first adhesive layer is melted, so that the periphery of the first panel P1 and the frame F are joined together. Glue. On the other hand, as shown in FIG. 17C, a second adhesive layer A2m is formed or arranged on the peripheral portion of the frame F and the second panel P2. Next, as shown in FIG. 17D, the second panel P2 is positioned in the vacuum vessel VC with respect to the first panel P1 already bonded to the frame F,
The second adhesive layer A2 has a temperature higher than the melting point of the low-melting metal material forming the second adhesive layer A2m and lower than the melting point of the low-melting metal material forming the remainder of the first adhesive layer A1.
By heating m, a sealing panel device can be obtained. In the obtained sealing panel device, FIG.
As shown in (E), the space is made vacuum (VAC) at the same time as the bonding.

On the other hand, FIG. 18 shows that after the heating and bonding step, the first panel P1, the first bonding layer A1, the frame F and the second bonding layer A
It is process drawing of the manufacturing method which concerns on 3B aspect of making the vacuum by exhausting the space enclosed by 2m and 2nd panel P2. That is, the formation or arrangement of the first adhesive layer A1 shown in FIG. 18A and the adhesion between the first panel P1 and the frame F shown in FIG. It can be the same as the manufacturing method. Next, the second adhesive layer A2m is formed or arranged on the peripheral portion of the second panel P2 and the frame F. However, the exhaust pipe E is inserted through the second panel P2. Next, as shown in FIG. 18C, the first panel P1 already bonded to the frame F is replaced with the second panel P2.
And the frame F and the second panel P2 are heated and bonded. The heating and bonding between the frame F and the second panel P2 can be the same as the manufacturing method according to the above-described third embodiment A. Heating and bonding can be performed under normal pressure or under reduced pressure that does not reach the final degree of vacuum required for the sealing panel device, and the atmosphere is air or an inert gas. At this point, the first panel P1 and the first adhesive layer A
The space surrounded by 1 m, the frame F, the second adhesive layer A2m, and the second panel P2 is not yet a vacuum. Thereafter, the evacuation step shown in FIG. 18D and the fusion step shown in FIG. 18E are performed by the same method as the manufacturing method according to the second embodiment described in the first embodiment. As a result, as shown in FIG. 18E, a sealed panel device in which the space is vacuum (VAC) can be finally obtained.

Although the present invention has been described based on the embodiments, the present invention is not limited to these embodiments. The details of the structure of the sealing panel device, the details of the structure of the display device to which the sealing panel device is applied are examples, and may be appropriately changed,
Selection and combination are possible. For example, the wettability improving layer W
Can be applied to the sealing panel device and the manufacturing method thereof according to all aspects of the present invention. Further, a display device can be formed by applying the sealing panel device according to any of the embodiments of the present invention.

In the sealing panel device or the method of manufacturing the same according to the first aspect of the present invention, the first panel and / or the second panel have projections made of frit glass on the peripheral portion (according to the second aspect). A first panel and / or a second panel on which a frame (corresponding to a frame in a sealing panel device) is formed can also be used. Then, if necessary, an adhesive layer made of a low-melting-point metal material may be formed or arranged on such protrusions of the first panel and / or the second panel. In the case where the first panel and / or the second panel having such a structure is used and a wettability improving layer needs to be formed, a wettability improving layer is formed on the top surface of the projection made of frit glass. It may be formed.

[0081]

According to the sealing panel device or the method of manufacturing the same of the present invention, an adhesive layer for adhering a first panel and a second panel which are opposed to each other, and a first adhesive layer for adhering a first panel and a frame. Alternatively, since the second adhesive layer for bonding the frame and the second panel is made of a low melting point metal material, it is possible to improve the degree of vacuum in the vacuum space and maintain the high degree of vacuum for a long period of time. The reliability of the panel device is improved.
In the configuration using the frame, if frit glass is used for at least a part of the first adhesive layer, high insulation performance can be guaranteed for the first panel with high voltage specifications. Further, according to the method for manufacturing a sealed panel device of the present invention, a sealed panel device can be manufactured with high productivity without any complicated operation.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of a sealing panel device according to a first embodiment of the present invention, in which (A) is a cross-sectional view and (B) is an exploded perspective view.

FIG. 2 is a first embodiment of the invention configured as a display device;
It is a typical sectional view of the sealing panel device of.

FIG. 3 is an exploded perspective view showing a part of the sealing panel device shown in FIG. 2 in an enlarged manner.

FIG. 4 is a process chart conceptually showing a method of manufacturing the sealed panel device according to the first embodiment of the present invention.

FIG. 5 is a process chart conceptually showing a method of manufacturing the sealed panel device of the first embodiment of the present invention in which a vacuum space is formed simultaneously with bonding.

FIG. 6 is a process chart conceptually showing a method of manufacturing the sealed panel device of the first embodiment of the present invention in which a vacuum space is formed by evacuation after bonding.

FIG. 7 is a process chart conceptually showing a method for manufacturing a sealed panel device of Embodiment 2 of the present invention using a spacing member.

FIG. 8 is a process chart conceptually showing a method for manufacturing a sealing panel device of Embodiment 3 of the present invention using a wettability improving layer.

FIGS. 9A and 9B are conceptual views of a sealing panel device according to Embodiment 4 of the present invention, wherein FIG. 9A is a cross-sectional view and FIG. 9B is an exploded perspective view.

10A and 10B are conceptual diagrams showing another configuration of the sealing panel device according to the fourth embodiment of the present invention, wherein FIG. 10A is a cross-sectional view and FIG. 10B is an exploded perspective view.

11A and 11B are conceptual views showing still another configuration of the sealing panel device according to the fourth embodiment of the present invention, wherein FIG. 11A is a cross-sectional view, and FIG.
Is an exploded perspective view.

FIG. 12 is a conceptual sectional view of a sealing panel device according to a fourth embodiment of the present invention configured as a display device.

FIG. 13 is a process chart conceptually showing a method of manufacturing the sealed panel device of the fourth embodiment of the present invention.

FIG. 14 is a process chart conceptually showing a method of manufacturing a sealed panel device according to a fourth embodiment of the present invention in which a vacuum space is formed simultaneously with bonding.

FIG. 15 is a process chart conceptually showing a method of manufacturing a sealed panel device according to a fourth embodiment of the present invention in which a vacuum space is formed by evacuation after bonding.

FIG. 16 is a process chart conceptually showing a method of manufacturing the sealed panel device according to the fifth embodiment of the present invention.

FIG. 17 is a process chart conceptually showing a method of manufacturing a sealed panel device according to a fifth embodiment of the present invention in which a vacuum space is formed simultaneously with bonding.

FIG. 18 is a process chart conceptually showing a method of manufacturing a sealed panel device according to a fifth embodiment of the present invention in which a vacuum space is formed by evacuation after bonding.

[Explanation of symbols]

P1: first panel, P2: second panel, Am,
30 m: adhesive layer, F, 40: frame, A1, A1
f, 31... first adhesive layer, A2, A2 m, 32 m.
A second adhesive layer, S: a spacing maintaining member, W: a wettability improving layer, VC: a vacuum vessel, E: an exhaust pipe, 10 ·
..Transparent support, 11 ... Black matrix, 1
2R, 12G, 12B: phosphor layer, 13: anode electrode, 14, 24: insulating layer, 20: support, 21: cathode electrode, 23: gate electrode,
51 ... acceleration power supply, 52 ... control circuit, 53 ...
Scanning circuit

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5C012 AA05 BC03 BC05 5C032 AA01 BB16 BB18 5C036 EE14 EE17 EF01 EF06 EF09 EG06 EH11

Claims (30)

[Claims] A first panel and a second panel which are opposed to each other are bonded by an adhesive layer at a peripheral edge, and a space surrounded by the first panel, the second panel and the adhesive layer is evacuated. A panel device, wherein the adhesive layer is made of a low melting point metal material. 2. The apparatus according to claim 1, wherein a spacing maintaining member for maintaining a constant spacing between the first panel and the second panel is sandwiched between the first panel and the second panel. A sealing panel device according to item 1. 3. The first panel comprises a transparent support, an anode electrode and a phosphor layer formed on the transparent support, and the second panel comprises a support and the support formed on the support. A plurality of cold cathode field emission devices opposed to the anode electrode and the phosphor layer, and display is performed based on light emission caused by collision of electrons emitted from the cold cathode field emission devices with the phosphor layer. The sealing panel device according to claim 1, wherein: 4. A frame, and a first panel and a second panel opposed to each other with the frame interposed therebetween, wherein the frame and the first panel are adhered to each other by a first adhesive layer. The second panel is bonded to the first panel with the first panel by the second adhesive layer.
A sealing panel device in which a space surrounded by an adhesive layer, a frame, a second adhesive layer, and a second panel is evacuated, wherein the second adhesive layer is made of a low-melting metal material. Stop panel device. 5. The first adhesive layer is made of a low-melting metal material, and the melting point of the low-melting metal material constituting the first adhesive layer is substantially equal to the melting point of the low-melting metal material constituting the second adhesive layer. The sealing panel device according to claim 4, wherein: 6. The first bonding layer is made of a low-melting metal material, and the melting point of the low-melting metal material forming the first bonding layer is higher than the melting point of the low-melting metal material forming the second bonding layer. The sealing panel device according to claim 4, characterized in that: 7. The sealing panel device according to claim 4, wherein the first adhesive layer is made of frit glass. 8. The sealing panel device according to claim 4, wherein a part of the first adhesive layer is made of frit glass, and the remaining part of the first adhesive layer is made of a low melting point metal material. 9. The first panel comprises a transparent support, an anode electrode and a phosphor layer formed on the transparent support, and the second panel comprises a support and the support formed on the support. A plurality of cold cathode field emission devices opposed to the anode electrode and the phosphor layer, and display is performed based on light emission caused by collision of electrons emitted from the cold cathode field emission devices with the phosphor layer. The sealing panel device according to claim 4, wherein: 10. A step of forming or arranging an adhesive layer made of a low-melting metal material on the periphery of the first panel and / or the second panel; and Heating the adhesive layer to a temperature higher than the melting point of the material, thereby bonding the first panel and the second panel with the adhesive layer. 11. The method according to claim 10, wherein the heating in the step (b) is performed in a vacuum atmosphere, so that a space surrounded by the first panel, the second panel, and the adhesive layer is evacuated. The manufacturing method of the sealing panel device as described in the above. 12. The sealing panel according to claim 10, wherein, after the step (b), the space surrounded by the first panel, the second panel, and the adhesive layer is evacuated to make a vacuum. Device manufacturing method. 13. In the step (a), an interval maintaining member for maintaining a constant interval between the first panel and the second panel is previously arranged on the first panel or the second panel. The method for manufacturing a sealed panel device according to claim 10. 14. The method according to claim 1, wherein the first panel and / or
The method for manufacturing a sealing panel device according to claim 10, wherein a wettability improving layer for improving wettability with respect to a low-melting metal material is formed at a portion of the second panel where an adhesive layer is to be formed. 15. A first panel comprising a transparent support, an anode electrode and a phosphor layer formed on the transparent support, and a second panel comprising a support and the transparent electrode formed on the support. A plurality of cold cathode field emission devices opposed to the anode electrode and the phosphor layer, and display is performed based on light emission caused by collision of electrons emitted from the cold cathode field emission devices with the phosphor layer. The method for manufacturing a sealed panel device according to claim 10, wherein: 16. A method of manufacturing a frame, and a sealed panel device comprising a first panel and a second panel arranged to face each other with the frame interposed therebetween, comprising: (a) a peripheral portion of the first panel; And / or forming and / or disposing a first adhesive layer made of a low-melting metal material on the frame, while forming a second adhesive layer made of a low-melting metal material on the periphery of the second panel and / or the frame. Or (b) setting the first adhesive layer and the second adhesive layer at a temperature higher than the melting point of the low melting point metal material forming the first adhesive layer and the melting point of the low melting point metal material forming the second adhesive layer. By heating the adhesive layer, the frame and the first panel are adhered by the first adhesive layer,
And a step of bonding the frame and the second panel with a second adhesive layer. 17. The heating in the step (b) is performed in a vacuum atmosphere, so that the space surrounded by the first panel, the first adhesive layer, the frame, the second adhesive layer, and the second panel is evacuated. The method for manufacturing a sealed panel device according to claim 16, wherein: 18. After the step (b), the space enclosed by the first panel, the first adhesive layer, the frame, the second adhesive layer, and the second panel is evacuated to make a vacuum. The method for manufacturing a sealed panel device according to claim 16. 19. In the step (a), a wettability improving layer for improving the wettability with respect to a low melting point metal material is provided on at least one of the first panel, the frame and the second panel where the adhesive layer is to be formed. The method for manufacturing a sealed panel device according to claim 16, wherein the sealing panel device is formed. 20. The encapsulation according to claim 16, wherein the melting point of the low melting point metal material forming the first adhesive layer is substantially equal to the melting point of the low melting point metal material forming the second adhesive layer. A method for manufacturing a panel device. 21. A first panel comprising a transparent support, an anode electrode and a phosphor layer formed on the transparent support, and a second panel formed on the support and the support. A plurality of cold cathode field emission devices opposed to the anode electrode and the phosphor layer, and display is performed based on light emission caused by collision of electrons emitted from the cold cathode field emission devices with the phosphor layer. The method for manufacturing a sealed panel device according to claim 16, wherein: 22. A method of manufacturing a frame, and a sealing panel device comprising a first panel and a second panel disposed to face each other with the frame interposed therebetween, comprising: (a) a peripheral portion of the first panel; (B) forming or arranging a second adhesive layer made of a low-melting metal material on a peripheral portion of the second panel and / or the frame, C) heating the second adhesive layer to a temperature higher than the melting point of the low-melting metal material forming the second adhesive layer, thereby bonding the frame and the second panel with the second adhesive layer. A method for manufacturing a sealed panel device, comprising: 23. The heating in the step (c) is performed in a vacuum atmosphere, so that a space surrounded by the first panel, the first adhesive layer, the frame, the second adhesive layer, and the second panel is evacuated. The method for manufacturing a sealed panel device according to claim 22, wherein: 24. After the step (c), a space surrounded by the first panel, the first adhesive layer, the frame, the second adhesive layer, and the second panel is evacuated to make a vacuum. The method for manufacturing a sealed panel device according to claim 22. 25. Prior to the step (b), a wettability improving layer for improving wettability with respect to a low melting point metal material is provided on a peripheral portion of the second panel and / or a portion where the second adhesive layer is to be formed on the frame. The method for manufacturing a sealed panel device according to claim 22, wherein the sealing panel device is formed. 26. The first adhesive layer is made of a low-melting metal material having a higher melting point than the low-melting metal material forming the second adhesive layer. In the step (a), the first adhesive layer is formed. Heating the first adhesive layer at a temperature higher than the melting point of the low-melting metal material; The method for manufacturing a sealing panel device according to claim 22, wherein the second adhesive layer is heated to a temperature lower than a melting point of the low melting point metal material forming the layer. 27. Prior to the step (A), a wettability improving layer for improving wettability with respect to a low melting point metal material is provided on a peripheral portion of the first panel and / or a portion where the first adhesive layer is to be formed on the frame. The method for manufacturing a sealing panel device according to claim 26, wherein the sealing panel device is formed. 28. The first adhesive layer is made of frit glass having a firing temperature higher than the melting point of the low-melting metal material forming the second adhesive layer. In the step (a), the first adhesive layer is fired by firing the frit glass. In the step (c), the temperature of the frit glass forming the first adhesive layer is higher than the melting point of the low-melting metal material forming the second adhesive layer. The method for manufacturing a sealing panel device according to claim 22, wherein the second adhesive layer is heated to a temperature lower than a firing temperature. 29. A part of the first adhesive layer is made of frit glass having a firing temperature higher than the melting point of the low-melting metal material forming the second adhesive layer, and the remainder of the first adhesive layer is a second adhesive layer. In the step (a), the frit glass is fired, and the first frit glass is fired.
By melting the low melting point metal material forming the adhesive layer, the peripheral portion of the first panel and the frame are bonded to each other. In the step (c), the melting point is higher than the melting point of the low melting point metal material forming the second bonding layer. 23. The method according to claim 22, wherein the second adhesive layer is heated to a temperature lower than the melting point of the low-melting metal material forming the remainder of the first adhesive layer. . 30. A first panel comprising a transparent support, an anode electrode and a phosphor layer formed on the transparent support, and a second panel formed on the support and the support. A plurality of cold cathode field emission devices opposed to the anode electrode and the phosphor layer, and display is performed based on light emission caused by collision of electrons emitted from the cold cathode field emission devices with the phosphor layer. The method for manufacturing a sealed panel device according to claim 22, wherein: