JP2000201417A - Wiring board assembly and method of manufacturing the same - Google Patents

Wiring board assembly and method of manufacturing the same

Info

Publication number
JP2000201417A
JP2000201417A JP11222165A JP22216599A JP2000201417A JP 2000201417 A JP2000201417 A JP 2000201417A JP 11222165 A JP11222165 A JP 11222165A JP 22216599 A JP22216599 A JP 22216599A JP 2000201417 A JP2000201417 A JP 2000201417A
Authority
JP
Japan
Prior art keywords
wiring board
bus bar
layer
terminal
electric wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11222165A
Other languages
Japanese (ja)
Other versions
JP3620015B2 (en
Inventor
Katsuaki Terada
克明 寺田
Mitsuji Kubota
満治 久保田
Hiroyuki Murakoshi
洋行 村越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP22216599A priority Critical patent/JP3620015B2/en
Publication of JP2000201417A publication Critical patent/JP2000201417A/en
Application granted granted Critical
Publication of JP3620015B2 publication Critical patent/JP3620015B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Connection Or Junction Boxes (AREA)

Abstract

(57)【要約】 【課題】 コスト低減及びバスバーからのリーク防止等
を図る。 【解決手段】 配線板1,2に並設した複数のバスバー
3,4は両端に逆向きの端子5〜8を有し、第二層の配
線板2のバスバー4が第一層の配線板1のバスバー3を
反転させた形状のもので、配線板1の一側の端子5と配
線板2の他側の端子8、及び配線板1の他側の端子6と
配線板2の一側の端子7とが同じ長さである。バスバー
3の一端と他端に端子5,6を逆向きに突出形成し、バ
スバー3を第一層の配線板1に設け、バスバー3と同形
状のバスバーを反転させて第二層の配線板2に設ける。
配線板1(2)の凹部内にバスバー3(4)の一部を露
出し、配線板2(1)に、凹部に係合する突出部を形成
した。各凹部に対応して各配線板1,2の各突出部が隣
接して位置する。凹部と突出部はテーパ状である。バス
バー3に設けた抵抗溶接用の突起に電線12を点接触さ
せて溶接する。
(57) [Summary] [PROBLEMS] To reduce costs and prevent leakage from bus bars. A plurality of bus bars (3, 4) arranged in parallel on wiring boards (1) and (2) have terminals (5) to (8) at opposite ends, and a bus bar (4) of a second-layer wiring board (2) is a first-layer wiring board. The terminal 5 on one side of the wiring board 1 and the terminal 8 on the other side of the wiring board 2, and the terminal 6 on the other side of the wiring board 1 and one side of the wiring board 2 Are the same length. Terminals 5 and 6 are formed on one end and the other end of the bus bar 3 so as to protrude in opposite directions, and the bus bar 3 is provided on the first-layer wiring board 1. 2 is provided.
A part of the bus bar 3 (4) was exposed in the recess of the wiring board 1 (2), and a protruding portion engaging with the recess was formed on the wiring board 2 (1). Each protruding portion of each of the wiring boards 1 and 2 is located adjacent to each recess. The recess and the protrusion are tapered. The electric wire 12 is brought into point contact with the projection for resistance welding provided on the bus bar 3 for welding.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複数本のバスバー
を有する複数枚の配線板を積層して電気接続箱等に収容
させる配線板組立体とその製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board assembly in which a plurality of wiring boards having a plurality of bus bars are stacked and housed in an electric junction box or the like, and a method of manufacturing the same.

【0002】[0002]

【従来の技術】図11は従来の配線板組立体の一例を示
すものである。この配線板組立体80は、帯状の配線板
81を蛇腹状に折り畳んで、配線板81の上下の端末に
おいて端子82を配線板81の電線83に圧接接続させ
るものである。
2. Description of the Related Art FIG. 11 shows an example of a conventional wiring board assembly. In the wiring board assembly 80, a strip-shaped wiring board 81 is folded in a bellows shape, and terminals 82 are pressed and connected to electric wires 83 of the wiring board 81 at upper and lower terminals of the wiring board 81.

【0003】電線83は配線板81の表面上に並列に設
けられている。折り畳んだ配線板81の上面81aと下
面81bとに電線83が位置するように、配線板81は
三つ折りに畳まれる。各端子82は一方にタブ部84、
他方に圧接部85を有し、圧接部85が電線83に圧接
される。配線板81と端子82とで配線板組立体80が
構成される。配線板組立体80は折り畳まれた状態で図
示しない電気接続箱内に収容される。タブ部84は電気
接続箱の図示しない上下のコネクタ部内に配置される。
The electric wires 83 are provided on the surface of the wiring board 81 in parallel. The wiring board 81 is folded in three so that the electric wires 83 are located on the upper surface 81a and the lower surface 81b of the folded wiring board 81. Each terminal 82 has a tab 84 on one side,
The other end has a press contact portion 85, and the press contact portion 85 is pressed against the electric wire 83. The wiring board 81 and the terminals 82 constitute a wiring board assembly 80. The wiring board assembly 80 is accommodated in an electric junction box (not shown) in a folded state. The tab portions 84 are arranged in upper and lower connector portions (not shown) of the electric connection box.

【0004】しかしながら、上記従来の構造にあって
は、配線板81の上面81aと下面81b、すなわち配
線板81の端末部のみにしか端子82を配置することが
できないために、端子82と電線83との接続数が配線
板81の幅すなわち電線83の本数で制限されてしまう
という問題があった。
However, in the above-mentioned conventional structure, the terminal 82 can be arranged only on the upper surface 81a and the lower surface 81b of the wiring board 81, that is, only at the terminal portion of the wiring board 81. Is limited by the width of the wiring board 81, that is, the number of the electric wires 83.

【0005】そこで、本出願人は特願平10−2366
50号において、図12に示す如く配線板87〜89を
三層構造にすると共に、各配線板87〜89に一体成形
されたバスバー90〜92と、配線板87〜89上に配
索した電線93とを、図13の如く電極94,95を用
いた抵抗溶接により接続し、且つ、配線板87,89の
長さ方向中間部において電線93と端子(図示せず)と
を圧接接続させるという配線板組立体97とその製造方
法を提案した。図13においてバスバー90は接続孔9
6内に露出して位置している。
Accordingly, the present applicant has filed Japanese Patent Application No. 10-2366.
In No. 50, as shown in FIG. 12, wiring boards 87 to 89 have a three-layer structure, bus bars 90 to 92 formed integrally with wiring boards 87 to 89, and electric wires routed on wiring boards 87 to 89. As shown in FIG. 13, the wires 93 and 93 are connected by resistance welding using the electrodes 94 and 95, and the electric wires 93 and terminals (not shown) are press-connected to the wiring boards 87 and 89 at longitudinally intermediate portions. A wiring board assembly 97 and a method of manufacturing the same have been proposed. In FIG. 13, the bus bar 90 is connected to the connection hole 9.
6 and is exposed.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記従
来の構造及び方法にあっては、バスバー90〜92は例
えば端末のタブ端子(図示せず)の長さに応じて何種類
もの形状に打ち抜かなければならないために、パンチや
ダイスといった成形金型の費用が嵩み、配線板組立体9
7のコストがアップするという問題を生じた。
However, in the above-described conventional structure and method, the bus bars 90 to 92 can be punched in various shapes depending on, for example, the length of the terminal tab terminal (not shown). The cost of the molding die such as punches and dies increases, and the wiring board assembly 9
7 has a problem that the cost increases.

【0007】また、配線板87〜89を複数層に重ねた
場合に、凹状の接続孔(正確には接続穴)96内に例え
ば結露等による水98や塵等が溜り、配線板87,88
のバスバー90,91の露出部、特に電線93との溶接
面90a,91aとは反対側の露出面90b,91bが
水98等によって短絡やリークを起こすのではないかと
いう懸念を生じた。
Further, when the wiring boards 87 to 89 are stacked in a plurality of layers, water 98 or dust due to, for example, dew condensation accumulates in the concave connection holes (more precisely, the connection holes) 96, and the wiring boards 87 and 88.
The exposed portions of the bus bars 90, 91, in particular, the exposed surfaces 90b, 91b opposite to the welding surfaces 90a, 91a with the electric wires 93 may cause a short circuit or leak due to the water 98 or the like.

【0008】また、バスバー90に電線93を抵抗溶接
する際に、バスバー90と電線93とが線接触するため
に、溶接電流が拡散して、溶接の境界面が安定せず、溶
接強度が低下するという問題があった。
Further, when the electric wire 93 is resistance-welded to the bus bar 90, since the bus bar 90 and the electric wire 93 are in line contact, the welding current is diffused, the welding boundary surface is not stabilized, and the welding strength is reduced. There was a problem of doing.

【0009】本発明は、上記した各点に鑑み、バスバー
の打抜き成形にかかる費用を低減させてコストアップを
防止すると共に、配線板のバスバーの露出部からのリー
クや短絡を確実に防止し、さらに、バスバーに電線を確
実に溶接することのできる手段を提供することを目的と
する。
In view of the above points, the present invention reduces the cost of stamping and forming a bus bar, thereby preventing an increase in cost, and reliably preventing a leak or a short circuit from an exposed portion of a bus bar of a wiring board. It is another object of the present invention to provide a means that can reliably weld an electric wire to a bus bar.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、複数枚の配線板に複数本のバスバーが並
列に設けられ、該バスバーが両端部に逆向きの端子を有
し、該複数枚の配線板が積層される配線板組立体におい
て、第二層の配線板のバスバーが第一層の配線板のバス
バーを反転させた形状のものであり、該第一層の配線板
の一側の端子と該第二層の配線板の他側の端子とが同じ
長さで、該第一層の配線板の他側の端子と該第二層の配
線板の一側の端子とが同じ長さである配線板組立体を採
用する(請求項1)。また、バスバーの一端と他端とに
それぞれ端子を逆向きに突出形成し、該バスバーを第一
層の配線板に設け、該バスバーと同一形状のバスバーを
反転させて第二層の配線板に設ける配線板組立体の製造
方法を併せて採用する(請求項2)。前記第一層及び/
又は第二層の配線板の凹部内に前記バスバーの一部が露
出し、該第二層及び/又は第一層の配線板に、該凹部に
係合する突出部が形成された構造も有効である(請求項
3)。そして、配線板の内部にバスバーが設けられ、該
バスバーの一部が該配線板の凹部内で露出し、複数枚の
該配線板が積層されて成る配線板組立体において、前記
配線板に、前記凹部に係合する突出部が形成された配線
板組立体を併せて採用する(請求項4)。第一層の配線
板と第二層の配線板との各凹部に対応して該第一層の配
線板の突出部と該第二層の配線板の突出部とが隣接して
位置することも有効である(請求項5)。前記凹部及び
前記突出部がテーパ状に形成されたことも有効である
(請求項6)。また、前記配線板の接続孔内で前記バス
バーに抵抗溶接用の突起が設けられ、該突起に電線が点
接触して抵抗溶接される構造も有効である(請求項
7)。また、請求項2における前記バスバーに抵抗溶接
用の突起を設け、前記配線板の接続孔内で該突起に電線
を点接触させた状態で、該バスバーと該電線とを抵抗溶
接する方法も有効である(請求項8)。
In order to achieve the above-mentioned object, the present invention provides a plurality of wiring boards in which a plurality of bus bars are provided in parallel, and the bus bars have oppositely oriented terminals at both ends. In the wiring board assembly in which the plurality of wiring boards are stacked, the bus bar of the second layer wiring board has a shape obtained by inverting the bus bar of the first layer wiring board, and the wiring of the first layer The terminal on one side of the board and the terminal on the other side of the wiring board of the second layer have the same length, and the terminal on the other side of the wiring board of the first layer and one side of the wiring board on the second layer A wiring board assembly having the same length as the terminals is employed (claim 1). Also, terminals are formed on one end and the other end of the bus bar in opposite directions, respectively, and the bus bar is provided on the first layer wiring board, and the bus bar having the same shape as the bus bar is inverted to form a second layer wiring board. The manufacturing method of the provided wiring board assembly is also adopted (claim 2). The first layer and / or
Alternatively, a structure is also effective in which a part of the bus bar is exposed in a concave portion of the second-layer wiring board, and a protrusion engaging with the concave portion is formed on the second-layer and / or first-layer wiring board. (Claim 3). A bus bar is provided inside the wiring board, a part of the bus bar is exposed in a concave portion of the wiring board, and in a wiring board assembly in which a plurality of the wiring boards are stacked, the wiring board includes A wiring board assembly having a protruding portion that engages with the concave portion is also employed (claim 4). The protruding portion of the first-layer wiring board and the protruding portion of the second-layer wiring board are positioned adjacent to each recess of the first-layer wiring board and the second-layer wiring board. Is also effective (claim 5). It is also effective that the concave portion and the protruding portion are formed in a tapered shape. Further, a structure is also effective in which a projection for resistance welding is provided on the bus bar in a connection hole of the wiring board, and an electric wire is point-contacted with the projection to perform resistance welding. In addition, a method for providing resistance bushing to the bus bar according to claim 2 and effecting resistance welding between the bus bar and the wire in a state where the wire is point-contacted to the protrusion in the connection hole of the wiring board is also effective. (Claim 8).

【0011】[0011]

【発明の実施の形態】以下に本発明の実施の形態の具体
例を図面を用いて詳細に説明する。図1は、本発明に係
る配線板接続体の一実施形態を含む電気接続箱を示すも
のである。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an electric junction box including an embodiment of a wiring board connector according to the present invention.

【0012】この配線板組立体C1 は、図2にも示す如
く、第一層の配線板1と第二層の配線板2とを上下に重
ね合わせ、各配線板1,2のバスバー3,4のタブ端子
(端子)5〜8を各配線板1,2の一側方で上向きに、
他側方で下向きにそれぞれ突出させ、第一層の配線板1
の上向きのタブ端子5の長さと、第二層の配線板2の下
向きのタブ端子8の長さとを同一に設定し、且つ第一層
の配線板1の下向きのタブ端子6の長さと、第二層の配
線板2の上向きのタブ端子7の長さとを同一に設定し
て、両配線板1,2のバスバー3,4を共通使用できる
ようにしたものである。
As shown in FIG. 2, the wiring board assembly C 1 has a wiring board 1 of the first layer and a wiring board 2 of the second layer which are vertically overlapped with each other, and the bus bar 3 of each of the wiring boards 1 and 2. , 4 with tab terminals (terminals) 5 to 8 facing upward on one side of each wiring board 1, 2.
The wiring board 1 of the first layer is protruded downward on the other side.
The length of the upward tab terminal 5 and the length of the downward tab terminal 8 of the second layer wiring board 2 are set to be the same, and the length of the downward tab terminal 6 of the first layer wiring board 1 The length of the upward tab terminal 7 of the wiring board 2 of the second layer is set to be the same, so that the bus bars 3 and 4 of the wiring boards 1 and 2 can be commonly used.

【0013】バスバー3,4は各配線板1,2の母体で
ある合成樹脂製の絶縁基板9,10の横断方向に複数本
が直線的に且つ並列にインサート成形され、バスバー
3,4の両端部が各絶縁基板9,10の両端面11(図
2)から突出し、バスバー3,4の両端部にタブ端子5
〜8が形成されている。バスバー3,4と絶縁基板9,
10とで配線板1,2が構成される。第一層の配線板1
の上向きのタブ端子5と第二層の配線板2の下向きのタ
ブ端子8とは短く、第一層の配線板1の下向きのタブ端
子6と第二層の配線板2の上向きのタブ端子7とは長く
設定されている。両配線板1,2を積層した状態で、上
向きの各タブ端子5,7の先端の位置(高さ)は同じで
あり、下向きの各タブ端子6,8の先端の位置(高さ)
は同じである。
A plurality of busbars 3 and 4 are insert-molded linearly and in parallel in the transverse direction of insulating substrates 9 and 10 made of synthetic resin, which are the base bodies of the wiring boards 1 and 2. Portions protrude from both end surfaces 11 (FIG. 2) of the insulating substrates 9 and 10, and tab terminals 5 are provided at both ends of the bus bars 3 and 4.
To 8 are formed. Busbars 3, 4 and insulating substrate 9,
10 constitute wiring boards 1 and 2. First layer wiring board 1
The upward tab terminal 5 and the downward tab terminal 8 of the second layer wiring board 2 are short, and the downward tab terminal 6 of the first layer wiring board 1 and the upward tab terminal of the second layer wiring board 2 are short. 7 is set to be long. In the state where both wiring boards 1 and 2 are stacked, the positions (heights) of the tips of the upward tab terminals 5 and 7 are the same, and the positions (heights) of the tips of the downward tab terminals 6 and 8.
Is the same.

【0014】図2の如く、各バスバー3,4は配線板
1,2の厚さ方向中央に配置されている。両配線板1,
2の板厚は同一である。第一層の配線板1のバスバー3
(以下第一層のバスバーという)と第二層の配線板2の
バスバー4(以下第二層のバスバーという)とは配線板
1(又は2)の板厚分だけ離間しており、両バスバー
3,4のタブ端子5,7(又は6,8)の突出長さは配
線板1(又は2)の板厚分(寸法T)だけ相違してい
る。第二層(又は第一層)のバスバー4(3)は第一層
(又は第二層)のバスバー3(4)と同一形状のバスバ
ーを反転して使用したものであり、この構成は配線板組
立体C1 の製造方法としても有効である。
As shown in FIG. 2, each bus bar 3, 4 is arranged at the center of the wiring boards 1, 2 in the thickness direction. Both wiring boards 1,
2 have the same thickness. Bus bar 3 of first layer wiring board 1
(Hereinafter, referred to as a first-layer bus bar) and a bus bar 4 (hereinafter, referred to as a second-layer bus bar) of the second-layer wiring board 2 are separated by a thickness of the wiring board 1 (or 2). The projecting lengths of the tab terminals 5, 7 (or 6, 8) of the 3, 4 are different by the thickness (dimension T) of the wiring board 1 (or 2). The bus bar 4 (3) of the second layer (or the first layer) is obtained by inverting and using a bus bar having the same shape as the bus bar 3 (4) of the first layer (or the second layer). even manufacturing process of the plate assembly C 1 is effective.

【0015】第一層の配線板1の上面と第二の配線板2
の下面とに複数本の電線12がバスバー3,4とは直交
する方向に配索されている。電線12は両配線板1,2
の前端側で屈曲して続いている。第一層の配線板1は電
線12の屈曲部12aをヒンジとして第二層の配線板2
の上に反転して載った状態となっている。電線12は被
覆電線やエナメル線等である。
The upper surface of the first wiring board 1 and the second wiring board 2
A plurality of electric wires 12 are routed in a direction orthogonal to the bus bars 3 and 4 on the lower surface of the wire. The electric wire 12 is connected to both wiring boards 1 and 2
And bends at the front end side. The first-layer wiring board 1 uses the bent portion 12a of the electric wire 12 as a hinge, and the second-layer wiring board 2
It is in a state of being inverted and placed on. The electric wire 12 is a covered electric wire, an enameled wire, or the like.

【0016】第一層の配線板1の中間部には、接続用の
標準のタブ端子13の圧接部14を係合させる各一対の
通孔15が並列に複数形成され、各一対の通孔15の間
で電線12が切断され、電線12の端末部に圧接部14
が圧接される。また、第一層の配線板1の後端寄りに
は、ヒューズ接続用の標準の挟持端子16に対する通孔
18が形成され、挟持端子16の圧接部17が電線12
に圧接される。
In the middle portion of the first layer wiring board 1, a plurality of pairs of through-holes 15 are formed in parallel with each other to engage the press-contact portions 14 of the standard tab terminals 13 for connection. 15, the wire 12 is cut, and the pressure contact portion 14 is attached to the end of the wire 12.
Is pressed. A through hole 18 for a standard holding terminal 16 for fuse connection is formed near the rear end of the first-layer wiring board 1, and a press-contact portion 17 of the holding terminal 16 is connected to the electric wire 12.
Is pressed against.

【0017】第二層の配線板2の後部には段部19を介
して第一層の配線板1と同一高さの電源用の副配線部2
0が一体に形成されている。副配線部20には電源用の
バスバー21が配置される。電源用のバスバー21は受
電用のタブ端子22と給電用の上下の挟持端子23,2
4とを有している。副配線部20の下面にまで電線12
が配索され、リレー用の挟持端子25の圧接部26が電
線12に圧接される。
At the rear of the second-layer wiring board 2, a sub-wiring 2 for power supply having the same height as the first-layer wiring board 1 is provided via a step 19.
0 are integrally formed. A bus bar 21 for a power supply is arranged in the sub wiring portion 20. A bus bar 21 for power supply includes a tab terminal 22 for power reception and upper and lower clamping terminals 23 and 2 for power supply.
And 4. The electric wire 12 extends to the lower surface of the sub-wiring portion 20.
Are arranged, and the press contact portion 26 of the holding terminal 25 for the relay is pressed against the electric wire 12.

【0018】二枚の配線板1,2と電線12と電源用の
バスバー21と各端子13,16,25とで配線板組立
体C1 が構成される。配線板組立体C1 は合成樹脂製の
下カバー27に収容され、配線板組立体C1 の上から上
カバー28が覆設される。バスバー3,4の上向きのタ
ブ端子5,7は上カバー28のコネクタハウジング29
内に収容され、下向きのタブ端子6,8は下カバー27
のコネクタハウジング30内に収容され、それぞれコネ
クタを構成する。電線12に圧接されたタブ端子13は
上カバー28のコネクタハウジング31内に収容され、
挟持端子16と電源用のバスバー21の挟持端子23と
はヒューズ収容部32に収容される。配線板組立体C1
と上カバー28と下カバー27とで電気接続箱E1 が構
成される。なお、配線板1,2を二枚にして、タブ端子
5〜8を含むバスバー3,4の共通化を図った以外の構
成は特願平10−236650号と同様である。
The circuit board assembly C 1 is constituted by the two wiring boards 1 and 2 and the wire 12 and the bus bar 21 for power supply and the terminals 13,16,25. Circuit board assembly C 1 is accommodated in the lower cover 27 made of synthetic resin, the upper cover 28 is Kutsugae設from the top of the circuit board assembly C 1. The upward tab terminals 5, 7 of the bus bars 3, 4 are connected to the connector housing 29 of the upper cover 28.
The tab terminals 6 and 8 facing downward are accommodated in the lower cover 27.
Are housed in the connector housings 30 and 30 and constitute connectors. The tab terminal 13 pressed into contact with the electric wire 12 is housed in the connector housing 31 of the upper cover 28,
The holding terminal 16 and the holding terminal 23 of the power supply bus bar 21 are housed in the fuse housing 32. Wiring board assembly C 1
Electrical connection box E 1 is constituted by an upper cover 28 and lower cover 27 and. The configuration is the same as that of Japanese Patent Application No. 10-236650 except that two wiring boards 1 and 2 are used and the bus bars 3 and 4 including the tab terminals 5 to 8 are shared.

【0019】各配線板1,2には、図3(第一層の配線
板1のみを示す)の如く、バスバー3を露出させた接続
孔33や切断孔34が形成されている。所要の接続孔3
3内でバスバー3の露出部3aに電線12が溶接され、
所要の切断孔34内でバスバー3が切断される。切断孔
34を接続孔33として用いることも可能である。図3
においてバスバー3は連鎖部35で一体化されており、
この連鎖バスバー36の連鎖部35を切断することで複
数本のバスバー3が構成される。連鎖バスバー36は金
型で打ち抜き成形された状態のものである。
As shown in FIG. 3 (only the first layer wiring board 1 is shown), connection holes 33 and cutting holes 34 exposing the bus bar 3 are formed in each of the wiring boards 1 and 2. Required connection hole 3
3, the electric wire 12 is welded to the exposed portion 3a of the bus bar 3,
The bus bar 3 is cut in the required cutting hole 34. The cutting hole 34 can be used as the connection hole 33. FIG.
, The bus bar 3 is integrated with the chain portion 35,
By cutting the chain portion 35 of the chain bus bar 36, a plurality of bus bars 3 are formed. The chain bus bar 36 is in a state punched and formed by a die.

【0020】第一層の配線板1と第二層の配線板2(図
1)とで連鎖バスバー36は共通に使用される。従がっ
て、連鎖バスバー36は一種類あれば(打抜き成形すれ
ば)よく、極めて経済的である。勿論、連鎖部35を用
いずに複数本の同一形状のバスバー3を第一層の配線板
1と第二層の配線板2とで共通使用(インサート成形)
することもできる。
The chain bus bar 36 is commonly used for the first-layer wiring board 1 and the second-layer wiring board 2 (FIG. 1). Accordingly, only one type of chain bus bar 36 (if punched) is required, which is extremely economical. Of course, a plurality of busbars 3 having the same shape are commonly used for the first-layer wiring board 1 and the second-layer wiring board 2 without using the chain portion 35 (insert molding).
You can also.

【0021】図4の如く、接続孔33内でバスバー3
(図3)の露出部3aと電線12との溶接は上下一対の
電極37,38により行われる。この際、接続孔33内
における板厚方向の隙間を埋める手段として、後述する
図10の凹部と突出部の構成を適用することも可能であ
る。
As shown in FIG. 4, the bus bar 3
The welding of the exposed portion 3a and the electric wire 12 in FIG. 3 is performed by a pair of upper and lower electrodes 37 and 38. At this time, as a means for filling a gap in the plate thickness direction in the connection hole 33, a configuration of a concave portion and a protruding portion shown in FIG. 10 described later can be applied.

【0022】また、図5〜図6の示す如く、配線板1の
各接続孔33内に露出したバスバー3の露出部3aに突
起79を設け、突起79に電線12を接触させた状態
で、バスバー3と電線12とを両電極37,38の間で
抵抗溶接することも可能である。
As shown in FIGS. 5 and 6, a projection 79 is provided on the exposed portion 3a of the bus bar 3 exposed in each connection hole 33 of the wiring board 1, and the electric wire 12 is brought into contact with the projection 79. The bus bar 3 and the electric wire 12 can be resistance-welded between the electrodes 37 and 38.

【0023】突起79は略半球状に膨出形成され、バス
バー3には突起79の裏側において略半球状の溝78
(図6)が形成される。突起79は、連鎖バスバー36
を金属板(図示せず)から打ち抜く際に形成することが
好ましいが、前記図3の如く配線板1に連鎖バスバー3
6をモールド成形した後に形成することも可能である。
突起79はバスバー3の幅の1/4程度の径の小さなも
のである。図5〜図6の実施形態で電線12は配線板1
の上側からバスバー3に溶接しているが、バスバー3の
露出部3aの下面側に突起79を設けて、図3の如く配
線板1の下側から電線12を溶接することも無論可能で
ある。
The projection 79 is formed in a substantially hemispherical bulging shape, and the bus bar 3 has a substantially hemispherical groove 78 on the back side of the projection 79.
(FIG. 6) is formed. The projection 79 is provided on the chain bus bar 36.
Is preferably formed when punching from a metal plate (not shown). However, as shown in FIG.
6 can also be formed after molding.
The projection 79 has a small diameter of about 1 / of the width of the bus bar 3. In the embodiment shown in FIGS.
Is welded to the bus bar 3 from above, but it is of course possible to provide a projection 79 on the lower surface side of the exposed portion 3a of the bus bar 3 and weld the electric wire 12 from below the wiring board 1 as shown in FIG. .

【0024】電線12はバスバー3に直交してバスバー
3の幅方向に載置され、接続孔33の内面33a(図
6)とバスバー3の側面77との間の隙間76を跨いで
配線板1の表面に接する。電線12をバスバー3の幅方
向に載置することで、電線12をバスバー3の長手方向
に配置する場合に較べて、電線12とバスバー3との無
用な接触が防止される。電線12はバスバー3の突起7
9のみと接触(点接触)する。その状態で上下の電極3
7,38(図6)により抵抗溶接が行われる。
The electric wire 12 is placed orthogonally to the bus bar 3 in the width direction of the bus bar 3, and extends over the gap 76 between the inner surface 33 a (FIG. 6) of the connection hole 33 and the side surface 77 of the bus bar 3. Touching the surface of By placing the electric wire 12 in the width direction of the bus bar 3, unnecessary contact between the electric wire 12 and the bus bar 3 is prevented as compared with the case where the electric wire 12 is arranged in the longitudinal direction of the bus bar 3. The electric wire 12 is the protrusion 7 of the bus bar 3
Contact with only 9 (point contact). In that state, the upper and lower electrodes 3
7, 38 (FIG. 6), resistance welding is performed.

【0025】電線12が突起79に点接触した状態で抵
抗溶接が行われるから、電流が突起79に集中し、溶接
の境界面が安定する。すなわち従来のような電線12の
長手方向への溶接電流の拡散が起こらず、溶け込みが一
点に集中し、それにより溶け込み不足がなくなり、溶接
強度及び電気的接続の信頼性が向上する。
Since resistance welding is performed in a state where the electric wire 12 is in point contact with the projection 79, current is concentrated on the projection 79, and the welding boundary surface is stabilized. That is, the diffusion of the welding current in the longitudinal direction of the electric wire 12 does not occur as in the related art, and the penetration is concentrated at one point, whereby insufficient penetration is eliminated, and the welding strength and the reliability of the electrical connection are improved.

【0026】また、配線板1にバスバー3をインサート
成形する際に、接続孔33内でバスバー3の突起79を
図示しない成形金型に対する位置決め部とすることによ
り(成形金型に、突起79に対する係合穴を設けてお
く)、配線板1に対するバスバー3の位置精度が向上す
る。
Further, when the bus bar 3 is insert-molded into the wiring board 1, the projection 79 of the bus bar 3 in the connection hole 33 is used as a positioning portion for a molding die (not shown). An engagement hole is provided), and the positional accuracy of the bus bar 3 with respect to the wiring board 1 is improved.

【0027】図5で、5,6はバスバー3のタブ端子を
示す。図5〜図6の溶接構造及び溶接方法は図8の実施
形態におけるバスバー46,48と電線51との接続に
も適用可能である。
In FIG. 5, reference numerals 5 and 6 denote tab terminals of the bus bar 3. The welding structure and the welding method of FIGS. 5 and 6 can be applied to the connection between the bus bars 46 and 48 and the electric wire 51 in the embodiment of FIG.

【0028】図7〜図8は、本発明に係る配線板組立体
の他の実施形態を含む電気接続箱を示すものである。図
7において、41,42は二層に重ねられた配線板、4
3は、第一層の配線板41の一端部寄りに配置される電
源用のバスバー、44は上カバー、45は下カバーを示
す。
FIGS. 7 and 8 show an electric junction box including another embodiment of the wiring board assembly according to the present invention. In FIG. 7, reference numerals 41 and 42 denote wiring boards stacked in two layers,
Reference numeral 3 denotes a power supply bus bar disposed near one end of the first-layer wiring board 41, 44 denotes an upper cover, and 45 denotes a lower cover.

【0029】本実施形態で第二層の配線板42は第一層
の配線板41よりも大きく形成され、第一層の配線板4
1の一側部寄りに標準のバスバー46(図8)のタブ端
子(端子)47が上向きに配置され、第一層の配線板4
1から外側に突出した第二層の配線板42の一側部寄り
に、標準のバスバー48(図8)のタブ端子(端子)4
9(図7)が上向きに配置され、両タブ端子47,49
は並列に位置して、上カバー44のコネクタハウジング
50内に収容される。第一層の配線板41の上面から第
二層の配線板42の下面にかけて複数本の電線51が連
続して並列に配索されている。
In this embodiment, the wiring board 42 of the second layer is formed larger than the wiring board 41 of the first layer,
1, a tab terminal (terminal) 47 of a standard bus bar 46 (FIG. 8) is arranged upward, and the first layer wiring board 4
The tab terminals (terminals) 4 of the standard bus bar 48 (FIG. 8) are located near one side of the wiring board 42 of the second layer protruding outward from
9 (FIG. 7) are arranged upward, and both tab terminals 47, 49
Are arranged in parallel and housed in the connector housing 50 of the upper cover 44. A plurality of electric wires 51 are continuously arranged in parallel from the upper surface of the first layer wiring board 41 to the lower surface of the second layer wiring board 42.

【0030】第一層の配線板41の一端部側すなわち電
線51の屈曲部51aとは反対側において電線51の先
端に対向して挟持端子52が例えば第二層の配線板42
を貫通して設けられている。図8の如く挟持端子52に
対向して電線51に標準の挟持端子53の圧接部54が
圧接接続される。各挟持端子52,53と電源用のバス
バー43のタブ端子55とはヒューズ収容部56内に位
置し、ヒューズ57に接続される。
On one end side of the first layer wiring board 41, that is, on the side opposite to the bent portion 51a of the electric wire 51, the clamping terminal 52 is opposed to the tip of the electric wire 51, for example, the second layer wiring board 42.
Are provided to pass through. As shown in FIG. 8, the press-contact portion 54 of the standard hold-down terminal 53 is connected to the electric wire 51 by press-contact facing the hold-down terminal 52. Each of the clamping terminals 52 and 53 and the tab terminal 55 of the power supply bus bar 43 are located in the fuse accommodating portion 56 and are connected to the fuse 57.

【0031】電源用のバスバー43の下向きの挟持端子
58は両配線板41,42を貫通して下カバー45の例
えばリレー接続部59内に位置する。電源用のバスバー
43の上向きの受電用のタブ端子60は上カバー44の
コネクタハウジング61内に位置する。下カバー45の
他側部には、図6の第二層の配線板42のタブ端子(端
子)62を収容するコネクタハウジング63が形成さ
れ、下カバー45の他端部側には、第二層の配線板42
の標準のタブ端子64を接続する標準の挟持端子65が
コネクタハウジング66に配置されている。
The downward holding terminal 58 of the power supply bus bar 43 penetrates both wiring boards 41 and 42 and is located, for example, in a relay connection portion 59 of the lower cover 45. The upwardly-facing power receiving tab terminal 60 of the power supply bus bar 43 is located in the connector housing 61 of the upper cover 44. On the other side of the lower cover 45, a connector housing 63 for accommodating the tab terminals (terminals) 62 of the wiring board 42 of the second layer in FIG. Layer wiring board 42
A standard holding terminal 65 for connecting the standard tab terminal 64 is disposed on the connector housing 66.

【0032】図8の如く二枚の配線板41,42が一平
面上において前後に並列に配置された状態で、複数本の
電線51が各配線板41,42の上に直線的に配索され
る。各配線板41,42には、電線51と直交する方向
に標準のバスバー46,48が複数本一体成形されて、
電線51とバスバー46,48とがマトリックス的に配
置されている。
As shown in FIG. 8, in a state where the two wiring boards 41 and 42 are arranged in front and back in parallel on one plane, a plurality of electric wires 51 are routed linearly on each of the wiring boards 41 and 42. Is done. A plurality of standard bus bars 46, 48 are integrally formed on each of the wiring boards 41, 42 in a direction orthogonal to the electric wires 51,
The electric wires 51 and the bus bars 46 and 48 are arranged in a matrix.

【0033】第一層の配線板41のバスバー46(以下
第一層のバスバーという)は一端に上向きにタブ端子4
7を有し、他端に下向きにタブ端子(端子)67を有し
ている。第二層の配線板のバスバー42(以下第二層の
バスバーという)は一端に下向きにタブ端子49を有
し、他端に上向きにタブ端子62を有している。各タブ
端子47,49,62,67は配線板41,42の上面
及び下面から直角に突出している。前例に較べてタブ端
子47,49,62,67が、配線板41,42の母体
である絶縁基板68,69に直接支持されている分、タ
ブ端子47,49,62,67の接続時の強度が強くな
っている。
The bus bar 46 of the first-layer wiring board 41 (hereinafter referred to as the first-layer bus bar) is provided with one end of the tab terminal 4 facing upward.
7 and a tab terminal (terminal) 67 at the other end downward. The bus bar 42 of the second-layer wiring board (hereinafter referred to as the second-layer bus bar) has a tab terminal 49 at one end downward and a tab terminal 62 at the other end upward. The tab terminals 47, 49, 62, 67 project at right angles from the upper and lower surfaces of the wiring boards 41, 42. As compared with the previous example, the tab terminals 47, 49, 62, 67 are directly supported by the insulating substrates 68, 69, which are the bases of the wiring boards 41, 42, so that the tab terminals 47, 49, 62, 67 are connected. Strength is increasing.

【0034】本実施形態で第二層の配線板42は第一層
の配線板41よりも幅広に形成され、第二層のバスバー
48は第一層のバスバー46よりもバスバー長手方向に
ずらして配置されている。それにより、図5の配線板4
1,42の重合状態で第一層のバスバー46(図8)の
タブ端子47と第二層のバスバー48(図8)のタブ端
子49とがぶつからずにバスバー長手方向に並列に対向
して位置する。タブ端子67は絶縁基板69を貫通す
る。この場合、第一層のバスバー46と第二層のバスバ
ー48とは、前例と同様に同一形状及び同一長さのもの
が反転して共通使用される。この構成は配線板組立体C
2 の製造方法としても有効である。
In this embodiment, the wiring board 42 of the second layer is formed wider than the wiring board 41 of the first layer, and the bus bar 48 of the second layer is shifted from the bus bar 46 of the first layer in the longitudinal direction of the bus bar. Are located. Thereby, the wiring board 4 of FIG.
The tab terminals 47 of the first-layer bus bar 46 (FIG. 8) and the tab terminals 49 of the second-layer bus bar 48 (FIG. 8) are opposed in parallel in the longitudinal direction of the bus bar without collision in the superposed state of the bus bars 1 and 42. To position. The tab terminals 67 pass through the insulating substrate 69. In this case, the bus bars 46 of the first layer and the bus bars 48 of the second layer are commonly used with the same shape and the same length being inverted as in the previous example. This configuration is a circuit board assembly C
It is also effective as the manufacturing method of 2 .

【0035】なお、第二層のバスバー48を第一層のバ
スバー46よりも長く設定することも可能であり、この
場合は、第一層のバスバー46のタブ端子67と第二層
のバスバー48とが干渉しないようにタブ端子67を逃
がす必要がある。また、この場合、少なくとも二種類の
標準のバスバー46,48が必要であるが、バスバー4
6,48の長さが違うだけであり、タブ端子47,4
9,62,67の形状は同一であるので、打抜き成形に
要する金型コストはさほど高くならない。
The second-layer bus bar 48 can be set longer than the first-layer bus bar 46. In this case, the tab terminal 67 of the first-layer bus bar 46 and the second-layer bus bar 48 It is necessary to escape the tab terminal 67 so as not to interfere with the terminal. In this case, at least two types of standard bus bars 46 and 48 are required.
Only the lengths of the tab terminals 47 and 4 differ.
Since the shapes of 9, 62 and 67 are the same, the die cost required for the punch forming is not so high.

【0036】図8において第二層の配線板42を矢印イ
の如く電線51の渡し部(屈曲部となる部分)51aを
支点に回転させて第一層の配線板41の下面側に重ね合
わせることで、図7の配線板組立体C2 を得る。配線板
組立体C2 と上カバー44と下カバー45とで電気接続
箱E2 が構成される。
In FIG. 8, the wiring board 42 of the second layer is rotated about the crossing portion (the part to be bent) 51a of the electric wire 51 as a fulcrum as shown by the arrow A to overlap the lower surface side of the wiring board 41 of the first layer. it is, obtain a wiring board assembly C 2 in FIG. Electrical connection box E 2 is composed of a circuit board assembly C 2 and the upper cover 44 and lower cover 45.

【0037】図9は、標準のバスバー46,48と電線
51の接続構造の一実施形態を示すものである。バスバ
ー46,48は電線51を通過して延びるものに限ら
ず、電線51の片側において配索されるもの48b,4
8cであってもよい。この場合、バスバー48b,48
cは上向きないし下向きのタブ端子62,49を有する
が、一方のバスバー48bを反転させることで、他方の
バスバー48cを得ることができ、バスバー48bの共
通使用が可能である。無論、バスバー46を反転してバ
スバー48を得ることも可能である。
FIG. 9 shows an embodiment of the connection structure between the standard bus bars 46 and 48 and the electric wire 51. The busbars 46 and 48 are not limited to those extending through the electric wire 51, and those arranged on one side of the electric wire 51.
8c. In this case, the bus bars 48b, 48
Although c has upward or downward tab terminals 62 and 49, by inverting one bus bar 48b, the other bus bar 48c can be obtained, and the common use of the bus bar 48b is possible. Of course, it is also possible to obtain the bus bar 48 by inverting the bus bar 46.

【0038】バスバー46,48は長手方向中間部にお
いて、またバスバー48b,48cはタブ端子49,6
2とは反対側の端部においてそれぞれ電線51に溶接接
続される。溶接方法は図4の電極37,38を用いた抵
抗溶接と同じである。図9で、53は、圧接部54と挟
持部(53)とを有する標準の挟持端子、64は、圧接
部70とタブ部(64)とを有する標準のタブ端子であ
り、両者とも電線51に圧接されている。タブ端子64
は本例で四列に配置される。各バスバー46,48,4
8b,48cと電線51との溶接部には図10で示す構
造が適用される。
The bus bars 46 and 48 are located in the middle portion in the longitudinal direction, and the bus bars 48b and 48c are located at the tab terminals 49 and 6.
2 are welded to the electric wires 51 at the opposite ends. The welding method is the same as the resistance welding using the electrodes 37 and 38 in FIG. In FIG. 9, reference numeral 53 denotes a standard pin terminal having a press contact portion 54 and a pin portion (53), 64 denotes a standard tab terminal having a press contact portion 70 and a tab portion (64), and both are electric wires 51. Is pressed against. Tab terminal 64
Are arranged in four rows in this example. Each bus bar 46, 48, 4
The structure shown in FIG. 10 is applied to the welded portion between 8b, 48c and the electric wire 51.

【0039】図10は例えば図7のA−A断面を示すも
のであり、第一層と第二層の各配線板41,42のバス
バー46,48と電線51の各溶接部において、合成樹
脂製の絶縁基板68,69に、各接続孔(凹部)71、
正確には接続穴(凹部)71内のバスバー46,48の
露出面46a1 ,48a1 に対向して突出部72,73
が形成され、この突出部72,73によってバスバー4
6,48の露出面46a1 ,48a1 と絶縁基板68,
69との間の窪み(凹部)が塞がれて、窪み内への結露
等による水や塵等の侵入が防止され、バスバー46,4
8の露出面46a1 ,48a1 からのリークやバスバー
46,48相互の短絡等が防止されている。
FIG. 10 shows, for example, a cross section taken along the line AA of FIG. 7, in which the welded portions between the bus bars 46, 48 of the wiring boards 41, 42 of the first and second layers and the electric wires 51 are made of synthetic resin. Connection holes (concave portions) 71 in insulating substrates 68 and 69 made of
Exactly protrusion opposed to the exposed surface 46a 1, 48a 1 of the bus bars 46, 48 in the connecting hole (recess) 71 72 73
Are formed, and the bus bars 4 are formed by the projections 72 and 73.
6 , 48 exposed surfaces 46a 1 , 48a 1 and insulating substrate 68,
The recess (concave portion) between the busbars 46 and 4 is prevented by blocking the recess (recess) between the busbars 46 and 4.
Leakage from the exposed surfaces 46a 1 and 48a 1 of 8 and short circuit between the bus bars 46 and 48 are prevented.

【0040】バスバー46,48は絶縁基板68,69
の厚さ方向中央に位置し、接続孔71内においてバスバ
ー46,48の上下両面が露出され、第一層の配線板4
1ではバスバー46の上面46a2 に電線51が溶接さ
れ、第二層の配線板42ではバスバー48の下面48a
2 に電線51が溶接されている。これは、図9の如く二
枚の配線板41,42を平面的に並べた状態で電線51
をバスバー46,48に溶接し、第二層の配線板42を
矢印イの如く反転させて第一層の配線板41に積層する
ためである。
The bus bars 46, 48 are provided on insulating substrates 68, 69.
The upper and lower surfaces of the bus bars 46 and 48 are exposed in the connection hole 71 in the thickness direction of the first wiring board 4.
Wire 51 on the upper surface 46a 2 of the bus bar 46 in 1 are welded, the lower surface of the wiring board 42 in the bus bar 48 of the second layer 48a
An electric wire 51 is welded to 2 . This is because the two wiring boards 41 and 42 are arranged in a plane as shown in FIG.
Is welded to the bus bars 46 and 48, and the wiring board 42 of the second layer is inverted as shown by the arrow A to be laminated on the wiring board 41 of the first layer.

【0041】図10で、第一層のバスバー46の下面
(露出面)46a1 と第二層のバスバー48の上面(露
出面)48a1 とは完全に露出しており、リークや短絡
が起こりやすい状態となるが、第一層のバスバー46の
下面(露出面)46a1 に第二層の絶縁基板69の上向
きの突出部73が近接し、ないしは接触して位置し、第
二層のバスバー48の上面(露出面)48a1 に第一層
の絶縁基板68の下向きの突出部72が近接し、ないし
は接触して位置することで、両配線板41,42間にお
いて各バスバー46,48の露出面46a1 ,48a1
が覆われて保護され、且つ露出面46a1 ,48a1
下側ないし上側の窪みがなくなって、水や塵等の溜りが
防止される。
[0041] In FIG. 10, lower surface (exposed surface) of the first layer of the bus bar 46 46a 1 and the upper surface (exposed surface) 48a 1 of the bus bar 48 of the second layer are completely exposed, occurs leakage or short circuit While the easy state, the lower surface (exposed surface) 46a 1 of the first layer of the bus bar 46 upward projecting portion 73 is adjacent the second layer of insulating substrate 69, or contact located, the bus bar of the second layer the top surface (exposed surface) 48a 1 48 proximate the downward projecting portion 72 of the insulating substrate 68 of the first layer, or in contact with that position, the respective bus bars 46, 48 in between both circuit boards 41 and 42 Exposed surfaces 46a 1 , 48a 1
Is covered and protected, and the dents below or above the exposed surfaces 46a 1 and 48a 1 are eliminated, thereby preventing accumulation of water, dust, and the like.

【0042】各突出部72,73は左右に隣接して設け
られており、第一層の配線板41と第二層の配線板42
の近接した各接続孔71,71に水が連続して充填され
ないようになっている。接続孔71は図3の接続孔33
よりも小径に形成され、バスバー46,48の両側面が
隙間なく絶縁基板68,69に密着ないし固着してい
る。テーパ状の接続孔71はバスバー46,48をイン
サート成形すると同時に形成することが好ましい。接続
孔71はバスバー46(48)に上下に仕切られて凹部
ないしは窪みとなっている。
The protruding portions 72 and 73 are provided adjacent to each other on the left and right sides, and the first layer wiring board 41 and the second layer wiring board 42
Each of the adjacent connection holes 71, 71 is not filled with water continuously. The connection hole 71 is the connection hole 33 in FIG.
The bus bars 46 and 48 are tightly attached or fixed to the insulating substrates 68 and 69 without gaps. The tapered connection hole 71 is preferably formed at the same time as the insert molding of the bus bars 46, 48. The connection hole 71 is vertically partitioned by the bus bar 46 (48) to form a recess or a depression.

【0043】本例で突出部72,73は接続孔71の形
状に合わせて縦断面台形状に形成されて両側にテーパ面
72a,73aを有し、テーパ面72a,73aによっ
て接続孔71との位置決めが容易になっている。突出部
72,73が各接続孔71に係合することで両配線板4
1,42の位置決めと長さ方向及び幅方向への位置ずれ
防止が行われる。
In this embodiment, the projections 72 and 73 are formed in a trapezoidal longitudinal section in conformity with the shape of the connection hole 71, and have tapered surfaces 72a and 73a on both sides. Positioning is easy. The protrusions 72 and 73 are engaged with the respective connection holes 71 so that both the wiring boards 4
Positioning of the first and second members 42 and prevention of misalignment in the length direction and the width direction are performed.

【0044】なお、図4のように接続孔33をストレー
トな円形とした場合は、突出部72,73は接続孔33
に合わせて短円柱状に形成される。また、上下の配線板
41,42の接続孔71が近接していない場合は、一方
の配線板41又は42にのみ突出部72を設けることも
可能である。
When the connection hole 33 is formed in a straight circular shape as shown in FIG.
It is formed in a short columnar shape according to. When the connection holes 71 of the upper and lower wiring boards 41 and 42 are not close to each other, it is possible to provide the protruding portion 72 only on one of the wiring boards 41 or 42.

【0045】[0045]

【発明の効果】以上の如く、請求項1,2記載の発明に
よれば、各配線板においてバスバーを反転して共通使用
することで、例えばコネクタハウジング内で第一層と第
二層の各配線板の端子の先端を同一高さに位置させ、且
つ各端子を並列に対向させて位置させることができ、端
子の寸法品質を損なうことなく、バスバー成形金型の共
用化で低コストな配線板組立体を得ることができる。
As described above, according to the first and second aspects of the present invention, by inverting the bus bar in each wiring board and commonly using the bus bar, for example, each of the first layer and the second layer in the connector housing is provided. Wiring boards can be positioned at the same height, and the terminals can be positioned facing each other in parallel. Low-cost wiring can be achieved by using a common busbar molding die without impairing the dimensional quality of the terminals. A plate assembly can be obtained.

【0046】また、請求項3,4記載の発明によれば、
例えば一方の配線板の凹部に他方の配線板の突出部が係
合することで、凹部の空間が突出部によって埋められ、
凹部内に水や塵等が溜まることが防止される。それによ
り、凹部内のバスバーの露出部からのリークや短絡が防
止される。また、バスバーの露出部に突出部が接触する
ことで、露出部が確実に絶縁され、それによってもリー
クや短絡が防止される。また、請求項5記載の発明によ
れば、第一層の配線板の凹部と第二層の配線板の凹部と
に跨がって水が溜まるという現象が防止され、各配線板
のバスバーの露出部同士の短絡が確実に阻止される。ま
た、請求項6記載の発明によれば、テーパ状の凹部と突
出部とによって各配線板の位置決め及び接合が簡単にス
ムーズ且つ確実に行われる。また、くさび作用によって
凹部と突出部との密着が確実に行われ、防水・防塵性が
高まる。
According to the third and fourth aspects of the present invention,
For example, when the protrusion of the other wiring board is engaged with the recess of one wiring board, the space of the recess is filled with the protrusion,
Accumulation of water, dust and the like in the recess is prevented. This prevents leakage or short circuit from the exposed portion of the bus bar in the recess. In addition, when the protruding portion comes into contact with the exposed portion of the bus bar, the exposed portion is reliably insulated, thereby preventing leakage and short circuit. Further, according to the invention of claim 5, a phenomenon that water accumulates over the concave portion of the first-layer wiring board and the concave portion of the second-layer wiring board is prevented, and the bus bar of each wiring board is prevented. The short circuit between the exposed portions is reliably prevented. According to the invention of claim 6, positioning and joining of each wiring board can be easily, smoothly and reliably performed by the tapered concave portion and the projecting portion. In addition, the concave portion and the protruding portion are securely brought into close contact with each other by the wedge action, and the waterproof and dustproof properties are enhanced.

【0047】また、請求項7,8記載の発明によれば、
電線とバスバーとが点接触した状態で抵抗溶接されるか
ら、溶接電流の拡散が防止され、電流が集中すること
で、溶接の境界面が安定し、電気的接続の信頼性が向上
すると共に、溶接強度がアップし、電線の引張時の剥が
れ等が防止される。
According to the seventh and eighth aspects of the present invention,
Since resistance welding is performed in a state where the electric wire and the bus bar are in point contact with each other, the diffusion of welding current is prevented, and the concentration of the current stabilizes the welding interface, improving the reliability of electrical connection, The welding strength is increased, and peeling of the electric wire during tension is prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る配線板組立体の一実施形態を含む
電気接続箱を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing an electric junction box including an embodiment of a wiring board assembly according to the present invention.

【図2】同じく配線板組立体のタブ端子の突出形状を示
す正面図である。
FIG. 2 is a front view showing a protruding shape of a tab terminal of the wiring board assembly.

【図3】同じく配線板の中間加工品を示す分解斜視図で
ある。
FIG. 3 is an exploded perspective view showing an intermediate processed product of the wiring board.

【図4】同じくバスバーに電線を溶接する状態を示す縦
断面図である。
FIG. 4 is a longitudinal sectional view showing a state where the electric wire is welded to the bus bar.

【図5】配線板のバスバーに電線を溶接する構造及び方
法の他の実施形態を示す分解斜視図である。
FIG. 5 is an exploded perspective view showing another embodiment of a structure and a method for welding an electric wire to a bus bar of a wiring board.

【図6】同じくバスバーに電線を溶接する状態を示す図
5のB−B相当断面図である。
FIG. 6 is a sectional view corresponding to line BB in FIG. 5, showing a state where the electric wire is welded to the bus bar.

【図7】配線板組立体の他の実施形態を含む電気接続箱
を示す分解斜視図である。
FIG. 7 is an exploded perspective view showing an electric junction box including another embodiment of a wiring board assembly.

【図8】同じく配線板組立体を展開した状態を示す斜視
図である。
FIG. 8 is a perspective view showing a state in which the wiring board assembly is similarly expanded.

【図9】同じくバスバーと電線及び端子の接続状態を示
す分解斜視図である。
FIG. 9 is an exploded perspective view showing a connection state of a bus bar, an electric wire, and a terminal.

【図10】配線板組立体の防水構造の一実施形態を示す
縦断面図(図7のA−A断面図)である。
FIG. 10 is a longitudinal sectional view (AA sectional view of FIG. 7) showing one embodiment of a waterproof structure of the wiring board assembly;

【図11】一従来例を示す分解斜視図である。FIG. 11 is an exploded perspective view showing a conventional example.

【図12】他の従来例を示す縦断面図である。FIG. 12 is a longitudinal sectional view showing another conventional example.

【図13】同じくバスバーに電線を溶接する状態を示す
縦断面図である。
FIG. 13 is a longitudinal sectional view showing a state where the electric wire is welded to the bus bar.

【符号の説明】[Explanation of symbols]

1,2,41,42 配線板 3,4,46,48 バスバー 5〜8,47,49,62,67 タブ端子(端子) 12 電線 33 接続孔 71 接続孔(凹部) 72,73 突出部 79 突起 C1 ,C2 配線板組立体1, 2, 41, 42 Wiring board 3, 4, 46, 48 Bus bar 5 to 8, 47, 49, 62, 67 Tab terminal (terminal) 12 Electric wire 33 Connection hole 71 Connection hole (recess) 72, 73 Projection 79 Projection C 1 , C 2 wiring board assembly

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 複数枚の配線板に複数本のバスバーが並
列に設けられ、該バスバーが両端部に逆向きの端子を有
し、該複数枚の配線板が積層される配線板組立体におい
て、第二層の配線板のバスバーが第一層の配線板のバス
バーを反転させた形状のものであり、該第一層の配線板
の一側の端子と該第二層の配線板の他側の端子とが同じ
長さで、該第一層の配線板の他側の端子と該第二層の配
線板の一側の端子とが同じ長さであることを特徴とする
配線板組立体。
1. A wiring board assembly in which a plurality of bus bars are provided in parallel on a plurality of wiring boards, the bus bars have terminals at opposite ends at opposite ends, and the plurality of wiring boards are stacked. The bus bar of the second-layer wiring board has a shape obtained by inverting the bus bar of the first-layer wiring board, and the terminal on one side of the first-layer wiring board and the other of the second-layer wiring board A terminal on the other side of the wiring board of the first layer and a terminal on one side of the wiring board of the second layer have the same length. Three-dimensional.
【請求項2】 バスバーの一端と他端とにそれぞれ端子
を逆向きに突出形成し、該バスバーを第一層の配線板に
設け、該バスバーと同一形状のバスバーを反転させて第
二層の配線板に設けることを特徴とする配線板組立体の
製造方法。
2. A terminal is formed on one end and the other end of the bus bar in the opposite direction, the bus bar is provided on a first layer wiring board, and the bus bar having the same shape as the bus bar is inverted to form a second layer. A method for manufacturing a wiring board assembly, wherein the method is provided on a wiring board.
【請求項3】 前記第一層及び/又は第二層の配線板の
凹部内に前記バスバーの一部が露出し、該第二層及び/
又は第一層の配線板に、該凹部に係合する突出部が形成
されたことを特徴とする請求項1記載の配線板組立体。
3. A part of the bus bar is exposed in a concave portion of the first and / or second layer wiring board, and the second layer and / or
2. The wiring board assembly according to claim 1, wherein the first layer wiring board is formed with a protruding portion engaging with the concave portion.
【請求項4】 配線板の内部にバスバーが設けられ、該
バスバーの一部が該配線板の凹部内で露出し、複数枚の
該配線板が積層されて成る配線板組立体において、前記
配線板に、前記凹部に係合する突出部が形成されたこと
を特徴とする配線板組立体。
4. A wiring board assembly comprising a wiring board, wherein a bus bar is provided inside the wiring board, a part of the bus bar is exposed in a recess of the wiring board, and a plurality of the wiring boards are stacked. A wiring board assembly, wherein a protrusion is formed on the board to engage with the recess.
【請求項5】 第一層の配線板と第二層の配線板との各
凹部に対応して該第一層の配線板の突出部と該第二層の
配線板の突出部とが隣接して位置することを特徴とする
請求項3又は4記載の配線板組立体。
5. The protruding portion of the first-layer wiring board and the protruding portion of the second-layer wiring board are adjacent to the respective recesses of the first-layer wiring board and the second-layer wiring board. The wiring board assembly according to claim 3, wherein the wiring board assembly is positioned.
【請求項6】 前記凹部及び前記突出部がテーパ状に形
成されたことを特徴とする請求項3〜5の何れかに記載
の配線板組立体。
6. The wiring board assembly according to claim 3, wherein said concave portion and said projecting portion are formed in a tapered shape.
【請求項7】 前記配線板の接続孔内で前記バスバーに
抵抗溶接用の突起が設けられ、該突起に電線が点接触し
て抵抗溶接されることを特徴とする請求項1,3,4,
5,6の何れかに記載の配線板組立体。
7. The bus bar is provided with a projection for resistance welding in a connection hole of the wiring board, and the electric wire is point-contacted to the projection to perform resistance welding. ,
The wiring board assembly according to any one of claims 5 and 6.
【請求項8】 前記バスバーに抵抗溶接用の突起を設
け、前記配線板の接続孔内で該突起に電線を点接触させ
た状態で、該バスバーと該電線とを抵抗溶接することを
特徴とする請求項2記載の配線板組立体の製造方法。
8. The bus bar is provided with a projection for resistance welding, and the bus bar and the electric wire are resistance-welded in a state where the electric wire is in point contact with the projection in the connection hole of the wiring board. The method for manufacturing a wiring board assembly according to claim 2.
JP22216599A 1998-10-29 1999-08-05 Wiring board assembly and manufacturing method thereof Expired - Fee Related JP3620015B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22216599A JP3620015B2 (en) 1998-10-29 1999-08-05 Wiring board assembly and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30842498 1998-10-29
JP10-308424 1998-10-29
JP22216599A JP3620015B2 (en) 1998-10-29 1999-08-05 Wiring board assembly and manufacturing method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004153993A Division JP2004313000A (en) 1998-10-29 2004-05-24 Wiring board assembly and method of manufacturing the same

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Publication Number Publication Date
JP2000201417A true JP2000201417A (en) 2000-07-18
JP3620015B2 JP3620015B2 (en) 2005-02-16

Family

ID=26524726

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Cited By (8)

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JP2002142330A (en) * 2000-10-30 2002-05-17 Sumitomo Wiring Syst Ltd Junction box
JP2002165336A (en) * 2000-11-21 2002-06-07 Sumitomo Wiring Syst Ltd Junction box
JP2002165335A (en) * 2000-11-21 2002-06-07 Sumitomo Wiring Syst Ltd Junction box
US6870096B2 (en) 2002-05-29 2005-03-22 Yazaki Corporation Electrical junction box and method of manufacturing the same
US8729754B2 (en) 2008-03-13 2014-05-20 Nidec Corporation Motor incuding bearing supported by busbar holder
US8779641B2 (en) 2008-03-13 2014-07-15 Nidec Corporation Motor including busbar holder and busbars
WO2014199438A1 (en) * 2013-06-11 2014-12-18 三菱電機株式会社 Alternating-current generator, voltage regulation device for alternating-current generator, and manufacturing methods therefor
JP2016096637A (en) * 2014-11-13 2016-05-26 住友電装株式会社 Bus bar circuit body and method of manufacturing the same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002142330A (en) * 2000-10-30 2002-05-17 Sumitomo Wiring Syst Ltd Junction box
JP2002165336A (en) * 2000-11-21 2002-06-07 Sumitomo Wiring Syst Ltd Junction box
JP2002165335A (en) * 2000-11-21 2002-06-07 Sumitomo Wiring Syst Ltd Junction box
US6870096B2 (en) 2002-05-29 2005-03-22 Yazaki Corporation Electrical junction box and method of manufacturing the same
US8729754B2 (en) 2008-03-13 2014-05-20 Nidec Corporation Motor incuding bearing supported by busbar holder
US8779641B2 (en) 2008-03-13 2014-07-15 Nidec Corporation Motor including busbar holder and busbars
WO2014199438A1 (en) * 2013-06-11 2014-12-18 三菱電機株式会社 Alternating-current generator, voltage regulation device for alternating-current generator, and manufacturing methods therefor
CN105284034A (en) * 2013-06-11 2016-01-27 三菱电机株式会社 Alternator, voltage regulator for alternator, and manufacturing method for both
JP5897214B2 (en) * 2013-06-11 2016-03-30 三菱電機株式会社 Alternator, alternator voltage regulator, and manufacturing method thereof
CN105284034B (en) * 2013-06-11 2018-10-12 三菱电机株式会社 Alternator, voltage regulator for alternator, and manufacturing method for both
US10110097B2 (en) 2013-06-11 2018-10-23 Mitsubishi Electric Corporation Alternating-current generator, voltage regulation device for alternating-current generator, and manufacturing methods therefor
JP2016096637A (en) * 2014-11-13 2016-05-26 住友電装株式会社 Bus bar circuit body and method of manufacturing the same

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