JP2000206191A - Test device of electronic component board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the throughput of test, enable tests at an accurate temperature to be performed, and realize a miniaturization, simplification and cost reduction of a test device. SOLUTION: Two tray accommodating parts 212, 214, an elevator 206, a transfer arm 208 and a set plate 210 are installed in an accommodating part 200. A socket 50 for test and a board pusher 76 are installed in a measuring part 102. A memory module 10 as an object to be tested is mounted on a tray 20 for test, carried in the measuring part 102 and tested in the mounted state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component board testing apparatus for testing an electronic component board such as a memory module.

[0002]

2. Description of the Related Art In a process of manufacturing an electronic component substrate such as a memory module, a test device for testing a finally manufactured memory module is required. As one type of such a test apparatus, an apparatus for testing a memory module under a temperature condition higher or lower than room temperature is known. This is because, as a characteristic of the memory module, it is guaranteed that the memory module operates well even at high or low temperature.

When a high-temperature test or a low-temperature test is performed by a conventional memory module test apparatus, the memory module before the test is heated or cooled by a preheating unit or a cooling unit in the test apparatus, and the heated or cooled memory module is tested. The module is transported to the measurement section using a pick and place mechanism, and a high temperature test or a low temperature test is performed by preheating applied to the memory module.

A test apparatus of this type applies a test signal of a predetermined pattern to, for example, a memory module to be tested, and measures its electrical characteristics, and is generally called an IC tester. In the IC tester, the memory module is transported to the measuring section, where the memory module is brought into electrical contact with the socket of the test head. In many cases, a transfer processing device that classifies a tested memory module into a non-defective product and a non-defective product based on the tested memory module is connected. This type of transport processing apparatus is generally called a handler, but in the present specification, a test apparatus of a type in which the handler is integrally connected is simply called an electronic component board test apparatus.

[0005]

However, in such a conventional test apparatus for electronic component substrates, several memory modules are transported from the preheating section or the cooling section to the measuring section by pick-and-place operation. Test throughput is very poor. In addition, the temperature applied to the memory module changes before the memory module is transported to the measurement unit, and the temperature accuracy in the measurement unit is poor, and it is difficult to perform a test at an accurate temperature.

In particular, in a low-temperature test, dew condensation may occur on the surface of the memory module cooled to a low temperature. As a practical matter, it has been difficult to perform a low-temperature test using a conventional test apparatus. This is because if condensation occurs on the memory module, the condensation adheres to the terminals or socket terminals of the memory module and adversely affects the test.

In order to solve such inconvenience, it is conceivable to cover all the preheating section (or cooling section) and the measuring section with a chamber and maintain the inside of the chamber at a predetermined temperature. However, causing the pick and place operation of the memory module inside the chamber is
The pick-and-place mechanism becomes complicated, and the chamber must be designed large, which leads to an increase in size, complexity, and cost of the test apparatus, which is not preferable.

Further, when a large electronic component substrate such as a memory module is carried in or taken out of a test apparatus, a tray of a kind in which the electronic component substrates are arranged upright is used, but such trays cannot be stacked on each other. . For this reason, the loading and unloading sections of the test equipment
A drawer shelf-like tray storage unit for storing trays one by one is provided. However, in the drawer shelf-shaped tray storage unit, there is a problem that the larger the number of classifications, the larger the test apparatus itself.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an advantage of improving a test throughput, enabling a test at an accurate temperature, and reducing the size, simplification, and cost of a test apparatus. It is an object of the present invention to provide a simple electronic component substrate test apparatus.

[0010]

In order to achieve the above object, an electronic component board test apparatus according to the present invention comprises: a storage section for storing electronic component boards before and after a test; At least a measuring unit for testing the substrate,
(1) The storage unit includes a first tray storage unit in which a first tray is independently stored vertically and a second tray storage unit in which a second tray is independently stored vertically. Department and
A first tray or a second tray is provided between the first tray storage and the second tray storage so as to be able to move up and down between the first tray storage and the second tray storage. A first elevating means for transferring the two trays, and a first elevating means provided above the first tray accommodating portion, the second tray accommodating portion, and the first elevating means, and movable in the juxtaposition direction thereof. A horizontal transport unit that transfers the first tray or the second tray to and from the first lifting unit, and a vertical transport unit that can move up and down to a target position. And a second elevating means for transferring the first tray or the second tray between the first and second trays. (2) The measuring part has a substrate terminal of the electronic component substrate detachably attached thereto. A test socket to be inserted and the electronic part A board pusher for pushing a board terminal of the electronic component board into the test socket in a state where the board is mounted on the test tray, and the electronic component board is exposed such that the board terminal of the electronic component board is exposed. A test tray having an insert formed with holding grooves into which both side ends of the component board are movably inserted, and a tray body holding the insert so that board terminals of the electronic component board are exposed, is loaded and loaded. It is carried out.

[0011]

In the electronic component board testing apparatus of the present invention, the inside of the test apparatus is moved while the plurality of electronic component boards are held on the test tray, and the test and measurement section tests the plurality of electronic component boards simultaneously. The test throughput is greatly improved. Further, in the test and measurement section, it is not necessary to perform the pick and place operation of the electronic component substrate, so that the internal structure of the test apparatus can be simplified, and the size, simplification, and cost reduction of the entire test apparatus can be reduced. Can be planned. In addition, by maintaining the inside of the chamber at a constant high or low temperature, the temperature accuracy at the time of testing the electronic component substrate is improved, and an accurate test can be performed.

In addition to the above, in the electronic component board testing apparatus of the present invention, the tray is transported by the first lifting / lowering means, the horizontal transporting means, and the second lifting / lowering means, instead of lifting / lowering the tray housing itself. Therefore, there is no problem that a dead space is generated in the upper part of the tray storage portion, and the entire apparatus can be downsized at least in the height direction.

[0013] Further, by providing the first lifting / lowering means between the tray storage sections, both tray storage sections can be accessed, so that the tray transfer can be made more efficient and the degree of freedom in the tray transfer sequence can be improved. Increase. Moreover, the trays can be stored in any of the tray storage sections, and the trays stored in any of the tray storage sections can be taken out. Can respond flexibly.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a conceptual plan view showing an embodiment of an electronic component substrate test apparatus (hereinafter, also simply referred to as a test apparatus) 1 of the present invention, FIG. 1B is a sectional view taken along line BB, and FIG.
FIG. 3 is a side sectional view of the same, FIG. 3 is a perspective view showing an example of a supply or storage tray used in the present embodiment,
5A is a perspective view showing a memory module storage unit of the present embodiment, FIG. 5B is a perspective view showing a tray storage unit and an elevator part, and FIG. 5 is an XY transfer device 303 of the present embodiment.
FIG. 6 is a perspective view showing a memory module gripping mechanism used in 403, FIG. 6 is a cross-sectional view showing the entire measurement unit of this embodiment, FIG. 7 is a perspective view showing a test tray used in this embodiment, and FIG. FIG. 9A is a plan view, FIG. 9B is a front view, and FIG.
Is a perspective view showing a test head unit of the present embodiment, and FIG. 10 is a sectional view showing a contact state between a memory module and a socket in the test head unit.

In the following embodiment, the present invention will be described by taking as an example a memory module 10 having the shape shown in FIG. 3 as a test object, but the test apparatus of the present invention is applied to a memory module having the shape shown in FIG. It is not limited only,
The purpose is to include all electronic components that cannot be stacked and stored in the tray storage unit.

First, the overall configuration of the test apparatus according to the present embodiment will be outlined with reference to FIGS. As shown in FIG. 2, the test apparatus of this embodiment includes a handler 1 for handling a memory module 10 to be tested and a test head T to which the memory module 10 is electrically contacted.
H and a tester TS that sends a test signal of a predetermined pattern to the test head TH and executes a test of the memory module.

The test apparatus of the present invention can be applied to all test heads TH and testers TS, and includes all test heads TH and testers TS. Therefore, these are shown only in FIG. 2 and omitted from other drawings. I do.

The handler 1 includes a test head T
H, a memory module storage section 200 for storing a memory module 10 to be tested, a memory module storage section 200 for classifying and storing the tested memory modules 10, and a memory module
, And an unloader unit 400 for classifying and extracting the tested memory modules 10 that have been tested in the chamber 100.

The handler 1 includes a memory module 10
The memory module 10 is tested (inspected) for proper operation in a state where high or low temperature stress is applied to the memory module 1, and according to the test result, the memory module 1 is tested.
The operation test in a state where such a temperature stress is applied is a test tray transported in the handler 1 from a supply tray 202 on which a large number of memory modules 10 to be tested are mounted. 20 is implemented by replacing the memory module 20 with the memory module 20.

The test tray 20 includes a loader 300
After the memory module 10 is loaded in the chamber 1
00, and each memory module 10 is tested in the measuring section 102 of the chamber 100 while being mounted on the test tray 20. Then, after the tested memory module 10 is carried out to the unloader unit 400, each memory module 10 is replaced on the storage tray 204 according to the test result in the unloader unit 400.

The chamber 100 is a soak chamber (constant temperature chamber) for applying a desired high or low temperature stress to the memory module 10 loaded on the test tray 20.
101, a measuring unit 102 for bringing the memory module 10 in a state of being subjected to thermal stress in the soak chamber 101 into contact with the socket 50 of the test head TH, and a memory module 10 tested by the measuring unit 102. And an unsoak chamber (heat removal tank) 103 for removing thermal stress.

In the unsoak chamber 103, when a high temperature is applied in the soak chamber 101, the memory module 10 is cooled by blowing air to return to room temperature, or is naturally cooled and returned to near room temperature. On the other hand, when a low temperature of, for example, about −30 ° C. is applied in the soak chamber 101, the memory module 10 is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. Then, the heat-removed memory module 10 is carried out to the unloader unit 400.

Since the unsoak chamber 103 is preferably thermally disconnected from the soak chamber 101 and the measuring unit 102, the unsoak chamber 103 is provided outside the chamber 100 in this embodiment. The chamber 100 may also include a soak chamber 103.

The configuration of each area of the memory module storage section 200, the loader section 300, the chamber 100 and the unloader section 400 will be described in further detail.

Memory Module Storage Unit 200 First, the memory module 10 to be tested is mounted on the trays 202 and 204 shown in FIG. ,
It is also carried out in the same package. Reference numeral 205 shown in FIG. 5 denotes a protrusion for keeping the memory module 10 in an upright posture.

The tray for mounting the memory module 10 before the test is referred to as a supply tray 202, and the tray for mounting the memory module 10 after the test is referred to as a storage tray 204. The trays 202 and 204 may have the same shape or different shapes. However, at least the supply tray 202 is
It is desirable to have a function of positioning the mounted memory module 10. The memory module 10 mounted on the supply tray 202 is loaded into the handler 1 from now on and is provided with a plurality of pickup devices (an XY transfer device 3 described later).
This is because an operation such as reloading is performed in step 03).

The memory module storage section 20 of the present embodiment
0 is provided with a pair of tray storage sections 212 and 214. As shown in FIGS. 1, 2 and 4, one of the tray storage sections 212 mainly has a supply tray 20 on which the memory module 10 to be tested is mounted.
2 are vertically held independently of each other without being stacked. On the other hand, in the other tray storage section 214, storage trays 204 in which the memory modules 10 that have been tested are appropriately classified are vertically stored independently of each other without being stacked. That is, the trays 202 and 204 are stored in the tray storage portions 212 and 214, for example, in a drawer shelf shape.

The tray storage sections 212 and 214
The number of trays that can be stored in the
Can be appropriately determined based on the relationship between the size of the image and the classification ability. In this example, a maximum of 7
Each of the trays 202 and 204 can be stored.

Although details will be described later, the tray storage section 21
2 and 214 have the same structure, so that both the supply tray 202 and the storage tray 204 can be stored in each other. In other words, the classification of test results is not only good and bad, but also high-speed, medium-speed, low-speed, and defective products that require re-testing. If classification is required,
The problem can be solved by using the two tray storage sections 212 and 214 comprehensively.

An elevator 206 is provided between the pair of tray storage sections 212 and 214 so as to be able to move up and down. As shown in FIG. 4A, the elevator 206 is controlled to move vertically at least between the lowermost stage and the uppermost stage of each of the tray storage sections 212 and 214 by, for example, a ball screw driving device 206a.

The elevator 206 transfers the trays 202 and 204 to and from the respective tray storage sections 212 and 214. Such an operation is performed by, for example, hooking a rod or the like of the fluid pressure cylinder 206b on the trays 202 and 204 or a plate on which the tray is mounted, and driving the fluid pressure cylinder 206b forward and backward as shown in FIG.
The operation of taking in and out the trays 202 and 204 is performed.

Immediately above the tray storage sections 212 and 214 and the elevator 206, a transfer arm 208 is provided.
It is provided movably in the ± X-axis direction shown in FIG. The transfer arm 208 is controlled to move to a desired position in the ± X-axis direction by, for example, a ball screw driving device 208a. The transfer arm 208 receives the trays 202 and 204 placed on the elevator 206 and transfers them to a set plate 210 described later, or conversely receives the trays 202 and 204 placed on the set plate 210 and transfers them to the elevator 206. . At this time, the tray 20
Hook mechanism 20 to hold and release
8b (see FIG. 11) is provided so as to be openable and closable.

In this embodiment, the transfer arm 208 is provided.
Are set only in the ± X-axis direction, but the trays 202 and 204 can be moved up and down in the ± Z-axis direction.
May be raised and lowered in the ± Z-axis direction at the time of delivery. Further, it is also possible to be movable in the ± Y-axis direction so that a setting range of a set plate 210 described later has a degree of freedom.

In this embodiment, three set plates 210 are provided immediately above the transfer arm 208. These set plates 210 can be independently raised and lowered in the ± Z-axis direction by, for example, a ball screw driving device 210a, and can be raised and lowered at least between a position lower than the transfer arm 208 and a position higher than the transfer arm 208. Can be. The lower limit position here is the position when the trays 202 and 204 are delivered, and the upper limit position is the set position of the trays 202 and 204 (that is, the position where the XY transfer device 303 transfers the memory module 10 to the test tray 20 and This is a position where the XY transfer device 403 receives the memory module 10 from the test tray 20).

In this embodiment, the three set plates 21
4 is set as the set plate 210 of the loader unit 300 on the left side of FIG.
Set plates 210, 210. However, the present invention is not limited to this and may be two or four or more.

Loader 300 The above-described supply tray 202 is provided in the window 3 of the loader 300.
06 from below, the memory module 10 loaded in the supply tray 202 in the loader unit 300 is the test tray 2 stopped in the loader unit 300.
It is transshipped to 0.

From the supply tray 202 to the test tray 20
As shown in FIG. 1, as a transfer device for reloading the memory module 10, a Y-axis rail 301 and a space between the supply tray 202 and the test tray 20 along the Y-axis rail 301 in the ± Y-axis direction are provided. An XY transport device 303 including an X-axis rail 302 that can move in the X-axis direction and a movable head 304 that can move in the ± X-axis direction along the X-axis rail 302 is used.

The movable head 30 of the XY transport device 303
4, a memory module gripping mechanism 500 shown in FIG. 5 is mounted downward. The gripping mechanism 500 shown in FIG.
A fluid pressure cylinder 502 for moving the gripped memory module 10 in the ± Z-axis direction;
It comprises a pair of chucks 504 for grasping both side edges of the "0" and a fluid pressure cylinder 504 for opening and closing the pair of chucks 504. By opening and closing the chuck 504 by the fluid pressure cylinder 504, both side edges of the memory module 10 can be grasped or released, and the grasped memory module 10 can be moved up and down by the fluid pressure cylinder 502.

As described above, the gripping mechanism 500 moves while grasping the memory module 10, thereby gripping the memory module 10 from the supply tray 202 and reloading the memory module 10 on the test tray 20. The gripping mechanism 500 of this example is mounted on the movable head 303, for example, about eight, and can transfer eight memory modules to the test tray 20 at a time.

In the supply tray 202, since the pocket formed in a concave shape for mounting the memory module is formed relatively larger than the shape of the memory module 10, the pocket is stored in the supply tray 202. The position of the memory module 10 in the state has some variation. Therefore, if the memory module 10 is gripped by the gripping mechanism 500 in this state and directly carried to the test tray 20, it may be difficult to accurately drop the memory module 10 into the insert 30 of the test tray 20.

For this reason, in the present embodiment, a position correcting means called a precisor 305 is provided between the installation position of the supply tray 202 and the test tray 20. The precisor 305 has a relatively deep concave portion into which the memory module 10 can be inserted, and has a shape in which the periphery of the concave portion is surrounded by an inclined surface. Therefore, when the memory module 10 is dropped into the recess, the falling position of the memory module 10 is corrected on the inclined surface. As a result, the mutual positions of the eight memory modules 10 are accurately determined, and the memory modules 10 whose positions have been corrected are sucked again by the gripping mechanism 500 and reloaded on the test tray 20, whereby the test tray 20 Memory module 1 with high accuracy in insert 30
0 can be transshipped.

[0042] As the chamber portion 100 described above, the test tray 20 is loading the memory module 10 in the loader section 300, soak chamber 10
It is carried to 1. Although not shown, the soak chamber 101 is provided with a vertical transfer device, and the vertical transfer device waits while the plurality of test trays 20 are supported by the vertical transfer device until the measurement unit 102 becomes empty. . Then, high-temperature or low-temperature stress is applied to the memory module 10 mainly during this standby.

A test head TH is arranged at the center of the measuring section 102, and the socket 50 is set so as to face the inside of the measuring section 102 from below. Then, the test tray 20 is carried over the set test head TH, and the test is performed by electrically contacting each of the plurality of memory modules 10 with the plurality of sockets 50 at the same time. The test tray 20 after the test is completed
After the heat is removed in the unsoak chamber 103 and the temperature of the memory module 10 is returned to room temperature or a temperature corresponding thereto, the memory module 10 is carried out to the unloader section 400.

The test tray 20 carried out to the unloader section 400 is returned to the loader section 300 and the chamber 100 again by a roller conveyor (not shown).

As shown in detail in FIG. 7, the test tray 20 of the memory module holds the insert 30 in which the memory module 10 is removably accommodated and the plurality of inserts 30 in a line along the X-axis direction. Tray body 20
a. The tray body 20a has a rectangular upper frame 22 and a rectangular lower frame 24 of the same size and rectangular. These frames 22 and 24 are connected in parallel by a plurality of rod-shaped spacers 26.

Upper frame 22 and lower frame 24
, Holding holes 21 and 23 for penetrating and holding the respective inserts 30 are formed at predetermined intervals along the X-axis direction. A pair of positioning holes 2 are provided near both ends of the holding hole 21 formed in the upper frame 22 in the Y-axis direction.
5 are formed so as to be displaced in the X-axis direction. As shown in FIG. 8C, positioning pins 42 formed on the inserts 30 are fitted into these positioning holes 25, and each insert 30 is positioned with respect to the tray main body 20a.
Note that a cap 43 is attached to the lower end of the pin 42, and the insert 30 is prevented from coming off with respect to the tray main body 20a.

As shown in FIGS. 7 and 8 (A) and 8 (B), the insert 30 has a pair of side walls 32 in which inverted trapezoidal cutouts 31 are formed. These side walls 3 are formed so that a space 34 is formed.
2 is integrated by end walls 33a and 33b. Each insert 30 is made of, for example, a synthetic resin.

As shown in FIG. 8B, bosses 35 projecting from the accommodation space 34 are formed inside the end walls 33a and 33b. A groove 36 and a holding bottom wall 37 are formed. FIG.
As shown in (A) and (B), the bottom of the housing space 34 formed between the pair of side plates 32 is
5 and 35, a through hole 38 is formed, and the substrate terminal 12 of the memory module 10 held between the holding bottom walls 37 of the holding groove 36 is exposed downward through the through hole 38.

Both ends of the memory module 10 can be detachably inserted into the holding groove 36 from above, and as shown in FIG. Hold both sides of the memory module 10 with the holding grooves 3
6 are formed with a tapered guide groove 42 for guiding the inside. Inside the insert 30, the memory module 10 is positioned by the holding bottom wall 37 of the holding groove 36 with a slight clearance in the X-axis direction and the Y-axis direction, held by its own weight, and The clearance of the accommodation space 34 is formed with a relatively wide clearance so as not to contact with.

A flange 39 is integrally formed on the upper portions of the end walls 33a and 33b. The flange 39 is shown in FIG.
As shown in the figure, the insert 30 is placed on the edge of the holding hole of the upper frame 22 in a state of being inserted and held in the holding holes 21 and 23 of the tray main body 20a.
0 is prevented from falling downward from the holding holes 21 and 23. As shown in FIGS. 7 and 8, positioning pins 42 protrude from the lower surface of the flange 39.
These positioning pins 42 are, as shown in FIG.
It fits into a positioning hole 25 formed in the upper frame 22.

At the lower end of the positioning pin 42, a cap 4
3 is attached, and the insert 30 is prevented from coming off upward with respect to the tray main body 20a. As a result, each insert 30 is positioned and held with respect to the tray main body 20a. However, the clearance between the positioning hole 25 and the positioning pin 42 should be set large enough to allow the insert 30 to move about 0.5 to 1.5 mm in the X-axis and Y-axis directions with respect to the tray body 20a. Is preferred. As described later, each insert 30 needs to be positioned with respect to each board pusher 76 and each socket 50, and needs to be movable with respect to the tray main body 20a. In addition, since each insert 30 needs to be slightly movable in the Z-axis direction with respect to the tray body 20a, the cap 43 shown in FIG. ,
The insert 30 and the tray body 20a are attached so as to allow relative movement in the Z-axis direction. In addition, the insert 3 into the holding hole 23 formed in the lower frame 24
The clearance of the outer shape at the lower end of 0 is substantially the same as the clearance between the positioning hole 25 and the positioning pin 42, thereby preventing the insert 30 from tilting more than necessary with respect to the tray main body 20a.

In particular, as shown in FIG.
And 33b have an upper positioning hole 40 formed through the flange 39 and end walls 33a and 33b.
And a lower positioning hole 41 which is open at the bottom of the bottom. The positioning pins 80 formed on the holding plate 78 of the board pusher 76 shown in FIG. 6 are inserted into the upper positioning holes 40 to position the board pusher 76 and the insert 30. In addition, the lower positioning hole 41
6, a positioning pin 56 formed in the socket guide 52 of the test socket 50 shown in FIG. 6 is inserted, and the board terminal 12 of the memory module 10 held by the insert 30 is positioned with respect to the test socket 50. It has become.

As shown in FIG. 6, the test tray 20 holding the insert 30 is placed on a tray transport base 44 and can be transported, for example, in the X-axis direction. The tray transport base 44 is elastically held by a means such as a spring 46 (or a pressure cylinder) with respect to a test head base 48 holding the socket 50. As a result, a spring force is applied to the tray transport base 44 in a direction in which the test tray 20 moves away from the socket 50 on the test head base 48.

The structural relationship between the test tray 20 and the test head TH in the measuring section 102 is as follows. First, as shown in FIG. 9, a common test board 64 and an individual test board 66
, A plurality of sockets 50 are arranged along the X-axis direction. The number of sockets 50 shown in FIG. 9 depends on the number of inserts 30 held on the test tray 20 shown in FIG.
Is preferably 1 / integer of the number of arrangements. The arrangement pitch in the X-axis direction between the sockets 50 shown in FIG.
It is preferably an integral multiple of the arrangement pitch of the inserts 30 shown in FIG. 7 in the X-axis direction.

For example, when 16 inserts 30 shown in FIG. 7 are arranged along the X-axis direction, the socket 50 shown in FIG. 9 is の of the 16 sockets 8 along the X-axis direction. It is arranged in the number of arrangements. The arrangement pitch in the X-axis direction between the sockets 50 shown in FIG. 9 is twice the arrangement pitch in the X-axis direction of the insert 30 shown in FIG. By arranging sockets 50 with such an arrangement number and an arrangement pitch, a plurality of times (for example, 2
), All the memory modules 10 held in the test tray 20 can be tested.

That is, first, among the memory modules 10 held in the respective inserts 30 of the test tray 20 shown in FIG. 7, the substrate terminals 12 of the odd-numbered (or even-numbered) memory modules 10 along the X-axis direction. Is inserted into the socket groove 51 of each socket 50 shown in FIG. 9, and these are simultaneously tested. Thereafter, the test tray 20 shown in FIG. 7 is moved along the X-axis direction by the same interval as the arrangement pitch of the inserts 30 in the X-axis direction. The board terminals 12 of the memory module 10 are inserted into the socket grooves 51 of each socket 50 shown in FIG. 9, and these are simultaneously tested. In this way, all the memory modules 10 held in the test tray 20 can be tested.

As shown in FIG. 9, each socket 50
It has a socket body 53 having a socket groove 51 formed along the axial direction, and a pedestal 68 for holding the socket body 53. The pedestal 68 is connected to the upper part of the individual test board 66. Further, the socket body 5 is located above the pedestal 68.
A socket guide 52 having an elongated through-hole 54 formed in the Y-axis direction is mounted on the outer periphery of the socket 3, and a through-hole 54 is provided between both ends of the socket body 53 in the Y-axis direction and the socket guide 52. Escape grooves 55 corresponding to both ends are formed. As shown in FIG. 6, the bosses 35 formed at the lower ends of the end walls 33 a and 33 b of the insert 30 enter these escape grooves 55, and the both ends are held in the holding grooves 36 of the boss 35. The board terminal 12 of the module 10 can be conveniently inserted into the socket groove 51 of the socket 50.

Further, as shown in FIG.
A socket terminal 58 is arranged inside the 0 socket groove 51. The socket terminals 58 are formed by connecting the board terminals 12 formed at the lower end of the memory module 10 to the socket grooves 51.
Is electrically connected to the substrate terminal 12 in a state of being inserted into the inside. The socket terminals 58 are connected to the test head TH and the tester TS via the pedestal 68, the individual test board 66, the common test board 64, and the internal wiring of the test head base 48.
Each test result can be read.

In this embodiment, as shown in FIG. 10, a pad 60 for receiving the lower end of the module 10 and a return spring 62 for applying a spring force for pushing the pad 60 upward are provided at the bottom of the socket groove 51. Is provided. Therefore, when no external force acts on the memory module 10, the memory module 1
0 is pushed out from the socket groove 51 upward.

As shown in FIG. 6, a Z-axis drive unit 70 for moving the board pusher 76 in the vertical direction (Z direction) is provided above the test tray 20 held on the transport base 44. Are located. The Z-axis drive unit 70 includes a common drive plate 72 and a match plate 74
And a holding plate 78 for holding the board pusher 76.

On the lower surface of the board pusher 76, a pressing surface 71 for finally pressing the upper end of each memory module 10 is formed. Guide projections 73 projecting downward from the lower surface of the board pusher 76 are integrally formed at the positions of both ends of the pressing surface 71 in the Y-axis direction. Also,
The guide projection 73 can enter the inside of the accommodation space 34 of the insert 30.

Inside the guide projection 73, both upper end portions of the memory module 10 are inserted, and a guide groove 77 for calibrating the inclination in the insert 30 of the module 10 is provided.
Are formed. A tapered portion 75 is formed at the lower end of the guide groove 77 so that both upper end portions of the memory module 10 can be easily inserted into the guide groove 77.

A holding plate 78 for holding the board pusher 76
Positioning pins 80 are provided on the lower surfaces of both ends in the Y-axis direction. When the holding plate 78 moves downward in the Z-axis direction, the positioning pin 80 is inserted into the upper positioning hole 40 of the insert 30 and the board pusher 7.
6 and the memory module 10 are positioned.

The board pusher 76 and the holding plate 78
A plurality of sockets 50 are arranged along the X-axis direction at intervals and the number of arrangements corresponding to the arrangement pitch in the X-axis direction, and each holding plate 78 is fixed to a lower end of each of the plurality of suspension rods 82. The upper end of the suspension rod 82 is fixed to the lower surface of the individual drive plate 84. A plurality of individual driving plates 84 are also arranged along the X-axis direction at intervals and the number of arrangements corresponding to the arrangement pitch of the sockets 50 in the X-axis direction. Are respectively movably mounted in the Z-axis direction inside each of the plurality of accommodation grooves 86 formed along the X-axis direction. Each accommodation groove 8
6 has a mortar-shaped taper, and the board pusher 76 is individually suspended in a state of being suspended from the match plate 74 via the holding plate 78, the suspension rod 82 and the individual driving plate 84. The driving plate 84 is provided with the accommodation groove 8.
6 and is held.

As shown in FIGS. 13A to 13D, the match plate 74 and the common driving plate 72 are connected by a connecting block 92.
It is movable in the Z-axis direction. A drive mechanism (a pressure cylinder, a motor actuator, or the like) for moving the match plate 74 and the common drive plate 72 in the Z-axis direction is omitted.

As shown in FIG. 6, a pair of contact cylinders 88 are mounted on the lower surface of the common drive plate 72 in the Y-axis direction corresponding to the upper portions of the individual drive plates 84. Each contact cylinder 88 is provided with a pressing pad 90 that is freely drivable in the Z-axis direction. As described later, the individual driving plate 84 floating from the match plate 74 can be pressed downward at a predetermined timing. ing.

Unloader unit 400 The unloader unit 400 is also provided with an XY transfer device 403 having the same structure as the XY transfer device 303 provided in the loader unit 300. The XY transfer device 403 also includes a Y-axis rail 401, an X-axis rail 402 that can move along the Y-axis rail 401 between the storage tray 204 and the test tray 20 in the ± Y-axis direction, The movable head 40 that can move in the ± X-axis direction along the X-axis rail 402
The memory module gripping mechanism 500 shown in FIG. 5 is attached to the movable head 404 in a downward direction. The XY transport device 403 causes the unloader section 4
The tested memory modules 10 are transferred from the test tray 20 carried out to the storage tray 204 to the storage tray 204.

The unloader unit 400 has a pair of windows 406a and 406b in which the storage tray 204 carried to the unloader unit 400 is arranged so as to face from below.
Has been established. As described, each window 4
Set plates 210 and 210 for raising and lowering the storage tray 204 are provided below the storage trays 06a and 406b. Here, the storage tray 204 in which the memory modules 10 that have been tested are reloaded and filled up is loaded. The tray 204 is put down and transferred to the transfer arm 208.

Incidentally, in the handler 1 of the present embodiment,
Even when the maximum number of categories that can be sorted is desired to be, for example, eight, the window portions 406a, 4
In 06b, only two storage trays 204 can be arranged at the maximum. Therefore, the categories that can be sorted in real time are limited to two categories. In general, good products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices, and four categories are sufficient with defective products added thereto. There may be categories that do not belong to these categories, such as those that require a retest.

As described above, the window section 4 of the unloader section 400
06a, 406b, two storage trays 20
In the case where a memory module 10 classified into a category other than the category assigned to No. 4 occurs, one storage tray 204 is returned from the unloader unit 400 to the storage unit 200, and the newly generated category is replaced with the newly generated category. Storage tray 20 for storing the memory module 10
4 may be transferred to the unloader unit 400 and the memory module 10 may be stored.

However, if the storage trays 204 are replaced during the sorting operation, the sorting operation must be interrupted during that time, which causes a problem that the throughput is reduced. Therefore, in the handler 1 of the present embodiment, the test tray 20 of the unloader unit 400 and the window 406a,
A buffer section 405 is provided between the memory module 406b and the memory module 10 of a category that rarely occurs in the buffer section 405.

For example, 30 to 50
A memory device is provided which has a capacity capable of storing about the number of memory modules 10 and stores a category of the memory module 10 stored in each storage position of the buffer unit 405, and a memory temporarily stored in the buffer unit 405. The category and position of the module 10 are stored for each memory module 10. Then, during the sorting operation or when the buffer unit 405 is full, the storage tray 204 of the category to which the memory module 10 stored in the buffer unit 405 belongs is stored in the storage unit 2.
00 and stored in the storage tray 204. At this time, the memory modules 10 temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when the storage trays 204 are called, the plurality of storage trays 204 are simultaneously loaded into the unloader unit 400. What is necessary is just to call it to the window parts 406a and 406b.

Next, the operation will be described. First, the operation of the memory module storage unit 200 will be described with reference to FIGS. 11 and 12, the supply tray 202 full of the memory modules 10 before the test is stored in all the stages of the tray storage section 212,
The operation of setting the storage tray 204 in which the tested memory modules 10 are fully loaded by the unloader unit 400 of the handler 1 to the tray storage unit 214 will be described continuously.

For example, when the supply tray 202 is taken out from the uppermost stage of the tray storage section 212, FIG.
First, as shown in FIG.
2 and is pushed out to the elevator 206 by the fluid pressure cylinder 206a shown in FIG. At about the same time, the transfer arm 208 is moved immediately above the elevator 206.

Next, the elevator on which the supply tray 202 is placed is raised to a transfer position with the transfer arm 208, and the hook mechanism 208b of the transfer arm 208 is closed to receive and hold the supply tray 202. . Then, the loader unit 3 which is the target position
The run arm 208 is moved to the lower part of 00. Before this movement, the set plate 210 of the loader unit 300 is lowered to the lower limit position.

This state is shown in FIG. 11 (B). Here, the set plate 210 is slightly raised (or, when the vertical movement function in the ± Z-axis direction is added to the Tran arm 208, the Tran arm 208 side is moved). Then, the hook mechanism 208b of the transfer arm 208 is opened to transfer the supply tray 202 onto the set plate 210. After retracting the transfer arm 208 from that position, the set plate 210 is raised to the upper limit position as shown in FIG. 11C, and the supply tray 202 is set on the loader unit 300. As described above, the supply tray 202 full of the memory modules 10 before the test is moved to the loader unit 30.
The operation of setting to 0 is completed.

In FIG. 11C, the transfer arm 208 located at the lower part of the loader section 300 is moved to the storage tray 20 on which the memory modules 10 that have been tested are fully loaded.
4 to the right side of the unloader unit 400 to receive the same. Before this movement, the set plate 210 on the right side of the unloader unit 400 is lowered to the lower limit position. Then, the set plate 210 is slightly raised (or, if the function of raising and lowering in the ± Z-axis direction is added to the trunnarm 208, the trunnarm 208 side is slightly lowered), and the hook mechanism 208b of the trunnarm 208 is closed. Then, the storage tray 204 is transferred to the transfer arm 208 and held.

Next, as shown in FIG. 12A, the transfer arm 208 is moved to the upper part of the elevator 206 waiting at the raised position, where the hook mechanism 208b of the transfer arm 208 is opened to open the storage tray 204. Is transferred to the elevator 206. Then, as shown in FIG. 12 (B), after lowering the elevator 206 to a predetermined empty stage (the third stage from the top in this example) of the tray storage unit 214,
The storage tray 204 is pulled into the tray storage section 214 using the fluid pressure cylinder 206b shown in FIG. As described above, the storage tray 204 full of the tested memory modules 10 is moved from the unloader unit 400 to the tray storage unit 2.
The operation of transferring to S14 is completed.

As described above, when the tray transfer device of this embodiment is used, there is no need to raise and lower the tray storage sections 212 and 214 themselves.
There is no need to provide a space for the lifting locus above the 214. Therefore, the test apparatus itself is reduced in size at least in the height direction.

The tray handling sequence shown in FIGS. 11 and 12 is merely an example of the present invention. According to the present invention, the elevator 206 is housed in the pair of tray housings 212 and 214. Trays 202, 20
4, the loader unit 300, the unloader unit 400, and the tray storage unit 21 can be accessed.
2, 214, any of the trays 202, 204 can be taken in and out.

For example, when the supply tray 202 and the storage tray 204 are the same tray, the supply tray 202 on which the memory module 10 is fully loaded is replaced with the tray shown in FIG.
After the transfer tray 202 of the loader unit 300 is emptied, the transfer tray 202 is directly or indirectly transferred to the unloader unit 400 by the transfer arm 208. To the storage tray 204.

The storage tray in which the memory module 10 is fully loaded by the unloader section 400 is normally stored toward the tray storage section 214.
The use of the empty stage also allows flexible handling of an increase in the number of classifications.

That is, when the supply tray 202 and the storage tray 204 are used independently, when the number of supply trays is A, the number of storage trays is B, and the number of classifications is n, the storage trays 204 Cannot be operated continuously unless B = A + (n-1) or more. However, by sharing these trays 202 and 204, the classification operation can be performed continuously until n = B + 1. become.

Next, the above-mentioned memory module storage unit 2
From 00, the memory module 10 before the test, which is fully loaded on the supply tray 202 set in the window 306 of the loader unit 300, is transferred to the test tray 20 of the memory module by the XY transfer device 303 shown in FIG. Thereafter, the wafer is transferred into the chamber 100 while being mounted on the test tray 20. In the chamber 100, the memory module 10 is heated or cooled to a temperature (high or low temperature) at which a test is to be performed in a soak chamber (constant temperature chamber) 101, and is pressed against a test head by a measuring unit 102.
This pressing to the test head is performed in a state where the memory module 2 is mounted on the test tray 20 and some of the memory modules 2 are pressed.
0 are pressed simultaneously.

The operation of the measuring section 102 will be described in detail with reference to FIGS.

First, a test tray 20 holding a plurality of memory modules 10 shown in FIG. 7 is mounted on a socket 50 fixed on an upper portion of a test head base 48 by a tray transport base 44 as shown in FIG. It is conveyed from another position to the upper position, is positioned with respect to the socket 50, and stops.

Next, from the position shown in FIG.
The Z-axis drive unit 70 is moved down in the Z direction to the position shown in FIG. Then, the positioning pins 80 formed on the lower surface of the holding plate 78 shown in FIG.
Upper positioning holes 4 formed in each insert 30
0, the board pusher 78 and the memory module 10 held by the insert 30 are positioned.

At the same time, the guide projections 73 of each board pusher 76 enter the accommodation space 34 of the insert 30, and both upper end portions of the memory module 10 are
7, the inclination of the memory module 10 housed inside the insert 30 is calibrated, and the memory module 10 is kept substantially perpendicular to the pressing surface 71 of the board pusher 76.

At that time, the holding plate 78 of the board pusher 76 shown in FIG. 6 comes into contact with the upper surface of the insert 30 and presses the insert 30 together with the tray 20 downward. However, at that time, the pressing surface 71 of the board pusher shown in FIG. 6 is not completely in contact with the upper end of the memory module 10.

Thereafter, as shown in FIG. 13C, when the drive unit 70 is further moved down in the Z direction, the lower end of the connection block 92 comes into contact with the upper end of the tray transport base 44. Since the distance between the match plate 74 and the common drive plate 72 in the Z direction does not change and the test tray 20 is held with respect to the transport base 44, the board pushers 76 that come into contact with the upper surface of the insert 30 are individually driven. Board 84
At the same time, it is lifted slightly upward relative to the match plate 74. However, even at that time, the pressing surface 71 of the board pusher 76 shown in FIG. 6 does not completely contact the upper end of the memory module 10 housed inside the insert 30.

Next, as shown in FIG. 13D, when the drive unit 70 is further moved down in the Z direction,
The connection block 92 pushes down the tray transport base 44 against the force of the spring 46 shown in FIG. As a result, the test tray 20 held by the tray transport base 44 is also pushed down in the Z direction, and the lower end of the boss 35 of the insert 30 shown in FIG. The lower end of module 10 contacts socket 50. At the same time, the positioning pins 56 of the socket 50 enter the lower positioning holes 41 of the insert 30, and the insert 30 and the socket 50 are positioned.

As shown in FIG. 14A, when the drive unit 70 is further moved down along the Z direction,
2 starts to enter the socket groove 51 of the socket 50, and only the memory module 10 remains at that position due to the repulsive force of the socket terminal 58. That is, since the memory module 10 is stationary with respect to the downward movement of the insert 30 and the tray 20, the memory module 10 is relatively pushed upward, and as a result, the upper end of the memory module 10 is pressed against the pressing surface 71 shown in FIG. Contact. The tray 20 including the insert 30 other than the memory module 10, the transport base 44, the match plate 74, and the common driving plate 72 will continue to move downward. However, by installing a spring mechanism such as a spring at any position of the socket 50 shown in FIG. 6, the insert 30 may be configured to temporarily stop the downward movement together with the memory module 10.

As shown in FIG. 14B, when the drive unit 70 is further moved down, the connecting block 44
The drive unit 70 is stopped from moving downward by abutting against a mechanical stopper 94 provided on the test head base 48. When the drive unit 70 is driven by a motor actuator other than the pressure cylinder,
The downward movement may be stopped at an accurate position by numerical control without using the mechanical stopper 94.

Next, as shown in FIG. 14C, the contact cylinder 88 shown in FIG.
0 is depressed, and the individual drive plate 84 floating above the match plate 74 is depressed. As a result, the pressing surface 71 of the board pusher 76 pushes down the memory module 10, and the lower end of the memory module 10 completely enters the inside of the socket groove 51, as shown in FIG.
2 is electrically connected to the socket terminal. At this time, the contact cylinder 88 shown in FIG. 6 is designed so as to have a necessary and sufficient pressing force for inserting the memory module 10 into the socket groove 51 of the socket 50 and not to apply an excessively large force. Is done. The memory module 10 is abutted against a mechanical end (not shown) provided in the socket 50 to perform positioning in the height direction. At this time, the contact cylinder 88 is designed to have a sufficient stroke, absorb a height dimensional error (for example, about 0.3 mm) of the memory module 10, and press the memory module 10 downward with a constant force. I have.

In the state shown in FIG. 14 (B), when the insert 30 is configured to temporarily stop the downward movement together with the memory module 10, FIG.
In the state shown in (C), the board pusher 76 shown in FIG.
With the memory module 10, the insert 30
Is also pushed down.

In the state shown in FIG. 14 (C), as shown in FIG. 10, the substrate terminals 12 of each memory module 10 are electrically connected to the socket terminals 58, and a plurality of memory modules are accommodated in the tray 20. Testing of module 10 is performed simultaneously.

After the test is completed, the pressing by the contact cylinder 88 shown in FIG. 6 is released, and the drive unit 70 is moved upward. As a result, the tray transport base 44 holding the tray 20 attempts to return to the original tray transport height by a return mechanism such as a spring 46 or a pressure cylinder. The lower end of the memory module 10 is moved by the spring force of the return spring 62 attached to the bottom of the socket groove 51 of the socket 50 shown in FIG.
It is withdrawn from the socket groove 51 upward. In the present invention, the return spring 6 shown in FIG.
Not only a socket having a self-extracting force such as 2, but also a socket without a self-extracting force can be used.

In this case, since the socket itself has no pulling force, the memory module 10 tries to stay in the socket 50. For this reason, the spring shown in FIG. 6 is applied to the tray transport base 44 shown in FIG. 6 so that the force for pulling out the memory module 10 from the socket 50 and the force for lifting the tray 20 together with the insert 30 to the tray transport height are applied. Design lifting force of 46 or pressure cylinder. Note that a force for removing the memory module 10 from the socket is applied to the insert 30 or the socket 50 by a spring or the like that causes a force for separating the insert 30 and the socket 50 when the insert 30 and the socket 50 are positioned. You may respond by mounting.

By adopting such a structure, the memory module 10 can be inserted into and removed from the socket 50 without applying any extra force. Even if the insertion of the memory module 10 into the socket 50 fails, the contact cylinder 88 shown in FIG. 6 does not attempt to push down the memory module 10 with a force greater than the insertion force into the socket 50. There is little damage to the module 10 and no extra load acts on the tray 20.

In the handler 1 using the test tray 20, the inside of the handler 1 is moved while the plurality of memory modules 10 are held in the test tray 20, and the plurality of memory modules 10 Can be tested, and the test throughput is greatly improved. Further, the test and measurement unit 102 does not need to perform the pick-and-place operation of the memory module 10, so that the internal structure of the handler 1 can be simplified. Can be planned. Further, in the handler 1 according to the present embodiment, all or a part of such a test mechanism is disposed inside the chamber. Therefore, by maintaining the inside of the chamber at a constant high or low temperature, the memory module 10 The temperature accuracy during the test is improved, and an accurate test can be performed.

The present invention is not limited to the above-described embodiment. For example, means for positioning each member is not particularly limited, and other means besides the positioning pin and the positioning hole may be used. You may adopt it. Also,
The socket main body 52 and the socket main body 53 may have an integral structure.

Further, the board pusher 76 is not limited to the embodiment shown in FIG. 6, and in the present invention, the guide projection 73, the guide groove 77 and the tapered portion 75 are not necessarily essential, and at least the pressing surface 71 may be used. However, it is preferable to provide the positioning pin 80 as the positioning means.

When the test is completed in such a procedure, the test tray 20 is transported to the unsoak chamber 103, and the memory module 10 after the test is returned to near room temperature. This is performed mainly for the purpose of preventing dew condensation when a low temperature is applied.

The test tray 20 full of the memory modules 10 returned to room temperature is transported to the unloader section 400, where the tested memory modules 10 are transferred to the storage tray 204 by using the XY transport device 403. I do. At this time, each memory module 10 is transferred to the storage tray 204 according to each test result. FIG.
In the example shown in FIG.
Two storage trays 20 set in 6a and 406b
The memory modules 10 of “Pass” are transferred to 4,204, and the memory modules 10 of “Fail” or “Retest” are sequentially transferred to the buffer stage 405. When the buffer stage 405 is full, the storage tray 204 for “fail” or the storage tray 204 for “retest” is set in the window 406a or 406b of the unloader unit 400, and the buffer stage 405 is set. Are transferred according to the respective classifications. Through the above procedure, the tests of the memory modules 10 and the classification based on the test results are performed.

The embodiments described above are described for the purpose of facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, the memory module 10 is taken as an example of a test object. However, the test apparatus of the present invention is not limited to the memory module, and trays cannot be stacked and stored in the tray storage section. The purpose is to include all such electronic components.

[0107]

As described above, according to the present invention, the test throughput can be improved, the test can be performed at an accurate temperature, and the test apparatus can be reduced in size, simplified, and reduced in cost. .

[Brief description of the drawings]

FIG. 1A is a schematic plan view and FIG. 1B is a schematic front sectional view showing an embodiment of an electronic component substrate testing apparatus according to the present invention.

FIG. 2 is a schematic side sectional view of the electronic component substrate test apparatus shown in FIG.

FIG. 3 is a perspective view showing an example of a supply or storage tray used in the present invention.

4 (A) is a perspective view showing a memory module storage unit of FIG. 1, and FIG. 4 (B) is a perspective view showing a tray storage unit and an elevator.

FIG. 5 is a perspective view showing a memory module holding mechanism used in the XY transfer device in FIG. 1;

FIG. 6 is a cross-sectional view showing the entire measurement unit of FIG. 1;

FIG. 7 is a perspective view showing an example of a test tray used in the present invention.

8 shows the insert of the test tray of FIG. 7 (A).
It is a top view, (B) front view, and (C) side view.

FIG. 9 is a perspective view showing the test head unit of FIG. 1;

FIG. 10 is a cross-sectional view illustrating a contact state between a memory module and a socket in the test head unit of FIG. 1;

FIG. 11 is a conceptual diagram for explaining a method of operating a supply or storage tray according to the present invention.

FIG. 12 is a conceptual diagram (part 2) showing a continuation of FIG. 11;

FIG. 13 is a cross-sectional view of a main part for describing an operation in the measurement unit of FIG. 1;

FIG. 14 is a cross-sectional view of a main part showing a continuation of FIG. 13;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler (test apparatus of electronic component board) 100 ... Chamber 200 ... Memory module storage part 202 ... Supply tray (first and second trays) 204 ... Storage tray (first and second trays) 206 ... Elevator (first lifting / lowering means) 208 ... Tran arm (horizontal transportation means) 210 ... Set plate (second lifting / lowering means) 212, 214 ... Tray storage unit 300 ... Loader unit 400 ... Unloader unit 10 ... Memory module (electronic parts) 12) Terminal 20 ... Test tray 20a ... Tray body 30 ... Insert 40 ... Upper positioning hole (first positioning hole) 41 ... Lower positioning hole (second positioning hole) 50 ... Test socket 74 ... Match plate 76 ... Board pusher

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yoshiyuki Masuo 1-32-1, Asahimachi, Nerima-ku, Tokyo F-term in the Advantest Co., Ltd. (reference) 2G032 AA07 AB12 AB13 AC03 AD01 AE01 AE02 AE04 AG01 AJ04 AJ07 AK03 AL03 AL04 AL11

Claims (13)

[Claims] 1. A storage unit for storing electronic component boards before and after a test, and a measuring unit for testing the electronic component board before the test, wherein (1) the storage unit has a first A first tray storage section in which trays are independently stored vertically, a second tray storage section in which second trays are independently stored vertically, the first tray storage section and the first tray storage section. A first tray that is provided between the first tray storage unit and the second tray storage unit so as to be vertically movable between the first tray storage unit and the second tray storage unit; Lifting means, provided above the first tray housing, the second tray housing, and the first lifting / lowering means, and movable in the direction in which they are arranged; Receiving the first tray or the second tray between the first tray and the second tray Horizontal transfer means for transferring, and second raising and lowering means capable of moving up and down with respect to a target position and transferring the first tray or the second tray to and from the horizontal transfer device, (2) The measuring unit includes: a test socket into which a board terminal of the electronic component substrate is removably inserted; and the electronic component substrate in a state where the electronic component substrate is mounted on a test tray. A board pusher for pushing the board terminal into the test socket, and holding grooves into which both side ends of the electronic component board are movably inserted such that the board terminals of the electronic component board are exposed. And a test tray having a tray body holding the insert so that the board terminals of the electronic component substrate are exposed, are loaded and unloaded. Test device for an electronic component substrate to be. 2. The test apparatus according to claim 1, further comprising a first transfer means for transferring the electronic component substrate from the first or second tray on which the electronic component substrate before the test is mounted to the test tray. Item 2. An electronic component substrate testing apparatus according to item 1. 3. The apparatus according to claim 1, further comprising: a second transfer unit for transferring the electronic component substrate from the test tray on which the electronic component substrate after the test is mounted to the first or second tray. Item 3. An electronic component substrate test apparatus according to item 1 or 2. 4. The apparatus according to claim 1, wherein one of the tray storage portions is a tray on which an electronic component substrate before the test is mounted, and the other is a tray on which the electronic component substrate after the test is mounted. 4. The test device for an electronic component substrate according to any one of claims 1 to 3, wherein 5. The electronic component board testing apparatus according to claim 4, wherein a tray on which the electronic component board after the test is mounted is housed in at least a part of the first tray housing section. 6. The electronic component board testing apparatus according to claim 5, wherein the electronic component board after the test is a category to be retested. 7. The first tray and the second tray,
7. Trays of the same type.
The test device for an electronic component substrate according to any one of the above. 8. The board pusher according to claim 1, wherein said board pusher has a guide groove into which both side ends of said electronic component substrate are inserted to calibrate the inclination of said electronic component substrate. Testing equipment for electronic component boards. 9. The test apparatus for an electronic component substrate according to claim 1, further comprising a match plate for movably holding the board pusher. 10. The apparatus for testing an electronic component substrate according to claim 9, further comprising driving means for moving said match plate toward and away from said test tray. 11. The driving means includes a board pusher for moving the electronic component substrate in the test tray and pushing a board terminal of the electronic component substrate into a socket. 11. The apparatus for testing an electronic component substrate according to claim 9, further comprising auxiliary driving means for moving the board pusher. 12. The apparatus for testing an electronic component substrate according to claim 8, further comprising a tray transport base for elastically holding the test tray on the test socket at predetermined intervals. 13. The test socket according to claim 8, further comprising a return spring for urging a force in a direction in which a board terminal of said electronic component substrate is pulled out of said test socket. An electronic component substrate testing apparatus according to any one of the above.