JP2000210862A - Sphere polishing method and sphere polishing device - Google Patents
Sphere polishing method and sphere polishing deviceInfo
- Publication number
- JP2000210862A JP2000210862A JP1439399A JP1439399A JP2000210862A JP 2000210862 A JP2000210862 A JP 2000210862A JP 1439399 A JP1439399 A JP 1439399A JP 1439399 A JP1439399 A JP 1439399A JP 2000210862 A JP2000210862 A JP 2000210862A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- sphere
- lapping liquid
- liquid
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
(57)【要約】
【課題】 研磨作業全体にかかる時間を短縮できるとと
もに、セラミックス球の研磨に適した球体研磨方法およ
び球体研磨装置を提供する。
【解決手段】 球体研磨装置10は、研磨面を対向させて
配設した２枚の盤体11，12間に球体Ａを介在させ、盤体
11，12間にラップ液を供給しながら盤体11，12を相対軸
回転させて球体Ａを研磨し、研磨効果が異なる第１ラッ
プ液および第２ラップ液を選択的に用いることにより、
複数工程の研磨加工を１台の球体研磨装置で行う。
PROBLEM TO BE SOLVED: To provide a sphere polishing method and a sphere polishing apparatus which can reduce the time required for the entire polishing operation and are suitable for polishing ceramic spheres. SOLUTION: The ball polishing apparatus 10 has a ball A interposed between two plates 11, 12 arranged with their polishing surfaces facing each other.
By rotating the disks 11 and 12 relative to each other while supplying the lapping liquid between 11 and 12 to polish the sphere A, and selectively using the first lapping liquid and the second lapping liquid having different polishing effects,
A plurality of polishing steps are performed by one spherical polishing apparatus.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、球体研磨方法およ
び球体研磨装置に係り、例えば転がり軸受に用いられる
転動体を製造するための球体研磨方法および球体研磨装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball polishing method and a ball polishing apparatus, and more particularly to a ball polishing method and a ball polishing apparatus for manufacturing a rolling element used for a rolling bearing.
【０００２】[0002]
【従来の技術】図４には、転がり軸受等に用いられる球
体を研磨するための球体研磨装置40が示されている。球
体研磨装置40は、同軸配置された一対の円盤１，２と、
各円盤１に対して円盤２を押圧する押圧手段４と、各円
盤１，２に支持されて互いに対向する研磨面１Ａ，２Ａ
と、円盤２に対して円盤１を軸回転させる駆動手段３
と、研磨面１Ａ，２Ａ間にラップ液を供給する供給手段
５とを有している。そして、この球体研磨装置40は、研
磨面１Ａ，２Ａ間に球体Ａを挟持させるとともに、研磨
面１Ａ，２Ａ間にラップ液を供給しながら円盤２に対し
て円盤１を軸回転させることにより、高度な真球度およ
び小さな表面粗さを有する球体Ａを製造する。2. Description of the Related Art FIG. 4 shows a ball polishing apparatus 40 for polishing a ball used for a rolling bearing or the like. The spherical polishing device 40 includes a pair of disks 1, 2 coaxially arranged,
Pressing means 4 for pressing the disk 2 against the disks 1; and polishing surfaces 1A, 2A supported by the disks 1, 2 and facing each other.
Driving means 3 for rotating the disk 1 relative to the disk 2
And a supply means 5 for supplying a lapping liquid between the polishing surfaces 1A and 2A. The sphere polishing apparatus 40 holds the sphere A between the polishing surfaces 1A and 2A, and rotates the disk 1 relative to the disk 2 while supplying a lapping liquid between the polishing surfaces 1A and 2A. A sphere A having a high sphericity and a small surface roughness is produced.
【０００３】ところで、従来より、球体Ａに対する加工
時間を短くするとともに高い加工精度を得るために、円
盤１の回転速度およびラップ液の種類が異なる３台の球
体研磨装置40により粗加工工程，中仕上工程，精密仕上
工程の３工程が施される。具体的には、粗加工工程を行
う球体研磨装置40は、円盤１を高速回転させながら８μ
ｍ程度の遊離砥粒を含むラップ液を研磨面１Ａ，２Ａ間
に供給する。また、中仕上工程を行う球体研磨装置40
は、円盤１を中速回転させながら４μｍ程度の遊離砥粒
を含むラップ液を研磨面１Ａ，２Ａ間に供給する。そし
て、精密仕上工程を行う球体研磨装置40は、円盤１を低
速回転させながら１μｍ以下の遊離砥粒を含むラップ液
あるいはラップ液のみを研磨面１Ａ，２Ａ間に供給す
る。By the way, conventionally, in order to shorten the processing time for the spherical body A and obtain high processing accuracy, three spherical polishing apparatuses 40 having different rotation speeds of the disk 1 and different types of lapping liquid have been used to perform rough processing steps. Three steps, a finishing step and a precision finishing step, are performed. Specifically, the sphere polishing apparatus 40 for performing the roughing process performs the rotation of the
A lapping liquid containing about m free abrasive grains is supplied between the polishing surfaces 1A and 2A. In addition, a spherical polishing device 40 for performing the intermediate finishing process
Supplies the lapping liquid containing loose abrasive grains of about 4 μm between the polishing surfaces 1A and 2A while rotating the disk 1 at a medium speed. Then, the spherical polishing apparatus 40 performing the precision finishing process supplies the lap liquid containing free abrasive grains of 1 μm or less or only the lap liquid between the polishing surfaces 1A and 2A while rotating the disk 1 at a low speed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
球体研磨方法では、粗加工工程，中仕上工程，精密仕上
工程を３台以上の球体研磨装置40により行うため、各球
体研磨装置40の設置スペースが必要であるとともに、各
球体研磨装置40間において球体を搬送するための搬送作
業あるいは搬送装置が必要であり、球体の製造コストが
高くなるという問題がある。However, in the conventional sphere polishing method, the rough machining step, the intermediate finishing step, and the fine finishing step are performed by three or more sphere polishing apparatuses 40. In addition to this, there is a problem that a transport operation or a transport device for transporting the spheres between the respective sphere polishing devices 40 is required, and the production cost of the spheres is increased.
【０００５】また、従来の球体研磨方法では、粗加工工
程および中仕上工程において研磨面１Ａ，２Ａに目詰ま
りが生じると、生球を使用して研磨面１Ａ，２Ａの目詰
まりを直す目立作業を長時間施す必要があり、球体の製
造工程が長時間中断するという問題もある。特に、近
年、転がり軸受に多用されるセラミックス球は、硬さHv
830 以下の鋼球に比較して、製造工程において研磨面１
Ａ，２Ａを目詰まりさせ易いため加工が難しく、球体研
磨方法および球体研磨装置の改善が求められていた。In the conventional ball polishing method, when clogging of the polished surfaces 1A, 2A occurs in the rough processing step and the intermediate finishing step, the clogging of the polished surfaces 1A, 2A is corrected using fresh balls. There is also a problem that the work needs to be performed for a long time, and the sphere manufacturing process is interrupted for a long time. In particular, in recent years, ceramic spheres frequently used for rolling bearings have a hardness Hv
Polished surface 1 in the manufacturing process compared to steel balls of 830 or less
Since the A and 2A are easily clogged, processing is difficult, and there has been a demand for an improved sphere polishing method and sphere polishing apparatus.
【０００６】本発明は、前述した要望を満たすためにな
されたものであり、その目的はセラミックス球であって
も製造コストを低くできる球体研磨方法および球体研磨
装置を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to satisfy the above-mentioned demands, and an object of the present invention is to provide a sphere polishing method and a sphere polishing apparatus which can reduce the manufacturing cost of ceramic spheres.
【０００７】[0007]
【課題を解決するための手段】本発明は、ラップ液に含
まれる遊離砥粒を積極的に研磨面の目立に用いたり、あ
るいは遊離砥粒を用いないで研磨面を意図的に目詰まり
させれば、球体に対して同一の球体研磨装置が複数種類
の研磨加工を施せることに本発明者が着目してなされた
ものである。従って、前述した目的を達成するために、
本発明の球体研磨方法は、同軸配置された一対の円盤に
おける互いに対向する研磨面間に球体を挟持するととも
に、前記各円盤のうちの一方を他方に対して相対的に軸
回転させることにより前記球体を研磨する球体研磨方法
であって、所定の研磨効果を有する第１ラップ液を前記
各研磨面間に供給する第１研磨工程を所定時間行った
後、前記第１ラップ液に比較して前記研磨効果が低い第
２ラップ液を前記各研磨面間に供給する第２研磨工程を
行うことを特徴としている。SUMMARY OF THE INVENTION According to the present invention, free abrasive grains contained in a lapping liquid are positively used for sharpening a polished surface, or a polished surface is intentionally clogged without using free abrasive grains. Then, the inventor pays attention to the fact that the same sphere polishing apparatus can perform a plurality of types of polishing on the sphere. Therefore, in order to achieve the above-mentioned purpose,
The sphere polishing method of the present invention, while holding a sphere between the opposing polishing surfaces of a pair of disks arranged coaxially, and by rotating one of the disks relative to the other by axial rotation. A sphere polishing method for polishing a sphere, wherein a first polishing step of supplying a first lap liquid having a predetermined polishing effect between the respective polishing surfaces is performed for a predetermined time, and then compared with the first lap liquid. A second polishing step of supplying a second lap liquid having a low polishing effect between the respective polishing surfaces is performed.
【０００８】また、本発明の球体研磨装置は、同軸配置
された一対の円盤と、前記各円盤に支持されて互いに対
向する研磨面と、前記各円盤のうちの一方を他方に対し
て相対的に軸回転させる駆動手段と、前記各研磨面間に
ラップ液を供給する供給手段とを有し、前記供給手段
が、所定の研磨効果を有する第１ラップ液と、前記第１
ラップ液に比較して前記研磨効果が低い第２ラップ液と
を選択的に前記各研磨面間に供給可能であることを特徴
としている。[0008] Further, the spherical polishing apparatus of the present invention comprises a pair of disks coaxially arranged, a polishing surface supported by each disk and facing each other, and one of the disks relative to the other. And a supply unit for supplying a lapping liquid between the polishing surfaces, wherein the supply unit includes a first lapping liquid having a predetermined polishing effect, and a first lapping liquid having a predetermined polishing effect.
The second lapping liquid having a lower polishing effect than the lapping liquid can be selectively supplied between the polishing surfaces.
【０００９】ここで、第１ラップ液および第２ラップ液
としては、ラップ液に含まれる砥粒の有無や、ラップ液
に含まれる遊離砥粒の粗さ、あるいはラップ液に含まれ
る遊離砥粒の比率、各研磨面間に対する供給量，供給速
度等を適宜選択することにより、研磨効果を相違させれ
ばよい。また、遊離砥粒としては、ダイヤモンド砥石を
例示できるが、ＣＢＮ砥石を用いてもよい。Here, the first lapping liquid and the second lapping liquid include the presence or absence of abrasive grains contained in the lapping liquid, the roughness of free abrasive grains contained in the lapping liquid, or the free abrasive grains contained in the lapping liquid. The polishing effect can be made different by appropriately selecting the ratio, the supply amount between the polishing surfaces, the supply speed, and the like. As the loose abrasive, a diamond grindstone can be exemplified, but a CBN grindstone may be used.
【００１０】これらのように構成された本発明において
は、同一の球体研磨装置を用いて第１ラップ液および第
２ラップ液を適宜選択することにより、遊離砥粒による
目立効果を積極的に利用して中仕上工程とするととも
に、研磨面の目詰まりを利用して精密仕上げとする。さ
らに、精度向上のために、精密仕上げ工程で研磨砥石の
砥粒を変えた２台以上の球体研磨装置を用いる場合は、
それらを１台で兼ねることができる。すなわち、これら
の発明においては、球体を製造するために３工程を行う
場合、従来において必要とされた３台以上の球体研磨装
置を少数化できるため、球体の製造コストを低くできる
ことになる。[0010] In the present invention having such a configuration, the sharpening effect by the free abrasive grains is positively selected by appropriately selecting the first lap liquid and the second lap liquid using the same sphere polishing apparatus. It is used for the medium finishing process, and is used for precision finishing using the clogging of the polished surface. Furthermore, in order to improve the accuracy, when using two or more sphere polishing devices in which the abrasive grains of the polishing stone are changed in the precision finishing process,
They can be used together. That is, in these inventions, when three steps are performed to manufacture a sphere, the number of conventionally required three or more sphere polishing apparatuses can be reduced, and the manufacturing cost of the sphere can be reduced.
【００１１】[0011]
【発明の実施の形態】図１に示すように、本発明に係る
実施形態の球体研磨装置10は、従来と同様に、同軸配置
された回転盤11および固定盤12を備えている。回転盤11
は、モータ13，プーリ14，15，ベルト16等を含む回転機
構17により適宜な回転数で駆動される。一方、固定盤12
は、図示しない油圧シリンダ等の押圧機構18により回転
盤11に対して近付く方向へ適宜な圧力で押圧される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a sphere polishing apparatus 10 according to an embodiment of the present invention includes a rotating disk 11 and a fixed disk 12 which are coaxially arranged as in the prior art. Turntable 11
Is driven at an appropriate rotation speed by a rotation mechanism 17 including a motor 13, pulleys 14, 15, a belt 16, and the like. On the other hand, fixed plate 12
Is pressed by a pressing mechanism 18 such as a hydraulic cylinder (not shown) with an appropriate pressure in a direction approaching the turntable 11.
【００１２】そして、回転盤11および固定盤12における
互いに対向する研磨面には、それぞれダイヤモンド等の
砥石が植設された略渦巻き状の溝11Ａ，12Ａが形成され
ている。球体研磨装置10は、円盤状のコンベア19と、コ
ンベア19の出口および入口に設置したシュート20，21と
を含む球体供給機構22を備えている。シュート20の先端
は、前述した溝11Ａ，12Ａの一端に臨んで位置されてい
る。[0012] On the opposing polished surfaces of the rotating disk 11 and the fixed disk 12, there are formed substantially spiral grooves 11A and 12A in each of which a grindstone such as diamond is implanted. The sphere polishing device 10 includes a sphere supply mechanism 22 including a disk-shaped conveyor 19 and chutes 20 and 21 installed at the outlet and the entrance of the conveyor 19. The tip of the chute 20 is located facing one end of each of the above-described grooves 11A and 12A.
【００１３】また、球体研磨装置10は、２つのラップ液
タンク23，24と、タンク23，24内のラップ液を回転盤11
および固定盤12間に供給するポンプ25，26等を含むラッ
プ液供給機構27を備える。タンク23，24内のラップ液
は、切換弁28を介して選択的に回転盤11および固定盤12
の間に導かれ、使用後のラップ液は切換弁29およびフィ
ルタ30，31を介して各々のタンク23，24に導かれる。The sphere polishing apparatus 10 also includes two lapping liquid tanks 23 and 24 and a lapping liquid in the tanks 23 and 24,
And a lapping liquid supply mechanism 27 including pumps 25 and 26 for supplying between the fixed platen 12 and the like. The lap liquid in the tanks 23 and 24 is selectively supplied to the turntable 11 and the fixed
And the used lapping liquid is guided to the respective tanks 23 and 24 via the switching valve 29 and the filters 30 and 31.
【００１４】このように構成された球体研磨装置10にお
いて、コンベア19上の球体Ａは、シュート20を介して回
転盤11の溝11Ａと固定盤12の溝12Ａ間に供給され、溝11
Ａ，12Ａの砥石によって研磨された後、シュート21を介
してコンベア19上へ排出される。その間、切換弁28によ
りタンク23，24のうちの一方、例えばタンク23のラップ
液が回転盤11および固定盤12間に供給され、使用後に切
換弁29を介してタンク23に戻される。その際、ラップ液
に混入した所定よりも大きな粒子はフィルタ30，31によ
って取り除かれる。 なお、ポンプを切換弁28の下流に
設ければ、一台で済む。また、回転数や押圧の変更は、
中仕上げと精密仕上げの工程が変わる際に行ってもよい
し、中仕上げ，精密仕上げの工程中に行ってもよい。In the sphere polishing apparatus 10 configured as described above, the sphere A on the conveyor 19 is supplied between the groove 11A of the rotating disk 11 and the groove 12A of the fixed disk 12 via the chute 20, and
After being polished by the grindstones A and 12A, it is discharged onto the conveyor 19 via the chute 21. In the meantime, the lap liquid in one of the tanks 23 and 24, for example, the tank 23, is supplied between the rotary plate 11 and the fixed plate 12 by the switching valve 28, and is returned to the tank 23 through the switching valve 29 after use. At that time, particles larger than a predetermined amount mixed in the lapping liquid are removed by the filters 30 and 31. If a pump is provided downstream of the switching valve 28, only one pump is required. In addition, change of the number of rotations and pressing
It may be performed when the steps of the intermediate finishing and the precision finishing are changed, or may be performed during the steps of the intermediate finishing and the precision finishing.
【００１５】以下、この実施形態における球体研磨方法
を説明する。まず、前述した球体研磨装置10において、
一方のタンク23に中仕上げ用のラップ液を入れ、他方の
タンク24に精密仕上げ用のラップ液を入れる。中仕上げ
用のラップ液としては、0.5cSt〜５cSt の流体、例えば
殺虫ソルベント等の白灯油系の油に、砥石の粒度と同等
か、それより粒度が小さい0.25μｍ〜２μｍの遊離砥粒
を混入させたものを使用し、精密仕上げ用のラップ液と
しては、遊離砥粒を混入させないものを使用する。な
お、ラップ液の基油は、0.5cSt〜５cSt の範囲であれ
ば、中仕上げ用と精密仕上げ用とは別でもよく、同じ油
あるいは溶剤を用いた場合には、中仕上げ用のラップ液
と精密仕上げ用のラップ液をブレンドして研磨量や仕上
げ面粗さを調整することもできる。The sphere polishing method according to this embodiment will be described below. First, in the above-mentioned sphere polishing device 10,
One tank 23 is filled with a lap liquid for medium finishing, and the other tank 24 is filled with a lap liquid for precision finishing. As a lapping liquid for semi-finishing, a free abrasive of 0.25 μm to 2 μm with a grain size equal to or smaller than that of a grindstone is mixed with a fluid of 0.5 cSt to 5 cSt, for example, white kerosene oil such as insecticide solvent. The lapping liquid used for precision finishing is used without mixing free abrasive grains. If the base oil of the lapping liquid is in the range of 0.5 cSt to 5 cSt, the medium finishing and the precision finishing may be different from each other. The amount of polishing and the roughness of the finished surface can also be adjusted by blending a lapping liquid for precision finishing.
【００１６】[0016]
【実施例】図２および図３は、球体研磨方法における単
位時間の研磨量と精度（粗さ，真球度）について、本発
明と従来とを比較したものである。本発明の球体研磨方
法では、粒度１μｍのダイヤモンド砥石に、中仕上げで
は最大系１μｍの遊離砥粒を0.5 〜２ｇ／ｌ混入した殺
虫ソルベント，精密仕上げでは遊離砥粒を入れない殺虫
ソルベントを使用した。FIGS. 2 and 3 show the comparison between the present invention and the prior art with respect to the polishing amount per unit time and the precision (roughness, sphericity) in the spherical polishing method. In the sphere polishing method of the present invention, an insecticide solvent in which 0.5 to 2 g / l of free abrasive grains having a maximum of 1 .mu.m is mixed in a medium finish, and an insecticide solvent in which no free abrasive grains are incorporated in precision finishing, is used for a diamond grinding stone having a grain size of 1 .mu.m. .
【００１７】また、従来の球体研磨方法としては、中仕
上げに粒度４μｍのダイヤモンド砥石とラップ液として
殺虫ソルベント用い、精密仕上げに粒度１μｍのダイヤ
モンド砥石とラップ液としてダフニーカットＨＬ２を用
い、切れ味が悪くなったときに遊離砥粒を適宜混入して
加工した。加工した球は、球径1/16（φ1.5625mm）のＳ
ｉ3 Ｎ4 のセラミックス球を用いた。In the conventional ball polishing method, a diamond grindstone having a particle size of 4 μm is used for semi-finishing and an insecticide solvent is used as a lapping solution, and a diamond grindstone having a particle size of 1 μm is used for precision finishing and Daphne Cut HL2 is used as a lapping solution. When it became, free abrasive grains were appropriately mixed and processed. The processed sphere has an S diameter of 1/16 (φ1.5625mm).
i 3 N 4 ceramic spheres were used.
【００１８】図２および図３のグラフでは、太実線が本
発明の方法による結果を示し、細実線が従来の方法によ
る結果を示している。図２のグラフにおいて、従来の方
法（細線）では、研磨に先立って砥石の目立てをおこな
っているのに対し、本発明の方法（太線）では、B1部で
明らかなように、遊離砥粒の自動目立て作用により砥石
の目が粗くなり、研磨量が増えている。また、従来の方
法では、精密仕上げで砥石の粒度が小さくなるので、最
初から研磨量が小さいが、本発明の方法では、B2部で明
らかなように、最初のうちは砥石の目が粗いので、研磨
量が大きいが、目詰まりにより砥石の目が次第に細かく
なり、研磨量が小さくなり加工精度が上がる。In the graphs of FIGS. 2 and 3, a thick solid line indicates the result obtained by the method of the present invention, and a thin solid line indicates the result obtained by the conventional method. In the graph of FIG. 2, in the conventional method (thin line), the grindstone is dressed prior to polishing, whereas in the method of the present invention (thick line), as is apparent in the B1 part, the free abrasive grains are removed. The automatic dressing action coarsens the grindstone and increases the amount of polishing. Also, in the conventional method, the grinding amount is small from the beginning because the grain size of the grindstone is reduced by precision finishing, but in the method of the present invention, as is apparent in the B2 part, the grindstone is initially coarse because it is coarse. However, although the polishing amount is large, the eyes of the grindstone gradually become finer due to the clogging, and the polishing amount decreases, and the processing accuracy increases.
【００１９】このように、本発明では、精密仕上げにお
いて研磨量が大きいため、従来の所要時間T2に対して本
発明の所要時間はT3と短縮される。なお、本発明では、
中仕上げにおいても、従来の所要時間T1に対して、砥粒
の径および量を調整することによって、砥粒による砥石
の目立て作用によって所要時間をT4に短縮できる。ま
た、図３に示したように、本発明の方法（太実線）で
は、従来方法（細実線）に対して短時間で所望とする精
度が得られる。As described above, in the present invention, since the polishing amount is large in precision finishing, the required time of the present invention is shortened to T3 compared to the conventional required time T2. In the present invention,
Also in the intermediate finishing, the required time can be shortened to T4 by adjusting the diameter and amount of the abrasive grains with respect to the conventional required time T1, by the dressing action of the grindstone by the abrasive grains. Further, as shown in FIG. 3, the method of the present invention (thick solid line) can obtain desired accuracy in a short time as compared with the conventional method (thin solid line).
【００２０】なお、前述した前述した実施例では、粒度
１μｍのダイヤモンド砥石を使用したが、砥石粒度はこ
の場合に限らず、0.25μｍとか、0.5 μｍとか任意に選
ぶことができ、その場合も遊離砥粒は砥石粒度と同じ
か、それ以下のものを用いることは実施例と同様であ
る。 さらに、球体としてセラミックス球を用いている
が、本発明は、通常の軸受球よりも硬さが硬いHv830 以
上の特殊鋼、例えばハイス等の難加工材料の球体の研磨
にも適する。In the above-described embodiment, a diamond grindstone having a grain size of 1 μm is used. However, the grain size of the grindstone is not limited to this case, and can be arbitrarily selected as 0.25 μm or 0.5 μm. The use of abrasive grains having a grain size equal to or less than the grain size of the grindstone is the same as in the embodiment. Furthermore, although ceramic spheres are used as spheres, the present invention is also suitable for polishing spheres of hard-to-machine materials such as high-speed steel, such as Hv830, which is harder than ordinary bearing balls.
【００２１】[0021]
【発明の効果】以上、説明したように、本発明の球体研
磨方法および球体研磨装置によれば、研磨効果が異なる
ラップ液を選択的に用いるため、同一の球体研磨装置に
より球体を製造するために３工程を行う場合、従来にお
いて必要とされた３台の球体研磨装置を少数化できるた
め、球体の製造コストを低くできる。As described above, according to the sphere polishing method and the sphere polishing apparatus of the present invention, since the lapping liquids having different polishing effects are selectively used, the spheres can be manufactured by the same sphere polishing apparatus. When the three steps are performed, the number of conventionally required three ball polishing apparatuses can be reduced, so that the manufacturing cost of the ball can be reduced.
【図１】本発明に係る実施形態の球体研磨装置を示す全
体斜視図である。FIG. 1 is an overall perspective view showing a spherical polishing apparatus according to an embodiment of the present invention.
【図２】単位時間あたりの研磨量について実施例と従来
例とを比較したグラフである。FIG. 2 is a graph comparing the polishing amount per unit time between the embodiment and the conventional example.
【図３】加工面の精度について実施例と従来例とを比較
したグラフである。FIG. 3 is a graph comparing the working example and the conventional example with respect to the accuracy of the machined surface.
【図４】従来の球体研磨機を示す概要図である。FIG. 4 is a schematic view showing a conventional ball polishing machine.
10 球体研磨装置 11 回転盤 11Ａ 溝 12 固定盤 12Ａ 溝 17 回転機構 18 押圧機構 22 球体供給機構 23，24 ラップ液タンク 27 ラップ液供給機構 28，29 切換弁 30，31 フィルタ 10 Spherical polishing device 11 Rotating plate 11A groove 12 Fixed plate 12A groove 17 Rotating mechanism 18 Pressing mechanism 22 Sphere supply mechanism 23,24 Lapping liquid tank 27 Lapping liquid supply mechanism 28,29 Switching valve 30,31 Filter
Claims (1)
に対向する研磨面間に球体を挟持するとともに、前記各
円盤のうちの一方を他方に対して相対的に軸回転させる
ことにより前記球体を研磨する球体研磨方法であって、 所定の研磨効果を有する第１ラップ液を前記各研磨面間
に供給する第１研磨工程を所定時間行った後、前記第１
ラップ液に比較して前記研磨効果が低い第２ラップ液を
前記各研磨面間に供給する第２研磨工程を行うことを特
徴とする球体研磨方法および前記第１ラップ液と前記第
２ラップ液とを選択的に前記各研磨面間に供給可能であ
ることを特徴とする球体研磨装置。1. A sphere is sandwiched between polishing surfaces opposed to each other in a pair of disks coaxially arranged, and one of the disks is axially rotated relative to the other to polish the sphere. After performing a first polishing step of supplying a first lap liquid having a predetermined polishing effect between the polishing surfaces for a predetermined time,
A second polishing step of supplying a second lapping liquid having a lower polishing effect than the lapping liquid between the respective polishing surfaces, and a method for polishing spheres, and the first lapping liquid and the second lapping liquid. Is selectively supplied between the polishing surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1439399A JP2000210862A (en) | 1999-01-22 | 1999-01-22 | Sphere polishing method and sphere polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1439399A JP2000210862A (en) | 1999-01-22 | 1999-01-22 | Sphere polishing method and sphere polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000210862A true JP2000210862A (en) | 2000-08-02 |
Family
ID=11859825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1439399A Pending JP2000210862A (en) | 1999-01-22 | 1999-01-22 | Sphere polishing method and sphere polishing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000210862A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010038646A1 (en) | 2008-10-03 | 2010-04-08 | Ntn株式会社 | Apparatus for polishing spherical body, method for polishing spherical body and method for manufacturing spherical member |
| CN103419120A (en) * | 2013-08-22 | 2013-12-04 | 安庆机床有限公司 | Vertical steel ball lapping machine with batch diameter control device |
| CN104325391A (en) * | 2014-10-08 | 2015-02-04 | 安庆机床有限公司 | Automatic ball discharger for steel ball polishing and grinding machines |
| JP2016203360A (en) * | 2015-04-28 | 2016-12-08 | 株式会社ジェイテクト | Spherical body polishing device and spherical body polishing method |
| CN107322465A (en) * | 2017-08-23 | 2017-11-07 | 朱建良 | A kind of equipment for processing mill ball |
| CN113927406A (en) * | 2021-11-08 | 2022-01-14 | 永康铨琪机械设备有限公司 | Steel ball polishing equipment |
-
1999
- 1999-01-22 JP JP1439399A patent/JP2000210862A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010038646A1 (en) | 2008-10-03 | 2010-04-08 | Ntn株式会社 | Apparatus for polishing spherical body, method for polishing spherical body and method for manufacturing spherical member |
| US9089947B2 (en) | 2008-10-03 | 2015-07-28 | Ntn Corporation | Spherical body polishing apparatus, method for polishing spherical body and method for manufacturing spherical member |
| CN103419120A (en) * | 2013-08-22 | 2013-12-04 | 安庆机床有限公司 | Vertical steel ball lapping machine with batch diameter control device |
| CN103419120B (en) * | 2013-08-22 | 2015-12-23 | 安庆机床有限公司 | Be equipped with the vertical steel ball lapping machine of batch diameter control device |
| CN104325391A (en) * | 2014-10-08 | 2015-02-04 | 安庆机床有限公司 | Automatic ball discharger for steel ball polishing and grinding machines |
| JP2016203360A (en) * | 2015-04-28 | 2016-12-08 | 株式会社ジェイテクト | Spherical body polishing device and spherical body polishing method |
| CN107322465A (en) * | 2017-08-23 | 2017-11-07 | 朱建良 | A kind of equipment for processing mill ball |
| CN107322465B (en) * | 2017-08-23 | 2019-04-05 | 朱建良 | A device for processing grinding balls |
| CN113927406A (en) * | 2021-11-08 | 2022-01-14 | 永康铨琪机械设备有限公司 | Steel ball polishing equipment |
| CN113927406B (en) * | 2021-11-08 | 2024-05-03 | 湘潭嘉亮科技有限公司 | Steel ball polishing equipment |
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