JP2000218504A - Wire with fixed abrasive grains and cutting method for fixed abrasive grains wire saw - Google Patents
Wire with fixed abrasive grains and cutting method for fixed abrasive grains wire sawInfo
- Publication number
- JP2000218504A JP2000218504A JP2208299A JP2208299A JP2000218504A JP 2000218504 A JP2000218504 A JP 2000218504A JP 2208299 A JP2208299 A JP 2208299A JP 2208299 A JP2208299 A JP 2208299A JP 2000218504 A JP2000218504 A JP 2000218504A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- abrasive grains
- fixed
- fixed abrasive
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 113
- 238000005520 cutting process Methods 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000002349 favourable effect Effects 0.000 abstract 2
- 239000000843 powder Substances 0.000 description 10
- 239000010432 diamond Substances 0.000 description 9
- 229910003460 diamond Inorganic materials 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は固定砥粒付ワイヤの
構造及び該固定砥粒付ワイヤを用いた固定砥粒ワイヤソ
ーの切断方法に係り、特にシリコン、ガラス、セラミッ
クス等の脆性材料を切断する固定砥粒付ワイヤ及び固定
砥粒ワイヤソーの切断方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a wire with fixed abrasive grains and a method of cutting a fixed abrasive wire saw using the wire with fixed abrasive grains, and particularly to cutting brittle materials such as silicon, glass and ceramics. The present invention relates to a fixed abrasive wire and a method for cutting a fixed abrasive wire saw.
【０００２】[0002]
【従来の技術】棒状の材料（インゴット）を切断して薄
板（ウェーハ）を製造する装置の一つにワイヤソーがあ
る。ワイヤソーは所定のピッチで張架されたワイヤ列を
高速走行させ、そのワイヤ列に被加工物を押し当てるこ
とにより多数枚のウェーハに同時に切断する装置であ
る。2. Description of the Related Art A wire saw is one of devices for manufacturing a thin plate (wafer) by cutting a rod-shaped material (ingot). A wire saw is a device that allows a wire row stretched at a predetermined pitch to travel at high speed, and simultaneously cuts a large number of wafers by pressing a workpiece against the wire row.
【０００３】このワイヤソーには従来から主に使用され
ている遊離砥粒方式による遊離砥粒ワイヤソーと、切断
加工面の精度を向上させるとともに切断加工コスト低減
の要求により近年開発されている固定砥粒方式による固
定砥粒ワイヤソーがある。固定砥粒ワイヤソーは、ワイ
ヤ全長にわたり表面に砥粒が固着された固定砥粒付ワイ
ヤを用いてワイヤ列を形成し、そのワイヤ列を高速走行
させることによりインゴットを切断する。[0003] This wire saw is a loose abrasive wire saw using a loose abrasive method, which has been mainly used in the past, and a fixed abrasive grain recently developed to improve the accuracy of the cut surface and reduce the cutting cost. There is a fixed abrasive wire saw by the method. The fixed-abrasive wire saw forms a wire row using a wire with fixed abrasive grains having abrasive grains fixed on the surface over the entire length of the wire, and cuts the ingot by running the wire row at high speed.
【０００４】従来の固定砥粒付ワイヤの製造方法は、金
属ワイヤの素線に砥粒を電着する方法であった。このワ
イヤの製造方法は、従来の円盤状薄板の金属ブレードの
内周または外周に固定砥粒を電着して、該金属ブレード
を高速回転することによりインゴットをウェーハ状の薄
板に切断するスライシングマシンや、ダイシングマシン
の頃からの金属ブレードに固定砥粒を付ける電着方法と
同じであった。そのため、ワイヤに固着する砥粒は１種
類の粒度であり、材質も１種類の材質の砥粒を用いてい
た。[0004] A conventional method of manufacturing a wire with fixed abrasive grains is a method of electrodepositing abrasive grains on a metal wire. This wire manufacturing method is a slicing machine that cuts an ingot into a wafer-like thin plate by electrodepositing fixed abrasive particles on the inner or outer periphery of a conventional disk-shaped thin metal blade and rotating the metal blade at high speed. It was the same as the electrodeposition method of attaching fixed abrasive grains to a metal blade since the days of dicing machines. Therefore, the abrasive grains fixed to the wire have one type of particle size, and the material used is one type of abrasive grain.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、固定砥
粒方式によるワイヤソーに於いては、固着された砥粒間
にインゴットの切断粉が堆積し目詰まりし易い。このよ
うに砥粒間に切断粉が堆積すると切断性能が悪くなり、
切断加工面のウェーハ表面にうねりを生じていた。この
切断粉の堆積を少なくするために砥粒の集中度を下げる
と砥粒がワイヤから脱落し易くなり、ワイヤの寿命が短
くなるので切断加工コストが上昇するという不具合を生
じていた。However, in the wire saw using the fixed abrasive method, the cutting powder of the ingot is easily deposited between the fixed abrasive grains and clogged. When the cutting powder accumulates between the abrasive grains, the cutting performance deteriorates,
The undulation occurred on the wafer surface of the cut processing surface. If the degree of concentration of the abrasive grains is reduced in order to reduce the accumulation of the cutting powder, the abrasive grains are likely to fall off the wire, and the life of the wire is shortened, resulting in an increase in the cutting cost.
【０００６】切断能率を向上させるには、固定砥粒付ワ
イヤの砥粒にダイヤモンドを用いると切削性が良くなる
ことは周知であるが、ダイヤモンド自体がたいへん高価
であるので、生産レベルでダイヤモンド砥粒を用いて切
断加工すると加工コストの面で不利であった。また、砥
粒にＳｉＣやＡｌ2 Ｏ3 を用いるとワイヤの生産コスト
は低いが、切断能率が悪いうえに、ワイヤに対する砥粒
の固着力が低いことにより砥粒が脱落し易く固定砥粒付
ワイヤの寿命が短いため、切断加工コストの低減には至
らなかった。In order to improve the cutting efficiency, it is well known that the use of diamond as the abrasive grains of the wire with fixed abrasive grains improves the machinability. However, since diamond itself is very expensive, it is necessary to use diamond grinding at the production level. Cutting using granules is disadvantageous in terms of processing cost. Also, if SiC or Al 2 O 3 is used for the abrasive grains, the production cost of the wire is low, but the cutting efficiency is poor, and the abrasive grains are easy to fall off due to the low adhesive force of the abrasive grains to the wire. Since the life of the wire was short, the cutting cost was not reduced.
【０００７】本発明はこのような事情に鑑みてなされた
もので、固定砥粒付ワイヤによる切断加工において、被
加工物の切断面精度を良好な状態に維持し、且つ、生産
能率を向上するための固定砥粒付ワイヤと固定砥粒ワイ
ヤソーの切断方法を提供することを目的とする。The present invention has been made in view of such circumstances, and in cutting with a wire with fixed abrasive grains, the cutting surface accuracy of a workpiece is maintained in a good state, and the production efficiency is improved. It is an object to provide a method for cutting a fixed abrasive wire and a fixed abrasive wire saw.
【０００８】[0008]
【課題を解決するための手段】本発明は前記目的を達成
するために、ワイヤ表面に砥粒が固着された固定砥粒付
ワイヤを走行させながら被加工物を押し当てることによ
り該被加工物を切断する固定砥粒ワイヤソーにおいて、
前記固定砥粒付ワイヤは、複数の異なった粒度を持つ砥
粒が混在して固着されていること、且つ／又は、複数の
異なった種類の材質で構成された砥粒が混在して固着さ
れていることを特徴としている。According to the present invention, in order to achieve the above object, a workpiece is pressed by moving a wire with fixed abrasive grains having abrasive grains fixed to the surface of the wire. In a fixed abrasive wire saw that cuts
In the wire with fixed abrasive grains, abrasive grains having a plurality of different particle sizes are mixed and fixed, and / or abrasive grains composed of a plurality of different types of materials are mixed and fixed. It is characterized by having.
【０００９】本発明によれば、固定砥粒ワイヤソーに用
いる固定砥粒付ワイヤに、複数の異なった粒度を持つ砥
粒が混在して固着されている、且つ／又は、複数の異な
った種類の材質で構成された砥粒が混在して固着されて
いる固定砥粒付ワイヤを用いたので、被加工物の切断面
精度を良好な状態に維持し、且つ、生産能率の向上及び
生産コストの低減を図ることができる。According to the present invention, a plurality of abrasive grains having different grain sizes are mixed and fixed to a wire with fixed abrasive grains used in a fixed abrasive wire saw, and / or a plurality of different types of abrasive grains are fixed. Since the fixed-abrasive wire is used, in which the abrasive grains composed of the materials are fixedly mixed, the cut surface accuracy of the workpiece is maintained in a good state, and the production efficiency is improved and the production cost is reduced. Reduction can be achieved.
【００１０】[0010]
【発明の実施の形態】以下添付図面に従って本発明に係
る固定砥粒付ワイヤ及び固定砥粒ワイヤソーの好ましい
形態について説明する。図１は、本発明に係る固定砥粒
付ワイヤ１２が、被加工物であるインゴット３０を切断
している状態を、固定砥粒付ワイヤ１２を誇張して示し
た断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wire with fixed abrasive grains and a wire saw with fixed abrasive grains according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view exaggeratingly showing a state in which a wire 12 with fixed abrasive grains according to the present invention is cutting an ingot 30 as a workpiece.
【００１１】以下に、図１に示した固定砥粒付ワイヤ１
２の構造について説明する。図１に示されるように、固
定砥粒付きワイヤ１２は、高張力線材等の素材によるワ
イヤ素線１と、ダイヤモンド、ＣＢＮ、Ｂ4Ｃ、Ｓｉ
Ｃ、ＷＣ、ＴｉＣ、ＧＣ、アルミナ等の材質による比較
的大きな大砥粒２と、ダイヤモンド、ＣＢＮ、Ｂ4Ｃ、
ＳｉＣ、ＷＣ、ＴｉＣ、ＧＣ、アルミナ等の材質による
比較的小さな小砥粒３と、ワイヤ素線１と大砥粒２及び
小砥粒３とを固着している固着材４（バインダー）とか
ら構成されている。Hereinafter, a wire 1 with fixed abrasive grains shown in FIG.
Structure 2 will be described. As shown in FIG. 1, a wire 12 with fixed abrasive is composed of a wire 1 made of a material such as a high-tensile wire and diamond, CBN, B 4 C, Si
A relatively large abrasive 2 made of a material such as C, WC, TiC, GC, alumina, etc., and diamond, CBN, B 4 C,
From relatively small abrasive grains 3 made of a material such as SiC, WC, TiC, GC, alumina, etc., and a bonding material 4 (binder) which fixes the wire 1 to the large abrasive grains 2 and the small abrasive grains 3. It is configured.
【００１２】被加工物のインゴット３０の素材は、Ｓｉ
（シリコン）、ＧａＡｓ、ＧａＰに代表される半導体材
料や、磁性材、水晶、サファイヤ等である。なお、大砥
粒２及び小砥粒３の固着方法については、ＣｏやＮｉ、
Ｃｕ等の金属をバインダーとする電着による方法や、有
機材料または無機材料による固着（熱硬化等）の樹脂固
定等による方法を用いるが、本発明はこれらの方法に限
定されるものではない。ただし、樹脂固定の方法によれ
ば、容易に砥粒の集中度を下げることが可能である。ま
た、ワイヤ素線１の材質は、ピアノ線や高抗張力非金属
繊維線（ファイバ等を含む）でもよいし、該ワイヤ素線
１に表面処理を行ってもよい。ワイヤ素線１の断面形状
についても円形でも多角形でもよいし、構造についても
単線であっても、縒り線であっても本発明の目的は達成
される。一般にワイヤソーに於ける前記ワイヤ素線の線
径は５０〜３００μｍの範囲の素線を用いる。更に大砥
粒２と小砥粒３の粒度についても限定されるものではな
く、図１に示したように異なる２つの粒度でもよいし、
異なる３つ以上の複数の粒度を持つ砥粒の混粒でもよ
い。例えば、大砥粒２の材質をダイヤモンドとしてその
粒度をメッシュ２４０番とし、小砥粒３の材質をＳｉＣ
としてその粒度をメッシュ８０００番のように組み合わ
せて、固着材４を用いてワイヤ１２に固着する。また、
固着材４に気孔と呼ばれる空洞を設けることによって、
切断粉５が砥粒と砥粒の間に堆積して切断能力が低下す
ることを防ぐようにすることも可能である。The material of the ingot 30 to be processed is Si
(Silicon), semiconductor materials typified by GaAs and GaP, magnetic materials, quartz, sapphire, and the like. In addition, about the fixing method of the large abrasive 2 and the small abrasive 3, Co, Ni,
A method of electrodeposition using a metal such as Cu as a binder, a method of fixing resin (for example, thermosetting) with an organic or inorganic material, or the like is used, but the present invention is not limited to these methods. However, according to the resin fixing method, the degree of concentration of the abrasive grains can be easily reduced. Further, the material of the wire 1 may be a piano wire or a high tensile strength non-metallic fiber wire (including a fiber or the like), or the wire 1 may be subjected to a surface treatment. The object of the present invention can be achieved even if the cross-sectional shape of the wire 1 is circular or polygonal, and the structure is a single wire or a stranded wire. Generally, the wire diameter of the wire in a wire saw is in the range of 50 to 300 μm. Further, the particle size of the large abrasive particles 2 and the small abrasive particles 3 is not limited, and may be two different particle sizes as shown in FIG.
A mixture of abrasive grains having three or more different particle sizes may be used. For example, the material of the large abrasive grains 2 is diamond, the particle size is 240 mesh, and the material of the small abrasive grains 3 is SiC.
And fixed to the wire 12 by using the fixing material 4. Also,
By providing a cavity called a pore in the fixing material 4,
It is also possible to prevent cutting powder 5 from accumulating between the abrasive grains and reducing the cutting ability.
【００１３】図１の例では被加工物であるインゴット３
０はワークフィードテーブル２８（図２参照）に固定さ
れており、固定砥粒付ワイヤ１２が図１の８の方向に走
行しながらインゴット３０を切断する。切断加工中はノ
ズル付きの配管６から加工液７を噴射させて、該加工液
７がインゴット３０の切断部及びその近傍にかかるよう
になっている。In the example of FIG. 1, the ingot 3 which is a workpiece is
Numeral 0 is fixed to the work feed table 28 (see FIG. 2), and the fixed ingot-attached wire 12 cuts the ingot 30 while traveling in the direction of 8 in FIG. During the cutting process, the processing liquid 7 is sprayed from the pipe 6 with the nozzle, and the processing liquid 7 is applied to the cut portion of the ingot 30 and its vicinity.
【００１４】なお、インゴット３０の切断加工に際して
切断粉５が発生する。加工液７は切断時に発生する加工
熱を吸収し、切断時に生じる固定砥粒付ワイヤとインゴ
ット３０間の切断抵抗を減じるとともに、固定砥粒付ワ
イヤ１２の各砥粒間に堆積した切断粉５の排出性を良く
するために用いる液体で、水溶性のものと、油性のもの
とを用いることができる。水溶性の加工液は、比熱と熱
伝導率が高いので加工熱を吸収し易いことに加えて、飛
散した加工液の清掃が容易で作業環境が良好であるとい
う特徴がある。また水溶性の加工液は、切断したウェー
ハの後工程に於いてウェーハに付着した加工液の洗浄が
容易であるとともに、洗い流した加工液の産業廃棄物処
理費用が安価であるという利点がある。In the process of cutting the ingot 30, cutting powder 5 is generated. The machining fluid 7 absorbs machining heat generated at the time of cutting, reduces cutting resistance between the wire with fixed abrasive grains and the ingot 30 generated at the time of cutting, and cuts powder 5 accumulated between the abrasive grains of the wire 12 with fixed abrasive grains. A water-soluble liquid and an oil-based liquid can be used to improve the discharge property of water. The water-soluble working fluid has a high specific heat and a high thermal conductivity, so that it is easy to absorb the working heat, and in addition, it is easy to clean the scattered working fluid and has a good working environment. In addition, the water-soluble processing liquid has the advantages that the processing liquid adhered to the wafer in the post-process of the cut wafer can be easily cleaned, and the cost of industrial waste disposal of the rinsed processing liquid is low.
【００１５】図２は、図１で示した固定砥粒付ワイヤ１
２を用いた固定砥粒ワイヤソーのワイヤ経路を示した図
である。図２に示すように、固定砥粒付ワイヤ１２は、
一対のワイヤリール１４Ａ、１４Ｂに巻回されており、
固定砥粒付ワイヤ１２は、この一対のワイヤリール１４
Ａ、１４Ｂ間を複数のガイドローラ１６、１６…に案内
されながら往復走行する。図２に示した構造例に於いて
は、ワイヤ走行路にはそれぞれトラバース装置２２Ａ、
２２Ｂ、ダンサローラ２４Ａ、２４Ｂが配置されてい
る。トラバース装置２２Ａ、２２Ｂは、ワイヤリール１
４Ａ、１４Ｂから固定砥粒付ワイヤ１２を一定の規則に
従って案内し、また、ダンサローラ２４Ａ、２４Ｂは走
行する固定砥粒付ワイヤ１２に一定の張力を付与する。
前記一対のワイヤリール１４Ａ、１４Ｂには、それぞれ
モータ２６Ａ、２６Ｂが連結されており、このモータ２
６Ａ、２６Ｂと、図示しないグルーブローラ１８、１８
…を駆動するモータとを同期して駆動することにより、
前記固定砥粒付ワイヤ１２が一対のワイヤリール１４
Ａ、１４Ｂ間を走行する。そして、三本のグルーブロー
ラ１８、１８、１８に、固定砥粒付ワイヤ１２が巻き掛
けられ、水平な固定砥粒付ワイヤ１２のワイヤ列２０が
形成される。前記ワイヤ列２０の下方にはワークフィー
ドテーブル２８が設置されている。このワークフィード
テーブル２８は、前記ワイヤ列２０に対して垂直に昇降
移動し、このワークフィードテーブル２８の上部に被加
工物であるインゴット３０が保持される。FIG. 2 shows a wire 1 with fixed abrasive grains shown in FIG.
FIG. 4 is a diagram showing a wire path of a fixed abrasive wire saw using No. 2; As shown in FIG. 2, the fixed abrasive wire 12 is
It is wound around a pair of wire reels 14A and 14B,
The wire 12 with the fixed abrasive is connected to the pair of wire reels 14.
A reciprocates between A and 14B while being guided by a plurality of guide rollers 16. In the structural example shown in FIG. 2, traverse devices 22 </ b> A,
22B, and dancer rollers 24A and 24B are arranged. The traverse devices 22A and 22B are connected to the wire reel 1
4A and 14B guide the wire with fixed abrasive 12 according to a certain rule, and the dancer rollers 24A and 24B apply a certain tension to the moving wire 12 with fixed abrasive.
Motors 26A and 26B are connected to the pair of wire reels 14A and 14B, respectively.
6A, 26B and groove rollers 18, 18 not shown
By driving in synchronization with the motor that drives ...
The wire with fixed abrasive grains 12 is a pair of wire reels 14.
Travel between A and 14B. Then, the fixed abrasive grain-attached wire 12 is wound around the three groove rollers 18, 18, and 18 to form a horizontal wire row 20 of the fixed abrasive grain-attached wires 12. A work feed table 28 is provided below the wire row 20. The work feed table 28 is vertically moved with respect to the wire row 20, and an ingot 30 as a workpiece is held on the work feed table 28.
【００１６】以上のように構成された固定砥粒ワイヤソ
ー１０に於いて、インゴット３０は次のように切断され
る。まず、インゴット３０をワークフィードテーブル２
８に取り付ける。次に、ワイヤリール１４Ａ、１４Ｂに
連結されたモータ２６Ａ、２６Ｂと、図示しないグルー
ブローラ１８、１８…を駆動するモータとを同期駆動し
て、固定砥粒付ワイヤ１２を走行させる。そして、固定
砥粒付ワイヤ１２の走行が安定したところで、ワークフ
ィードテーブル２８をワイヤ列２０に向けて上昇させ、
インゴット３０を走行するワイヤ列２０に押し当てる。
ワイヤ列２０に押し当てられたインゴット３０は、その
ワイヤ列２０を構成する固定砥粒付ワイヤ１２によって
接触部が研削され、これにより、ウェーハに切断され
る。In the fixed abrasive wire saw 10 configured as described above, the ingot 30 is cut as follows. First, ingot 30 is placed on work feed table 2
8 Next, the motors 26A and 26B connected to the wire reels 14A and 14B and the motor for driving the groove rollers 18, 18... Then, when the traveling of the fixed abrasive grain-attached wire 12 is stabilized, the work feed table 28 is raised toward the wire row 20,
The ingot 30 is pressed against the running wire row 20.
The contact portion of the ingot 30 pressed against the wire row 20 is ground by the fixed abrasive wire 12 constituting the wire row 20, whereby the ingot 30 is cut into a wafer.
【００１７】以下に固定砥粒付ワイヤを用いた固定砥粒
ワイヤソーに於ける被加工物の切断面精度と切断条件と
について説明する。固定砥粒ワイヤソーに於ける切断の
際に被加工物の切断面精度を良くするためには、図３に
示す切断中の固定砥粒付ワイヤ１２の撓みを少なくする
とともに、この撓み量を一定に保つことが有効である。
その理由は切断中の固定砥粒付ワイヤ１２の撓み量が大
きいと前記撓み量に応じて固定砥粒付ワイヤ１２が蛇行
し易くなり、ワイヤ列２０のワイヤ間隔が変動してウェ
ーハ一枚一枚の切断面のうねりが増大するからである。
そしてこのワイヤ１２の撓み量を少なく一定に保つこと
は、図３に示す固定砥粒付ワイヤ１２の走行方向に対し
て直角方向の切断抵抗ＦＺ（ｇ／ｃｍ）の値を小さく一
定に保つことに等しい。ウェーハ切断面精度が悪化する
原因である切断抵抗ＦＺが増えるのは、切断に対して固
定砥粒付ワイヤ１２の大砥粒２、２…間に於ける切断粉
５の排出性が悪いために切断粉排出能力が追いつかない
ことにより切断能力が低下するからである。Hereinafter, the cutting surface accuracy and cutting conditions of a workpiece in a fixed abrasive wire saw using a fixed abrasive wire will be described. In order to improve the accuracy of the cut surface of the workpiece when cutting with the fixed abrasive wire saw, the bending of the fixed abrasive wire 12 during cutting shown in FIG. It is effective to keep
The reason is that if the amount of bending of the wire with fixed abrasive grains 12 during cutting is large, the wire with fixed abrasive grains 12 tends to meander according to the amount of bending, the wire interval of the wire row 20 fluctuates, and one wafer at a time. This is because the undulation of the cut surface of the sheet increases.
In order to keep the amount of deflection of the wire 12 small and constant, the value of the cutting resistance FZ (g / cm) in the direction perpendicular to the running direction of the wire 12 with fixed abrasive grains shown in FIG. be equivalent to. The cutting resistance FZ, which is the cause of the deterioration of the accuracy of the cut surface of the wafer, increases because the discharge property of the cutting powder 5 between the large abrasive grains 2, 2,... This is because the cutting ability decreases because the cutting powder discharge ability cannot keep up.
【００１８】そこで図４及び図５に固定砥粒付ワイヤの
砥粒率である集中度Ｃ以外の切断条件を一定にして集中
度Ｃのみ横軸にを変化させたときのウェーハ切断面のう
ねり量ＦＮ（μｍ）と、切断抵抗ＦＺ（ｇ／ｃｍ）との
関係を調査した結果を示す。ここで、切断に使用した被
加工物は固定砥粒付ワイヤ１２と被加工物との接触長を
一定に保つ目的から、図２や図３に示されているような
円筒形のインゴット３０ではなく角柱状のＳｉ単結晶イ
ンゴット（一辺２００ｍｍ）を用いている。円筒状のイ
ンゴット３０を切断する場合には単位時間当たりの切断
仕事量を一定にするようにワイヤ走行速度を制御した
り、切断送り速度を制御すると良い。図４、図５の計測
条件は、切断送り速度は１（ｍｍ／ｍｉｎ）一定とし、
ワイヤ張力：３５（Ｎ）、最大線速度：１８００（ｍ／
ｍｉｎ）、双方向サイクル時間：３０（ｓｅｃ）、加減
速時間：５（ｓｅｃ）、加工液：水＋水溶性クーラント
３％、砥粒粒度：メッシュ＃６００番の単粒、ワイヤ素
線径：０．１８（ｍｍ）の条件での切断に於けるウェー
ハ切断面うねり量ＦＮと、切断抵抗ＦＺとを示してい
る。FIGS. 4 and 5 show the undulation of the cut surface of the wafer when the cutting conditions other than the concentration C, which is the abrasive ratio of the wire with fixed abrasive, are fixed and only the concentration C is changed on the horizontal axis. The result of having investigated the relationship between the quantity FN (μm) and the cutting resistance FZ (g / cm) is shown. Here, for the purpose of keeping the contact length between the wire with fixed abrasive grains 12 and the workpiece constant, the workpiece used for cutting is a cylindrical ingot 30 as shown in FIGS. 2 and 3. Instead, a prismatic Si single crystal ingot (200 mm on a side) is used. When cutting the cylindrical ingot 30, it is preferable to control the wire traveling speed or the cutting feed speed so that the cutting work per unit time is constant. 4 and 5, the cutting feed speed is 1 (mm / min) constant,
Wire tension: 35 (N), maximum linear velocity: 1800 (m /
min), bidirectional cycle time: 30 (sec), acceleration / deceleration time: 5 (sec), working fluid: water + water-soluble coolant 3%, abrasive grain size: single grain of mesh # 600, wire strand diameter: The undulation amount FN of the cut surface of the wafer and the cutting resistance FZ in the cutting under the condition of 0.18 (mm) are shown.
【００１９】図４に示されるとおり、ウェーハ切断面う
ねり量ＦＮをウェーハ切断面うねり量許容値以下に抑え
るためには固定砥粒付ワイヤの集中度Ｃを７５以下に設
定すれば良いことがわかる。また前述したように図５に
よれば、切断抵抗ＦＺも集中度Ｃが７５以上で急激に増
大することから、切断抵抗ＦＺが増大することに伴って
ウェーハ切断面うねり量ＦＮが悪化すると言える。集中
度とは、バインダーを含む砥粒層中にダイヤモンドやＣ
ＢＮ等の砥粒が含まれている割合、すなわち砥粒率を示
すものである。砥粒率が容積パーセントで２５％または
４．４（ｃｔ／ｃｍ3）を集中度１００と定義している
（１ｃｔ＝２００ｍｇ）。なお、この集中度Ｃは、被加
工物の材質に応じて２０〜２００の値とすると良い。As shown in FIG. 4, it can be seen that the concentration C of the wire with the fixed abrasive should be set to 75 or less in order to suppress the undulation amount FN of the cut surface of the wafer to the allowable value of the undulation amount of the cut surface of the wafer. . Further, as described above, according to FIG. 5, since the cutting resistance FZ sharply increases when the concentration C is 75 or more, it can be said that the undulation amount FN of the cut surface of the wafer is deteriorated as the cutting resistance FZ increases. The degree of concentration means that diamond or C is contained in the abrasive layer containing the binder.
It indicates the ratio of abrasive grains such as BN, that is, the abrasive grain rate. An abrasive ratio of 25% or 4.4 (ct / cm 3 ) in volume percent is defined as a concentration of 100 (1 ct = 200 mg). The degree of concentration C is preferably set to a value of 20 to 200 according to the material of the workpiece.
【００２０】固定砥粒ワイヤソーに於いて、ワイヤの固
定砥粒の集中度を７５以下にすると被加工物であるウェ
ーハ切断面うねり量が許容値以内に収まることは前述の
とおりであるが、従来の切断条件のままであるとウェー
ハの加工変質層が深く、また、固定砥粒付ワイヤの大砥
粒２、２…が切断時の抵抗により脱落し易いため固定砥
粒付ワイヤの寿命が短いという不具合が発生する。一般
的に固定砥粒付ワイヤは高価であるので、固定砥粒付ワ
イヤの寿命を延ばすことはウェーハの製造コストを下げ
る為に必須の課題である。加工変質層とは、削り痕に脆
性モードが多く含まれている状態で、この脆性モードの
削り痕が発生した場合には切断面にマイクロクラックが
多数存在するために半導体生成用のウェーハとしては使
用できない層である。逆に良好な切断加工面ではマイク
ロクラックは浅く、削り痕は延性モードとなっている。
ウェーハの加工変質層が深いとウェーハ表面仕上げのた
めの後工程でのラップ工程で多大な加工時間を要するの
でウェーハの加工時間及び加工費が増大する。In the fixed abrasive wire saw, if the concentration of the fixed abrasive of the wire is set to 75 or less, the undulation amount of the cut surface of the wafer, which is the workpiece, falls within the allowable value as described above. If the cutting conditions are maintained, the damaged layer of the wafer is deep, and the large abrasive grains 2, 2,... Of the fixed abrasive grains easily fall off due to resistance during cutting, so that the life of the fixed abrasive grains is short. The problem described above occurs. In general, since wires with fixed abrasive grains are expensive, extending the life of the wires with fixed abrasive grains is an essential issue in order to reduce the manufacturing cost of wafers. A work-affected layer is a state in which a large number of brittle modes are contained in the cutting marks, and when this brittle mode cutting mark occurs, a large number of microcracks are present on the cut surface. This layer cannot be used. Conversely, on a good cut surface, the microcracks are shallow, and the cut marks are in ductile mode.
If the processing-affected layer of the wafer is deep, a large amount of processing time is required in a lapping step in the subsequent step for finishing the wafer surface, so that the processing time and processing cost of the wafer increase.
【００２１】この加工変質層を浅くするには、ウェーハ
に対する砥粒一つ一つの切り込み量を減らせばよい。そ
のためには切断送り量を減らすか、ワイヤの走行速度を
増すことが必要である。ワイヤソーでは、切断送り速度
を遅くすると切断加工能率が低下するが、ワイヤ走行速
度の向上は切断能率の面で有利である。本発明に係る固
定砥粒付ワイヤを用いて切断加工することによって、従
来の遊離砥粒ワイヤソーでは加工液の供給面で設定不可
能であったワイヤ速度の高速化を図ることができる。In order to make the work-affected layer shallower, the cut amount of each abrasive grain in the wafer may be reduced. For that purpose, it is necessary to reduce the cutting feed amount or increase the traveling speed of the wire. In the case of a wire saw, when the cutting feed speed is reduced, the cutting efficiency is reduced. However, an improvement in the wire traveling speed is advantageous in terms of the cutting efficiency. By performing cutting using the wire with fixed abrasive grains according to the present invention, it is possible to increase the wire speed, which could not be set on the supply surface of the processing liquid with the conventional loose abrasive wire saw.
【００２２】図６にワイヤ走行速度Ｖ（ｍ／ｍｉｎ）と
加工変質層深Ｄ（μｍ）との関係を測定した結果を示
す。図６に示すとおり、加工変質層の深さは、ワイヤ走
行速度１２００（ｍ／ｍｉｎ）以上で急激に減少してお
り、９００（ｍ／ｍｉｎ）時の約半分の５（μｍ）程に
なる。従来の遊離砥粒ワイヤソーでは砥粒が加工液中に
含まれており、加工液中の砥粒により被加工物であるイ
ンゴットを切断していたため、加工液中の砥粒がワイヤ
に乗らず、切断部分に十分に引き込まれて行き渡らない
と切断面のソーマークが過多になり、インゴット３０を
きれいに切断できなかった。そのために遊離砥粒方式に
於けるワイヤ走行速度の最大設定値は６００〜８００
（ｍ／ｍｉｎ）程度が限度であった。ところが固定砥粒
ワイヤソーに於いては、加工液は切断部を潤滑する程度
存在すればよいため、ワイヤ走行速度の上限を上げるこ
とができる。FIG. 6 shows the result of measuring the relationship between the wire running speed V (m / min) and the depth D (μm) of the affected layer. As shown in FIG. 6, the depth of the work-affected layer rapidly decreases at a wire running speed of 1200 (m / min) or more, and is about 5 (μm), which is about half of 900 (m / min). . In the conventional free abrasive wire saw, abrasive grains are contained in the working fluid, and the ingot that is the workpiece is cut by the abrasive grains in the working fluid, so that the abrasive grains in the working fluid do not ride on the wire, If the cut portion was not sufficiently drawn and spread, the saw marks on the cut surface would be excessive, and the ingot 30 could not be cut cleanly. Therefore, the maximum set value of the wire traveling speed in the loose abrasive method is 600 to 800.
(M / min) was the limit. However, in the fixed-abrasive wire saw, since the working fluid only needs to be present to lubricate the cut portion, the upper limit of the wire traveling speed can be increased.
【００２３】図７にワイヤ走行速度Ｖ（ｍ／ｍｉｎ）を
横軸に、切断抵抗ＦＺ（ｇｆ／ｃｍ）との関係を示す。
図７に示すとおりワイヤ走行速度Ｖが増加するに従って
切断抵抗ＦＺは減少する傾向がある。切断抵抗ＦＺが減
少するとウェーハ切断面のうねり量が減少し良好なウェ
ーハが得られる。FIG. 7 shows the relationship between the wire running speed V (m / min) and the cutting resistance FZ (gf / cm) on the horizontal axis.
As shown in FIG. 7, the cutting resistance FZ tends to decrease as the wire traveling speed V increases. When the cutting resistance FZ decreases, the amount of undulation on the cut surface of the wafer decreases, and a good wafer can be obtained.
【００２４】これらの効果により、切断加工の能率を向
上することができるとともに、切断面の加工変質層を薄
くできるため良質なウェーハを安価にて製作することが
可能となり、更に大砥粒２、２…の一つ一つに於ける切
り込み量が減少するので大砥粒２、２…が脱落する確率
が少なくなり固定砥粒付きワイヤの寿命を延ばすことが
可能となる。With these effects, the efficiency of the cutting process can be improved, and the deteriorated layer on the cut surface can be made thin, so that a high-quality wafer can be manufactured at low cost. .. Decreases in the probability of large abrasive grains 2, 2... Falling off, and the life of the wire with fixed abrasive grains can be extended.
【００２５】更に、本発明に係る固定砥粒付ワイヤ及び
固定砥粒ワイヤソーの加工方法の実施の形態によれば、
切断に寄与する大砥粒２、２…が、小砥粒３、３…によ
って保持されながら固着材４によって固着されているの
で、従来の技術である固着材４のみによって大砥粒２、
２…を固着する方法と比較して大砥粒２、２…の固着力
が高く、大砥粒２、２…が脱落しにくい。また、切断に
寄与する大砥粒２をダイヤモンドやＣＢＮとし、小砥粒
３をダイヤモンドやＣＢＮに比較してはるかに安価なＳ
ｉＣやＡｌ2 Ｏ3 とすることによって、切断能力が高い
固定砥粒付ワイヤを安価にて提供することが可能とな
る。従って安価で長寿命な固定砥粒付ワイヤを提供する
ことができるとともに、前記説明のとおりウェーハの切
断加工面のうねりを少なくすることができ、更に次に示
すように切断時間と切断コストの低減を図ることができ
る。Further, according to the embodiment of the fixed abrasive grain-attached wire and the method for processing the fixed abrasive wire saw according to the present invention,
Since the large abrasive grains 2, 2,... Contributing to the cutting are fixed by the fixing material 4 while being held by the small abrasive grains 3, 3,.
The fixing force of the large abrasive grains 2, 2,... Is higher than the method of fixing the large abrasive grains 2, and the large abrasive grains 2, 2,. Further, the large abrasive grains 2 contributing to the cutting are diamond or CBN, and the small abrasive grains 3 are much less expensive than diamond or CBN.
By using iC or Al 2 O 3 , it is possible to provide a wire with fixed abrasive having high cutting ability at low cost. Accordingly, it is possible to provide an inexpensive and long-life wire with fixed abrasive grains, reduce the undulation of the cut surface of the wafer as described above, and further reduce the cutting time and cutting cost as shown below. Can be achieved.
【００２６】図８に横軸にワイヤ走行速度Ｖ（ｍ／ｍｉ
ｎ）を取り、縦軸にワイヤライフＷＬ（ｍｍ2 ／ｍ）と
した測定結果を示す。ここでワイヤライフＷＬとは、単
位ワイヤ長さ（ｍ）当たりに於ける、大砥粒２の脱落無
しに切断できたインゴットの切断面積（ｍｍ2 ）を示し
ている。従ってワイヤライフＦＬの値が大きいほどワイ
ヤの寿命が長く、経済的であることを示している。図８
によると、ワイヤ走行速度Ｖ＝１２００（ｍ／ｍｉｎ）
以上になるとＶ＝９００（ｍ／ｍｉｎ）の状態に於ける
ワイヤライフと比べて２倍以上急に大きくなり、更にワ
イヤ走行速度Ｖを増すことによってワイヤライフＷＬの
値は増加する。In FIG. 8, the horizontal axis represents the wire traveling speed V (m / mi).
n), and the vertical axis shows the measurement results with the wire life WL (mm 2 / m). Here, the wire life WL indicates a cut area (mm 2 ) of an ingot that can be cut without falling off of the large abrasive grains 2 per unit wire length (m). Therefore, it is shown that the larger the value of the wire life FL is, the longer the life of the wire is and the more economical it is. FIG.
According to the figure, the wire traveling speed V = 1200 (m / min)
With the above, the wire life suddenly becomes larger than twice the wire life in the state of V = 900 (m / min), and the value of the wire life WL increases by further increasing the wire running speed V.
【００２７】なお、ワイヤ走行速度を向上させるための
手段としては、図示しないグルーブローラ１８、１８…
の駆動モータ及びワイヤリールモータ２６Ａ、２６Ｂの
高出力化（トルク、回転数向上）や、グルーブローラ１
８、１８…の駆動減速比の変更、グルーブローラ１８、
１８…の大径化、ワイヤリール１４Ａ、１４Ｂの軽量
化、切断に使用する固定砥粒付ワイヤの量を減らしてワ
イヤリールモータ２６Ａ、２６Ｂにかかる負荷を減らす
等の対策を組み合わせて対応する。Means for improving the wire running speed include groove rollers 18 (not shown).
Drive motors and wire reel motors 26A, 26B with higher output (improvement of torque and rotation speed) and groove roller 1
Change of the drive reduction ratio of 8, 18,...
.., The weight of the wire reels 14A, 14B, and the amount of wire with fixed abrasive used for cutting to reduce the load on the wire reel motors 26A, 26B.
【００２８】[0028]
【発明の効果】以上説明したように、本発明に係る固定
砥粒付ワイヤ及び固定砥粒ワイヤソーの切断方法によれ
ば、固定砥粒ワイヤソーに用いる固定砥粒付ワイヤに、
複数の異なった粒度を持つ砥粒が混在して固着されてい
る、且つ／又は、複数の異なった種類の材質で構成され
た砥粒が混在して固着されている固定砥粒付ワイヤを用
いたので、切断粉の排出性が良くなるとともに固定砥粒
付ワイヤの寿命を延ばすことができる。更に、ウェーハ
の切断面のうねり量が減少するため、被加工物の切断面
精度を良好にすることができることに加えて、生産能率
の向上及び生産コストの低減を図ることができる。As described above, according to the fixed abrasive grain wire and the method for cutting the fixed abrasive wire saw according to the present invention, the fixed abrasive grain wire used for the fixed abrasive wire saw has:
Use a wire with fixed abrasive grains in which abrasive grains having a plurality of different particle sizes are mixed and fixed and / or abrasive grains composed of a plurality of different types of materials are mixed and fixed. As a result, it is possible to improve the dischargeability of the cutting powder and extend the life of the wire with fixed abrasive grains. Furthermore, since the amount of undulation on the cut surface of the wafer is reduced, the cut surface accuracy of the workpiece can be improved, and in addition, the production efficiency can be improved and the production cost can be reduced.
【図１】本発明に係る固定砥粒付ワイヤ１２が、インゴ
ット３０を切断している状態を固定砥粒ワイヤ１２を誇
張して示した断面図。FIG. 1 is a cross-sectional view showing a state in which a wire with fixed abrasive grains according to the present invention is cutting an ingot, exaggerating the fixed abrasive wire.
【図２】固定砥粒ワイヤソーのワイヤ経路構成図。FIG. 2 is a configuration diagram of a wire path of a fixed abrasive wire saw.
【図３】固定砥粒付ワイヤ１２の走行方向に対して直角
方向の切断抵抗ＦＺ（ｇ／ｃｍ）の値を示す図。FIG. 3 is a view showing a value of a cutting resistance FZ (g / cm) in a direction perpendicular to a running direction of a wire 12 with fixed abrasive grains.
【図４】集中度Ｃを横軸に変化させたときのウェーハ切
断面のうねり量ＦＮ（μｍ）との関係を示す図。FIG. 4 is a diagram showing a relationship between the undulation amount FN (μm) of the cut surface of the wafer when the concentration C is changed on the horizontal axis.
【図５】集中度Ｃを横軸に変化させたときの切断抵抗Ｆ
Ｚ（ｇ／ｃｍ）との関係を示す図。FIG. 5 shows the cutting resistance F when the concentration C is changed on the horizontal axis.
The figure which shows the relationship with Z (g / cm).
【図６】ワイヤ走行速度Ｖ（ｍ／ｍｉｎ）を横軸に変化
させたときの加工変質層深さＤ（μｍ）との関係を示す
図。FIG. 6 is a diagram showing a relationship between the depth D (μm) of the affected layer when the wire traveling speed V (m / min) is changed along the horizontal axis.
【図７】ワイヤ走行速度Ｖ（ｍ／ｍｉｎ）を横軸に変化
させたときの切断抵抗ＦＺ（ｇ／ｃｍ）との関係を示す
図。FIG. 7 is a diagram showing a relationship with a cutting resistance FZ (g / cm) when a wire running speed V (m / min) is changed on a horizontal axis.
【図８】ワイヤ走行速度Ｖ（ｍ／ｍｉｎ）を横軸に変化
させたときのワイヤライフＷＬ（ｍｍ2／ｍ）との関係
を示す図。FIG. 8 is a diagram showing a relationship with the wire life WL (mm 2 / m) when the wire running speed V (m / min) is changed on the horizontal axis.
１…ワイヤ素線 ２…大砥粒 ３…小砥粒 ４…固着材 ５…切断粉 ７…加工液 １０…固定砥粒ワイヤソー １２…固定砥粒付ワイヤ ３０…インゴット DESCRIPTION OF SYMBOLS 1 ... Wire strand 2 ... Large abrasive grain 3 ... Small abrasive grain 4 ... Bonding material 5 ... Cutting powder 7 ... Processing liquid 10 ... Fixed abrasive wire saw 12 ... Wire with fixed abrasive grain 30 ... Ingot
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 3C058 AA05 AA09 AA18 AB08 AC04 CA01 CB01 CB03 3C063 AA08 AB09 BB20 EE01 EE31 FF20 FF22 FF30 3C069 AA01 BA06 BB02 BB04 CA04 EA01 EA02 EA03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C058 AA05 AA09 AA18 AB08 AC04 CA01 CB01 CB03 3C063 AA08 AB09 BB20 EE01 EE31 FF20 FF22 FF30 3C069 AA01 BA06 BB02 BB04 CA04 EA01 EA02 EA03
Claims (4)
付ワイヤを走行させながら被加工物を押し当てることに
より、該被加工物を切断する固定砥粒付ワイヤにおい
て、 前記固定砥粒付ワイヤは、複数の異なった粒度を持つ砥
粒が混在して固着されていることを特徴とする固定砥粒
付ワイヤ。1. A wire with fixed abrasive grains for cutting a workpiece by pressing the workpiece while running the wire with fixed abrasive grains having abrasive grains fixed to the wire surface, wherein the fixed abrasive grains are A wire with fixed abrasive grains, wherein a plurality of abrasive grains having different particle sizes are mixed and fixed.
付ワイヤを走行させながら被加工物を押し当てることに
より、該被加工物を切断する固定砥粒付ワイヤにおい
て、 前記固定砥粒付ワイヤは、複数の異なった種類の材質で
構成された砥粒が混在して固着されていることを特徴と
する固定砥粒付ワイヤ。2. A fixed abrasive grain cutting wire for cutting a workpiece by pressing the workpiece while running the wire with the fixed abrasive grain having the abrasive grain fixed on the wire surface, A wire with fixed abrasive grains, wherein the wire with attached abrasive grains is composed of a plurality of different types of materials and is fixedly mixed.
付ワイヤを走行させながら被加工物を押し当てることに
より、該被加工物を切断する固定砥粒付ワイヤにおい
て、 前記固定砥粒付ワイヤは、複数の異なった粒度と、複数
の異なった種類の材質とで構成された砥粒が混在して固
着されていることを特徴とする固定砥粒付ワイヤ。3. A fixed abrasive grain cutting wire for cutting a workpiece by pressing a workpiece while running the wire with fixed abrasive grains having abrasive grains fixed to the surface of the wire. A wire with fixed abrasive grains, characterized in that the attached wire has abrasive grains composed of a plurality of different particle sizes and a plurality of different types of materials mixedly adhered thereto.
付ワイヤを複数個のグルーブローラに巻き掛けてワイヤ
列を形成し、該ワイヤ列を走行させながら被加工物を押
し当てることにより、該被加工物を多数枚のウェーハに
切断する固定砥粒ワイヤソーの切断方法において、 前記請求項１、または前記請求項２、または前記請求項
３に記載の固定砥粒付ワイヤを用いるとともに、 前記被加工物の切断部分とその近傍に水溶性の加工液を
噴射することを特徴とする固定砥粒ワイヤソーの切断方
法。4. A wire with fixed abrasive grains having abrasive grains fixed to the surface of the wire is wound around a plurality of groove rollers to form a wire row, and the workpiece is pressed against the wire row while running the wire row. In a method for cutting a fixed abrasive wire saw that cuts the workpiece into a large number of wafers, the fixed abrasive grain wire according to claim 1, or claim 2, or claim 3, A method for cutting a fixed-abrasive wire saw, wherein a water-soluble working fluid is jetted to a cut portion of the workpiece and its vicinity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208299A JP2000218504A (en) | 1999-01-29 | 1999-01-29 | Wire with fixed abrasive grains and cutting method for fixed abrasive grains wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208299A JP2000218504A (en) | 1999-01-29 | 1999-01-29 | Wire with fixed abrasive grains and cutting method for fixed abrasive grains wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000218504A true JP2000218504A (en) | 2000-08-08 |
Family
ID=12072968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2208299A Pending JP2000218504A (en) | 1999-01-29 | 1999-01-29 | Wire with fixed abrasive grains and cutting method for fixed abrasive grains wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000218504A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6837778B2 (en) | 2000-11-24 | 2005-01-04 | Neomax Co., Ltd | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| US7025054B2 (en) | 2002-03-01 | 2006-04-11 | Neomax Co., Ltd. | Method of cutting rare-earth alloy |
| JP2012152830A (en) * | 2011-01-21 | 2012-08-16 | Noritake Co Ltd | Fixed abrasive grain wire and method for manufacturing the same |
| US8425640B2 (en) | 2009-08-14 | 2013-04-23 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| CN104070614A (en) * | 2013-03-26 | 2014-10-01 | 蒙特集团（香港）有限公司 | Fixed abrasive wire saw and preparation method thereof |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
| US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
| US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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-
1999
- 1999-01-29 JP JP2208299A patent/JP2000218504A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6896595B2 (en) | 2000-11-24 | 2005-05-24 | Neomax Co., Ltd. | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| US6837778B2 (en) | 2000-11-24 | 2005-01-04 | Neomax Co., Ltd | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| US7025054B2 (en) | 2002-03-01 | 2006-04-11 | Neomax Co., Ltd. | Method of cutting rare-earth alloy |
| US8425640B2 (en) | 2009-08-14 | 2013-04-23 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9248583B2 (en) | 2010-12-30 | 2016-02-02 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| JP2012152830A (en) * | 2011-01-21 | 2012-08-16 | Noritake Co Ltd | Fixed abrasive grain wire and method for manufacturing the same |
| US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
| US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
| US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| CN104070614A (en) * | 2013-03-26 | 2014-10-01 | 蒙特集团（香港）有限公司 | Fixed abrasive wire saw and preparation method thereof |
| US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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