JP2000230856A - Semiconductor optical sensor device - Google Patents

Abstract

[PROBLEMS] To improve the stability of a semiconductor optical sensor device against temperature changes with an inexpensive configuration, prevent deterioration and fluctuation of optical characteristics, and achieve both long life and improved reliability. To provide a semiconductor optical sensor device. A semiconductor optical sensor chip is fixed to have an opening at the bottom, and a housing is filled with the semiconductor optical sensor chip to cover the upper surface of the semiconductor optical sensor chip and open the housing. A transparent filler such as a transparent silicon gel 7 which escapes a volume change due to expansion or contraction at the portion, and a transparent filler which is provided above the semiconductor optical sensor chip 1 via the transparent filler and is adhered or welded to the housing 2. A plate 5 and a lens portion 6 adhered or welded to the transparent plate 5 at a position where an image is formed on the semiconductor optical sensor chip 1. The lens portion, the transparent plate, and the housing have substantially the same material and substantially the same thermal expansion coefficient. Molded with equal material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor optical sensor device on which a semiconductor optical sensor chip is mounted.

[0002]

2. Description of the Related Art Conventionally, a CCD (Charge Coupled Device) has been used.
e) or MOS (Metal Oxide Semiconductor)
Semiconductor optical sensor devices such as described above are used in a mounting form sealed in a ceramic envelope. The semiconductor optical sensor chip detects an image formed by the glass aspherical lens. 20 (a), 21 (a), 22
(A) is a plan view showing a conventional CCD image sensor packaged in a ceramic envelope and combined with an aspheric lens, and is shown in FIGS. 20 (b), 21 (b) and 2
2 (b) is a cross-sectional view of each of SS, TT, and U-
It is U sectional drawing. In this case, the optical sensor may be a CCD image sensor, a MOS image sensor, or another optical sensor such as a photodiode or an infrared sensor.

[0005] The semiconductor optical sensor device shown in FIGS. 20A and 20B includes a detection unit and an optical unit. The detection unit includes a ceramic envelope 112 to which the semiconductor optical sensor chip 111 is die-bonded, a lead frame 113 that is patterned corresponding to the internal terminals of the semiconductor optical sensor chip 111 to be accommodated, and also has a lead pin function, It is composed of a bonding wire 114 connecting each internal terminal of the optical sensor chip 111 and the lead frame 113, and a transparent plate 116 fixed to an end face of the opening of the envelope 112 with low melting point glass or an adhesive 115 (not shown).

The semiconductor optical sensor chip 111 housed in the bottom of the envelope 112 is sealed by a transparent plate 116. The interior sealed by the envelope 112 and the transparent plate 116 is either filled with a transparent filler (not shown) or filled with gas and hollow. The detection unit is fixed to the printed circuit board 117 by soldering the lead frame 113.

The optical part is a glass aspherical lens 118, a position where an image formed by the glass aspherical lens 118 is on the semiconductor optical sensor chip 111, and is fixed to the printed circuit board 117 by an adhesive 119. The lens fixing frame 120 includes a lens holding metal fitting 121 for fixing the glass aspherical lens 118 to the lens fixing frame 120.

[0006] In the semiconductor optical sensor device having the above configuration, the image formed by the glass aspherical lens 118 is formed by the transparent plate 1.
By detecting the signal on the semiconductor optical sensor chip 111 via the semiconductor light sensor chip 16 and outputting the signal via the lead frame 113 via the lead frame 113, the device functions as an image sensor.

The semiconductor optical sensor devices shown in FIGS. 21A and 21B are different from the semiconductor optical sensor devices described with reference to FIGS. 20A and 20B only in the optical part. . The optical part includes a glass aspherical lens 1
18. A lens fixing frame 124 which determines an image formed by the glass aspheric lens 118 on the semiconductor optical sensor chip 111 and is fixed to the printed circuit board 117 by frame fixing columns 122 and screws 123. The frame 124 includes a lens holder 125 for fixing the glass aspherical lens 118 to the frame 124.

The semiconductor optical sensor device shown in FIGS. 22A and 22B differs from the semiconductor optical sensor device described with reference to FIGS. And the optical unit are integrally formed. The optical part includes a glass aspherical lens 118 and a lens fixing frame 12 on which the glass aspherical lens 118 is mounted.
6. This lens fixing frame 126 is attached to the transparent plate 1 of the detecting section.
Adhesive 127 fixed to 16, glass aspherical lens 11
The lens holding member 128 fixes the lens 8. At this time, the position of the glass aspherical lens 118 is determined in consideration of the focal position so that the image formed by the glass aspherical lens 118 is on the semiconductor optical sensor chip 111.

[0009]

In these conventional semiconductor optical sensor devices, the semiconductor optical sensor chip 111
When the gas is sealed in the hollow state of the envelope 112 containing the gas, the surface of the semiconductor optical sensor chip 111 or the bonding wire 114 is depending on the state of the sealed gas.
Therefore, it is necessary to fill the inside of the envelope 112 with an inert gas, which requires much time and effort for manufacturing. Even if an inert gas is used, deterioration of the characteristics cannot be avoided unless temperature and humidity conditions are strictly controlled. Furthermore, after filling with an inert gas, a gas leak inspection has to be performed, so that there is a problem that the cost increases.

Further, a transparent filler (not shown) is filled in the envelope 112 accommodating the semiconductor optical sensor chip 111 to protect the semiconductor optical sensor chip 111 and to protect the envelope 11.
2, the transparent filler expands or contracts due to changes in the ambient temperature of the envelope 112 and the temperature inside the envelope, and as a result, the envelope 112 and the transparent filler May occur at the interface of the transparent wire, bubbles may be generated inside the transparent filler, and in some cases, the bonding wire 114
There was a problem that was disconnected. Furthermore, the distance from the upper surface of the transparent plate 116 to the surface of the semiconductor optical sensor chip 111 changes due to expansion or contraction of the transparent filler due to a temperature change, and there is a problem that optical characteristics fluctuate.

Further, conventional CCD and MOS imaging devices are manufactured by combining a ceramic housing and a glass aspherical lens in order to suppress a change in a focal position due to a temperature change. As shown in FIGS. 20, 21, and 22, one is attached to the lens fixing frames 120, 124, and 126.
Place one or more glass aspheric lenses 118,
The lens was fixed using metal lens holders 121, 125, and 128. For this reason, the manufacturing cost of the optical system and the time and effort for manufacturing it have been increased.

Further, in order to reduce the cost of the optical system, a plastic package which is an insulator as a housing of an image pickup device and a plastic aspherical lens is used as a lens, the expansion of a transparent filler. Alternatively, the envelope 112 expands or contracts in accordance with the contraction, and the fluctuation of the focal position due to the temperature change becomes further large, so that it is difficult to obtain a clear image.

In order to solve the above-mentioned problems, the present invention improves the stability of a semiconductor optical sensor device against a temperature change with an inexpensive structure, prevents deterioration and fluctuation of optical characteristics, and increases the service life and reliability. It is intended to provide a semiconductor optical sensor device capable of improving both.

[0014]

According to a first aspect of the present invention, there is provided a housing configured to have an opening at a bottom using an insulating material, and a housing having an opening at a bottom. A wiring member drawn out, a semiconductor optical sensor chip fixed to the housing, connection means for electrically connecting a terminal provided on the surface of the semiconductor optical sensor chip to the wiring member, and the housing And a transparent filler that covers the upper surface of the semiconductor optical sensor chip and that escapes a volume change due to expansion or contraction at the open portion of the housing, and that over the semiconductor optical sensor chip via the transparent filler. Provided, and a transparent plate that is bonded or welded to the housing, and a lens unit that is bonded or welded to the transparent plate at a position where an image is formed on the semiconductor optical sensor chip,
Wherein the lens portion, the transparent plate, and the housing are formed of the same material or a material having substantially equal coefficients of thermal expansion.

According to a second aspect of the present invention, there is provided a housing configured to have an opening at the bottom using an insulating material;
A wiring member extending from the inside of the housing to the outside, a semiconductor optical sensor chip fixed to the housing, and a connection for electrically connecting a terminal provided on the surface of the semiconductor optical sensor chip to the wiring member Means, a transparent filler filled in the housing to cover the upper surface of the semiconductor optical sensor chip and escape a volume change due to expansion or contraction at an open portion of the housing, and the semiconductor via the transparent filler. A lens portion provided above the optical sensor chip and bonded or welded to the housing at a position where an image is formed on the semiconductor optical sensor chip, wherein the lens portion And the casing is formed of the same material or a material having substantially the same coefficient of thermal expansion.

According to a third aspect of the present invention, there is provided a housing configured to have an opening at the bottom using an insulating material;
A wiring member extending from the inside of the housing to the outside, a semiconductor optical sensor chip fixed to the housing, and a connection for electrically connecting a terminal provided on the surface of the semiconductor optical sensor chip to the wiring member A transparent filler that fills the inside of the housing to cover the upper surface of the semiconductor optical sensor chip and that escapes a volume change due to expansion or contraction at an open portion of the housing; and a transparent filler that expands or contracts. A transparent plate which is disposed above the semiconductor optical sensor chip via the transparent filler while forming an open portion for escaping a volume change, and which is adhered or welded to a support provided on the housing; and A lens unit adhered or welded to the transparent plate at a position where an image is formed on the optical sensor chip, wherein the lens unit, the transparent plate and The housing is characterized in that the same material or thermal expansion coefficient is formed by a substantially equal material.

According to a fourth aspect of the present invention, there is provided a housing configured to have an opening at the bottom using an insulating material;
A wiring member extending from the inside of the housing to the outside, a semiconductor optical sensor chip fixed to the housing, and a connection for electrically connecting a terminal provided on the surface of the semiconductor optical sensor chip to the wiring member A transparent filler that fills the inside of the housing to cover the upper surface of the semiconductor optical sensor chip and that escapes a volume change due to expansion or contraction at an open portion of the housing; and a transparent filler that expands or contracts. A lens portion which is disposed via the transparent filler at a position where an image is formed on the semiconductor optical sensor chip while forming an open portion for escaping a volume change, and which is adhered or welded to a support provided on the housing; Wherein the lens portion and the housing are formed of the same material or a material having a substantially equal coefficient of thermal expansion.

According to a fifth aspect of the present invention, there is provided a housing configured to have an opening at the bottom using an insulating material;
A wiring member extending from the inside of the housing to the outside, a semiconductor optical sensor chip fixed to the housing, and a connection for electrically connecting a terminal provided on the surface of the semiconductor optical sensor chip to the wiring member Means, a transparent filler filled in the housing to cover the upper surface of the semiconductor optical sensor chip and escape a volume change due to expansion or contraction at an open portion of the housing, and the semiconductor via the transparent filler. An aperture plate that is provided above the optical sensor chip, restricts a light beam incident on the semiconductor optical sensor chip, and is adhered or welded to the housing, and the housing at a position where an image is formed on the semiconductor optical sensor chip. Or a lens unit adhered or welded to the diaphragm plate, wherein the lens unit, the transparent plate and the housing are made of the same material or Wherein the expansion ratio is formed by substantially the same material.

According to a sixth aspect of the present invention, in the semiconductor optical sensor device according to the fifth aspect, the lens portion is provided with at least one pair of pairs of lenses, each pair comprising two lenses, and Are characterized in that aperture holes are provided for all the lenses of the one or more paired lenses.

[0020] Further, the invention according to claim 7 provides the invention according to claims 1 to
7. The semiconductor optical sensor device according to claim 6, wherein a thin film covering the transparent filler in the opening is provided.

The invention described in claim 8 is the first invention.
The semiconductor optical sensor device according to claim 6, wherein a coating is applied to a surface of the transparent filler in the opening.

The ninth aspect of the present invention is the first aspect of the present invention.
7. The semiconductor optical sensor device according to claim 6, further comprising a protection plate that covers the transparent filler in the opening.

The invention according to claim 10 is the first invention.
The semiconductor optical sensor device according to any one of claims 1 to 9, wherein the transparent filler is a transparent silicone gel.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view of the first embodiment of the present invention, FIG. 1B is a cross-sectional view taken along line AA of FIG.
FIG. 2 is an external view illustrating the external appearance of a semiconductor optical sensor device common to each embodiment. This embodiment corresponds to the embodiment of the invention described in claim 1, and has an appearance as shown in FIG. In FIG. 1B, a semiconductor optical sensor chip 2 is bonded to the bottom of a plastic housing 1. The semiconductor optical sensor chip 2
A plastic housing 1 such as a CCD image sensor, a MOS image sensor, a photodiode, or an infrared sensor;
Has an open structure except for a bonding portion of the semiconductor optical sensor chip 2 and a portion supporting the bonding portion, that is, has open portions 1a and 1b.

In the plastic housing 1, a lead frame 3 as a wiring member penetrates from inside to outside.
The internal terminals on the surface of the semiconductor optical sensor chip 2 to be bonded and the lead frame 3 are connected via bonding wires 4 as connecting means. Further, a transparent plate 5 is fixed to the outer edge of the upper surface of the plastic housing 1 by bonding or welding. The transparent plate 5 is formed in a plate shape and has an area that completely covers the upper opening of the plastic housing 1.

A lens portion 6 is fixed to the outer edge of the upper surface of the transparent plate 5 by bonding or welding. The lens unit 6 includes a lens 6 a for forming an image on the semiconductor optical sensor chip 2.
Are integrally formed. The plastic casing 1, the transparent plate 5, and the lens portion 6 are made of the same material or a material having substantially the same coefficient of thermal expansion.
The reason will be described later.

The inside of the plastic casing 1 is filled with a transparent silicone gel 7 as a transparent filler, and the transparent silicone gel 7 is exposed to the outside air at the open portions 1a and 1b at the bottom of the plastic casing 1. I have. In the first embodiment, the inside of the plastic casing 1 is completely filled with the transparent silicone gel 7, and the semiconductor optical sensor chip 2 and the bonding wires 4 are completely sealed and protected by the transparent silicone gel 7. Therefore, the gas state used for sealing does not affect the semiconductor optical sensor chip as in the related art, and stable characteristics can be maintained.

In the first embodiment, the bottom surface of the plastic casing 1 is opened by the open portions 1a and 1b, and the transparent silicone gel 7 is formed by these open portions 1a and 1b.
It is in the form exposed from. Therefore, even if the transparent silicone gel 7 expands or contracts due to a temperature change, the transparent silicone gel 7 exposed at the open portions 1a and 1b of the plastic casing 1 moves up and down, and absorbs a volume change due to the temperature change of the transparent silicone gel 7. I do. Therefore, as in the conventional structure in which the inside of the housing is completely sealed by the transparent filler, generation of bubbles and suction of outside air inside the filler due to expansion and contraction of the filler, suction of the filler and the housing Interfacial peeling does not occur, and stable characteristics can be maintained.

Furthermore, in the first embodiment, since the transparent plate 5 is firmly fixed to the upper surface of the plastic casing 1, even if the transparent silicone gel 7 inside the casing expands or contracts, the transparent plate 5 is The distance from the surface to the surface of the semiconductor optical sensor chip 2 is not changed. Therefore, the change in volume of the transparent silicone gel 7 does not affect the optical characteristics.

Further, since the plastic casing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients, they can be formed at a low cost. Further, for example, when the temperature rises, the plastic housing 1, the transparent plate 5, and the lens portion 6 expand integrally, so that the shapes before and after expansion are similar to each other. Although the lens diameter of the lens 6a and the thickness of the lens become large and the curvature changes, the focal length becomes long.
The plastic housing 1 on which the semiconductor optical sensor chip 2 is mounted and the transparent plate 5 expand accordingly, so that the focal length of the lens 6a can be maintained at a position above the semiconductor optical sensor chip 2, Stable characteristics can be maintained.

A method for manufacturing the semiconductor optical sensor device according to the first embodiment will be described below. A metal plate (lead frame 3) is inserted into a mold, a semiconductor optical sensor chip 2 is bonded to a plastic housing 1 injection-molded with a thermoplastic resin, and bonding wires 4 are bonded. 1 is bonded by an adhesive or welded by a solvent, ultrasonic waves or the like.

Further, the lens portion 6 is bonded or welded to the transparent plate 5. At this time, since the plastic housing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients, adhesion or welding is easy. After that, the plastic housing 1 is turned upside down and the uncured transparent silicone gel 7 is filled from the bottom open portions 1a and 1b, and then put in a thermostat to thermally cure the transparent silicone gel 7.

Even if the plastic housing 1, the transparent plate 5, and the lens portion 6 thermally expand or contract, the lens 6a
Can be always positioned on the semiconductor optical sensor chip 2, and the transparent silicone gel 7 escapes the fluctuation of the volume due to expansion or contraction by the open portions 1a and 1b at the bottom, and achieves a stable sealed state. maintain. A semiconductor optical sensor device having a high detection capability can be obtained even in an environment where temperature changes are drastic.

The lens portion 6 of the present embodiment is shown in FIGS. 1A, 1B and 19A as having a cylindrical shape, but the lens 6 has a circular shape. The configuration is not limited to a columnar shape, and for example, as shown in FIG. 19B, a configuration in which a lens 6a is provided on a plate-shaped or rectangular parallelepiped member may be used. Thus, the shapes of the lens portions 6 are appropriately selected. In an embodiment described later, a columnar lens unit or a plate-like lens unit can be selected.

FIG. 2A is a plan view of the second embodiment, and FIG.
FIG. 2B is a sectional view taken along line BB of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 1, and has an appearance as shown in FIG. In the present embodiment, in addition to the first embodiment, a metal die pad 8 is provided at a bonding position of the semiconductor optical sensor chip 2 of the plastic housing 1. The metal die pad 8 is inserted to lower the potential of the package of the semiconductor optical sensor chip 2 to the ground or to improve the adhesiveness between the semiconductor optical sensor chip 2 and the plastic housing 1.

An opening 1c is formed in the portion of the plastic housing 1 where the metal die pad 8 is arranged. The opening 1c is an opening into which a pin for preventing the metal die pad 8 from being moved by the resin injected during the injection molding of the plastic housing 1 is inserted. Other configurations are the same as those of the first embodiment. If the plate-shaped or rectangular parallelepiped lens portion 6 is selected, FIG.
The appearance is as shown in FIG. 9 (b). Even with such a configuration, a predetermined effect can be obtained.

FIG. 3A is a plan view of the third embodiment, and FIG.
FIG. 3B is a cross-sectional view taken along the line CC of FIG. This embodiment corresponds to the embodiment of the invention described in claim 2, and has an appearance as shown in FIG. The present embodiment is basically a semiconductor optical sensor device in which the transparent plate 5 is removed from the semiconductor optical sensor device of the first embodiment, and the lens unit 6 is directly bonded or welded to the plastic housing 1. As shown in FIG. 19C, the lens unit 6
It has a plate shape and a rectangular parallelepiped shape, and is formed in a size to completely cover the opening of the plastic housing 1. When the lens unit 6 is bonded and welded to the plastic housing 1, the lens unit 6
The lens 6a is configured to be at a position where an image is formed on the semiconductor optical sensor chip 2. Further, the plastic casing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients.

Even if the plastic housing 1 and the lens portion 6 thermally expand or contract, the focal position of the lens 6a can always be located on the semiconductor optical sensor chip 2, and the transparent silicone gel 7 The opening portion 1a and the opening portion 1b at the bottom escape volume fluctuation due to thermal expansion or thermal contraction, and maintain a stable sealed state. A semiconductor optical sensor device having a high detection capability can be obtained even in an environment where temperature changes are drastic.

FIG. 4A is a plan view of the fourth embodiment, and FIG.
FIG. 4B is a sectional view taken along line DD of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 2, and has an appearance as shown in FIG. This embodiment is basically a semiconductor optical sensor device including a metal die pad 8 at a bonding position of a semiconductor optical sensor chip 2 of a plastic housing 1 in addition to the third embodiment. Then, the plastic housing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention.

FIG. 5A is a plan view of the fifth embodiment, and FIG.
FIG. 5B is a cross-sectional view taken along the line EE of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 2, and has an appearance as shown in FIG. The present embodiment is basically a semiconductor in which a columnar lens portion 6 is directly adhered and welded to the plastic housing 1 instead of the plate-shaped or rectangular parallelepiped lens portion 6 of the semiconductor optical sensor device of the third embodiment. An optical sensor device. As shown by the halftone portion in FIG. 5A, the transparent silicone gel 7 is exposed to the outside air not only at the lower open portions 1a and 1b but also at the upper open portion 1d.

The lens 6 a of the lens section 6 is configured to form an image on the semiconductor optical sensor chip 2. And whether the plastic housing 1 and the lens part 6 are made of the same material,
Alternatively, materials having substantially equal thermal expansion coefficients are used. Even if the plastic housing 1 and the lens unit 6 are thermally expanded or contracted, the focal position of the lens 6a can always be located on the semiconductor optical sensor chip 2, and the transparent silicone gel 7 The opening portions 1a, 1b, 1d of the first embodiment escape the volume fluctuation due to thermal expansion or thermal contraction, and maintain a stable sealed state. A semiconductor optical sensor device having a high detection capability can be obtained even in an environment where temperature changes are drastic. In this embodiment, the metal die pad 8 may be provided.

FIG. 6A is a plan view of the sixth embodiment, and FIG.
FIG. 7B is a sectional view taken along line FF of FIG. This embodiment corresponds to the embodiment of the invention described in claim 3. The plastic housing 1 of the semiconductor optical sensor device of the present embodiment has a structure in which two surfaces, an upper surface, a bonding position of the semiconductor optical sensor chip 2 and a bottom surface excluding a portion supporting the bonding position, are opened. The plastic housing 1 includes a transparent plate fixing column 9 projecting inward from two inner peripheral surfaces.

In this plastic housing 1, a lead frame 3 penetrates from inside to outside. A semiconductor optical sensor chip 2 is bonded to the bottom of the plastic housing 1. The internal terminals on the surface of the semiconductor optical sensor chip 2 to be bonded and the lead frame 3 are connected via bonding wires 4. The inside of the plastic casing 1 is filled with a transparent silicone gel 7,
Further, on the surface of the transparent silicone gel 7, a transparent plate 5 is supported by the plastic housing 1 by a transparent plate fixing support 9. 6A, an open portion 1d is formed on the outer periphery of the transparent plate 5, and the transparent silicone gel 7 is exposed to the outside air.

In this case, the transparent plate 5 is a plastic casing 1
In this state, the bottom surface of the transparent plate 5 contacts the surface of the transparent silicone gel 7 without directly contacting the transparent silicone gel 7. Further, the lens portion 6 is fixed to the upper outer edge of the transparent plate 5 by bonding or welding. The lens unit 6 is provided with the semiconductor optical sensor chip 2
A lens 6a for forming an image above is integrally formed.

In the sixth embodiment, the inside of the plastic casing 1 is completely filled with the transparent silicone gel 7, and the semiconductor optical sensor chip 2 and the bonding wires 4 are completely sealed and protected by the transparent silicone gel 7. I have. Therefore, the gas state used for sealing does not affect the semiconductor chip as in the related art, and stable characteristics can be maintained.

In the sixth embodiment, the plastic housing 1 is open not only on the bottom surface but also on the upper surface, so that the transparent silicone gel 7 is exposed. Therefore, even if the transparent silicone gel 7 expands or contracts due to a temperature change, the silicone gel exposed at the open portions 1a, 1b, 1d of the plastic casing 1 moves up and down, and absorbs a volume change due to the temperature change of the transparent silicone gel 7. . Therefore, unlike the sealing structure of the conventional transparent filler, the generation or generation of air bubbles inside the filler, the suction of outside air, and the separation of the interface between the filler and the housing due to the expansion or contraction of the filler do not occur, and are stable. Characteristics can be maintained.

Further, in the sixth embodiment, since the transparent plate 5 is supported by the transparent plate fixing columns 9 attached to the inner peripheral surface of the plastic housing 1, the transparent silicone gel 7 inside the housing expands. Even if contracted, the distance from the surface of the transparent plate 5 to the surface of the semiconductor optical sensor chip 2 does not change. Further, since the plastic housing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients, they can be formed at low cost. Further, even if the plastic housing 1, the transparent plate 5, and the lens portion 6 expand due to a rise in temperature to extend the focal position, the lens 6a also expands to extend the focal position, and the focal position is placed on the semiconductor optical sensor chip 2. Can be maintained, and stable characteristics can be maintained. Therefore, stable characteristics can be maintained without the volume change of the transparent silicone gel 7 affecting the optical characteristics.

In the sixth embodiment, if necessary, a metal die pad can be provided at the bonding position of the semiconductor optical sensor chip 2 on the inner bottom of the plastic housing 1. 6A, the transparent plate 5 is extended only in the vertical direction (or only in the horizontal direction) in FIG.
It is also possible to adhere and weld directly to the plastic housing 1 while leaving d. These configurations are appropriately designed. In addition, the shape of the lens unit 6 of the present embodiment is appropriately selected, and it is possible to select a columnar lens unit or a plate-shaped lens unit.

FIG. 7A is a plan view of the seventh embodiment, and FIG.
(B) is GG sectional drawing of FIG.7 (a). This embodiment corresponds to the embodiment of the invention described in claim 4. In the present embodiment, basically, the transparent plate 5 is removed from the semiconductor optical sensor device of the sixth embodiment, and the plate-shaped and rectangular parallelepiped lens portion 6 is directly bonded to the transparent plate fixing support 9 of the plastic housing 1. Alternatively, it is a welded semiconductor optical sensor device. As shown by the halftone portion in FIG. 7A, the transparent silicone gel 7 is exposed to the outside air at the opening 1d. The lens section 6 is formed in a plate shape or a rectangular parallelepiped shape. Then, the lens portion 6 is bonded to the transparent plate fixing support 9 of the plastic housing 1.
When welded, the lens 6 a of the lens unit 6 is configured to be at a position where an image is formed on the semiconductor optical sensor chip 2. Then, the plastic housing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention.

In the seventh embodiment, if necessary, a metal die pad can be provided at the bonding position of the semiconductor optical sensor chip 2 on the inner bottom of the plastic housing 1. Further, a plate-shaped lens portion 6 is provided instead of the transparent plate fixing support 9 (not shown), as shown in FIG.
It is also possible to extend and extend only in the vertical direction (or only in the horizontal direction) in (a) and directly adhere and weld to the plastic housing 1 while leaving the opening 1d. These configurations are appropriately designed.

FIG. 8A is a plan view of the eighth embodiment, and FIG.
(B) is an HH sectional view of FIG. 8 (a). This embodiment corresponds to the embodiment of the invention described in claim 5, and has an appearance as shown in FIG. This embodiment is basically similar to the semiconductor optical sensor device of the first embodiment except that the transparent plate 5 is provided between the plastic housing 1 and the lens portion 6.
, A semiconductor optical sensor device provided with an aperture plate 13. The aperture plate 13 has an aperture 13a, and is formed in a plate shape or a rectangular parallelepiped shape, and has a size to completely cover the opening of the plastic housing 1. It is fixed to the outer edge of the upper surface of the plastic housing 1 by bonding or welding. The lens portion 6 is fixed to the outer edge of the upper surface of the aperture plate 13 by bonding or welding.

The lens 6 a of the lens section 6 is configured to form an image on the semiconductor optical sensor chip 2. And whether the plastic housing 1 and the lens part 6 are made of the same material,
Alternatively, materials having substantially equal thermal expansion coefficients are used. Even if the plastic housing 1 and the lens unit 6 are thermally expanded or contracted, the focal position of the lens 6a can always be located on the semiconductor optical sensor chip 2, and the transparent silicone gel 7 The opening portion 1a and the opening portion 1b escape the fluctuation in volume due to thermal expansion or thermal contraction, and maintain a stable sealed state. A semiconductor optical sensor device having a high detection capability can be obtained even in an environment where temperature changes are drastic.

A box-shaped lens unit 6 (not shown) is disposed so as to cover the diaphragm plate 13 bonded or welded to the plastic housing 1.
May be fixed to the outer edge of the upper surface of the plastic housing 1 by bonding or welding. In this case, the appearance is as shown in FIG. Further, the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 9A is a plan view of the ninth embodiment, and FIG.
(B) is a sectional view taken along the line II in FIG. 9 (a). This embodiment corresponds to the embodiment of the invention described in claim 6. The present embodiment basically has the same technical idea as the semiconductor optical sensor device of the eighth embodiment, except that the lens unit 6 has two lenses.
At least one set of lenses (lens 6a, lens 6 in FIG. 9)
b) is a semiconductor optical sensor device including a pair lens 6c.

Below the lenses 6a and 6b of the pair lens 6c, a pair lens aperture plate 13c in which aperture holes 13a and 13b are arranged is fixed to the outer edge of the upper surface of the plastic housing 1 by bonding or welding. Further, the pair lens 6c is fixed to the upper surface of the pair lens aperture plate 13c by bonding or welding. The pair lens 6c is configured to form an image at two places on the semiconductor optical sensor chip 2. Then, the plastic housing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients.

Even if the plastic housing 1 and the lens portion 6 thermally expand or contract, the focal position of the lens 6a can always be located on the semiconductor optical sensor chip 2, and the transparent silicone gel 7 , Escapes volume fluctuations due to thermal expansion or thermal contraction by the open portion 1a at the bottom, and maintains a stable sealed state. A semiconductor optical sensor device having a high detection capability can be obtained even in an environment where temperature changes are drastic.

FIG. 10A is a plan view of the tenth embodiment.
FIG. 10B is a sectional view taken along line JJ of FIG. This embodiment corresponds to the embodiment of the invention described in claim 7, and has an appearance as shown in FIG. In this embodiment, the plastic housing 1 of the first embodiment is used.
A thin film 10 that further covers the open portions 1a and 1b is added to the bottom of. The thin film 10 protects the transparent silicone gel 7 filled in the inside of the housing 1 from infiltration of moisture, foreign matter and the like from the outside air.

The cut-off portion of the open portion of the thin film 10 expands or dents as the transparent silicone gel 7 expands or contracts. This thin film 10
It is preferably made of a film of rubber, plastic, synthetic resin, or the like, and has been devised so as not to transmit light (colored in black or the like). Then, the plastic casing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. Note that the lens portion 6 is formed in a plate shape or a rectangular parallelepiped shape, and as shown in FIG.
You may comprise so that it may have an external appearance as shown in (b).

FIG. 11A is a plan view of the eleventh embodiment,
FIG. 11B is a sectional view taken along line KK of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 7,
The external appearance is as shown in FIG. In the tenth embodiment, basically, a thin film 10 covering the open portions 1a and 1b is further added to the bottom of the plastic housing 1 of the third embodiment. The thin film 10 protects the transparent silicone gel 7 filled in the inside of the housing 1 from infiltration of moisture, foreign matter and the like from the outside air. Note that the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 12A is a plan view of the twelfth embodiment.
FIG. 12B is a sectional view taken along line LL of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 7, and has an appearance as shown in FIG. In the twelfth embodiment, basically, a thin film 10 that further covers the open portions 1a and 1b is added to the bottom of the plastic housing 1 of the eighth embodiment. The thin film 10 protects the transparent silicone gel 7 filled in the inside of the housing 1 from infiltration of moisture, foreign matter and the like from the outside air. In addition,
The lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 13A is a plan view of the thirteenth embodiment.
FIG. 13B is a cross-sectional view taken along line MM of FIG. This embodiment corresponds to the embodiment of the invention described in claim 8, and has an appearance as shown in FIG. In the present embodiment, in addition to the semiconductor optical sensor device of the first embodiment, the open portions 1a and 1b of the plastic housing 1 are provided.
Formed on the surface of the transparent silicone gel 7 by coating a silicone rubber or a synthetic resin having a lower hygroscopicity than the silicone gel 7 and a hardness after curing, which is harder than the silicone gel 7, to form coating films 11a and 11b. It is.

The coating films 11 a and 11 b are formed by opening portions 1 a and 1 due to expansion or contraction of the transparent silicone gel 7.
In order to protect the transparent silicone gel 7 filled in the inside of the housing 1 while moving up and down with the up and down movement in b, the intrusion of moisture, foreign matter and the like from the outside air is prevented. Then, the plastic casing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. The lens portion 6 may be formed in a plate shape or a rectangular parallelepiped shape so as to have an appearance as shown in FIG.

FIG. 14A is a plan view of a fourteenth embodiment.
FIG. 14B is a sectional view taken along line NN of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 8, and has an appearance as shown in FIG. In this embodiment, in addition to the semiconductor optical sensor device of the third embodiment, the surface of the transparent silicone gel 7 at the open portions 1a and 1b of the plastic housing 1 has a lower hygroscopic property than the silicone gel 7. A coating film 11a, 11b coated with a silicone rubber or a synthetic resin whose hardness after curing is harder than the silicone gel 7;
Is formed. Then, the plastic housing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. Note that the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 15A is a plan view of the fifteenth embodiment,
FIG. 15B is a cross-sectional view taken along the line OO of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 8, and has an appearance as shown in FIG. In the present embodiment, basically, in addition to the semiconductor optical sensor device of the eighth embodiment, the surface of the transparent silicone gel 7 at the open portions 1a and 1b of the plastic casing 1 has lower hygroscopicity than the silicone gel 7. A coating film 11a, 11b coated with a silicone rubber or a synthetic resin whose hardness after curing is harder than the silicone gel 7;
Is formed. Then, the plastic housing 1 and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. Note that the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 16A is a plan view of the sixteenth embodiment.
FIG. 16B is a cross-sectional view taken along line PP of FIG. This embodiment corresponds to the embodiment of the invention described in claim 9, and has an appearance as shown in FIG. In the present embodiment, a protective plate 12 having holes 12a and 12b is further attached to the bottom of the plastic housing 1 in the first embodiment. The protective plate 12 preferably has a small opening area in order to prevent intrusion of moisture, foreign matter and the like from the outside air and to protect the transparent silicone gel 7 filled in the housing. Then, the plastic casing 1, the transparent plate 5, and the lens portion 6 are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. In addition, the lens part 6 is formed in a plate shape or a rectangular parallelepiped shape,
The configuration shown in FIG. 19B may be adopted.

FIG. 17A is a plan view of the seventeenth embodiment.
FIG. 17B is a QQ sectional view of FIG. 17A. This embodiment also corresponds to the embodiment of the invention described in claim 9, and has an appearance as shown in FIG. In the present embodiment, basically, a protective plate 12 having holes 12a and 12b is further attached to the bottom of the plastic housing 1 of the semiconductor optical sensor device of the third embodiment. Then, the plastic housing 1 and the lens unit 6
Are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. Note that the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

FIG. 18A is a plan view of the eighteenth embodiment.
FIG. 18B is a sectional view taken along the line RR of FIG. This embodiment also corresponds to the embodiment of the invention described in claim 9, and has an appearance as shown in FIG. In this embodiment, a protective plate 12 having holes 12a and 12b is further attached to the bottom of the plastic housing 1 of the semiconductor optical sensor device of the eighth embodiment. Then, the plastic housing 1 and the lens unit 6
Are made of the same material or materials having substantially equal thermal expansion coefficients. Such a semiconductor optical sensor device also exhibits the predetermined effects of the present invention. Note that the lens portion 6 may be formed in a cylindrical shape so as to have an appearance as shown in FIG.

In the tenth to eighteenth embodiments, if necessary, the metal die pad 8 can be provided at the bonding position of the semiconductor optical sensor chip 2 on the inner bottom of the plastic housing 1. In addition, the tenth to first
In the eighth embodiment as well, not only the structure in which the bottom of the housing is opened, but also the opening 1d can be added by using the transparent fixing post 9 which is a technical feature of the sixth or seventh embodiment. In the tenth to eighteenth embodiments, the opening portions 1a,
1b, the thin film 1 is applied to the transparent silicone gel 7 exposed to the outside air.
0, the coating film 11, and the protection plate 12 are provided. However, even when the opening 1d is further provided on the upper side as in the fifth to seventh embodiments, the coating is exposed to the opening 1d and the outside air. It is desirable to provide any one of the thin film 10, the coating film 11, and the protective plate 12 on the transparent silicone gel 7 to prevent moisture and foreign substances from being mixed. The effects of the present invention are exhibited in any of these modes.

The scope of application of the present invention is not limited to the above-described embodiment. For example, the present invention is similarly applicable to a case where a transparent filler is filled inside using a surface mount type envelope. It is possible to In all of the above-described embodiments, the transparent silicone gel is used as the transparent filler to be filled in the envelope.However, the present invention is not limited to this, and it is also possible to apply a transparent silicone rubber, a transparent synthetic resin, or the like. is there. In the above embodiment, a plastic housing is also used as the insulating housing. However, in addition to plastic, ceramic, ceramic / plastic composite materials, and the like can be used as the housing material.

In the first to eighteenth embodiments, the plastic housing 1 is manufactured by injection molding using a thermoplastic resin. However, a thermosetting resin such as an epoxy resin is used. It can also be made by casting with resin. Furthermore, in the above embodiment, the bonding wire is used for the connection between the internal terminal on the surface of the semiconductor optical sensor chip and the wiring pattern of the insulating casing. However, the present invention is not limited to this, and connection means using bumps can be applied.

As the plastic material, a cycloolefin polymer plastic generally called CPO is desirable. Further, as a material having substantially the same coefficient of thermal expansion, for example, a transparent cycloolefin polymer-based plastic or the like is used for the transparent plate 5 and the lens portion 6, and a dye-mixed cycloolefin polymer-based plastic It is conceivable to use such as. The present invention can be implemented by using such a material.

[0072]

As described above, according to the semiconductor optical sensor device of the present invention, the stability of the semiconductor optical sensor device with respect to temperature changes is improved with an inexpensive structure, and the deterioration and fluctuation of the optical characteristics are prevented, thereby extending the life. And reliability improvement.

[Brief description of the drawings]

FIG. 1A is a plan view of a first embodiment, FIG.
FIG. 2B is a sectional view taken along line AA of FIG.

FIG. 2A is a plan view of a second embodiment, and FIG.
FIG. 2B is a sectional view taken along line BB of FIG.

FIG. 3A is a plan view of a third embodiment, and FIG.
FIG. 3B is a cross-sectional view taken along the line CC of FIG.

FIG. 4A is a plan view of a fourth embodiment, and FIG.
FIG. 4B is a sectional view taken along line DD of FIG.

FIG. 5A is a plan view of a fifth embodiment, and FIG.
FIG. 5B is a cross-sectional view taken along the line EE of FIG.

FIG. 6A is a plan view of a sixth embodiment, and FIG.
FIG. 7B is a sectional view taken along line FF of FIG.

FIG. 7A is a plan view of a seventh embodiment, and FIG.
(B) is GG sectional drawing of FIG.7 (a).

FIG. 8A is a plan view of an eighth embodiment, and FIG.
(B) is an HH sectional view of FIG. 8 (a).

FIG. 9A is a plan view of a ninth embodiment, and FIG.
(B) is a sectional view taken along the line II in FIG. 9 (a).

10A is a plan view of a tenth embodiment, and FIG. 10B is a cross-sectional view taken along the line JJ of FIG. 10A.

11A is a plan view of the eleventh embodiment, and FIG. 11B is a cross-sectional view taken along a line KK of FIG. 11A.

12A is a plan view of a twelfth embodiment, and FIG. 12B is a cross-sectional view taken along line LL of FIG. 12A.

13A is a plan view of the thirteenth embodiment, and FIG. 13B is a cross-sectional view taken along line MM of FIG. 13A.

14A is a plan view of a fourteenth embodiment, and FIG. 14B is a cross-sectional view taken along the line NN of FIG. 14A.

FIG. 15A is a plan view of the fifteenth embodiment, and FIG. 15B is a cross-sectional view taken along the line OO of FIG. 15A.

16A is a plan view of a sixteenth embodiment, and FIG. 16B is a cross-sectional view taken along a line PP of FIG. 16A.

17 (a) is a plan view of a seventeenth embodiment, and FIG. 17 (b) is a QQ sectional view of FIG. 17 (a).

FIG. 18A is a plan view of an eighteenth embodiment, and FIG. 18B is a cross-sectional view taken along the line RR of FIG. 18A.

FIG. 19 is an external view illustrating the external appearance of the semiconductor optical sensor device.

FIG. 20 (a) is a plan view of a conventional semiconductor optical sensor device, and FIG. 20 (b) is an SS diagram of FIG. 20 (a).
It is sectional drawing.

21 (a) is a plan view of a conventional semiconductor optical sensor device, and FIG. 21 (b) is a TT of FIG. 21 (a).
It is sectional drawing.

FIG. 22A is a plan view of a conventional semiconductor optical sensor device, and FIG. 22B is UU of FIG. 22A.
It is sectional drawing.

[Explanation of symbols]

 Reference Signs List 1 plastic housing 1a, 1b, 1c, 1d opening 2 semiconductor optical sensor chip 3 lead frame 4 bonding wire 5 transparent plate 6 lens 6a lens 6b lens 6c pair lens 7 transparent silicone gel 8 metal die pad 9 transparent plate fixing post 10 Thin film 11 Coating film 12 Protective plate 12a, 12b Hole 13 Aperture plate 13a Aperture hole 13b Aperture hole 13c Aperture plate for pair lens

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hajime Fukamura 1-1-1, Tanabe-Nitta, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fuji Electric Co., Ltd. (72) Inventor Osamu Sugiyama 1, Shin-Tanabe-Tanabe, Kawasaki-ku, Kawasaki-shi, Kanagawa No. 1 Inside Fuji Electric Co., Ltd.

Claims (10)

[Claims] A housing configured to have an opening at the bottom using an insulating material; a wiring member drawn out of the housing to the outside; and a semiconductor optical sensor chip fixed to the housing. Connecting means for electrically connecting terminals provided on the surface of the semiconductor optical sensor chip and the wiring member; and filling the interior of the housing to cover the upper surface of the semiconductor optical sensor chip, and A transparent filler that escapes a volume change due to expansion or contraction at the opening; a transparent plate provided above the semiconductor optical sensor chip via the transparent filler, and bonded or welded to the housing; A lens unit adhered or fused to the transparent plate at a position where an image is formed on the semiconductor optical sensor chip, wherein the lens unit, the transparent plate, and the housing are provided. Is a semiconductor optical sensor device characterized by being formed of the same material or materials having substantially equal thermal expansion coefficients. 2. A housing configured to have an opening at the bottom using an insulating material; a wiring member drawn out from the inside of the housing to the outside; and a semiconductor optical sensor chip fixed to the housing. Connecting means for electrically connecting terminals provided on the surface of the semiconductor optical sensor chip and the wiring member; and filling the interior of the housing to cover the upper surface of the semiconductor optical sensor chip, and A transparent filler that escapes a change in volume due to expansion or contraction at the open portion; and the casing is provided above the semiconductor optical sensor chip via the transparent filler and forms an image on the semiconductor optical sensor chip. A lens unit adhered or welded to a body, wherein the lens unit and the housing are formed of the same material or a material having substantially the same coefficient of thermal expansion. A semiconductor optical sensor device, characterized in that: 3. A housing configured to have an opening at the bottom using an insulating material; a wiring member drawn out of the housing to the outside; and a semiconductor optical sensor chip fixed to the housing. Connecting means for electrically connecting terminals provided on the surface of the semiconductor optical sensor chip and the wiring member; and filling the interior of the housing to cover the upper surface of the semiconductor optical sensor chip, and A transparent filler that escapes a volume change due to expansion or contraction at an open portion, and the transparent filler above the semiconductor optical sensor chip while forming an open portion to escape a volume change due to expansion or contraction of the transparent filler. A transparent plate, which is disposed via a support and is bonded or welded to a support provided in the housing, and a lens which is bonded or welded to the transparent plate at a position where an image is formed on the semiconductor optical sensor chip. A semiconductor optical sensor device comprising: a lens unit, the transparent plate, and the housing are formed of the same material or a material having substantially equal thermal expansion coefficients. . 4. A housing configured to have an opening at the bottom using an insulating material; a wiring member drawn out of the housing to the outside; and a semiconductor optical sensor chip fixed to the housing. Connecting means for electrically connecting terminals provided on the surface of the semiconductor optical sensor chip and the wiring member; and filling the interior of the housing to cover the upper surface of the semiconductor optical sensor chip, and A transparent filler that escapes a volume change due to expansion or contraction at an open portion; and a position where an image is formed on the semiconductor optical sensor chip while forming an open portion to escape a volume change due to expansion or contraction of the transparent filler. Placed through a transparent filler,
A lens unit adhered or welded to a support provided on the housing, wherein the lens unit and the housing are formed of the same material or a material having substantially the same coefficient of thermal expansion. Semiconductor optical sensor device characterized by being performed. 5. A housing configured to have an opening at the bottom using an insulating material; a wiring member drawn out of the housing to the outside; and a semiconductor optical sensor chip fixed to the housing. Connecting means for electrically connecting terminals provided on the surface of the semiconductor optical sensor chip and the wiring member; and filling the interior of the housing to cover the upper surface of the semiconductor optical sensor chip, and A transparent filler that escapes a change in volume due to expansion or contraction at the open portion; and a housing provided above the semiconductor optical sensor chip via the transparent filler to limit light rays incident on the semiconductor optical sensor chip; And a lens unit adhered or welded to the housing or the aperture plate at a position where an image is formed on the semiconductor optical sensor chip. A semiconductor optical sensor device, wherein the lens portion, the transparent plate, and the housing are formed of the same material or materials having substantially equal thermal expansion coefficients. 6. The semiconductor optical sensor device according to claim 5, wherein the lens portion is provided with at least one pair of paired lenses, each of which is a pair of two lenses, and the aperture plate is at least one paired pair of lenses. Wherein a plurality of apertures are provided for all of the lenses. 7. The semiconductor optical sensor device according to claim 1, further comprising a thin film covering said transparent filler in said open portion. 8. The semiconductor optical sensor device according to claim 1, wherein a coating is applied to a surface of the transparent filler in the open portion. 9. The semiconductor optical sensor device according to claim 1, further comprising a protective plate for covering said transparent filler in said open portion. 10. The semiconductor optical sensor device according to claim 1, wherein the transparent filler is a transparent silicone gel.