JP2000233411A - 金型用の温度調節装置 - Google Patents

金型用の温度調節装置

Info

Publication number
JP2000233411A
JP2000233411A JP11038014A JP3801499A JP2000233411A JP 2000233411 A JP2000233411 A JP 2000233411A JP 11038014 A JP11038014 A JP 11038014A JP 3801499 A JP3801499 A JP 3801499A JP 2000233411 A JP2000233411 A JP 2000233411A
Authority
JP
Japan
Prior art keywords
valve
liquid
conduit
mold
liquid circulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11038014A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000233411A5 (2
Inventor
Motoharu Shimizu
元治 清水
Yoshitaka Koishi
芳孝 小石
Kimiya Kanou
公也 稼農
Osamu Matsui
治 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsui Mfg Co Ltd
Original Assignee
Matsui Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsui Mfg Co Ltd filed Critical Matsui Mfg Co Ltd
Priority to JP11038014A priority Critical patent/JP2000233411A/ja
Publication of JP2000233411A publication Critical patent/JP2000233411A/ja
Publication of JP2000233411A5 publication Critical patent/JP2000233411A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
JP11038014A 1999-02-17 1999-02-17 金型用の温度調節装置 Pending JP2000233411A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11038014A JP2000233411A (ja) 1999-02-17 1999-02-17 金型用の温度調節装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11038014A JP2000233411A (ja) 1999-02-17 1999-02-17 金型用の温度調節装置

Publications (2)

Publication Number Publication Date
JP2000233411A true JP2000233411A (ja) 2000-08-29
JP2000233411A5 JP2000233411A5 (2) 2004-12-02

Family

ID=12513732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11038014A Pending JP2000233411A (ja) 1999-02-17 1999-02-17 金型用の温度調節装置

Country Status (1)

Country Link
JP (1) JP2000233411A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011132220A1 (ja) * 2010-04-21 2011-10-27 三菱重工プラスチックテクノロジー株式会社 射出成形装置、及び射出成形装置の熱媒体の排出方法
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium
WO2011132220A1 (ja) * 2010-04-21 2011-10-27 三菱重工プラスチックテクノロジー株式会社 射出成形装置、及び射出成形装置の熱媒体の排出方法
JP5335994B2 (ja) * 2010-04-21 2013-11-06 三菱重工プラスチックテクノロジー株式会社 射出成形装置、及び射出成形装置の熱媒体の排出方法
US9011750B2 (en) 2010-04-21 2015-04-21 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Injection molding device and method for discharging heat medium for injection molding device

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