JP2000235902A - PTC resistance element - Google Patents
PTC resistance elementInfo
- Publication number
- JP2000235902A JP2000235902A JP3550799A JP3550799A JP2000235902A JP 2000235902 A JP2000235902 A JP 2000235902A JP 3550799 A JP3550799 A JP 3550799A JP 3550799 A JP3550799 A JP 3550799A JP 2000235902 A JP2000235902 A JP 2000235902A
- Authority
- JP
- Japan
- Prior art keywords
- ptc
- conductive
- conductive filler
- resistance element
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、PTC抵抗素子に
関し、特に、PTC(Positive Temperature Coeffic
ient;正温度係数)特性を示すPTC導電性組成物を用
いた電気回路保護用PTC抵抗素子に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PTC resistance element, and more particularly, to a PTC (Positive Temperature Coeffic).
The present invention relates to a PTC resistance element for protecting an electric circuit using a PTC conductive composition having a characteristic of a positive temperature coefficient.
【0002】[0002]
【従来の技術】二次電池を始め、電気機器、電子機器に
用いられている電気回路保護素子としては、カーボン系
導電性フィラーを結晶性高分子マトリックスに分散させ
た有機導電性組成物が知られている。2. Description of the Related Art As an electric circuit protection element used in electric equipment and electronic equipment including secondary batteries, an organic conductive composition in which a carbon-based conductive filler is dispersed in a crystalline polymer matrix is known. Have been.
【0003】 有機導電性組
成物は、結晶性高分子マトリックスの結晶融点よりも低
い温度にある間は、カーボン系導電性フィラーが結晶性
高分子マトリックスの非結晶領域のみに存在し、連鎖状
構造をとり導電性フィラーを通し電子が移動する導電機
構により低い抵抗率を示す。In the organic conductive composition, while the temperature is lower than the crystal melting point of the crystalline polymer matrix, the carbon-based conductive filler is present only in the non-crystalline region of the crystalline polymer matrix, and has a chain structure. And exhibits a low resistivity due to a conductive mechanism in which electrons move through the conductive filler.
【0004】 また、温度が上昇し、結晶性高分子マト
リックスが融解し始めると、結晶性高分子マトリックス
の体積が増加するため、結晶性高分子マトリックスの中
のカーボン系導電性フィラー間の距離が広がり、その結
果、導電経路の破壊が進み抵抗が上昇する。When the temperature rises and the crystalline polymer matrix begins to melt, the volume of the crystalline polymer matrix increases, so that the distance between the carbon-based conductive fillers in the crystalline polymer matrix is reduced. As a result, the conductive path is broken and the resistance increases.
【0005】 以上の動作原理を応用した電気回路保護
素子には、室温で低抵抗であり温度上昇とともに抵抗が
増大して電流を制限する導電性組成物、特に所望のスイ
ッチング温度(抵抗が急激に上昇する温度)で急激に抵
抗が大きくなるPTC導電性組成物が用いられる。An electric circuit protection element using the above operation principle includes a conductive composition which has a low resistance at room temperature and increases the resistance as the temperature rises to limit the current, particularly a desired switching temperature (the resistance is rapidly increased). A PTC conductive composition whose resistance rapidly increases at a rising temperature) is used.
【0006】[0006]
【発明が解決しようとする課題】しかし、良好な導電性
を有する素子を得るためには、導電性フィラーの充填量
を多くしなければならない。そこで、導電性フィラーの
高充填化を図ることが考えられるが、導電性フィラー
は、結晶性高分子マトリックスに対し40wt%以上、
充填させることが難しく、PTC抵抗素子の作製を困難
としていた。However, in order to obtain an element having good conductivity, the filling amount of the conductive filler must be increased. Therefore, it is conceivable to increase the filling of the conductive filler, but the conductive filler is 40 wt% or more based on the crystalline polymer matrix.
It is difficult to fill, and it has been difficult to manufacture a PTC resistance element.
【0007】そこで、本発明の目的は、繰り返し使用に
対して安定で、かつ、導電性フィラーの混入量が少なく
ても、再現性の良好なPTC特性を有するPTC抵抗素
子を提供することにある。Accordingly, an object of the present invention is to provide a PTC resistance element which is stable against repeated use and has good reproducibility of PTC characteristics even when the amount of conductive filler is small. .
【0008】[0008]
【課題を解決するための手段】本発明のPTC抵抗素子
は、熱硬化性樹脂とフレーク状の金属導電牲フィラーを
含むPTC導電性組成物を熱硬化させたものであり、金
属導電性フィラーの体積分率と熱硬化性樹脂の体積分率
との比が15/85〜35/65であり、20℃におけ
る抵抗率が1Ωcm以下であり、スイッチング温度以上
で105Ωcm以上の抵抗率を示す。The PTC resistance element of the present invention is obtained by thermosetting a PTC conductive composition containing a thermosetting resin and a flake-shaped metal conductive filler. The ratio of the volume fraction to the volume fraction of the thermosetting resin is 15/85 to 35/65, the resistivity at 20 ° C. is 1 Ωcm or less, and the resistivity is 10 5 Ωcm or more at a switching temperature or higher. .
【0009】 PTC抵抗素子の作製時、所望するスイ
ッチング温度以上に加熱して熱硬化させることが好まし
い。また、PTC導電性組成物において、導電牲フィラ
ーの分散状態が均一であると、安定なPTC特性を示す
ため、導電牲フィラーを均一な分散状態を図ることが好
ましい。When the PTC resistance element is manufactured, it is preferable that the PTC resistance element is heated to a desired switching temperature or higher and thermally cured. In the PTC conductive composition, if the dispersion state of the conductive filler is uniform, stable PTC characteristics are exhibited. Therefore, the dispersion state of the conductive filler is preferably uniform.
【0010】本発明では、使用する熱硬化性樹脂及び硬
化剤の種類を所望のスイッチング温度に基づき選定し、
利用目的に応じて熱可塑性充填剤を併用することで、7
0〜135℃の中温度領域に安定なPTC特性を示す導
電性組成物が得られ、かつ、一液系熱硬化性樹脂中に金
属フレーク導電牲フィラーを分散させ、塗布機を用いて
PETフィルム上に塗布した後に、熱プレスを施すこと
で導電性及びPTC特性を改善するものである。In the present invention, the type of thermosetting resin and curing agent to be used is selected based on a desired switching temperature,
By using a thermoplastic filler according to the purpose of use, 7
A conductive composition exhibiting stable PTC characteristics in a medium temperature range of 0 to 135 ° C. is obtained, and a metal flake conductive filler is dispersed in a one-component thermosetting resin. After application on the surface, a hot press is performed to improve conductivity and PTC characteristics.
【0011】即ち、本発明は、PTC抵抗素子として熱
硬化性樹脂と金属フレーク導電性フィラーを含む導電性
組成物をシート状に成形したPTC抵抗素子である。That is, the present invention is a PTC resistance element obtained by forming a conductive composition containing a thermosetting resin and a metal flake conductive filler into a sheet shape as the PTC resistance element.
【0012】また、本発明は、前記金属導電性フィラー
は、その平均粒径が2〜75μm、粒子厚みが0.2〜
1μmのアスペクト比が10以上のフレーク状粒子であ
るPTC抵抗素子である。Further, according to the present invention, the metal conductive filler has an average particle diameter of 2 to 75 μm and a particle thickness of 0.2 to 75 μm.
The PTC resistance element is a flake-shaped particle having a 1 μm aspect ratio of 10 or more.
【0013】[0013]
【発明の実施の形態】本発明の実施の形態によるPTC
抵抗素子について、以下に実施例により説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS PTC according to an embodiment of the present invention
An example of the resistance element will be described below.
【0014】[0014]
【実施例】(実施例1)一液系エポキシ樹脂(商品名;
ECCOBOND)80重量部と金属粉末導電牲フィラ
ー;銀粉(商品名;AgC−AO)20重量部を加え、
均一に分散させて、導電牲組成物を作製した。EXAMPLES Example 1 One-component epoxy resin (trade name;
(ECCOBOND) 80 parts by weight and a metal powder conductive filler; 20 parts by weight of silver powder (trade name: AgC-AO).
The conductive composition was uniformly dispersed to prepare a conductive composition.
【0015】次いで、片面を粗面加工した厚み25μm
のニッケル箔2枚の粗面間に前記導電性組成物を挟み、
厚さ300μmになるように加圧、延展後、150℃で
15分熱硬化させた。Then, the thickness of one side is roughened to 25 μm.
Sandwiching the conductive composition between two rough surfaces of nickel foil of
After being pressurized and spread to a thickness of 300 μm, it was thermally cured at 150 ° C. for 15 minutes.
【0016】PTC抵抗素子は、ニッケル箔に接合され
た前記導電性組成物を外径10mmφ:内径6mmφの
リング状に切り出し、PTC抵抗素子を作製した。The PTC resistance element was prepared by cutting the conductive composition bonded to the nickel foil into a ring shape having an outer diameter of 10 mmφ and an inner diameter of 6 mmφ.
【0017】このPTC抵抗素子の繰り返し電流遮断時
の抵抗変化を測定した。その結果、室温における抵抗率
が0.8Ωcmとなり、従来の結晶性高分子マトリック
スに球状粒(平均粒径;4μm)の導電性フィラーを充
填して作製したPTC抵抗素子よりも抵抗値を20%低
減させることができた。The resistance change of the PTC resistance element when the current was repeatedly interrupted was measured. As a result, the resistivity at room temperature becomes 0.8 Ωcm, which is 20% lower than that of a conventional PTC resistor element prepared by filling a crystalline polymer matrix with conductive filler of spherical particles (average particle size: 4 μm). Could be reduced.
【0018】電圧30V、電流5Aを通電すると、3秒
でスイチィングし、繰り返し電流遮断を10回施した場
合でも、自然冷却して室温まで下がったときの抵抗値
は、初期抵抗の1.3倍以内と、従来用いられていた球
状銀粉よりも高いPTC特性の安定性が得られ、安定な
繰り返し電流遮断を行えることが確認された。その結果
を、表1、表2に示す。When a voltage of 30 V and a current of 5 A are applied, switching is performed in 3 seconds, and even when current is repeatedly interrupted 10 times, the resistance value when cooled to room temperature by natural cooling is 1.3 times the initial resistance. Within this range, it was confirmed that a higher stability of PTC characteristics was obtained as compared with the conventionally used spherical silver powder, and that stable repetitive current interruption could be performed. The results are shown in Tables 1 and 2.
【0019】[0019]
【表1】 [Table 1]
【0020】[0020]
【表2】 [Table 2]
【0021】(実施例2)一液系エポキシ樹脂(商品
名;ECCOBOND)80重量部とアスペクト比が1
〜100を持つ金属フレーク導電フィラー;銀フレーク
(商品名;PUFF−SILVER−X)20重量部を
加え、均一に分散させて、導電牲組成物を作製した。Example 2 One-part epoxy resin (trade name: ECCOBOND) 80 parts by weight and an aspect ratio of 1
A conductive composition was prepared by adding 20 parts by weight of a metal flake conductive filler having a particle size of -100 to silver flake (trade name: PUFF-SILVER-X) and uniformly dispersing the same.
【0022】次いで、片面を粗面加工した厚さ25μm
のニッケル箔2枚の粗面間に前記導電性組成物を挟み、
厚さ300μmになるように加圧、延展後、150℃で
15分熱硬化させた。Next, one side is roughened to a thickness of 25 μm.
Sandwiching the conductive composition between two rough surfaces of nickel foil of
After being pressurized and spread to a thickness of 300 μm, it was thermally cured at 150 ° C. for 15 minutes.
【0023】PTC抵抗素子は、ニッケル箔に接合され
た前記導電性組成物を外径10mmφ:内径6mmφの
リング状に切り出し、本発明のPTC抵抗素子を作製し
た。As the PTC resistance element, the conductive composition bonded to the nickel foil was cut into a ring shape having an outer diameter of 10 mmφ and an inner diameter of 6 mmφ to produce a PTC resistance element of the present invention.
【0024】本発明のPTC抵抗素子の抵抗値を測定し
た結果、同じ粒径でも厚さが薄い、高アスペクト比を持
つ導電性フィラーほど、非常に優れた導電性を示すこと
が確認された。その結果を表3に示すAs a result of measuring the resistance value of the PTC resistance element of the present invention, it was confirmed that a conductive filler having a smaller thickness and a higher aspect ratio even with the same particle diameter exhibits more excellent conductivity. Table 3 shows the results.
【0025】[0025]
【表3】 [Table 3]
【0026】表3より、アスペクト10以上にて、抵抗
率に著しい改善効果が見られていることがわかる。
From Table 3, it can be seen that a remarkable effect of improving the resistivity is seen at an aspect ratio of 10 or more.
【0027】[0027]
【発明の効果】以上、本発明によれば、繰り返し使用に
対して安定で、かつ、導電性フィラーの混入量が少なく
ても、再現性の良好なPTC特性を有するPTC抵抗素
子を提供することができる。As described above, according to the present invention, it is possible to provide a PTC resistance element which is stable against repeated use and has good reproducibility of PTC characteristics even if the amount of conductive filler is small. Can be.
Claims (2)
て、その材質を、熱硬化性樹脂と金属フレーク導電性フ
ィラーを含む導電性組成物としており、前記導電性組成
物をシート状に成形して構成されることを特徴とするP
TC抵抗素子。1. A PTC resistance element for protecting an electric circuit, wherein the material is a conductive composition containing a thermosetting resin and a metal flake conductive filler, and the conductive composition is formed into a sheet. P characterized by comprising
TC resistance element.
の平均粒径が2〜75μm、粒子厚みが0.2〜1μm
のアスペクト比が10以上のフレーク状粒子であること
を特徴とする請求項1記載のPTC抵抗素子。2. The metal flake conductive filler has an average particle size of 2 to 75 μm and a particle thickness of 0.2 to 1 μm.
2. The PTC resistance element according to claim 1, wherein the PTC resistance element has an aspect ratio of 10 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3550799A JP2000235902A (en) | 1999-02-15 | 1999-02-15 | PTC resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3550799A JP2000235902A (en) | 1999-02-15 | 1999-02-15 | PTC resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000235902A true JP2000235902A (en) | 2000-08-29 |
Family
ID=12443688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3550799A Pending JP2000235902A (en) | 1999-02-15 | 1999-02-15 | PTC resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000235902A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258316A (en) * | 2009-04-28 | 2010-11-11 | Murata Mfg Co Ltd | Overcurrent protection material and electrostatic countermeasure component |
-
1999
- 1999-02-15 JP JP3550799A patent/JP2000235902A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258316A (en) * | 2009-04-28 | 2010-11-11 | Murata Mfg Co Ltd | Overcurrent protection material and electrostatic countermeasure component |
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