JP2000252243A5 - - Google Patents
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- Publication number
- JP2000252243A5 JP2000252243A5 JP1999352885A JP35288599A JP2000252243A5 JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5 JP 1999352885 A JP1999352885 A JP 1999352885A JP 35288599 A JP35288599 A JP 35288599A JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- protective film
- forming agent
- film forming
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35288599A JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37260898 | 1998-12-28 | ||
| JP10-372608 | 1998-12-28 | ||
| JP35288599A JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000252243A JP2000252243A (ja) | 2000-09-14 |
| JP2000252243A5 true JP2000252243A5 (2) | 2007-02-22 |
Family
ID=26579726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35288599A Pending JP2000252243A (ja) | 1998-12-28 | 1999-12-13 | 金属用研磨液及びそれを用いた研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000252243A (2) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1803964B (zh) | 1998-12-28 | 2010-12-15 | 日立化成工业株式会社 | 金属研磨液材料、金属研磨液、其制造方法及使用它的研磨方法 |
| WO2001004231A1 (en) | 1999-07-13 | 2001-01-18 | Kao Corporation | Polishing liquid composition |
| JP4614497B2 (ja) * | 1999-07-13 | 2011-01-19 | 花王株式会社 | 研磨液組成物 |
| TWI257126B (en) * | 2002-07-25 | 2006-06-21 | Hitachi Chemical Co Ltd | Slurry and polishing method |
| JP4667013B2 (ja) * | 2003-11-14 | 2011-04-06 | 昭和電工株式会社 | 研磨組成物および研磨方法 |
| US7348276B2 (en) | 2005-03-30 | 2008-03-25 | Fujitsu, Limited | Fabrication process of semiconductor device and polishing method |
| JP5433936B2 (ja) * | 2006-10-11 | 2014-03-05 | 日立化成株式会社 | 金属用研磨液とその製造方法及び金属用研磨液を用いた被研磨膜の研磨方法 |
| WO2010098734A1 (en) * | 2009-02-26 | 2010-09-02 | Ppt Research, Inc. | Corrosion inhibiting compositions |
| CN108527012A (zh) * | 2018-05-21 | 2018-09-14 | 浙江工业大学 | 一种利用液态金属抛光液进行大平面抛光的装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864594A (ja) * | 1994-08-18 | 1996-03-08 | Sumitomo Metal Ind Ltd | 配線の形成方法 |
| JPH10163141A (ja) * | 1996-12-02 | 1998-06-19 | Fujimi Inkooporeetetsudo:Kk | 銅の研磨用組成物 |
| US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| JP2001523395A (ja) * | 1997-04-30 | 2001-11-20 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | 半導体ウェーハの上面を平坦化する方法 |
-
1999
- 1999-12-13 JP JP35288599A patent/JP2000252243A/ja active Pending
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