JP2000269634A - Cream solder application equipment - Google Patents

Abstract

(57) [Problem] To provide a cream solder application device capable of applying cream solder to a side wall of an electrode. SOLUTION: The cream solder 22a is applied onto a printed circuit board 30 through a hole 25a of an imprint plate 25 filled with the cream solder 22a, and the cream solder 22a in the hole 25a is extruded by an extruding pin 29 and printed. This is to press and adhere to the side electrode 32 of the substrate 30. Thereby, the cream solder can be efficiently applied to the side surfaces of the electrodes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder applying apparatus for applying cream solder to a side wall of an electrode.

[0002]

2. Description of the Related Art FIG. 10 is an assembled perspective view of a high-frequency module. Reference numeral 1 denotes a printed circuit board on which an electronic component 2 is fixed by cream solder, and reference numeral 3 denotes a metal shield case which is put on the printed circuit board 1. . Reference numeral 4 denotes a mounting leg provided on the shield case 3. The mounting leg 4 is fixed to a side electrode 5 provided on a side surface of the printed circuit board 1 by soldering.

As shown in FIG. 11, this fixation is performed by covering a shield case 3 on a printed circuit board 1 and applying cream solder 7 to a side electrode 5 with a dispenser (used as an example of a cream solder applying device) 6. I was Then, the mounting leg 4 was fixed to the side electrode 5 by heating in a reflow furnace.

[0004]

However, in applying the cream solder with such a dispenser, it is necessary to apply the solder to the side electrodes 5 of the high-frequency module one by one.
The production efficiency was low.

Therefore, as an apparatus for applying cream solder more efficiently, as shown in FIG. 12, an imprint plate 8 in which cream solder 11 is filled in a hole 8a is parallel to a printed board 10 on which electronic components 9 are fixed. There is also a cream solder application device in which the cream solder 11 is extruded with an extruding pin 12 and is applied on the upper surface of the printed circuit board 10. However, in this apparatus, the cream solder 11 could be applied to the upper surface of the printed circuit board 10, but could not be applied to the electrodes provided on the side surfaces.

Accordingly, an object of the present invention is to solve the above-mentioned problem and to provide a cream solder applying apparatus capable of applying cream solder to a side wall of an electrode.

[0007]

In order to achieve this object, the present invention relates to a tank filled with cream solder and having an open upper side, and a tank which is moved above and below the tank by moving in a horizontal direction to approach / separate from the tank. Two squeegees provided so as to be able to be imprinted, an imprinting plate to be inserted into and withdrawn from the tank through the two squeegees; And a push pin for pushing the cream solder through a hole provided in the imprint plate and filled with the cream solder, and pushing the cream solder with the push pin, thereby forming a side electrode or a through hole of the printed circuit board. It is pressed against and adhered to the side wall surface. Thereby, the cream solder can be efficiently applied to the side wall of the electrode.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that a tank filled with cream solder and having an open upper side is movable above and below the tank in a horizontal direction so that they can approach and separate from each other. Two squeegees, an imprint plate inserted into and withdrawn from the tank through the two squeegees, and after removing the imprint plate from the tank, the squeegee is separated in parallel with the printed circuit board. And an extruding pin for extruding the cream solder through a hole provided in the imprint plate and filled with the cream solder, and extruding the cream solder with the extruding pin, and the side of the side electrode or through hole of the printed circuit board. This is a cream solder applicator that presses and adheres to the wall surface. Since the pressing on the side wall surface of the side electrode or the through-hole, the cream solder is separated from the extrusion pin, it is applied to the side wall surface of the side electrode or the through-hole. This makes it possible to apply cream solder efficiently.

According to a second aspect of the present invention, a container filled with alcohol is provided, a push pin is inserted into the container, and the alcohol is attached to the tip of the push pin, and then the plate is imprinted on the printing plate. 2. The cream solder application device according to claim 1, wherein the cream solder is inserted into the provided hole, and alcohol is attached to the tip of the push pin, so that the cream solder and the push pin are separated well.

According to a third aspect of the present invention, in the imprint plate of the present invention, a plurality of holes for filling with cream solder are provided, and a plurality of push pins are provided corresponding to the holes. The cream solder applying apparatus described above can apply cream solder to a plurality of places at a time, so that the production efficiency is further improved.

According to the fourth aspect of the present invention, at the time of pushing out the push pin, a minute distance is provided between the tip of the push pin and the upper surface of the printed board, and at least one of the pushed pin or the printed board is horizontally moved. The cream solder application device according to claim 1, wherein the cream solder is pressed against a side surface electrode or a side wall surface of the through hole by moving the push pin and the printed board. Therefore, the configuration of the cream solder application device is simplified, and the number of failures is reduced.

According to a fifth aspect of the present invention, there is provided the cream solder applying apparatus according to the fourth aspect, wherein the tip of the push pin has a taper that opens in the moving direction. Even when the distance from the printed circuit board during the movement of the printed circuit board is reduced, the push pins are safe against the movement of the upper surface of the printed circuit board.

According to a sixth aspect of the present invention, there is provided the cream solder applying apparatus according to the third aspect, wherein the diameter of the through hole is approximately 1 mm and the diameter of the push pin is approximately 0.7 mm. Since cream solder can also be applied to the wall surface of the through hole, a small high-frequency module can be efficiently produced.

According to a seventh aspect of the present invention, the push pin is passed through a hole of an adjustment jig having a constant thickness on a base on which the push pin is implanted, and the upper surface thereof is polished with a grindstone. 4. The cream solder application device according to claim 3, wherein the length of the push pin is adjusted to be constant by using the adjusting jig. .

(Embodiment 1) A cream solder applying apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a main part near a tank for describing a first state of the cream solder applying device. In FIG. 1, reference numeral 21 denotes a stainless steel tank having an upper opening.
The inside is filled with cream solder 22. 23 and 24
Are two squeegees provided above the tank 21 and made of stainless steel (or resin). The squeegees are horizontally movable with respect to each other and are provided so as to be able to approach and separate. 25
Is an imprint plate made of stainless steel. First, the two squeegees 23 and 24 are separated from each other, and the imprint plate 25 is lowered from between them and inserted into the cream solder 22 in the tank 21. At this time, the cream solder 22 penetrates into the hole 25a provided in the imprint plate 25 to become 22a. At this time, the solder amount of the cream solder 22a that has entered is determined by the volume of the hole 25a. In the present embodiment, the thickness is determined by the thickness (0.7 mm) of the imprint plate 25 and the diameter (0.7 mm) of the hole 25a.

Next, the two squeegees 23 and 24 are brought close to each other and brought into contact with the front surface 25b and the back surface 25c of the printing plate 25, and in this state, the printing plate 25 is pulled upward. At this time, the cream solder 22 is adhered to the front surface 25b and the back surface 25c of the imprint plate 25. The squeegees 23 and 24 remove the cream solder 22 and return the cream solder 22 into the tank 21 and the holes 25a.
The inside is reliably filled with the cream solder 22a. For this purpose, the lower surfaces of the squeegees 23 and 24 are inclined downward by approximately 45 degrees with respect to the printing plate 25. This angle may be between 60 degrees and 30 degrees.

FIG. 2 is a cross-sectional view of a main part in a second state near the application section of the cream solder application apparatus. In FIG. 2, the imprint plate 25 pulled out of the tank 21 is placed above the printed circuit board 30 in parallel with the printed circuit board 30. Here, reference numeral 31 denotes a metal shield case, which is connected to a side electrode 32 formed on a side surface of the printed circuit board 30 to form a high-frequency module. The tip 33a of the mounting leg 33 of the shield case 31 is the thickness (0.7 mm) 30a of the printed circuit board 30.
It is inserted to the center of. Reference numeral 27 denotes a stainless steel container, and this container 27 is filled with isopropyl alcohol 28. Reference numeral 29 denotes a push pin. The push pin 29 is inserted into the container 27, an alcohol 28a is attached to the tip 29a, and then the push pin 29 is lowered toward the hole 25a of the printing plate 25.

Then, as shown in FIG. 3, which is a cross-sectional view of the main part in the third state near the application part of the cream solder application device, the push pin 29 is connected to the hole 25 of the printing plate 25.
a, and is lowered toward the side electrode 32 of the printed circuit board 30 (FIG. 4).
reference). Here, the side electrode 32 is used, but this may be a through hole provided in the printed circuit board 30. At this time, the diameter of the through hole is about 1.0 mm,
The push-out pin 29 can be inserted into this through-hole. That is, the cream solder 22a is inserted into the through hole.

However, the push pin 29
Is raised, the cream solder 22a rises while being attached to the push-out pin 29 again, and the cream solder 22a cannot be attached to the side electrode 32. This is because the adhesive force of the cream solder 22a is larger at the tip 29a of the push pin 29 than the sum of the side electrode 32 and the tip 33a.

Then, as shown in FIG. 5, the push pin 29 is moved in the direction of arrow A to press the cream solder 22a against the side electrode 32, and the adhesive force to the side electrode 32 is applied to the tip 29a of the push pin 29. The cream solder 22 a is made to adhere to the side surface electrode 32 by making the adhesive force larger than the adhesive force. In this case, the printed circuit board 30 may be moved in the B direction. In addition, a distance 34 of 0.1 mm is provided between the tip of the push-out pin 29 and the upper surface of the printed circuit board 30 so that the push-out pin 29 can be moved without fail, and the cream solder 22a is placed on the upper surface of the printed circuit board 30. It does not adhere. This is important in a high-frequency module as a surface mount component. That is, if the solder adheres to the upper surface of the printed circuit board 30, the solder becomes a convex portion, and surface mounting becomes difficult. If the tip 29a of the push pin 29 is tapered so as to open in the moving direction, the push pin 29
Does not stop at the side electrode 32 and the movement is safer.

(Embodiment 2) FIG. 6 is a perspective view of a main part of a coating section according to Embodiment 2. In FIG. 6, 40
Is a parent printed circuit board. In the parent printed circuit board 40, 12 × 14 child printed circuit boards 42 are connected in a matrix and formed. Reference numeral 43 denotes a base on which a plurality of push pins 44 are implanted.

FIG. 7 shows the connected child printed circuit board 42a.
It is a principal part perspective view of 42b. In FIG. 7, reference numeral 45 denotes a long through hole, and the side electrodes 45 a and 45 b are formed by dividing the sub-printed board 42 at the dividing section 48. 6, the same number of push pins 44 as the number of the long holes 45 are provided at positions corresponding to the long holes 45.

Reference numeral 46a denotes a mounting leg of the shield case fixed to the side electrode 45a of the sub-printed board 42a, and 46b denotes a mounting leg of the shield case fixed to the side electrode 45b of the sub-printed board 42b. 47
Is cream solder attached to the respective side electrodes 45a and 45b.

Then, first, the child printed circuit board 42a
Then, the cream solder 47 is attached to the side electrode 45a side, and then the parent printed board 40 is rotated by 180 degrees to attach the cream solder 47 to the side electrode 45b side of the child printed board 42b. Thus, the parent printed circuit board 40 is
By rotating the high frequency module on both sides of the secondary printed circuit board 42 and the mounting legs 46 of the shield case.
Can be applied with cream solder 47. The parent printed circuit board 40 is rotated by 90 degrees, and each time the mounting leg 46 of the shield case and the child printed circuit board 42 are rotated.
When the cream solder 47 is attached to the side electrode 45, the cream solder can be applied to the four sides of the high-frequency module and fixed by solder.

FIG. 8 shows a shield case 4 made of cream solder.
FIG. 9 is a perspective view of the high-frequency module after being fixed by heating in a reflow furnace and then divided by a dividing section. In this way, after dividing the high-frequency module, the final inspection is performed,
It is mounted on taping and stored.

FIG. 9 shows an adjustment jig 50 for adjusting the length of the push pin 44. It is important for the push pins 44 implanted on the base 43 to have a uniform length for uniform application of cream solder. Therefore, as shown in FIG.
By using an adjusting jig 50 having a uniform thickness of 0a and polishing the upper surface thereof with a grindstone, the length of the push-out pins 44 is made uniform.

[0027]

As described above, according to the present invention, the cream solder is extruded with the push pins for applying the cream solder onto the printed circuit board, and is pressed and adhered to the side electrodes of the printed circuit board or the side walls of the through holes. Thus, the cream solder can be efficiently applied to the side surfaces of the electrodes.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part showing a first state of a cream solder application device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a main part showing a second state of the same.

FIG. 3 is a sectional view of a main part showing a third state of the same.

FIG. 4 is a sectional view of a main part showing a fourth state of the same.

FIG. 5 is a sectional view of a main part showing a fifth state of the same.

FIG. 6 is a perspective view of a main part of a cream solder application device according to a second embodiment of the present invention.

FIG. 7 is an enlarged perspective view of a main part of the child printed circuit board.

FIG. 8 is a perspective view of the high-frequency module to which the cream solder is fixed using the cream solder applying device.

FIG. 9 is a sectional view of a jig for adjusting a push-out pin of the cream solder applying apparatus.

FIG. 10 is an assembled perspective view of a high-frequency module using a conventional cream solder application device.

FIG. 11 is a perspective view of the high-frequency module assembled by using the cream solder applying device.

FIG. 12 is a sectional view of a main part of a cream solder application device according to another example of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Tank 22 Cream solder 22a Cream solder 23 Squeegee 24 Squeegee 25 Imprint plate 25a Hole 29 Extrusion pin 30 Printed circuit board 32 Side electrode 33 Mounting leg 33a Tip

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Junichi Kimura 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. Term (reference) 4F040 AA12 AA33 AB20 AC01 BA02 CA12 5E319 AC01 BB05 CD27 CD29

Claims (7)

[Claims] 1. A tank filled with cream solder and having an open top, two squeegees provided above the tank so as to be movable toward and away from each other in a horizontal direction, and A printing plate to be inserted into and withdrawn from the tank through the squeegee; and a printing plate which is removed from the tank and placed parallel to the printed circuit board and separated from the tank. An extruding pin for extruding the cream solder through the hole filled with the solder, and a cream solder applying device for extruding the cream solder with the extruding pin and pressing and attaching the cream solder to the side surface electrode of the printed circuit board or the side wall surface of the through hole. 2. A container filled with alcohol is provided, a push pin is inserted into the container, the alcohol is attached to the tip of the push pin, and then inserted into a hole provided in the printing plate. The cream solder application device according to claim 1. 3. The cream solder application apparatus according to claim 1, wherein the printing plate is provided with a plurality of holes into which the cream solder is filled, and a plurality of push pins are provided corresponding to these holes. . 4. When the push pin is pushed out, a minute distance is provided between the tip of the push pin and the upper surface of the printed board, and at least one of the pushed pin or the printed board is moved in the horizontal direction, so that the cream is formed. 2. The cream solder application device according to claim 1, wherein the solder is pressed against the side surface electrode or the side wall surface of the through hole. 5. The cream solder application device according to claim 4, wherein the tip of the push pin has a taper that opens in the moving direction. 6. The through-hole having a diameter of about 1 mm and the push pin having a diameter of about 0.7 mm.
3. The cream solder application device according to item 1. 7. The length of the push-out pin is reduced by passing the push-out pin through a hole of an adjusting jig having a constant thickness on a base on which the push-out pin is implanted, and polishing the upper surface thereof with a grindstone. 4. The cream solder application device according to claim 3, wherein the thickness is adjusted to be constant.