JP2000277006A - Display panel manufacturing method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To enable high-quality display at low cost. SOLUTION: A step (b) of forming a photosensitive coating layer 104 on a substrate, and a groove 106 having a predetermined pattern is formed in the photosensitive coating layer.
(D), a step (e) of roughening the substrate surface, a step (f) of embedding a partition material by thermal spraying in the groove 106, and removing the photosensitive coating layer to form a partition having a predetermined shape. It is characterized by having at least a step (h) for obtaining.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a display panel such as a plasma display panel used for a display device.

[0002]

2. Description of the Related Art In recent years, a plasma display panel, which has attracted attention as a thin display device, has, for example, a structure shown in FIG. The plasma display panel includes a front substrate 300 arranged opposite to each other.
And a back substrate 301. On the front substrate 300, display electrodes 302 and 303, a dielectric layer 304, and an MgO dielectric protection layer 305 are sequentially formed. An address electrode 306 and a dielectric layer 307 are formed on the rear substrate 301, and a partition 308 is further formed thereon, and a phosphor layer 309 is applied on side surfaces of the partition 308. ing.

A discharge gas 310 is sealed between the front substrate 300 and the rear substrate 301 at a predetermined pressure. The discharge gas 310 is discharged between the display electrodes 302 and 303 to generate ultraviolet rays, and the ultraviolet rays are emitted from the phosphor layer 30.
By irradiating 9, image display including color display becomes possible. It should be noted that, in reality, unlike the drawing, the configuration is such that one of the substrates is rotated by 90 degrees,
Are arranged to intersect.

[0004] The partition wall 308 has a color (G, B,
R) is a partition for forming a discharge cell by forming a minute discharge space, and the partition wall 308 enables the discharge to be controlled for each cell, thereby preventing erroneous discharge and erroneous display. it can. The size of the partition wall 308 is typically, in a 40-inch NTSC panel, a partition wall pitch of 360 μm per color and a partition top width of 50 μm to 1 μm.
00 μm, and the partition height is 100 μm to 150 μm.

[0005] As a conventional method of forming a partition, (1) a printing method of forming a partition using a screen printing technique,
(2) After applying a partition material to the entire surface of the rear substrate, a photosensitive film layer is formed on the coated partition material, a predetermined pattern is formed by a photographic method, and unnecessary portions of the partition material are removed by sandblasting. A sand blast method of peeling off the photosensitive film layer to form a partition, (3) a photo paste method of applying a photosensitive paste and removing unnecessary portions by a photographic method to form a partition, and (4) a photosensitive film on a substrate. A photo-embedding method (or a lift-off method) in which a layer is formed, a predetermined pattern is formed by a photographic method, a paste is buried in the groove of the pattern, the photosensitive film is peeled off, and then the paste is baked in a firing step. ), And the like.

[0006]

However, each of these conventional methods for forming a partition has the following problems.

First, in the printing method, since the height of the partition walls that can be formed in one printing process is about 10 μm,
In order to form a partition having a height of about m, it is necessary to repeat the printing step and the drying step.

This causes an increase in the number of steps and cost. In addition, as the screen becomes larger, the non-linear expansion and contraction of the screen plate becomes remarkable, and the displacement of the formed partition walls and variations in the film thickness or shape are caused. growing.

The sand blast method has problems that the amount of material to be removed is large and that the amount of cutting is difficult to control, and the substrate and the electrode are easily damaged.

In the photosensitive paste method, the cost of the paste material is high.

Although the photo-embedding method can realize a high-definition plasma display panel, the sintering step for forming the partition walls hinders the realization of low-cost manufacturing.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-mentioned problems of the prior art, and has as its object to realize a display panel which enables high-quality display at low cost.

[0013]

In order to achieve the above object, the present invention provides a step of forming a photosensitive coating layer on a substrate and a step of forming a groove in a predetermined pattern in the photosensitive coating layer. And, a step of roughening the surface of the substrate, a step of embedding a partition material in the groove, and removing the photosensitive coating layer,
The method is characterized by including at least a step of obtaining a partition having a predetermined shape.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same portions are denoted by the same reference numerals and description thereof may be omitted.

In the present embodiment, a plasma spraying method which is a kind of the thermal spraying method (for example, Japanese Patent Application No. 10-295891).
The process of forming the barrier ribs of the plasma display panel using will be described below.

(Configuration of Plasma Spraying Apparatus) First, the configuration of the plasma spraying apparatus will be described. FIG. 2 is a diagram schematically showing a configuration of the plasma spraying apparatus. As shown in FIG. 2, a plasma spraying torch 200 included in the plasma spraying apparatus has a water-cooled cathode 201 and a water-cooled anode 202. A DC voltage is applied between the electrodes 201 and 202 from a DC power supply 203 to generate an arc discharge 20.
4 is generated.

A plasma working gas 206 is supplied from a gas port 205 attached to the rear of the plasma spray torch 200.
Is supplied. The supplied plasma working gas 206 is
Arc discharge 2 generated between electrode 201 and electrode 202
The plasma is jetted from the nozzle 208 as a plasma jet 207. Plasma working gas 2
As 06, argon, helium, nitrogen, hydrogen and the like can be used. In this embodiment, argon or a mixed gas of argon and helium is used.

A thermal spray material 209 serving as a material of the partition wall is placed in a carrier gas from a supply port 210 in a powder state and is blown into a plasma jet 207. The supplied thermal spray material 209 is heated and melted by the plasma jet 207 and collides with the substrate 211 (thickness: t) on which the pattern of the photosensitive coating layer 212 is formed at a high speed. As a result, a coating (sprayed film) 213 is deposited on the surface of the substrate 211.

Further, preferably, the cooling gas port 214
Is installed, and at the same time as the thermal spraying of the plasma jet 207,
A cooling gas is blown onto the substrate 211. However, description and illustration of a specific piping configuration of the cooling gas port 214 are omitted here for simplification.

(Partition Forming Process Using Thermal Spraying Method) Next, the partitioning forming process using the thermal spraying method in the present embodiment will be described with reference to FIG. FIG. 1 (a) to (h)
FIG. 2 is a cross-sectional view of a main part showing each step of the above process.

First, as shown in FIG. 1A, an address electrode 101 is formed on a glass substrate 100. As the glass substrate 100, for example, soda glass or high strain point glass having a thickness of 2.8 mm is used. Address electrode 1
01, the underlayer 1 made of, for example, dielectric glass
02 is formed.

In the following description, for convenience, the structure including the glass substrate 100, the address electrodes 101, and the underlayer 102 will be collectively referred to as a substrate 103. Also in the following description, similarly, a configuration including a substrate and an address electrode and a base layer formed thereon is generally referred to as a substrate. It goes without saying that the configuration described above can be considered.

Next, as shown in FIG.
On top of this, a photosensitive coating layer 104 made of, for example, an organic photosensitive resin is formed. In the present embodiment, a photosensitive dry film resist (hereinafter, referred to as “DFR”) is used as the photosensitive coating layer 104 to form a 60 μm thick D
Two layers of FR are stacked to a thickness of 120 μm.

Next, as shown in FIG. 1C, exposure is performed by irradiating with ultraviolet light (UV light) using a photomask 105 having a predetermined pattern width and pitch. The amount of exposure is optimized according to the pattern width and pitch of the photomask 105.

In the step shown in FIG. 1D, development is performed after exposure. As a developing solution, a 1% aqueous solution of sodium carbonate is used. After exposure and development processes, a groove (opening portion) 106 having a predetermined pattern in a stripe shape is formed in the DFR 104. The size of the groove 106 is typically such that the upper open groove width is 80 μm and the pitch is 360 μm.
m.

Next, as shown in FIG. 1E, the surface of the substrate, that is, the surface of the base film 102 in this embodiment is roughened by spraying a blast material 1001 onto the surface of the substrate.
As the blast material 1001, an inorganic material, for example, alumina of 92 w% or more can be used. By roughening the surface of the substrate, the adhesion between the material of the partition and the surface of the substrate is improved by the anchor effect when the partition is formed.

Next, after forming the pattern of the groove 106, as shown in FIG. 1F, plasma spraying is performed from above the substrate 103, and a sprayed film (partition material) 107 is deposited in the groove 106 of the DFR 104. Let it. Specifically, a cooling gas port 110 is provided in the plasma spraying torch 108, and a cooling gas 111 is sprayed on the substrate surface simultaneously with the spraying of the plasma jet 109.

As shown in FIG. 4, the plasma spraying torch 108 is moved by a scanning pattern 401 scanning in parallel with the longitudinal direction of the groove and a scanning pattern 402 scanning in a direction perpendicular to the longitudinal direction of the groove. Can be taken,
In this embodiment, it is assumed that the plasma spray torch 108 scans in parallel with the longitudinal direction of the groove.

As the cooling gas 111, a nitrogen gas is used. Due to the action of the cooling gas 111, D
Damage to the FR 104 is reduced, and a highly accurate partition wall can be formed.

In this thermal spraying step, the thermal spray film 107
It is mainly deposited inside the groove 106 of the FR 104, and is usually deposited so as to rise upward from the surface of the DFR 104. However, the thermal spray film hardly deposits (adheres) on the surrounding DFR 104.

Next, as shown in FIG.
The portion of the thermal sprayed film 107 protruding from the surface of the DFR 104 is mainly removed by polishing, and the surface of the thermal sprayed film 107 deposited inside the groove 106 of the DFR 104 is planarized.

However, from the surface of the DFR 104,
If 7 does not pop out, polishing can be dispensed with. Even if the sprayed film 107 does not protrude from the surface of the DFR 104, it is not unfortunate that polishing for flattening is performed.

Next, there is a step of removing the photosensitive resin between the partition walls. As one of the methods, there is a method of removing using a stripper, but in this embodiment, it is removed by firing. That is, as shown in FIG. 1H, by firing the substrate 103 in a high-temperature atmosphere containing oxygen, the organic photosensitive resin is burned and removed, and a partition 1071 having a predetermined shape is formed on the substrate. I do.

Organic photosensitive resin has a temperature of 350 ° C.
It begins to burn at about 400 degrees, rises to 550 to 570 degrees, and cools the substrate for about 3 hours.

As described above, according to this embodiment, the DFR
The surface of the base film 102 is roughened by spraying a blast material on the surface of the substrate on which the grooves 106 having the predetermined pattern are formed in the grooves 104. Can be easily manufactured in a short time at low cost.

The average particle diameter of the fine particles is one of the partition opening width.
/ 3 or less or 30 μm or less.

For the photosensitive coating layer, a negative type photosensitive resist or a negative type photosensitive resist may be used. The partition may be formed by embedding a paste-like partition material. Further, a cleaning step may be provided after the step of roughening the substrate surface.

[0038]

As described above, according to the present invention, an excellent display device can be easily manufactured at low cost and in a short time.

[Brief description of the drawings]

FIG. 1A to FIG. 1H are views showing each step of a partition wall forming process using a thermal spraying method according to an embodiment of the present invention.

FIG. 2 is a view schematically showing one configuration example of a plasma spraying apparatus used in the present embodiment.

FIG. 3 is a diagram schematically showing a configuration of a plasma display panel.

FIG. 4 (a) is a view showing the relationship between the moving direction of a plasma spraying torch and the direction of a stripe-shaped groove pattern of a dry film resist (DFR) on a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 100 Glass substrate 101 Address electrode 102 Underlayer 103 Substrate 104 Photosensitive coating layer (DFR) 105 Photomask 106 Groove (open groove part) 107 Thermal spray film (partition material) 108 Plasma spray torch 109 Plasma jet 110 Cooling gas port 111 Cooling gas 200 Plasma spraying torch 201 Cathode 202 Anode 203 DC power supply 204 Arc discharge 205 Gas port 206 Plasma working gas 207 Plasma jet 208 Nozzle 209 Thermal spray material 210 Supply port 212 Photosensitive coating layer 211 Substrate 213 Thermal spray film 214 Cooling gas port 300 Front substrate 301 Back substrate 302 Display electrode 303 Display electrode 304 Dielectric layer 305 Dielectric protection layer 306 Address electrode 307 Dielectric layer 308 Partition wall 309 Phosphor layer 310 Discharge gas 1001 blasting material

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Taku Watanabe 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Hideki Ashida 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co. Terms (reference) 5C027 AA09 5C040 FA01 GB03 GB14 GF02 GF19 JA07 JA28 MA23

Claims (9)

[Claims] Forming a photosensitive coating layer on a substrate;
Forming a groove of a predetermined pattern in the photosensitive coating layer, roughening the substrate surface, embedding a partition material in the groove, removing the photosensitive coating layer, A method for manufacturing a display panel, comprising at least a step of obtaining a partition having a shape. 2. The method for manufacturing a display panel according to claim 1, wherein the substrate surface is roughened using a thrust material made of an inorganic material. 3. The method according to claim 1, wherein the average particle size of the fine particles is 1/3 of the partition wall opening width.
2. The method for manufacturing a display panel according to claim 1, wherein the thickness is 30 μm or less. 4. The method according to claim 1, wherein the photosensitive coating layer is a negative type photosensitive resist. 5. The method according to claim 1, wherein the photosensitive coating layer is a positive type photosensitive resist. 6. The method of manufacturing a display panel according to claim 1, wherein the partition is a thermal sprayed film formed by spraying a material of the partition. 7. The method for manufacturing a display panel according to claim 6, wherein the thermal spraying is plasma thermal spraying. 8. The method according to claim 1, wherein the partition is formed by embedding a paste-like partition material. 9. The method of manufacturing a display panel according to claim 1, further comprising a cleaning step after the step of roughening the substrate surface.