JP2000277975A - Electromagnetic wave shield circuit board and method of manufacturing the same - Google Patents
Electromagnetic wave shield circuit board and method of manufacturing the sameInfo
- Publication number
- JP2000277975A JP2000277975A JP11082479A JP8247999A JP2000277975A JP 2000277975 A JP2000277975 A JP 2000277975A JP 11082479 A JP11082479 A JP 11082479A JP 8247999 A JP8247999 A JP 8247999A JP 2000277975 A JP2000277975 A JP 2000277975A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- circuit board
- insulating layer
- shield
- conductive circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 電磁波シールド効果に優れたシールド回路基
板とその製造方法を提供する。
【構成】 熱可塑性液晶ポリマーからなる絶縁層３を用
い、この絶縁層３で導電回路２の周りを覆って回路基板
１とし、その両面に導電回路２を挟むように電磁波シー
ルド体４を設け、この電磁波シールド体４の周縁を互い
に接触するように両面あるいは片面から熱押圧して、各
電磁波シールド体４により導電回路２とその周囲の絶縁
層３を取り囲む。
(57) [Summary] [Object] To provide a shielded circuit board excellent in an electromagnetic wave shielding effect and a manufacturing method thereof. An insulating layer made of a thermoplastic liquid crystal polymer is used, a circuit board is formed by covering the conductive circuit with the insulating layer, and electromagnetic wave shields are provided on both sides of the circuit board so as to sandwich the conductive circuit. The peripheral edges of the electromagnetic wave shields 4 are heat-pressed from both surfaces or one surface so as to contact each other, and each of the electromagnetic wave shields 4 surrounds the conductive circuit 2 and the insulating layer 3 therearound.
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電磁波に対する
シールド効果に優れたシールド回路基板およびその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shielded circuit board having an excellent electromagnetic wave shielding effect and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来より、電磁波シールド配線として、
単線の同軸ケーブルを用いるものが知られている。この
シールド配線は、基本的に導電線を絶縁材料で覆い、そ
の上に電磁波シールド用の金属を被せた構造となってい
る。2. Description of the Related Art Conventionally, as an electromagnetic shielding wire,
One using a single-wire coaxial cable is known. This shield wiring basically has a structure in which a conductive wire is covered with an insulating material, and a metal for electromagnetic wave shielding is placed on the conductive wire.
【０００３】[0003]
【発明が解決しようとする課題】上記と同様の構造を、
プリント配線基板のような回路基板に合理的に適用でき
れば、近年めざましい発達を見せている電子回路の高密
度化、高周波数化のさらなる発展に寄与する。しかしな
がら、このような構造を有する電磁波シールド回路基板
は、未だ知られていない。A structure similar to the above is
If it can be applied rationally to a circuit board such as a printed wiring board, it will contribute to further development of higher density and higher frequency of electronic circuits which have been remarkably developed in recent years. However, an electromagnetic wave shielding circuit board having such a structure has not been known yet.
【０００４】本発明者らは、電磁波シールド効果に優れ
たシールド回路基板を得るために、次のことを検討し
た。すなわち、配線が設けられた導電回路の上下両面
に、ポリエステル、ポリエチレン、ポリプロピレンなど
の熱可塑性樹脂からなる絶縁層を設けて回路基板とし、
さらにこれの上下両面に導電回路を挟むように導電材料
からなる電磁波シールド体を接着し、これらシールド体
により内部の導電回路を保護する。しかし、単に回路基
板の上下両面に電磁波シールド体を設けるだけでは、導
電回路の側部の外周囲はシールドされないので、十分な
シールド効果は得られない。The present inventors have studied the following in order to obtain a shield circuit board having an excellent electromagnetic wave shielding effect. That is, an insulating layer made of a thermoplastic resin such as polyester, polyethylene, or polypropylene is provided on the upper and lower surfaces of the conductive circuit provided with the wiring to form a circuit board,
Further, an electromagnetic wave shield made of a conductive material is adhered to both upper and lower surfaces of the conductive circuit so as to sandwich the conductive circuit, and the inner conductive circuit is protected by these shields. However, simply providing the electromagnetic wave shields on both the upper and lower surfaces of the circuit board does not shield the outer periphery of the side of the conductive circuit, so that a sufficient shielding effect cannot be obtained.
【０００５】そこで、回路基板の上下両面に設ける各電
磁波シールド体の周縁を、互いに接触するように両面あ
るいは片面から熱押圧（加熱しながら押圧）して、各シ
ールド体で導電回路とその周囲の絶縁層を取り囲むこと
により、導電回路の周りをシールドすることを考えた。
しかし、以上の熱可塑性樹脂を絶縁層として用いる場
合、前記回路基板の両面あるいは片面から熱押圧して
も、この回路基板の両面に設けた電磁波シールド体同士
を電気的に接続させることはできず、また各シールド体
の間は密接されない。これは、熱押圧時に熱可塑性樹脂
がシールド体同士の接続部位に電気絶縁性のある被膜を
形成するためである。ここで、各シールド体が電気的に
接続されていないと、例えば各シールド体のアース配線
を行うときに不便となり、また各シールド体の間に被膜
が存在すると、この被膜により電磁波シールド効果が損
なわれるなどの不都合を招く。Therefore, the periphery of each electromagnetic wave shield provided on the upper and lower surfaces of the circuit board is hot-pressed (pressed while heating) from both surfaces or one surface so as to be in contact with each other. We considered shielding around the conductive circuit by surrounding the insulating layer.
However, when the above-mentioned thermoplastic resin is used as the insulating layer, even if heat is applied from both sides or one side of the circuit board, the electromagnetic shielding members provided on both sides of the circuit board cannot be electrically connected to each other. Also, there is no closeness between the shields. This is because the thermoplastic resin forms an electrically insulating film at the connection site between the shields when hot pressed. Here, if the shields are not electrically connected, it becomes inconvenient when, for example, grounding the shields, and if there is a coating between the shields, the coating impairs the electromagnetic wave shielding effect. Cause inconveniences such as
【０００６】本発明者は、さらに研究を続けた結果、光
学的異方性の溶融相を形成し得る熱可塑性ポリマー（以
下、熱可塑性液晶ポリマーと称する）は、耐熱性、電気
絶縁性、高周波特性に優れた長所を有し（吉川淳夫，表
面実装技術，ｐ５４，１９９７．６．号）、一方、溶融
状態でねばりがなく、造膜性に乏しくて被膜になり難い
（末永純一「成形・設計のための液晶ポリマー」シグマ
出版、１２７頁）という短所を有していることに着目し
た。そして、熱可塑性液晶ポリマーが造膜性に乏しいと
いう短所を利用すれば、前記電磁波シールド体同士の接
続部位において電気絶縁性被膜を形成することなく、シ
ールド体同士を電気的に良好に接続させることができ、
また、２つのシールド体の間に実質的に被膜が形成され
ず両者の間を密接状態にできて、電磁波シールド効果を
高め得ることを見出した。そこで、本発明の目的は、電
磁波シールド効果に優れたシールド回路基板とその製造
方法を提供することにある。As a result of further studies, the present inventor has found that a thermoplastic polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a thermoplastic liquid crystal polymer) has heat resistance, electrical insulation, and high frequency. It has the advantage of excellent properties (Atsuo Yoshikawa, Surface Mount Technology, p54, 1997.6), but has no stickiness in the molten state, has poor film-forming properties, and is hardly formed into a film (Junichi Suenaga, " Liquid Crystal Polymer for Design ”, Sigma Publishing, p. 127). If the disadvantage that the thermoplastic liquid crystal polymer has poor film-forming properties is used, the shields can be electrically connected to each other without forming an electrically insulating coating at the connection portion between the electromagnetic shields. Can be
Further, it has been found that a coating is not substantially formed between the two shields, and the two can be brought into close contact with each other, so that the electromagnetic wave shielding effect can be enhanced. Therefore, an object of the present invention is to provide a shield circuit board having an excellent electromagnetic wave shielding effect and a method of manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の電磁波シールド回路基板は、基本的には、
電磁波シールド体により導電回路と絶縁層とが取り囲ま
れた構造を有し、該導電回路が該絶縁層で覆われてお
り、該絶縁層が熱可塑性液晶ポリマーからなることを特
徴とする。この構成によれば、電磁波シールド効果に優
れ、かつ、熱可塑性液晶ポリマーにより、耐熱性、電気
絶縁性および高周波特性にも優れたシールド回路基板が
得られる。In order to achieve the above object, an electromagnetic wave shielding circuit board of the present invention basically comprises:
It has a structure in which a conductive circuit and an insulating layer are surrounded by an electromagnetic wave shield, the conductive circuit is covered with the insulating layer, and the insulating layer is made of a thermoplastic liquid crystal polymer. According to this configuration, it is possible to obtain a shield circuit board having an excellent electromagnetic wave shielding effect and also having excellent heat resistance, electric insulation, and high-frequency characteristics due to the thermoplastic liquid crystal polymer.
【０００８】また、本発明の電磁波シールド回路基板の
製造方法は、熱可塑性液晶ポリマーからなる絶縁層を用
い、この絶縁層で導電回路の周りを覆って回路基板と
し、その両面に導電回路を挟むように電磁波シールド体
を設け、この電磁波シールド体の周縁を互いに接触する
ように両面あるいは片面から熱押圧して、各電磁波シー
ルド体により導電回路とその周囲の絶縁層を取り囲む。The method of manufacturing an electromagnetic wave shield circuit board according to the present invention uses an insulating layer made of a thermoplastic liquid crystal polymer, covers the conductive circuit with the insulating layer to form a circuit board, and sandwiches the conductive circuit on both sides. The electromagnetic wave shields are provided as described above, and the peripheral edges of the electromagnetic wave shields are heat-pressed from both surfaces or one surface so as to be in contact with each other, and each of the electromagnetic wave shields surrounds the conductive circuit and the surrounding insulating layer.
【０００９】この製造方法によれば、電磁波シールド効
果に優れたシールド回路基板が容易に得られる。また、
得られたシールド回路基板は、絶縁層として熱可塑性液
晶ポリマーを用いたことにより、２つの電磁波シールド
体の間には実質的に被膜が存在せず、これらシールド体
は互いに密接状態となって電気的に接続される。したが
って、シールド効果が高められるとともに、これらシー
ルド体を１本のアースラインで容易にアースできる。According to this manufacturing method, a shield circuit board having an excellent electromagnetic wave shielding effect can be easily obtained. Also,
In the obtained shield circuit board, since the thermoplastic liquid crystal polymer was used as the insulating layer, there was substantially no coating between the two electromagnetic wave shields, and the shields were brought into close contact with each other to make electrical Connected. Therefore, the shield effect is enhanced, and these shields can be easily grounded with a single ground line.
【００１０】また、本発明の電磁波シールド回路基板
は、基本的には、電磁波シールド体により導電回路と絶
縁層が取り囲まれた構造を有し、該導電回路が絶縁層で
覆われており、該絶縁層が熱可塑性液晶ポリマーからな
ることを特徴とする。The electromagnetic wave shield circuit board of the present invention basically has a structure in which a conductive circuit and an insulating layer are surrounded by an electromagnetic wave shield, and the conductive circuit is covered with an insulating layer. The insulating layer is made of a thermoplastic liquid crystal polymer.
【００１１】前記絶縁層の材料である熱可塑性液晶ポリ
マーは、特に限定されるものではないが、その具体例と
して、以下に例示する（１）から（４）に分類される化
合物およびその誘導体から導かれる公知のサーモトロピ
ック液晶ポリエステルおよびサーモトロピック液晶ポリ
エステルアミドを挙げることができる。但し、光学的に
異方性の溶融相を形成し得るポリマーを得るためには、
各々の原料化合物の組み合わせには適当な範囲があるこ
とは言うまでもない。The thermoplastic liquid crystal polymer as the material of the insulating layer is not particularly limited, but specific examples thereof include compounds (1) to (4) and derivatives thereof as exemplified below. There may be mentioned known thermotropic liquid crystal polyesters and thermotropic liquid crystal polyesteramides. However, in order to obtain a polymer capable of forming an optically anisotropic molten phase,
It goes without saying that there is an appropriate range for each combination of the starting compounds.
【００１２】（１）芳香族または脂肪族ジヒドロキシ化
合物（代表例は表１参照）(1) Aromatic or aliphatic dihydroxy compounds (see Table 1 for typical examples)
【００１３】[0013]
【表１】 [Table 1]
【００１４】（２）芳香族または脂肪族ジカルボン酸
（代表例は表２参照）(2) Aromatic or aliphatic dicarboxylic acids (see Table 2 for typical examples)
【００１５】[0015]
【表２】 [Table 2]
【００１６】（３）芳香族ヒドロキシカルボン酸（代表
例は表３参照）(3) Aromatic hydroxycarboxylic acids (see Table 3 for typical examples)
【００１７】[0017]
【表３】 [Table 3]
【００１８】（４）芳香族ジアミン、芳香族ヒドロキシ
アミンまたは芳香族アミノカルボン酸（代表例は表４参
照）(4) Aromatic diamine, aromatic hydroxyamine or aromatic aminocarboxylic acid (see Table 4 for typical examples)
【００１９】[0019]
【表４】 [Table 4]
【００２０】これらの原料化合物から得られる熱可塑性
液晶ポリマーの代表例として表５に示す構造単位を有す
る共重合体（ａ）〜（ｅ）を挙げることができる。Representative examples of the thermoplastic liquid crystal polymer obtained from these starting compounds include copolymers (a) to (e) having the structural units shown in Table 5.
【００２１】[0021]
【表５】 [Table 5]
【００２２】また、本発明では、絶縁層として前記熱可
塑性液晶ポリマーをフィルムの形で使用するのが好まし
い。このフィルムは、フィルムの所望の耐熱性および加
工性を得る目的においては、約２００〜約４００℃の範
囲内、とりわけ約２５０〜約３５０℃の範囲内に融点を
有するものが好ましいが、フィルム製造の観点からは、
比較的低い融点のものが好ましい。したがって、より高
い耐熱性や融点が必要な場合には、一旦得られたフィル
ムを加熱処理することによって、所望の耐熱性や融点に
まで高めることが有利である。加熱処理の条件の一例を
説明すれば、一旦得られたフィルムの融点が２８３℃の
場合でも、２６０℃で５時間加熱すれば、融点は３２０
℃になる。In the present invention, it is preferable to use the thermoplastic liquid crystal polymer as a film as an insulating layer. The film preferably has a melting point in the range of about 200 to about 400C, particularly about 250 to about 350C for the purpose of obtaining the desired heat resistance and processability of the film. From the perspective of
Those with relatively low melting points are preferred. Therefore, when a higher heat resistance and a higher melting point are required, it is advantageous to heat the obtained film to a desired heat resistance and a higher melting point. To explain an example of the condition of the heat treatment, even if the melting point of the obtained film is 283 ° C., if the film is heated at 260 ° C. for 5 hours, the melting point becomes 320.
° C.
【００２３】前記熱可塑性液晶ポリマーフィルムは、熱
可塑性液晶ポリマーを押出成形して得られる。任意の押
出成形法がこの目的のために適用されるが、周知のＴダ
イ法、インフレーション法、ラミネート体延伸法等、あ
るいはこれらの方法を組み合わせた方法が工業的に有利
である。特にインフレーション法やラミネート体延伸法
では、フィルムの長手方向（以下、ＭＤ方向と略す）だ
けでなく、これと直交する幅方向（以下、ＴＤ方向と略
す）にも応力が加えられるため、ＭＤ方向とＴＤ方向に
おける機械的性質および熱的性質のバランスのとれたフ
ィルムを得ることができる。The thermoplastic liquid crystal polymer film is obtained by extruding a thermoplastic liquid crystal polymer. Any extrusion molding method can be applied for this purpose, but the well-known T-die method, inflation method, laminate drawing method, or a combination of these methods is industrially advantageous. In particular, in the inflation method or the laminate stretching method, stress is applied not only in the longitudinal direction of the film (hereinafter abbreviated as the MD direction) but also in the width direction perpendicular thereto (hereinafter abbreviated as the TD direction). And a film in which mechanical properties and thermal properties in the TD direction are well balanced.
【００２４】また、前記電磁波シールド体としては金属
を用い、これを焼き鈍して熱押圧することが好ましい。
このとき、電磁波シールド体の材料である金属として
は、金属箔や金属鍍金または金属蒸着によるものを用い
ることができる。また、金属は軟らかいものほどよく、
これを用いれば熱押圧したとき変形し易いので、各電磁
波シールド体を容易に接触させられる。しかし、材料と
して、例えば軟らかい金属箔を作業の当初から用いて、
電磁波シールド回路基板を作ることは、金属箔の取り扱
いが困難となって、作業性が悪くなる。したがって、材
料としては比較的硬くて取り扱いが容易な銅箔などの金
属箔を用い、この金属箔を前記回路基板の両面に熱接着
することが好ましい。また、この金属箔の熱接着時また
は熱接着した後、もしくは金属箔をエッチングするなど
して電磁波シールド体を形成した後に、金属箔を焼き鈍
し処理するようにすれば、この金属箔の延展性が高めら
れて容易に変形し、同時に熱可塑性液晶ポリマーからな
る絶縁層が軟化もしくは溶融されるので、各金属箔を互
いに簡単に接触させられる。It is preferable that a metal is used as the electromagnetic wave shield, which is annealed and hot pressed.
At this time, as the metal which is the material of the electromagnetic wave shield, a metal foil, metal plating or metal deposition can be used. Also, the softer the metal, the better
If this is used, it is easy to deform when hot pressed, so that each electromagnetic wave shield can be easily brought into contact. However, as a material, for example, using a soft metal foil from the beginning of the work,
Making an electromagnetic wave shielding circuit board makes it difficult to handle the metal foil, resulting in poor workability. Therefore, it is preferable to use a metal foil such as a copper foil that is relatively hard and easy to handle as a material, and heat-bond this metal foil to both sides of the circuit board. Also, if the metal foil is annealed and treated at the time of heat bonding of the metal foil or after the heat bonding, or after forming the electromagnetic wave shielding body by etching the metal foil, etc., the extensibility of the metal foil is improved. The metal foils can be easily brought into contact with each other because the insulating layer made of the thermoplastic liquid crystal polymer is softened or melted at the same time as the resin foil is raised and easily deformed.
【００２５】上記した熱可塑性液晶ポリマーは耐熱性に
優れているために、金属の焼き鈍し温度においても、熱
劣化はほとんど起らない。したがって、電磁波シールド
体と絶縁層との熱接着時または熱接着した後、もしくは
電磁波シールド体を形成した後に、電磁波シールド体を
焼き鈍し処理することが可能となる。電磁波シールド体
の材料は、導電性材質であれば何でもよいが、特に銅は
比較的安価であり、回路基板の材料としても通常用いら
れ、焼き鈍し温度（２６０〜３００℃）が熱可塑性液晶
ポリマーの耐熱性上限（３５０〜４５０℃）よりも低い
ので、特に好適である。Since the above-mentioned thermoplastic liquid crystal polymer has excellent heat resistance, almost no thermal deterioration occurs even at the annealing temperature of the metal. Therefore, it is possible to anneal and process the electromagnetic wave shield body during or after the electromagnetic wave shield body and the insulating layer are thermally bonded or after the electromagnetic wave shield body is formed. The material of the electromagnetic wave shield may be any material as long as it is a conductive material. In particular, copper is relatively inexpensive and is usually used as a material of a circuit board, and the annealing temperature (260 to 300 ° C.) Since it is lower than the heat resistance upper limit (350 to 450 ° C.), it is particularly preferable.
【００２６】[0026]
【発明の実施の形態】以下、本発明の一実施形態を図面
により説明する。先ず、図１のように、配線が設けられ
た導電回路２の全体を、熱可塑性液晶ポリマーフィルム
からなる絶縁層３，３によりサンドイッチ状に上下から
挟み込んで回路基板１とする。また、この回路基板１の
上下両面に、導電回路２の上下および左右を覆えるよう
に、これよりも広幅の、例えば銅箔からなる電磁波シー
ルド体４、４を熱接着させる。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. First, as shown in FIG. 1, the entirety of the conductive circuit 2 provided with the wiring is sandwiched between insulating layers 3 and 3 made of a thermoplastic liquid crystal polymer film from above and below to form a circuit board 1. Electromagnetic shields 4, 4 made of, for example, copper foil and having a wider width than the conductive circuit 2 are thermally bonded to the upper and lower surfaces of the circuit board 1 so as to cover the upper, lower, left, and right sides of the conductive circuit 2.
【００２７】ついで、断面半円弧状とされ、その先端の
押圧面がフラットな一対の熱プレス５、５を用い、その
間に前記シールド体４を介装して、この各シールド体４
の左右両側縁を熱プレス５により絶縁層３を軟化点温度
以上の温度に加熱しながら上下方向から熱押圧する。す
ると、各熱プレス５により各シールド体４が焼き鈍さ
れ、同時に各絶縁層３が軟化もしくは溶融され、各シー
ルド体４の左右両側部が接触面４ａで密着される。Next, a pair of heat presses 5 and 5 having a semi-circular cross section and a flat pressing surface at the tip are used, and the shields 4 are interposed therebetween, and each of the shields 4 is inserted.
The left and right side edges are heated by a hot press 5 while the insulating layer 3 is heated to a temperature equal to or higher than the softening point while being pressed vertically. Then, each shield body 4 is annealed by each heat press 5, and at the same time, each insulating layer 3 is softened or melted, and both right and left sides of each shield body 4 are brought into close contact with the contact surface 4a.
【００２８】この結果、図２、３のように、各シールド
体４により導電回路２とその周囲の絶縁層３を取り囲ん
でなる電磁波シールド回路基板６が得られる。また、前
記導電回路２に接続するリード線７は、シールド体４の
開放側（図３の上下部分の非密接部）から外方に引出
す。As a result, as shown in FIGS. 2 and 3, an electromagnetic wave shielding circuit board 6 in which the conductive circuit 2 and the insulating layer 3 around the conductive circuit 2 are surrounded by the shields 4 is obtained. Further, the lead wire 7 connected to the conductive circuit 2 is drawn out from the open side of the shield body 4 (the non-close portion of the upper and lower portions in FIG. 3).
【００２９】図４に示す他の実施形態では、回路基板１
の上下面に電磁波シールド体４を熱接着したものをベー
ス８上に置き、前記シールド体４の上方側からのみ熱プ
レス５で熱押圧して、下方側のシールド体４は変形させ
ることなく、上方側のシールド体４だけを変形させて、
この上方側の断面蒲鉾状のシールド体４により、導電回
路２とその周囲の絶縁層３を取り囲んで、電磁波シール
ド回路基板６を形成している。In another embodiment shown in FIG.
The electromagnetic wave shield 4 is thermally bonded to the upper and lower surfaces of the shield 4 and placed on the base 8 and hot-pressed only from above the shield 4 by a hot press 5 without deforming the lower shield 4. By deforming only the upper shield 4,
An electromagnetic wave shield circuit board 6 is formed by surrounding the conductive circuit 2 and the insulating layer 3 around the conductive circuit 2 by the shield body 4 having a semicylindrical cross section on the upper side.
【００３０】また、図５に示すさらに他の実施形態で
は、複数の導電回路２を絶縁層３、３で上下から挟み込
み、これの上下面に電磁波シールド体４、４を接着させ
て、これらシールド体４を上下から熱プレスすることに
より、各導電回路２とその周囲の絶縁層３をシールド体
４で取り囲んで、電磁波シールド回路基板６を形成して
いる。In still another embodiment shown in FIG. 5, a plurality of conductive circuits 2 are sandwiched between insulating layers 3 and 3 from above and below, and electromagnetic wave shields 4 and 4 are adhered to the upper and lower surfaces of the conductive circuits 2 to form a shield. By thermally pressing the body 4 from above and below, each conductive circuit 2 and the surrounding insulating layer 3 are surrounded by the shield body 4 to form the electromagnetic wave shield circuit board 6.
【００３１】さらに、前記熱プレスには、その押圧面に
複数の突起を設けて、図６に示すように、各シールド体
４を断続的な接触面４ａで密接させるようにしてもよ
い。Further, the heat press may be provided with a plurality of projections on its pressing surface, so that each shield body 4 is brought into close contact with an intermittent contact surface 4a as shown in FIG.
【００３２】以上のようにして得られたシールド回路基
板６は、導電回路２とその周囲の絶縁層３が電磁波シー
ルド体４により取り囲まれているので、導電回路２が電
磁波による影響を受けることなく、シールド効果に優れ
たものとなる。また、絶縁層３として熱可塑性液晶ポリ
マーを用いているので、各電磁波シールド体４の接着面
４ａには実質的に被膜が形成されず、これらシールド体
４は互いに密接状態となって電気的に接続されるので、
シールド効果が一層高まるとともに、これらシールド体
４を１本のアースラインで容易にアースすることができ
る。In the shielded circuit board 6 obtained as described above, since the conductive circuit 2 and the insulating layer 3 around the conductive circuit 2 are surrounded by the electromagnetic wave shield 4, the conductive circuit 2 is not affected by the electromagnetic wave. , Resulting in an excellent shielding effect. Further, since a thermoplastic liquid crystal polymer is used as the insulating layer 3, a coating is not substantially formed on the bonding surface 4a of each electromagnetic wave shield 4, and these shields 4 are in close contact with each other and are electrically connected. Because it is connected,
The shielding effect is further enhanced, and these shields 4 can be easily grounded with a single ground line.
【００３３】[0033]
【発明の効果】以上述べたとおり、本発明によれば、電
磁波シールド回路基板を容易に得ることができ、また得
られるシールド回路基板は、電磁波シールド効果に優れ
たものとなる。As described above, according to the present invention, an electromagnetic wave shield circuit board can be easily obtained, and the obtained shield circuit board has an excellent electromagnetic wave shield effect.
【図１】本発明にかかるシールド回路基板の製造方法の
一例を示す概念図である。FIG. 1 is a conceptual diagram showing an example of a method for manufacturing a shield circuit board according to the present invention.
【図２】同法により得られるシールド回路基板の断面図
である。FIG. 2 is a sectional view of a shield circuit board obtained by the same method.
【図３】同回路基板の平面図である。FIG. 3 is a plan view of the circuit board.
【図４】シールド回路基板の他の実施形態を示す断面図
である。FIG. 4 is a sectional view showing another embodiment of the shield circuit board.
【図５】シールド回路基板のさらに他の実施形態を示す
断面斜視図である。FIG. 5 is a sectional perspective view showing still another embodiment of the shield circuit board.
【図６】シールド回路基板のさらに他の実施形態を示す
平面図である。FIG. 6 is a plan view showing still another embodiment of the shield circuit board.
１…回路基板、２…導電回路、３…絶縁層、４…シール
ド体、５…熱プレス。DESCRIPTION OF SYMBOLS 1 ... Circuit board, 2 ... Conductive circuit, 3 ... Insulating layer, 4 ... Shield body, 5 ... Hot press.
Claims (4)
層とが取り囲まれた構造を有し、該導電回路が該絶縁層
で覆われており、該絶縁層が光学的異方性の溶融相を形
成し得る熱可塑性ポリマーからなることを特徴とする電
磁波シールド回路基板。An electromagnetic wave shielding body surrounds a conductive circuit and an insulating layer. The conductive circuit is covered with the insulating layer, and the insulating layer is formed of an optically anisotropic molten phase. An electromagnetic wave shielding circuit board comprising a thermoplastic polymer which can be formed.
記載の電磁波シールド回路基板。2. The electromagnetic wave shielding body is made of metal.
Electromagnetic wave shield circuit board as described.
塑性ポリマーからなる絶縁層を用い、この絶縁層で導電
回路の周りを覆って回路基板とし、その両面に導電回路
を挟むように電磁波シールド体を設け、この電磁波シー
ルド体の周縁を互いに接触するように両面あるいは片面
から熱押圧して、各電磁波シールド体により導電回路と
その周囲の絶縁層を取り囲むことを特徴とする電磁波シ
ールド回路基板の製造方法。3. An insulating layer made of a thermoplastic polymer capable of forming an optically anisotropic molten phase, wherein the insulating layer covers a conductive circuit to form a circuit board, and the conductive circuit is sandwiched on both sides thereof. An electromagnetic wave shield is provided in which a conductive circuit and an insulating layer around the conductive circuit are surrounded by each electromagnetic wave shield by pressing the periphery of the electromagnetic wave shield from both sides or one side so as to contact each other. A method for manufacturing a circuit board.
して金属を用い、これを焼き鈍して熱押圧する電磁波シ
ールド回路基板の製造方法。4. The method of manufacturing an electromagnetic wave shield circuit board according to claim 3, wherein a metal is used as the electromagnetic wave shield, and the metal is annealed and heat pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08247999A JP4205245B2 (en) | 1999-03-25 | 1999-03-25 | Electromagnetic wave shield circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08247999A JP4205245B2 (en) | 1999-03-25 | 1999-03-25 | Electromagnetic wave shield circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000277975A true JP2000277975A (en) | 2000-10-06 |
| JP4205245B2 JP4205245B2 (en) | 2009-01-07 |
Family
ID=13775662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08247999A Expired - Lifetime JP4205245B2 (en) | 1999-03-25 | 1999-03-25 | Electromagnetic wave shield circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4205245B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012243857A (en) * | 2011-05-17 | 2012-12-10 | Hitachi Ltd | Printed board and manufacturing method of printed board |
| KR20220024999A (en) * | 2019-07-08 | 2022-03-03 | 광저우 팡 방 일렉트로닉 컴퍼니, 리미티드 | Circuit board for high-frequency transmission and blocking method |
-
1999
- 1999-03-25 JP JP08247999A patent/JP4205245B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012243857A (en) * | 2011-05-17 | 2012-12-10 | Hitachi Ltd | Printed board and manufacturing method of printed board |
| KR20220024999A (en) * | 2019-07-08 | 2022-03-03 | 광저우 팡 방 일렉트로닉 컴퍼니, 리미티드 | Circuit board for high-frequency transmission and blocking method |
| JP2022539903A (en) * | 2019-07-08 | 2022-09-13 | 広州方邦電子股▲ふん▼有限公司 | High-frequency transmission circuit board and interrupting method |
| JP7432702B2 (en) | 2019-07-08 | 2024-02-16 | 広州方邦電子股▲ふん▼有限公司 | High frequency transmission circuit board and interruption method |
| KR102744702B1 (en) * | 2019-07-08 | 2024-12-18 | 광저우 팡 방 일렉트로닉 컴퍼니, 리미티드 | Circuit board for high frequency transmission and method of blocking |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4205245B2 (en) | 2009-01-07 |
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