JP2000290794A - High efficiency electroplating method for iron group metals - Google Patents
High efficiency electroplating method for iron group metalsInfo
- Publication number
- JP2000290794A JP2000290794A JP11097295A JP9729599A JP2000290794A JP 2000290794 A JP2000290794 A JP 2000290794A JP 11097295 A JP11097295 A JP 11097295A JP 9729599 A JP9729599 A JP 9729599A JP 2000290794 A JP2000290794 A JP 2000290794A
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- Prior art keywords
- plating
- acid
- iron group
- boric acid
- sulfate
- Prior art date
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、鉄族金属の電気め
っき方法に関するものである。The present invention relates to a method for electroplating iron group metals.
【0002】[0002]
【従来の技術】鉄族金属は装飾、塗装性改善等を目的と
して、数十〜数百mg/m2 程度のめっき付着量でネジ
といった機械部品から自動車、家電、建材まで幅広く使
用されている。その付着の方法も、ワット浴、塩化物浴
をはじめとする電気めっき法や次亜リン酸を還元剤とし
て用いる無電解めっき法など多岐にわたる。2. Description of the Related Art Iron group metals are widely used in machine parts such as screws, automobiles, home appliances, and building materials with a coating weight of about several tens to several hundreds mg / m 2 for the purpose of decoration, improvement of paintability, and the like. . There are a wide variety of deposition methods, such as an electroplating method using a Watts bath and a chloride bath, and an electroless plating method using hypophosphorous acid as a reducing agent.
【0003】このような鉄族金属めっきを自動車や家
電、建材といった耐用年数の長い防錆材料として用いる
場合は、装飾用とは異なり、数g/m2 〜数十g/m2
程度の付着量が必要となる。これまで鉄族めっきが主と
して機械部品の防食や装飾といった付着量の少ない分野
でのみ使用されてきた理由として、付着量を多くつける
にはこれまでの付着方法では生産性が著しく小さく、生
産コストが大きすぎることがあげられる。When such an iron-group metal plating is used as a long-life rust preventive material for automobiles, home appliances, and building materials, it is different from decorative ones, and is several g / m 2 to several tens g / m 2.
A certain amount of adhesion is required. Until now, iron group plating was mainly used only in fields with a small amount of adhesion, such as corrosion protection and decoration of machine parts. It is too big.
【0004】ニッケルを例に挙げると、実用めっき
(I)(日本プレーティング協会編)の中で、電気ニッ
ケルめっきの電流密度は、最大でも10A/dm2 程度
と記述されており、数g/m2 〜数十g/m2 程度のニ
ッケル付着量を得るには長時間を要することが明らかで
あり、生産性が著しく低いことが分かる。[0004] Taking nickel as an example, in the practical plating (I) (edited by the Japan Plating Association), the current density of electro-nickel plating is described as a maximum of about 10 A / dm 2 , and several g / g Obviously, it takes a long time to obtain a nickel deposition amount of m 2 to several tens g / m 2, which indicates that productivity is extremely low.
【0005】上記の問題に対し、特公平4−25356
号公報では硫酸塩系の支持電解質からなるニッケルめっ
き浴から高速ニッケルめっきを可能としたものであるも
のの、ここでも電流密度が20〜50A/dm2 と小さ
く、数g/m2 〜数十g/m 2 程度のニッケル付着量を
得るには通板速度を著しく小さくせねばならず、結果と
して生産性は乏しい結果となる。また特開平9−111
491号公報ではほう酸を添加しない硫酸塩系の支持電
解質からなるニッケルめっき浴から安価なニッケルめっ
きを可能としたものであるが、ここでも高電流密度下で
のめっきは不可能であり、例えば電流密度100A/d
m2 程度でめっきするとめっきやけと呼ばれるめっきの
黒化が生じ、外観上使用できないものとなってしまうこ
とが分かった。To solve the above problem, Japanese Patent Publication No. Hei 4-25356
In the publication, nickel plating consisting of a sulfate-based supporting electrolyte is described.
High-speed nickel plating from a bath
However, also in this case, the current density is 20 to 50 A / dm.TwoAnd small
G, several g / mTwoTo several tens g / m TwoAbout nickel adhesion
To achieve this, the threading speed must be significantly reduced,
And poor productivity. Also, JP-A-9-111
No. 491 discloses a sulfate-based supporting electrode without adding boric acid.
Inexpensive nickel plating from nickel plating bath
But also here at high current density
Plating is impossible, for example, a current density of 100 A / d
mTwoWhen plating with a degree of plating
Blackening may occur, making it unusable in appearance.
I understood.
【0006】めっきやけを防止する一般的な手段として
は浴の低pH化が考えられる。特公平4−25356号
公報では水素イオン活量を制御し、pHを1.3〜1.
8に保つことでニッケルめっきを施しているが、ここで
も50A/dm2 を超えると、めっきむらが現れやすく
なることが公知となっており、単なる低pH化では高電
流密度下での高速めっきが不可能であることが分かる。As a general means for preventing plating burnout, it is conceivable to lower the pH of the bath. In Japanese Patent Publication No. 25356/1992, the hydrogen ion activity is controlled to adjust the pH to 1.3 to 1.
It is known that nickel plating is likely to appear when the plating rate exceeds 50 A / dm 2. Turns out to be impossible.
【0007】一般的に行われている電気亜鉛めっきを比
較にあげると、電流密度を通常50〜200A/dm2
で通電しており、数十mg/m2 〜数十g/m2 までの
幅広いめっき付着量を高速で生産している。したがって
鉄族金属のめっきにおいても数十g/m2 程度のめっき
付着量を得るためには上記の電流密度範囲で生産できる
技術が必要であるが、これまでこのような課題に対する
取り組みはなされていない。[0007] In comparison with commonly used electrogalvanizing, the current density is usually 50 to 200 A / dm 2.
, And produces a wide range of coating weights from tens of mg / m 2 to tens of g / m 2 at high speed. Therefore, in order to obtain a coating weight of about several tens of g / m 2 even in the plating of an iron group metal, a technique capable of producing in the above-mentioned current density range is necessary. Absent.
【0008】ニッケルやコバルトの美麗な外観や防食
性、鉄の良好な塗装性を、耐食性のために施された亜鉛
めっきや亜鉛合金めっきのさらに上層にめっきすること
で活かすことが可能である。ただし、亜鉛めっきまたは
亜鉛合金めっきを原板として鉄族金属のめっきを施すと
ピットが発生しやすく、これを防止するために、例えば
ラウリル硫酸ナトリウムのような有機添加剤を添加する
必要がある。しかし、50A/dm2 を超えるような高
電流密度下では有機添加剤の分解が進み、分解した有機
不純物がめっきやけ等の外観不良やめっき密着不良を引
き起こしてしまうため、ここでも低電流密度にして生産
性を犠牲せざるをえない。[0008] The beautiful appearance and corrosion resistance of nickel and cobalt and the good paintability of iron can be utilized by plating further on zinc plating or zinc alloy plating provided for corrosion resistance. However, when an iron group metal is plated using zinc plating or zinc alloy plating as an original plate, pits are likely to be generated, and in order to prevent this, it is necessary to add an organic additive such as sodium lauryl sulfate. However, under a high current density exceeding 50 A / dm 2 , the decomposition of the organic additives proceeds, and the decomposed organic impurities cause poor appearance such as plating burnout and poor plating adhesion. You have to sacrifice productivity.
【0009】[0009]
【発明が解決しようとする課題】本発明は、上記の問題
点に鑑み、鉄族金属の高効率電気めっき方法を提供する
ことを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of electroplating iron group metals with high efficiency in view of the above problems.
【0010】[0010]
【課題を解決するための手段】本発明者らは、高電流密
度下でのめっきやけの発生挙動を鉄族金属としてニッケ
ルを用いて調査した。カソードではニッケルの電析とと
もに水の電気分解により水素が発生してアルカリ(水酸
化物イオン)が生成し、カソード近傍ではアルカリ性雰
囲気となる。アルカリ性下ではニッケルは水酸化ニッケ
ルとして沈殿し、めっきやけの発生要因になるはずであ
るが、浴中にpH緩衝能力を有するほう酸を含んでいる
ため、低電流密度下ではアルカリ性雰囲気まで到達せ
ず、結果として良好なニッケルめっきが電析する。しか
し、高電流密度下では、水の電気分解によって発生した
アルカリ(水酸化物イオン)がほう酸のpH緩衝能力を
はるかに越えて生成するため、カソード近傍のpHは急
激に上昇し、結果としてめっきやけを起こすことを見出
した。これを防止するために浴のpHを低下させる手段
を検討した結果、めっきやけを防止できる一方で、めっ
きの電析効率が著しく低下し、 めっき付着量が稼げない
現象が発生した。次に、pHとめっきの電析効率の関係
を調査したところ、pHが低下すると電析効率が低下す
る傾向は明らかであり、さらに、わずかなpHの変動で
効率が著しく変化し、めっきやけの抑制と、めっきの電
析効率を両立するには、単なる浴のpHの低下では、極
めて管理しにくいことを見出した。Means for Solving the Problems The present inventors have investigated the occurrence of plating and burn under high current density using nickel as the iron group metal. At the cathode, hydrogen is generated by electrolysis of water along with the electrodeposition of nickel, and alkali (hydroxide ion) is generated, and an alkaline atmosphere is formed near the cathode. Under alkaline conditions, nickel precipitates as nickel hydroxide and should cause plating burns.However, since the bath contains boric acid with pH buffering ability, it does not reach the alkaline atmosphere under low current density. As a result, good nickel plating is deposited. However, at high current densities, the alkali (hydroxide ions) generated by the electrolysis of water far exceeds the pH buffering capacity of boric acid, and the pH near the cathode rises sharply, resulting in plating. Found burns. As a result of examining a means for lowering the pH of the bath to prevent this, while plating can be prevented from being burnt, the phenomenon that the electrodeposition efficiency of plating has been remarkably reduced and the amount of applied plating cannot be obtained has occurred. Next, when the relationship between the pH and the electrodeposition efficiency of plating was investigated, it was clear that the electrodeposition efficiency tended to decrease as the pH decreased. In order to achieve both the suppression and the electrodeposition efficiency of plating, it has been found that it is extremely difficult to control simply by lowering the pH of the bath.
【0011】そこで、本発明者らは、低電流密度ではほ
う酸の有する緩衝能力にて良好なめっきを作製できる点
に着目し、低pHで緩衝能力を有する酸を検討した。ほ
う酸より低pHで緩衝作用を有する酸としては硫酸を使
用した。硫酸は強酸でありながら、プロトンの第2解離
が不完全なため、硫酸と硫酸ニッケルによる緩衝系が成
立し、ほう酸よりも低pH側でのpH緩衝能力を発揮す
る。 まずほう酸無添加で、硫酸のみを存在させた場合、
0.05mol/l程度の少量の硫酸ではめっきやけと
めっきむらが発生した。これは、硫酸の緩衝能力が小さ
いため高電流密度電解によって生じた被めっき材界面で
のアルカリ雰囲気を緩衝できなかったものと推察され
る。一方、0.1mol程度加えると、めっきやけは抑
制できるものの、めっきにむらは発生した。次に、ほう
酸と硫酸を共存させると良好な外観と高効率を両立でき
ることを見出した。これは、硫酸のpH緩衝能力にほう
酸のpH緩衝能力が重畳し、電解中に生じるはずの被め
っき材界面でのアルカリ雰囲気化をめっきやけが発生し
ない程度まで抑制したこと、さらに、ほう酸自身のもつ
めっきむらへの抑制効果の両者によるものと推察され
る。Therefore, the present inventors have paid attention to the fact that a good plating can be produced with the buffering ability of boric acid at a low current density, and studied an acid having a buffering ability at a low pH. Sulfuric acid was used as an acid having a buffer action at a lower pH than boric acid. Although sulfuric acid is a strong acid, the second dissociation of protons is incomplete, so that a buffer system of sulfuric acid and nickel sulfate is established, and exhibits a pH buffering ability at a lower pH than boric acid. First, when boric acid was not added and only sulfuric acid was present,
With a small amount of sulfuric acid of about 0.05 mol / l, plating burn and plating unevenness occurred. This is presumed to be because the buffering capacity of sulfuric acid was so small that it was not possible to buffer the alkaline atmosphere at the interface of the material to be plated, which was generated by high current density electrolysis. On the other hand, when about 0.1 mol is added, plating burns can be suppressed, but plating unevenness occurs. Next, it has been found that when boric acid and sulfuric acid coexist, both good appearance and high efficiency can be achieved. This is because the pH buffering capacity of boric acid is superimposed on the pH buffering capacity of sulfuric acid, and the alkali atmosphere at the interface of the material to be plated, which should occur during electrolysis, is suppressed to the extent that plating and burns do not occur. It is presumed to be due to both the effect of suppressing plating unevenness.
【0012】本発明はこれらの知見に基づいてなされた
もので、発明の要旨とするところは、(1)被めっき材
を通板させて、連続的に鉄族金属(Fe、Ni、Co)
電気めっきを製造する方法において、鉄族金属の硫酸
塩、ほう酸を含有するめっき浴にほう酸より低pHで緩
衝作用を有する酸を添加し、電流密度50〜200A/
dm2 でめっきすることを特徴とする鉄族金属の高効率
電気めっき方法、(2)ほう酸より低pHで緩衝作用を
有する酸が硫酸または硫酸水素塩であり、その濃度が
0.025〜0.15mol/lであることを特徴とす
る前記(1)に記載の鉄族金属の高効率電気めっき方
法、(3)鉄族金属がニッケルであり、硫酸塩が、硫酸
ニッケルであることを特徴とする前記(1)または前記
(2)に記載の鉄族金属の高効率電気めっき方法、
(4)被めっき材が亜鉛めっき材または亜鉛合金めっき
材であることを特徴とする前記(1)または前記(2)
または前記(3)に記載の鉄族金属の高効率電気めっき
方法、(5)被めっき材が非めっき材であることを特徴
とする前記(1)または前記(2)または前記(3)に
記載の鉄族金属の高効率電気めっき方法。The present invention has been made on the basis of these findings. The gist of the invention is as follows: (1) A material to be plated is passed through to continuously form an iron group metal (Fe, Ni, Co).
In the method for producing electroplating, an acid having a buffer action at a lower pH than boric acid is added to a plating bath containing a sulfate of iron group metal and boric acid, and a current density of 50 to 200 A /
High efficiency electroplating method of an iron group metal, characterized in that plated with dm 2, a (2) acid or sulfuric bisulfate having a buffering action at lower pH than boric acid, its concentration is 0.025 to 0 (1) The method for highly efficient electroplating of an iron group metal according to the above (1), wherein (3) the iron group metal is nickel and the sulfate is nickel sulfate. The high-efficiency electroplating method for an iron group metal according to the above (1) or (2),
(4) The above (1) or (2), wherein the material to be plated is a galvanized material or a zinc alloy plated material.
Or (5) the method for high-efficiency electroplating of an iron group metal according to (3), wherein (5) the material to be plated is a non-plated material. A high-efficiency electroplating method for the iron group metal described in the above.
【0013】[0013]
【発明の実施の形態】以下、本発明について詳細に説明
する。まず、ほう酸より低pH側で緩衝作用を有する酸
としては、リン酸、りん酸塩、硫酸、硫酸水素塩などが
あげられる。ただし、リン酸系の酸は、鉄族と沈殿を形
成してしまうため、好ましくない。したがって、本発明
におけるほう酸より低pH側で緩衝作用を有する酸とし
ては、硫酸または硫酸水素塩を用いるもので、該硫酸ま
たは硫酸水素塩の濃度は0.025mol/l未満では
緩衝作用が弱く、高電流密度下でやけが発生するため、
これ以上とする。また、0.15mol/lを超える
と、やけは発生しないが、効率が著しく低下し、生産性
に影響するため、これ以下とする。なお、硫酸水素塩は
例えば、硫酸水素アンモニウム、硫酸水素ナトリウム、
硫酸水素カリウムなど、カチオンとしてプロトンを一つ
有する塩であれば、いかなる塩でもかまわない。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. First, examples of acids having a buffering action at a lower pH side than boric acid include phosphoric acid, phosphate, sulfuric acid, hydrogen sulfate and the like. However, a phosphoric acid is not preferable because it forms a precipitate with the iron group. Therefore, as the acid having a buffer action at a lower pH side than boric acid in the present invention, sulfuric acid or hydrogen sulfate is used. When the concentration of the sulfuric acid or hydrogen sulfate is less than 0.025 mol / l, the buffer action is weak, Because burns occur at high current density,
More than this. Further, if it exceeds 0.15 mol / l, no burn occurs, but the efficiency is remarkably reduced and the productivity is affected. In addition, hydrogen hydrogen sulfate is, for example, ammonium hydrogen sulfate, sodium hydrogen sulfate,
Any salt having one proton as a cation, such as potassium hydrogen sulfate, may be used.
【0014】電流密度は50A/dm2 未満での操業は
もちろん可能だが、数g/m2 以上の目付け確保を目的
とするため、生産性を考えてこれ以上とする。200A
/dm2 を超えると、やけが発生する恐れがあるため、
これ以下とする。It is of course possible to operate at a current density of less than 50 A / dm 2 , but in order to secure a basis weight of several g / m 2 or more, the operation is further increased in consideration of productivity. 200A
Beyond / dm 2, because it may burn occurs,
It shall be less than this.
【0015】鉄族金属は硫酸または硫酸水素塩との緩衝
作用を考慮して、硫酸鉄、硫酸ニッケル、硫酸コバルト
として投入する。鉄族金属の硫酸塩濃度は少なすぎると
電極近傍での金属イオン活量が不足してやけが発生し、
多すぎると、板によるめっき液の持ち出しにより金属が
流出し、コスト的に不利であり、沈殿等の可能性もある
ため、以上の点を考慮すると、1mol/l〜2mol
/lが好ましい。ほう酸は少なすぎると、緩衝能力が減
少して、めっきやけを起こしやすくし、多すぎると、沈
殿等の問題を生じる。以上を考慮すると、0.1mol
/l〜1.0mol/lが好ましい。The iron group metal is introduced as iron sulfate, nickel sulfate or cobalt sulfate in consideration of the buffering action with sulfuric acid or hydrogen sulfate. If the sulfate concentration of the iron group metal is too low, the metal ion activity in the vicinity of the electrode becomes insufficient and burns occur,
If the amount is too large, the metal will flow out due to the removal of the plating solution by the plate, which is disadvantageous in terms of cost and there is a possibility of sedimentation. Therefore, considering the above points, 1 mol / l to 2 mol.
/ L is preferred. If the amount of boric acid is too small, the buffer capacity is reduced, and plating and burn easily occur. If the amount is too large, problems such as precipitation occur. Considering the above, 0.1 mol
/ L to 1.0 mol / l is preferred.
【0016】めっきの浴温度は低すぎるとめっきやけが
発生しやすく、高すぎると、コストや安全面で問題が生
じるため、以上を考慮して40〜70℃が好ましい。If the bath temperature of plating is too low, plating burns are liable to occur, and if it is too high, problems occur in cost and safety.
【0017】本発明のめっき浴に電気伝導度を高めるた
めにNH4 + イオン、Na+ イオン、K+ イオン、Li
+ イオンを硫酸塩として添加することが可能であり、電
気コストを少なくすることができる。 ただし、過剰の添
加は沈殿ややけの発生をもたらす恐れがあるため、上限
をカチオン濃度で0.5mol/l以下とする。In order to increase the electric conductivity of the plating bath of the present invention, NH 4 + ion, Na + ion, K + ion, Li
+ Ions can be added as sulfates, which can reduce electricity costs. However, since excessive addition may cause precipitation or burn, the upper limit is set to 0.5 mol / l or less in terms of cation concentration.
【0018】また、めっき浴中に不可避的にCr、C
o、Fe、Ni、Cu、Mn、P、Pb、Sn、Sb、
Cd、Si、Zn、Mo、V、Nb、Ti等を含んでも
本発明に何ら問題はない。Further, Cr and C are inevitably contained in the plating bath.
o, Fe, Ni, Cu, Mn, P, Pb, Sn, Sb,
There is no problem in the present invention even if Cd, Si, Zn, Mo, V, Nb, Ti and the like are included.
【0019】被めっき材が亜鉛めっき材または亜鉛合金
めっき材の場合、その素材の鋼板組成等は問わない。ま
た亜鉛合金として、亜鉛−鉄、亜鉛−ニッケル、亜鉛−
クロム、亜鉛−錫、亜鉛−ニッケル−クロムなど、亜鉛
が主体の合金めっきであれば、合金として含まれる金属
種類は特に問わず、多元合金系であってもかまわない。
さらには、該めっき材が溶融めっき材であるか、電気め
っき材であるか等も問わない。When the material to be plated is a galvanized material or a zinc alloy-plated material, the composition of the material is not limited. As zinc alloys, zinc-iron, zinc-nickel, zinc-
As long as it is an alloy plating mainly composed of zinc, such as chromium, zinc-tin, and zinc-nickel-chromium, the kind of metal contained in the alloy is not particularly limited, and a multi-element alloy may be used.
Further, it does not matter whether the plating material is a hot-dip plating material or an electroplating material.
【0020】被めっき材として非めっき材を用いる場
合、上記同様、鋼板組成は問わず、素材の要求特性に応
じて、低炭素アルミキルド鋼、極低炭素鋼、低合金鋼、
高合金鋼等を選択することができ、また、該材料は冷延
材、熱延材を問わない。When a non-plated material is used as the material to be plated, a low-carbon aluminum-killed steel, a very low-carbon steel, a low-alloy steel,
High alloy steel or the like can be selected, and the material may be a cold rolled material or a hot rolled material.
【0021】めっき材の清浄化は、従来から使用されて
いる方法を適用することができ、例えば、アルカリ脱
脂、電解脱脂、酸洗のいずれか、あるいはこれらの汲み
あわせを適用することができる。For cleaning the plating material, a conventionally used method can be applied. For example, any one of alkali degreasing, electrolytic degreasing, and pickling, or a combination thereof can be applied.
【0022】さらに、このようにして得られた鉄族金属
めっきの表面に塗装性や溶接性、潤滑性、耐食性等を改
善する目的で、必要に応じて、電気めっきや、クロメー
ト処理、りん酸塩処理、潤滑性向上処理、樹脂塗布処
理、溶接性向上処理等を施すことができる。Further, for the purpose of improving paintability, weldability, lubricity, corrosion resistance, etc. on the surface of the iron group metal plating thus obtained, if necessary, electroplating, chromate treatment, phosphoric acid treatment, etc. Salt treatment, lubricity improvement treatment, resin coating treatment, weldability improvement treatment, and the like can be performed.
【0023】[0023]
【実施例】次に、本発明の実施例を比較例とともに上げ
る。表1、表2に示すめっき液成分、めっき条件にてめ
っきを行った。原板はアルカリ電解脱脂、酸洗を行った
0.7mm厚の冷延鋼板または熱延鋼板または、アルカ
リ電解脱脂を行った0.7mm厚の各種亜鉛系めっき鋼
板を用いた。上記の条件にて、付着量10g/m2 の鉄
またはニッケルまたはコバルトめっきを施し、めっきの
電析効率、めっき密着性、めっき外観、生産性を評価
し、表3に示した。鉄族金属の付着量は、めっきを溶解
し、原子吸光法にて測定した。めっきの電析効率は、上
記で求めた付着量と通電量の割合から評価した。めっき
密着性は、密着曲げをした後の密着曲げ部分のめっき剥
離状況から評価し、○(めっき剥離なし、または実用上
差し支えない程度のわずかな剥離)、×(剥離ありまた
は実用上使用できない程度の大きな剥離)とした。めっ
き外観は、目視にて、やけがなく均一外観であるものを
○、やけが発生または外観にむらが生じ、実用不可のも
のを×で評価した。生産性はセル長さ1m×5セルの電
気めっきラインにて、電流密度100A/dm2 でNi
を10g/m2 めっきする時の最大ラインスピードで評
価し、50m/min以上を○、50m/min未満を
×とした。Next, examples of the present invention will be described together with comparative examples. Plating was performed under the plating solution components and plating conditions shown in Tables 1 and 2. A 0.7 mm-thick cold-rolled steel sheet or a hot-rolled steel sheet subjected to alkaline electrolytic degreasing and pickling, or various 0.7 mm-thick galvanized steel sheets subjected to alkaline electrolytic degreasing were used as the original sheets. Under the above conditions, iron or nickel or cobalt plating with an adhesion amount of 10 g / m 2 was performed, and the electrodeposition efficiency, plating adhesion, plating appearance, and productivity of the plating were evaluated. The adhesion amount of the iron group metal was measured by dissolving the plating and using an atomic absorption method. The electrodeposition efficiency of the plating was evaluated from the ratio between the amount of adhesion and the amount of electricity determined above. The plating adhesion was evaluated from the state of peeling of the plating at the contact bending portion after the contact bending, and was evaluated as follows: ○ (no plating peeling or slight peeling that is practically acceptable), × (peeling off or practically unusable) Large peeling). The plating appearance was visually evaluated as ○ for uniform appearance without burnt, and x for unburned or uneven appearance due to burnt appearance. The productivity is as follows: Ni plating at a current density of 100 A / dm 2 on an electroplating line with a cell length of 1 m × 5 cells.
Was evaluated at the maximum line speed at the time of plating at 10 g / m 2 , and ○ was given when 50 m / min or more, and × was given when less than 50 m / min.
【0024】実施例1〜16は、本発明であるが、いず
れもめっきの電析効率が60%以上と高く、めっき密着
性、外観も良好で、生産性が良好であった。一方、比較
例において、比較例1および2では浴中の硫酸水素塩が
少なすぎる、あるいは存在しないため、高電流密度下
で、めっきやけが発生し、めっき密着性も悪化した。比
較例3および4では、硫酸水素塩および硫酸濃度が高す
ぎたため、めっきの電析効率が低く、生産性が悪かっ
た。比較例5および6では電流密度が高すぎたため、め
っきやけが発生し、めっき密着性も劣った。比較例7で
はほう酸が存在しないためめっきむらが発生した。比較
例8は硫酸に変えて別の無機酸を使用したものである
が、めっきやけが発生し、めっき密着性も劣った。ま
た、塩酸を使用した浴では、アノードから塩素が発生
し、安全上にも問題が生じた。In Examples 1 to 16, which are the present invention, the electrodeposition efficiency of plating was as high as 60% or more, the plating adhesion and appearance were good, and the productivity was good. On the other hand, in Comparative Examples, in Comparative Examples 1 and 2, the amount of hydrogen sulfate in the bath was too small or absent, so that plating and burn occurred under high current density, and the plating adhesion was deteriorated. In Comparative Examples 3 and 4, the concentrations of hydrogen sulfate and sulfuric acid were too high, so that the electrodeposition efficiency of plating was low and the productivity was poor. In Comparative Examples 5 and 6, the current density was too high, so that plating burns occurred and the plating adhesion was poor. In Comparative Example 7, plating unevenness occurred because boric acid was not present. In Comparative Example 8, another inorganic acid was used instead of sulfuric acid, but plating and burn occurred, and the plating adhesion was poor. In addition, in a bath using hydrochloric acid, chlorine was generated from the anode, causing a problem in safety.
【0025】[0025]
【表1】 [Table 1]
【0026】[0026]
【表2】 [Table 2]
【0027】[0027]
【表3】 [Table 3]
【0028】[0028]
【発明の効果】以上述べたように、本発明は鉄族金属の
電気めっき方法について、高電流密度での高効率な製造
を可能としたものであり、産業の発展に貢献するところ
は極めて大きい。As described above, the present invention makes it possible to provide an electroplating method for an iron group metal with high efficiency at a high current density and greatly contributes to industrial development. .
───────────────────────────────────────────────────── フロントページの続き (72)発明者 油井 正弘 愛知県東海市東海町5−3 新日本製鐵株 式会社名古屋製鐵所内 Fターム(参考) 4K023 AA12 AA13 AA14 BA06 CA01 CA09 DA02 DA07 4K024 AA03 AA04 AA05 AA17 AB01 AB02 BA03 BC01 CA01 CA03 CA06 DA02 DA04 GA01 GA02 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masahiro Yui 5-3 Tokai-cho, Tokai-shi, Aichi F-term in Nippon Steel Corporation Nagoya Works (reference) 4K023 AA12 AA13 AA14 BA06 CA01 CA09 DA02 DA07 4K024 AA03 AA04 AA05 AA17 AB01 AB02 BA03 BC01 CA01 CA03 CA06 DA02 DA04 GA01 GA02
Claims (5)
金属電気めっきを製造する方法において、鉄族金属の硫
酸塩、ほう酸を含有するめっき浴にほう酸より低pHで
緩衝作用を有する酸を添加し、電流密度50〜200A
/dm2 でめっきすることを特徴とする鉄族金属の高効
率電気めっき方法。In a method for continuously producing an iron group metal electroplating by passing a material to be plated, a buffering action at a pH lower than that of boric acid is applied to a plating bath containing a sulfate of iron group metal and boric acid. Having an electric current density of 50 to 200 A
A high-efficiency electroplating method for iron group metals, characterized by plating at / dm 2 .
が硫酸または硫酸水素塩であり、その濃度が0.025
〜0.15mol/lであることを特徴とする請求項1
に記載の鉄族金属の高効率電気めっき方法。2. The acid having a buffering action at a lower pH than boric acid is sulfuric acid or hydrogen sulfate, and the concentration thereof is 0.025.
2. The composition according to claim 1, wherein the amount is 0.15 mol / l.
2. A highly efficient electroplating method for an iron group metal according to claim 1.
硫酸ニッケルであることを特徴とする請求項1または2
に記載の鉄族金属の高効率電気めっき方法。3. The iron group metal is nickel, and the sulfate is
3. The method according to claim 1, wherein the material is nickel sulfate.
2. A highly efficient electroplating method for an iron group metal according to claim 1.
金めっき材であることを特徴とする請求項1または請求
項2または請求項3に記載の鉄族金属の高効率電気めっ
き方法。4. The method according to claim 1, wherein the material to be plated is a galvanized material or a zinc alloy plated material.
徴とする請求項1または請求項2または請求項3に記載
の鉄族金属の高効率電気めっき方法。5. The highly efficient electroplating method for an iron group metal according to claim 1, wherein the material to be plated is a non-plated material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11097295A JP2000290794A (en) | 1999-04-05 | 1999-04-05 | High efficiency electroplating method for iron group metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11097295A JP2000290794A (en) | 1999-04-05 | 1999-04-05 | High efficiency electroplating method for iron group metals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000290794A true JP2000290794A (en) | 2000-10-17 |
Family
ID=14188517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11097295A Withdrawn JP2000290794A (en) | 1999-04-05 | 1999-04-05 | High efficiency electroplating method for iron group metals |
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| Country | Link |
|---|---|
| JP (1) | JP2000290794A (en) |
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|---|---|---|---|---|
| WO2021200412A1 (en) * | 2020-03-31 | 2021-10-07 | Jfeスチール株式会社 | Fe-ELECTROPLATED STEEL SHEET, ELECTRODEPOSITION COATED STEEL SHEET, AUTOMOBILE COMPONENT, METHOD FOR MANUFACTURING ELECTRODEPOSITION COATED STEEL SHEET, AND METHOD FOR MANUFACTURING Fe-ELECTROPLATED STEEL SHEET |
| JP2022142176A (en) * | 2021-03-16 | 2022-09-30 | 三菱電機株式会社 | Electric nickel plating solution and electric nickel plating method |
| CN119121307A (en) * | 2024-09-13 | 2024-12-13 | 湖南盈广环保科技有限公司 | Co/CoS2/surface porous Si composite photoelectrocatalytic material and preparation method and application thereof |
-
1999
- 1999-04-05 JP JP11097295A patent/JP2000290794A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021200412A1 (en) * | 2020-03-31 | 2021-10-07 | Jfeスチール株式会社 | Fe-ELECTROPLATED STEEL SHEET, ELECTRODEPOSITION COATED STEEL SHEET, AUTOMOBILE COMPONENT, METHOD FOR MANUFACTURING ELECTRODEPOSITION COATED STEEL SHEET, AND METHOD FOR MANUFACTURING Fe-ELECTROPLATED STEEL SHEET |
| JPWO2021200412A1 (en) * | 2020-03-31 | 2021-10-07 | ||
| JP7205664B2 (en) | 2020-03-31 | 2023-01-17 | Jfeスチール株式会社 | Fe electroplated steel sheet, electrodeposition coated steel sheet, automobile parts, method for manufacturing electrodeposition coated steel sheet, and method for manufacturing Fe electroplated steel sheet |
| JP2022142176A (en) * | 2021-03-16 | 2022-09-30 | 三菱電機株式会社 | Electric nickel plating solution and electric nickel plating method |
| JP7621838B2 (en) | 2021-03-16 | 2025-01-27 | 三菱電機株式会社 | Electronic nickel plating solution and electronic nickel plating method |
| CN119121307A (en) * | 2024-09-13 | 2024-12-13 | 湖南盈广环保科技有限公司 | Co/CoS2/surface porous Si composite photoelectrocatalytic material and preparation method and application thereof |
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