JP2000294832A - Light emitting diode device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a light emitting diode device which has wide directivity and a high-output characteristic and can be reduced in size and thickness and a method for manufacturing the device. SOLUTION: A light emitting diode device is provided with a flat metallic plate 20 and a plurality of lead terminals 50 arranged on the upper surface of a resin substrate 10, a plurality of light reflecting recesses 30 formed on the plate 20, and a plurality of light emitting diode elements 40 which are respectively mounted on the bottom faces of the recesses 30. The diode device is also provided with a plurality of wires 60 which respectively connect the diode elements 40 to the inner sections of the lead terminals 50, a frame 11 provided on the upper surface of the substrate 10 so as to surround the plate 20 and the inner sections of the terminals 50, and an optical lens 70 provided on the step 12 of the frame 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode device used for a remote control or a transmitter of a light control device.

[0002]

2. Description of the Related Art Light-emitting diodes (hereinafter, referred to as LED) are used as a transmitter for remote control of a television or an air conditioner.
) Is used. For example, by emitting output light from an infrared LED element through an optical lens as a transmission unit of a television remote control, and converting output light received by a photodiode provided in a reception unit into an electric signal, It controls channel switching and power on / off.

FIG. 7 is a front view of a conventional LED device.
The infrared LED element 40 is mounted on the bottom surface of the light reflecting recess 30 formed on the end surface of the lead frame (not shown),
Main surface electrode (not shown) of ED element 40 and lead terminal 50
Are connected by a bonding wire 60. An optical lens 70 is mounted above the light reflecting recess 30, and the infrared LED element 40 and the bonding wire 60 are packaged. The output light emitted from the end face of the infrared LED element 40 is reflected upward on the wall surface of the light reflecting recess 30, passes through the optical lens 70, and is emitted outward.

Generally, the directivity of output light emitted from an LED device, that is, the output angle or output range of output light is determined by the shape of an optical lens. When the output of the LED element is the same, if a wide-angle lens is used, the directivity of the output light will be wide-angle, but the output characteristics will be reduced. Conversely, if a narrow-angle lens is used, the directivity of the output light will be narrow. Although the angle becomes an angle, the output characteristics are enhanced.

When an LED device is used as a transmitter for remote control, if the directivity of the output light is reduced, it becomes difficult for the output light from the transmitter to hit the light receiving unit. It is necessary to emit light. However, as described above, if the directivity of the output light from the LED device is widened, the output characteristics deteriorate and the control distance of the remote control becomes short.

[0006] For example, Japanese Utility Model Laid-Open No. 5-82149 discloses an LED device in which a plurality of LED devices are provided side by side, and a wide-angle optical lens is disposed in front of the plurality of LED devices. According to this, the LED which can broaden the directivity of the output light and can obtain sufficient output characteristics
The device can be realized.

[0007]

However, such an LED unit occupies a large volume, and cannot meet the demand for miniaturization and thinning of various electronic devices.

An object of the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide a light-emitting diode device having a wide directivity and a high output characteristic, and capable of realizing a small size and a small thickness.

[0009]

In order to solve the above-mentioned problems, an LED device according to the present invention comprises a metal flat plate and a plurality of lead terminals disposed on an upper surface of an insulating base, and a plurality of light reflecting devices formed on the metal flat plate. A concave portion, a plurality of LED elements respectively mounted on the bottom surface of each light reflecting concave portion, a plurality of wires connecting each LED element and an inner portion of each lead terminal, and an inner portion of a metal plate and a lead terminal. The frame includes a frame provided on the upper surface of the insulating base so as to surround the frame, and an optical lens or an optical filter mounted on the frame.

According to the present invention, it is possible to obtain an LED device having a wide directivity and a high output characteristic and capable of realizing miniaturization and thinning. For this reason, when used as a transmitter for remote control,
The control range and control distance of the control can be improved.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claims 1 and 2 of the present invention is directed to a metal plate and a plurality of lead terminals disposed on an upper surface of an insulating base made of resin or ceramic, and a plurality of lead terminals formed on the metal plate. A plurality of LED elements respectively mounted on the bottom surface of each light reflecting recess,
A plurality of wires for connecting the ED element and the inner part of each lead terminal; a metal plate and a frame provided on the upper surface of the insulating base so as to surround the inner part of the lead terminal; and an optical lens mounted on the frame An LED device comprising: The lead terminals pass through the inside of the frame from the upper surface of the insulating base and are led out.

As described above, since a large number of LED elements are housed in one package, and the output light from each LED element passes through the optical lens and is emitted as combined output light, a wide-angle optical lens is used. Also, wide directivity can be obtained without deteriorating the output characteristics of the LED device. Further, since the light reflecting recesses are formed on the upper surface of the metal flat plate, a large number of light reflecting recesses, for example, 10 or more, can be easily formed, and a large number of LED elements can be mounted. Properties can be obtained. In addition, by adopting a package structure using an insulating base and a metal flat plate, the LED device can be reduced in size and thickness.

Further, since each LED element is independently connected to each lead terminal, the drive current flowing to each LED element can be set individually. For this reason, by changing the output balance of a large number of LED elements, it is possible to arbitrarily change the directivity of the combined output light emitted from the optical lens.

The invention according to claims 3 and 4 of the present invention
An optical lens assembly including a plurality of optical lenses respectively corresponding to the respective light reflecting recesses is mounted on a frame of an insulating base. Each optical lens assembly has an optical lens with a different focal length, a narrow-angle optical lens with a long focal length near the center, and a wide-angle optical lens with a short focal length near the periphery. The ratio of the combined output light emitted from the lens assembly as parallel light can be increased, and high output characteristics can be obtained.

According to a fifth aspect of the present invention, LED elements having different wavelengths are mounted in the respective light reflecting recesses. According to this, the emission spectrum of the combined output light emitted from the optical lens can be broadened.

According to a sixth aspect of the present invention, a lead frame having a metal flat plate and a plurality of lead terminals is formed by press working or etching means, and a plurality of light reflecting recesses are formed in the metal flat plate. A metal plate and a lead terminal are arranged on the upper surface of the resin substrate by integrally molding the resin substrate on the lead frame, and a frame body is formed on the upper surface of the resin substrate so as to surround an inner portion of the metal plate and the lead terminal.
LED elements are mounted on the bottom of each light reflecting recess, respectively.
Each LED element and each lead terminal are wire-bonded, and an optical lens or an optical filter is mounted on a frame of a resin base. According to this, an LED device can be obtained with high production efficiency by setting the lead frame in a mold and molding the resin base by a method such as transfer molding or injection.

(Embodiment 1) Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of the LED device according to the present embodiment, and FIG.
FIG. 3 is a top view showing a state in which a part of the LED device is omitted.

As shown in FIG. 1 to FIG.
The metal flat plate 20 and a large number of lead terminals 50 are arranged on the upper surface of the substrate. A large number of light reflecting recesses 30 are formed in the metal plate 20, and the infrared LED elements 4
0 is installed. Each infrared LED element 40 is connected to the inner part of the lead terminal 50 by a bonding wire 60. A frame 11 is formed on the upper surface of the resin base 10 so as to surround the metal plate 20 and the inner part of the lead terminal 50. The lead terminals 50 arranged on the upper surface of the resin base 10
It penetrates through the inside of the frame 11 and is led out. A step 12 is provided on the inner wall of the frame 11, and an optical lens 70 also serving as a cap is attached to the step 12. The optical lens may be an optical filter.

The metal flat plate 20 and the lead terminals 50 are made of an appropriate metal material such as iron, copper or an alloy thereof having a thickness of about 0.5 mm. The external dimensions of the LED device are 8.0 mm in length, 5.0 mm in width, and 2.0 mm in height, realizing miniaturization and thinning. The shape of the concave portion 30 for reflecting light is a perfect circle, and the infrared LED device is designed to reflect the uniform output light by reducing the variation in the distance from the end face of the infrared LED device 40 to the wall surface of the concave portion 30 for reflecting light. The shape of 40 is a hexagonal prism. The optical lens 70 is a concave portion 3 for light reflection.
There is a phase in which the output light reflected by the 0 wall is converged in a certain direction, and a coating layer (not shown) for preventing reflection of infrared light is provided on the inner surface of the optical lens 7 so that the infrared light has a quarter wavelength. Is formed.

The above-described LED device is an infrared LED.
The output light from the element is reflected on the wall surface of the light reflecting concave portion, and is emitted as combined output light of a number of infrared LED elements by passing through the optical lens. Therefore, high output characteristics can be obtained even if the directivity of the combined output light is widened using a wide-angle optical lens.

Next, the method for fabricating the LED device according to the present embodiment will be explained with reference to FIG. First, as shown in S1, a hoop-shaped metal material made of a copper material is punched out by pressing means to form a lead frame including a metal flat plate and a large number of lead terminals. Next, as shown in S2, a large number of light reflection concave portions are formed on the upper surface of the metal flat plate by a method such as drawing. Next, as shown in S3, the lead frame and the resin base are integrally formed by transfer molding. At this time, the inner portions of the metal flat plate and the lead terminals are arranged on the upper surface of the resin base, and the outer portions of the lead terminals pass through the frame of the resin base and are led out of the resin base. Next, as shown in S4, an infrared LED element is mounted on the bottom surface of the light reflecting recess of the metal flat plate. Next, as shown in S5, the electrode (not shown) of the infrared LED element and the inner part of each lead terminal are connected by wire bonding. Next, as shown in S6, an optical lens is attached to the step of the frame with an adhesive or the like to complete the LED device.

Next, an example of use of the LED device according to the present embodiment will be described. Since each infrared LED element is independently connected to the lead terminal, the balance of the drive current flowing through each infrared LED element is changed to
The balance of the output characteristics of the element can be changed. Therefore, it is possible to change the directivity of the combined output light emitted through the optical lens.

Further, a plurality of infrared LEs having different wavelength characteristics are provided.
By combining the D elements, the emission spectrum of the combined output light can be broadened.

In the present embodiment, an example using an LED device for remote control has been described. However, the present invention can be applied to an LED device for other uses such as display. The LED element is not limited to the infrared LED element, but may be a visible light LED element or the like.

(Embodiment 2) FIG. 5 is a perspective view of an LED device showing another embodiment of the present invention, and FIG. 6 is a longitudinal sectional view of the LED device. The optical lens assembly 80 includes optical lenses 71, 72, and 73 having different focal lengths corresponding to the infrared LED elements 40, respectively. An optical lens 71 having the shortest focal length is provided at the center of the optical lens assembly.
And an optical lens 7 with an intermediate focal length
2. An optical lens 73 having the longest focal length is disposed on the outermost side of the optical lens assembly 80. With such an arrangement, the ratio of parallel light emitted from the optical lens can be increased.

[0026]

As described above, according to the present invention, it is possible to provide a light emitting diode device having a wide directivity and a high output characteristic, and capable of realizing a reduction in size and thickness.

Further, the directivity of the LED device can be easily changed by changing the drive current flowing to each LED element.

Further, by combining a plurality of LED elements having different wavelength characteristics, the emission spectrum of the LED device can be broadened.

[Brief description of the drawings]

FIG. 1 is a perspective view of an LED device according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of an LED device according to an embodiment of the present invention.

FIG. 3 is a top view in which a part of the LED device according to the embodiment of the present invention is omitted.

FIG. 4 is a manufacturing process diagram of the LED device according to one embodiment of the present invention;

FIG. 5 is a perspective view of an LED device according to another embodiment of the present invention.

FIG. 6 is a longitudinal sectional view of an LED device according to another embodiment of the present invention.

FIG. 7 is a front view of a conventional LED device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resin base 11 Frame 12 Step 20 Metal plate 30 Light reflection recess 40 Infrared LED element 50 Lead terminal 60 Bonding wire 70, 71, 72, 73 Optical lens 80 Optical lens assembly

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[Procedure amendment]

[Submission date] January 27, 2000 (2000.1.2
7)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, an optical lens assembly having a plurality of optical lenses respectively corresponding to the respective light reflecting recesses is mounted on a frame of an insulating base. Preferably, each of the optical lens assemblies includes an optical lens having a different focal length, a narrow-angle optical lens having a long focal length is used near the center, and a wide-angle optical lens having a short focal length is used near the periphery. Thus, the ratio of the combined output light emitted as parallel light from the optical lens assembly can be increased, and high output characteristics can be obtained.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Deleted

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

According to a fourth aspect of the present invention, a lead frame provided with a metal flat plate and a plurality of lead terminals is formed by press working or etching means, and a plurality of light reflecting recesses are formed in the metal flat plate. A metal plate and a lead terminal are arranged on the upper surface of the resin substrate by integrally molding the resin substrate on the lead frame, and a frame body is formed on the upper surface of the resin substrate so as to surround an inner portion of the metal plate and the lead terminal.
LED elements are mounted on the bottom of each light reflecting recess, respectively.
Each LED element and each lead terminal are wire-bonded, and an optical lens or an optical filter is mounted on a frame of a resin base. According to this, an LED device can be obtained with high production efficiency by setting the lead frame in a mold and molding the resin base by a method such as transfer molding or injection.

Claims (6)

[Claims] 1. A metal flat plate and a plurality of lead terminals disposed on an upper surface of an insulating base, a plurality of light reflecting recesses formed on the metal flat plate, and a plurality of light reflecting recesses respectively mounted on the bottom surface of each of the light reflecting recesses. A light-emitting diode element, a plurality of wires connecting the respective light-emitting diode elements and an inner part of each of the lead terminals, and a plurality of wires provided on the upper surface of the insulating base so as to surround the metal plate and the inner part of the lead terminal. A light emitting diode device comprising: a frame; and an optical lens or an optical filter mounted on the frame. 2. The light-emitting diode device according to claim 1, wherein the lead terminal extends outward from the upper surface of the insulating base through the frame. 3. The light-emitting diode device according to claim 1, wherein an optical lens assembly including a plurality of optical lenses respectively corresponding to the respective light reflecting recesses is mounted on the frame of the insulating base. . 4. The light emitting diode device according to claim 3, wherein each of the optical lens assemblies includes an optical lens having a different focal length. 5. The light-emitting diode device according to claim 1, wherein light-emitting diode elements having different wavelengths are mounted on the respective light reflecting recesses. 6. A step of forming a lead frame having a metal flat plate and a plurality of lead terminals by press working or etching means, a step of forming a plurality of light reflecting recesses in the metal flat plate, and forming a resin on the lead frame. A base is integrally formed, and the metal flat plate and the inner part of the lead terminal are arranged on the upper surface of the resin base, and a frame body is formed on the upper surface of the resin base so as to surround the inner part of the metal flat plate and the lead terminal. Forming, a step of mounting a light emitting diode element on each of the bottom surfaces of the light reflecting recesses, a step of wire bonding each of the light emitting diode elements and each of the lead terminals, and A method for manufacturing a light emitting diode device, comprising a step of attaching an optical lens or an optical filter to a light emitting diode device.