JP2000299580A - Cooling device for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device for electronic components, having a metal case functioning also as radiator to which the electronic components can be fixed with stability and moreover a fixing device for easily fixing and removing the electronic components without special processes. SOLUTION: A metal case 1 serving functions of radiator and box is provided with a protuberance 12 in the case which is in intimate contact with electronic components 2a and 2b generating heat. The electronic components 2a and 2b are pressed and made into intimate contact with the protuberance 12 in the case by a fixing device 3 having an elastic part. The heat generated from the electronic components 2a and 2b is transferred to the metal case 1 through the protuberance 12 in the case.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic component, and more particularly to a cooling device for an electronic component which stably and reliably fixes an electronic component to a metal case also serving as a radiator without screwing the electronic component to the metal case.

[0002]

2. Description of the Related Art For example, heat-generating electronic components such as rectifier diodes and power transistors are used by attaching them to a radiator having a radiating fin for radiation, so that a special radiator is required. Therefore, Japanese Patent Application Laid-Open No. 10-3
As described in JP-A-35861, a heat-generating electronic component is sandwiched in a clip portion having a spring property formed on a heat radiating plate, and the heat-generating electronic component is brought into close contact with a heat radiating plate body also serving as a fixing device, thereby improving the spring property. It has been proposed to dissipate heat by fixing it to the heat sink body without screwing it.

[0003] However, since the radiator plate body has its feet fixed on the board of the device by soldering, when the heat-generating electronic components are attached to the radiator plate or when the heat-generating electronic components are removed in reverse, the radiator plate body is soldered. Attaching and removing operations are required, which increases the number of man-hours.

[0004]

SUMMARY OF THE INVENTION The present invention does not require screwing electronic components, and can omit the work of soldering a heat radiating plate to a substrate, and mounts the electronic components in a metal case which also functions as a radiator. The present invention is to provide a cooling device for an electronic component having a fixture, which can stably fix the electronic component, and which can be easily removed without any special process.

[0005]

Therefore, in the present invention,
As shown in FIG. 1, a metal case 1 having a heat dissipation function and a housing function is provided with a protruding portion 12 in a case that is in close contact with heat-generating electronic components 2 a and 2 b, and the fixing device 3 having an elastic portion is used to fix the electronic component. Parts 2a and 2b and Projection 12 in Case
And the heat generated from the electronic components 2a, 2b is transferred to the metal case 1 via the in-case protrusion 12.
And heat is dissipated.

Accordingly, the electronic component can be fixed stably and securely without screwing, and the number of components, the number of steps, and the size can be reduced. Since it is easy to attach and detach, it is possible to provide an environment-friendly cooling device for electronic components.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view of a cooling device for electronic components of the present invention, FIG. 2 is an explanatory diagram of a configuration state of the cooling device for electronic components of the present invention, FIG. 3 is an enlarged partial cross-sectional view, and FIG. It is.

In the drawing, 1 is a metal case, 2a and 2b are electronic components, 3 is a fixture, 4 is a board, 5 is a screw, 11 is a fin, 12 is a projection in the case, 13 is a guide section, and 14 is a board. A support portion, 31 is a stopper, 32 is a spring portion, 33 is an engagement portion, 41 is a cutout portion, and 42 is a side hole portion.

[0009] The metal case 1 includes a heat-producing electronic component 2a,
2b functions as a radiator, and functions as an exterior for circuit components mounted on the substrate 4 or components disposed inside the metal case 1, that is, functions as a housing.

In order to fulfill the function as a radiator, a projection 12 in the case is integrally formed inside the metal case 1. In a space other than the space surrounded by the in-case projection 12, a circuit component mounted on the substrate 4 or a component mounted on the metal case 1 side can be arranged. A guide portion 13 having a concave portion is provided at a central portion of the protruding portion 12 in the case.

A fin 11 is formed on the bottom surface of the metal case 1 to improve the heat radiation effect. The metal case 1 is made of a metal having excellent thermal conductivity, such as copper, aluminum, and magnesium alloy. Then, the case inner projection 12 may be integrally molded by, for example, die casting, or may be manufactured by cutting or the like. In FIG. 1 to FIG.
This shows a case where the substrate support portion 14 and the like are integrally formed by, for example, die casting.

The electronic components 2a and 2b are semiconductor components such as rectifying diodes and power transistors that generate heat during use.

The fixture 3 is for pressing the electronic components 2a and 2b attached to the substrate 4 against the protruding portion 12 in the case, and is made of, for example, spring stainless steel or phosphor bronze. The present invention is not limited to this, and any elastic member having a high yield point can be made of a resin. In the following description, a case of being made of a metal will be described.

As shown in FIG. 4, the fixing device 3 has stoppers 31 at both ends of a fixing device main body 30 and spring portions 32 at one surface thereof. This spring part 3
The number of 2, 32 is determined based on the number of electronic components 2a, 2b to be pressed.

A bent portion 34 is formed at the upper end of the fixture 3 so as to facilitate the insertion operation of the fixture 3, and an engaging portion 33 which is engaged with the guide portion 13 and positioned is formed. Have been. The stoppers 31, 31, the spring portions 32, 32, the bent portion 34, and the like, which form the fixing device 3, can be formed by bending a single metal plate.

An electronic circuit is formed on the substrate 4, and electronic components 2a and 2b are soldered to a part of the circuit pattern. Then, the substrate 4 is fixed to the substrate support portion 14 of the metal case 1 by screws 5. In the vicinity of the substrate 4 where the electronic components 2a and 2b are arranged, a side hole 42 into which the fixture 3 is inserted is formed.
At both ends, notches 41 are formed to engage with the stopper 31.

The board 4 to which the electronic components 2a and 2b are soldered is fixed to the board supporting portion 14 with screws 5 so that the board 4 is fixed to the metal case 1 and then into the side holes 42 formed in the board 4. On the other hand, the fixture 3 is inserted in the direction of the arrow shown in FIG.

At this time, the concave portion of the guide portion 13 and the fixture 3
And the fixing portion 3 is accurately positioned. When the fixture 3 is further inserted in the direction of the arrow, the spring portions 32 of the fixture 3 are connected to the electronic components 2a,
2b, and these spring portions 32, 32
A compression force is applied in the direction of 0, and as a reaction, these spring portions 32, 32 strongly press the electronic components 2a, 2b to bring them into close contact with the protruding portion 12 in the case.

When the fixture 3 is inserted, the spring 32
Of the electronic components 2a, 2a, 2
The fixture 3 can be easily pushed down to a predetermined position while the b and the spring portions 32 are in contact with each other.

After the fixture 3 is inserted, the stoppers 31 and 31 and the projections 36 provided on both sides are engaged with the notches 41 formed on the substrate 4, thereby preventing the fixture 3 from coming off. Can be.

By inserting the fixing member 3 to a predetermined position in this manner, the electronic components 2a, 2b can be strongly adhered to the projection 12 in the case by the spring portions 32, 32. Heat generated from the electronic components 2a and 2b is transmitted to the fins 11 integrated with the bottom surface of the metal case 1 via the protruding portions 12 in the case, and is radiated well.

If the screw 5 is removed, the notch 4
The substrate 4 and the metal case 1 are detached in a state where the stopper 31 of the fixture 3 is locked to 1. If the stoppers 31 and 31 of the fixture 3 are pushed inward after being removed in this manner, the locked state between the stoppers 31 and 31 and the notch 41 is released, so that the fixture 3 can be easily taken out. When replacement is necessary, the fixing device 3 can be easily replaced.

In this manner, no screws are required to bring the electronic components into close contact with the protruding portions 12 in the case provided on the metal case 1, so that the number of components can be reduced, and a solder portion is required to remove the fixture. Since there is no need to remove the work, the man-hour can be reduced. In addition, since the effect of radiating heat from the electronic components that generate heat can be increased, the size of the metal case and the like can be reduced.

Furthermore, since the fixing tool can be easily replaced by removing the screw, the number of steps can be greatly reduced in both the assembling property and the disassembling property.

Japanese Patent Application Laid-Open No. Hei 10-98286 discloses that heat is dissipated by bringing an electronic component into close contact with an upright portion constituting a housing wall. In this case, since the housing wall is used, there are restrictions on the arrangement of the electronic components based on the shape of the housing.

On the other hand, in the present invention, since the electronic components are adhered not to the case wall but to the case protrusion formed inside the case, the position of the case protrusion is most appropriate based on the circuit design. It can be appropriately provided at any position, and the degree of freedom in circuit design becomes very large.

[0027]

According to the present invention, the following functions and effects can be obtained. (1) Since heat is radiated by pressing the electronic component to the projecting portion in the case, the degree of freedom in circuit design can be increased, and the number of components and the number of steps can be reduced.

(2) A guide portion is provided on the metal case side, and an engaging portion and a stopper for engaging with the guide portion are provided on the fixture.
The board is provided with a notch that engages with this stopper, so that the fixture is accurately positioned by inserting the fixture into the guide, and the electronic component is pressed against the protrusion in the case by the elastic part. In addition to being able to be in close contact, the fixture does not come off easily due to vibration, etc., so that even under adverse conditions, the heat radiation of the electronic components is accurately and reliably performed, and the attachment of the fixture is extremely easy, and This can be done without using screws.

(3) Since the fixing device can be easily removed when the substrate is removed from the metal case, it is usually difficult to remove the fixing device. Therefore, the fixing device does not come off during use and heat is accurately radiated. Operation can be maintained. Moreover, if the screw between the substrate and the metal case is removed, the fixture can be easily removed, so that attachment and removal can be performed by a simple operation without requiring a special process such as soldering.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a cooling device for an electronic component of the present invention.

FIG. 2 is an explanatory diagram of a configuration state of a cooling device for an electronic component according to the present invention.

FIG. 3 is a sectional view of a main part of a cooling device for an electronic component according to the present invention.

FIG. 4 is a detailed view of a fixture according to the present invention.

[Description of Symbols] 1 Metal case 2a, 2b Electronic component 3 Fixing device 4 Board 5 Screw 11 Fin 12 Projecting portion in case 13 Guide portion 14 Board supporting portion 30 Fixing device main body 31 Stopper 32 Spring portion 33 Engaging portion 34 Bending Part 35 Tip part 36 Projection part 41 Notch part 42 Side hole

Continued on the front page F term (reference) 4E360 AB02 AB54 CA02 EA24 ED02 ED23 FA02 GA06 GA24 GB92 GC02 5E322 AA01 AA03 AB04 5F036 AA01 BC09 BC35

Claims (3)

[Claims] A metal case having a heat dissipation function and a housing function is provided with a projection in a case that is in close contact with a heat-generating electronic component, and the electronic component and the projection in the case are fixed by a fixture having an elastic portion. A cooling device for an electronic component, wherein heat generated from the electronic component is conducted to the metal case via the projection in the case to radiate heat. 2. A guide portion is provided on the metal case side, an engaging portion for engaging with the guide portion and a stopper are provided on the fixture, and the stopper is provided on a substrate fixed to the metal case. A notch portion to be locked is provided, the fixing device is positioned by inserting the fixing device into the guide portion, and the electronic component is pressed and brought into close contact with the projecting portion in the case by the elastic portion. 2. A cooling device for an electronic component according to claim 1, wherein said fixing device prevents said fixture from coming off by engaging said notch. 3. When the substrate is removed from the metal case, a stopper of the fixing member is made movable so that it can be easily released from a locked state with the cutout portion of the substrate. The cooling device for an electronic component according to claim 2.