JP2000321768A - Photosensitive paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obviate the occurrence of thickening and solidifying even if powder of copper, glass, ceramic, etc., is used by using inorganic powder and a photosensitive resin as indispensable components and incorporating a polymer having an amine structure therein. SOLUTION: The photosensitive paste having high preservation stability is obtained by suppressing the reactivity of the inorganic powder and the photosensitive resin and such obtaining is achieved by the photosensitive paste consisting of the polymer containing the inorganic powder, the photosensitive resin and the amine structure. The polymer having the amine structure is a nitrogenous compound and a high-polymer compound and, therefore, forms a secure adsorption layer on the surface of the inorganic particles, thereby effectively suppressing the reaction of the photosensitive resin. The photosensitive organic component consists indispensably of a polymer, a polyfunctional monomer having >=2 carbon-carbon double bonds in one molecule and a photopolymerization initiator. The inorganic powder is preferably monodisperse, is free of aggregation and is spherical or granular. In such a case, the sphericity is preferably, for example, >=80 pieces %.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive conductive paste for forming fine wiring patterns on a ceramic substrate or a glass substrate, and a photosensitive insulating paste for forming fine through holes in an insulating layer. .

[0002]

2. Description of the Related Art In recent years, multi-chip modules mounted on personal computers and PC cards, chip-size packages, or high-frequency filters for mobile communication devices such as mobile phones, chip inductors, multilayer capacitors, and other electronic components or ceramic multilayers. There is an increasing demand for smaller, higher density, higher definition, and higher reliability substrates. In addition, as the definition of a display device such as a plasma display has become higher, the demand for finer electrodes has also increased. To meet these requirements, various methods for forming a fine conductive film have been proposed.

Typical methods include a thin film method, a plating method, and a thick film printing method. In the thin film method, patterning with a resolution of L / S = 20/20 μm or more is possible by a photolithography technique after forming a film by sputtering, vapor deposition or the like. However, there is a drawback that only a thin film can be obtained because of having a long time to make the film thick, and as a result, the impedance as a circuit becomes high. Further, the plating method has a problem that it is difficult to form a thick-film passive element such as a resistor in a firing step.

On the other hand, in the thick film printing method in which a film is formed by screen printing, it is easy to increase the thickness of a conductor film and to simultaneously form passive elements such as resistors, but on the other hand, L
There is a problem that it is difficult to form a line with a fixed width at a resolution of / S = 50/50 μm or less, and it is difficult to design an electric characteristic surface because the cross-sectional shape is on a kamaho.

When a multilayer wiring layer is formed on a ceramic substrate, the wiring becomes finer and the through holes connecting the layers of the insulating layer must be finer. When forming an insulating layer of glass, glass ceramic, ceramic or the like on a ceramic substrate, there are a thick film printing method and a green sheet method, but it is difficult to form a through hole of 100 μm or less by any of these methods. is there.

As a method for improving the resolution and the sectional shape of the thick film printing method, there is a photosensitive paste method. In this method, a high-resolution thick-film conductor pattern can be formed by using a photosensitive paste as a conductive paste for thick-film printing and performing a mask exposure and development process after printing. As a photosensitive paste, a material obtained by mixing a conductive powder such as metal or carbon with a photocurable resin is used, and as a photosensitive insulating paste, a material obtained by mixing a powder of glass, ceramics, etc. with a photocurable resin is often used. .

Although the photosensitive paste method is an excellent method as described above, an acrylic copolymer, which is widely used as a photosensitive resin, reacts with a certain kind of metal to increase the viscosity or, in severe cases, solidify. There was a problem that would. No reaction occurs when the conductive powder is a chemically stable noble metal such as gold or silver, but this problem is remarkable when a base metal, particularly copper, is used. However, copper is inexpensive and has low electric resistance, and is a very suitable metal as a wiring material.
It is a big problem that this cannot be used as a photosensitive conductive paste. In addition, glass and ceramic components contain a large amount of metal oxide, and depending on the type of the metal oxide, the same problem of thickening and solidification as copper may occur. To address this problem, there is a surface treatment method using benzotriazole, which is a general copper rust preventive (Japanese Patent Laid-Open No. 10-287821).

[0008]

However, in the surface treatment method using benzotriazole, sufficient storage stability has not been obtained. Therefore, the object of the present invention is to provide copper, glass, ceramics and the like. An object of the present invention is to supply a photosensitive paste that does not cause thickening or solidification even when powder is used.

[0009]

The present invention provides an inorganic powder,
It is a photosensitive paste containing a photosensitive resin as an essential component, and is a photosensitive paste containing a polymer having an amine structure.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below. The present invention suppresses the reactivity between an inorganic powder and a photosensitive resin to obtain a photosensitive paste having high storage stability, and comprises a photosensitive paste comprising an inorganic powder, a photosensitive resin, and a polymer containing an amine structure. Achieved by a sexual paste.

The polymer having an amine structure forms an adsorption layer on the surface of the inorganic powder and suppresses the reactivity between the surface and the photosensitive resin. Nitrogen-containing compounds such as benzotriazole, which are generally used as copper rust inhibitors, also suppress the reactivity between the inorganic particle surface and the functional groups contained in the photosensitive resin by adsorption to similar inorganic particles. However, the surface treatment agents that have been studied so far have not had sufficient performance for stabilizing the photosensitive paste. Since these are low molecular compounds, the adsorption layer is very thin, and it is presumed that they are broken by the stress when the powder is kneaded with the resin and made into a paste, and the surface of the inorganic powder is exposed. However, the polymer having an amine structure, which is a surface treating agent of the present invention, forms a strong adsorption layer on the surface of the inorganic particles because it is a nitrogen-containing compound and a high-molecular compound,
The reaction of the photosensitive resin can be effectively suppressed.

The photosensitive organic component includes a polymer, a polyfunctional monomer having two or more carbon-carbon double bonds in one molecule, and a photosensitive paste in a photosensitive paste containing a photopolymerization initiator as essential components. It is an organic component that plays a role.

The shape of the inorganic powder used in the present invention may be plate-like, scale-like, conical, angular, rod-like, granular, needle-like, etc. Is desirable. In this case, spherical means that the sphericity is 80% by number
The above is preferred. For the measurement of the spherical ratio, the powder was photographed with an optical microscope at a magnification of 300 times and counted, and the ratio of the spherical particles was expressed. When the particles are spherical, scattering of light during exposure is very small, and light is easily transmitted to the inside of the film.

The conductive powder used in the present invention includes carbon powder, metal powder, and the like.
Examples include, but are not limited to, gold, silver, copper, nickel, tungsten, molybdenum. The present invention exerts a particularly great effect when a powder containing a highly reactive metal such as copper or an oxide thereof is used, but the scope of the present invention is limited to the types of these metals. is not. The average particle size of the conductive powder is 2 to 5
It is desirable to be in the range of μm. Average particle size is 2μm
When the content is below, when the same volume of the conductive powder is added to the resin, the surface area of the powder is increased, so that more light is blocked, and the light transmittance into the paste is reduced.
If it is larger than 5 μm, the surface roughness when applied is large, and the pattern accuracy and dimensional accuracy are undesirably reduced.

The insulating powder used in the present invention includes ferrite, cordierite, forsterite, alumina, silica, mullite, cristobalite, corundum (α-alumina), zirconia, calcium oxide, magnesium oxide, chromium oxide, lithium oxide, Examples include, but are not limited to, lead oxide, boron oxide, iron oxide, zinc oxide, nickel oxide, and borosilicate glass.

The present invention exerts its effect particularly on insulating powders containing lead oxide and calcium oxide, but the present invention is not limited to these powder types.

The average particle diameter of the insulating powder is preferably 0.5 to 7 μm from the viewpoint of dispersibility. If the average particle size is less than 0.5 μm, the dispersion in the paste is reduced,
A thickness of 7 μm or more is not preferred because the dimensional accuracy of the pattern and the surface roughness of the coating film surface are reduced. From the viewpoint of photolithography, a method in which scattering is small and a large amount of light passes through the film is preferable, and in that case, the thickness is preferably 1 μm or more. Taking these into consideration, the preferred average particle size of the insulating powder is 1 to 7 μm.

As the polymer having an amine structure, either a polymer having an amine structure in a side chain or a polymer having an amine structure in a main chain can be used, but a polymer having an amine structure in a side chain is more preferable. . As the copolymer having an amine structure in the side chain, for example, an acrylic copolymer containing aminoalkyl (meth) acrylate as a copolymer monomer can be suitably used. The acrylic copolymer is a copolymer containing at least an acrylic monomer in a copolymer component, and specific examples of the acrylic monomer include methyl acrylate, ethyl acrylate, n-propyl acrylate, and isopropyl acrylate. , N-butyl acrylate, sec-butyl acrylate, isobutyl acrylate, tert
-Butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, Heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafluoro Acrylics such as ethyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, thiophenol acrylate, and benzyl mercaptan acrylate Monomers and those obtained by replacing these acrylates with methacrylates are exemplified. As the copolymerization component other than the acrylic monomer, all compounds having a carbon-carbon double bond can be used.
-Methylstyrene, o-methylstyrene, m-methylstyrene, α-methylstyrene, chloromethylstyrene,
Styrenes such as hydroxymethylstyrene, γ-methacryloxypropyltrimethoxysilane, 1-vinyl-
2-pyrrolidone and the like. Examples of the aminoalkyl (meth) acrylate include, for example, aminoethyl acrylate, N-methylaminoethyl acrylate, N-
Ethylaminoethyl acrylate, N, N-dimethylaminoethyl methacrylate, N, N-diethylaminoethyl acrylate, aminopropyl acrylate, aminopropyl acrylate, N-methylaminopropyl acrylate, N-ethylaminopropyl acrylate,
N, N-dimethylaminopropyl methacrylate, N,
N-diethylaminopropyl acrylate, aminoethyl methacrylate, N-methylaminoethyl methacrylate, N-ethylaminoethyl methacrylate, N, N
-Dimethylaminoethyl methacrylate, N, N-diethylaminoethyl methacrylate, aminopropyl methacrylate, aminopropyl methacrylate, N-methylaminopropyl methacrylate, N-ethylaminopropyl methacrylate, N, N-dimethylaminopropyl methacrylate, N, N -Diethylaminopropyl acrylate and the like.

Examples of the polymer having an amine structure in the main chain include polyalkylene polyamines such as polyethyleneimine.

The polymer having an amine structure may be added to the paste by any method. To enhance the effect of suppressing the reaction between the inorganic particles and the photosensitive resin,
Before mixing the inorganic particles and the photosensitive resin, it is desirable to coat the surface of the inorganic particles with a copolymer having an amino group.

As a method of coating the surface of the inorganic powder with the polymer having an amine structure of the present invention, a method of preparing a solution from the copolymer and a solvent, mixing the solution with the inorganic powder, and evaporating the solvent, or a method of co-polymerizing After mixing the coalesced solution and the inorganic powder, a method of separating the inorganic powder by a method such as filtration, centrifugation, or precipitation and adsorbing the inorganic powder on the surface may be mentioned.

The polymer in the photosensitive resin is not particularly limited, but the present invention exerts its effects particularly when the polymer is an alkali-soluble acrylic copolymer. As the acrylic copolymer in the photosensitive resin, all of the above-mentioned ones can be used, but it is preferable to use an alkyl acrylate or an alkyl methacrylate, and more preferably to include at least methyl methacrylate, so that the heat-decomposable A good polymer can be obtained. Since the polymer has alkali solubility, an alkali aqueous solution can be used as a developer instead of an organic solvent having environmental problems. In order to impart alkali solubility to the acrylic copolymer, it is achieved by adding an unsaturated acid such as an unsaturated carboxylic acid as a monomer. Specific examples of the unsaturated acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetate, and acid anhydrides thereof. By adding these, the acid value of the polymer is from 80 to 14 from the viewpoint of developability.
It is preferably in the range of 0.

In order to improve the curing speed, it is preferable that at least a part of the polymer has a carbon-carbon double bond in a side chain or a molecular terminal. Examples of the group having a carbon-carbon double bond include a vinyl group, an allyl group, an acryl group, and a methacryl group. In order to add such a functional group to the polymer, a compound having a glycidyl group or an isocyanate group and a carbon-carbon double bond with respect to a mercapto group, an amino group, a hydroxyl group, and a carboxyl group in the polymer, acrylic acid chloride, There is a method in which methacrylic acid chloride or allyl chloride is produced by an addition reaction.

Examples of the compound having a glycidyl group and a carbon-carbon double bond include glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate and glycidyl isocrotonate. Examples of the compound having an isocyanate group and a carbon-carbon double bond include acryloyl isocyanate, methacryloyl isocyanate, acryloylethyl isocyanate, and methacryloylethyl isocyanate.

As the polyfunctional monomer, a compound having two or more carbon-carbon double bonds in one molecule is used. Specific examples thereof include allylated cyclohexyl diacrylate and 1,4-butanediol diacrylate. Acrylate,
1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate,
Polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate , Triglycerol diacrylate, trimethylolpropane triacrylate, bisphenol A
Examples include diacrylate, diacrylate of a bisphenol A-ethylene oxide adduct, diacrylate of a bisphenol A-propylene oxide adduct, and a compound in which one or all of the acryl group of the above compound is replaced with a methacryl group.

As the photopolymerization initiator, a commercially available photoradical initiator can be suitably used. For example, 2-benzyl-2
-Dimethylamino-1- (4-morpholinophenyl)
-Butanone-1, or bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2
Examples of 2,4-diethylthioxanthone and the like for -methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one include photopolymerization initiator systems which can be used in the present invention. However, the present invention is not limited to this.

The paste of the present invention can be obtained by uniformly mixing the above components with a kneading device or a dispersing device such as a three-roll mill or a coball mill. An example will be described. After the organic components are completely and uniformly mixed by a mixer or a stirrer, an inorganic powder is added, and further mixed and pre-dispersed. Thereafter, the mixture is kneaded through a three-roll mill. Preferably, the three-roll mill is passed continuously two to eight times.

Next, an example of forming a pattern using the photosensitive paste according to the present invention will be described, but the present invention is not limited to this.

A paste is applied on an alumina substrate, a glass substrate, or the like by screen printing and dried. 70 ° C-10
After drying by heating at 0 ° C. for a few minutes to 1 hour. Exposure is through a mask. A negative type mask is used for a desired electrode shape. Exposure is performed using a high-pressure mercury lamp or the like, and the amount of exposure is, for example, 10 to 3 as measured by i-line (365 nm).
It is performed at 00 mJ / cm ² . After exposure, development is performed using an alkaline aqueous solution as a developer. The alkaline aqueous solution is preferably an organic alkali such as tetramethylammonium hydroxide or ethanolamine in order to prevent residual metal components. After developing with a developer for a predetermined time, washing is performed with water. These development and washing can be performed by immersion, spraying, paddle, etc., but spray development is preferred because higher resolution can be obtained. The spraying time of the developing solution is 20 seconds to 200 seconds, and the washing with water is also performed by spraying for 10 seconds to 60 seconds. It is preferable to rotate the substrate during spraying from the viewpoint of uniformity of development. Rotation speed is 100 to 10
00 rpm is preferred. After washing with water, spin up to shake off excess water and dry. The rotation speed at this time is 1000
~ 4000 revolutions. If necessary, after completely removing the water with an oven or the like, firing is performed in an electric furnace, a belt furnace or the like to volatilize the organic components and sinter the inorganic powder to form a conductive film or an insulating layer. The firing is performed in the air or in a nitrogen atmosphere. If the conductor powder is a metal that is easily oxidized, such as copper,
In a nitrogen atmosphere, a hydrogen atmosphere, or the like containing 0 to 100 ppm, the pattern is formed by firing at a temperature of 800 to 1000 ° C. for 1 to 60 minutes.

With this configuration, a photosensitive paste having good storage stability and excellent pattern processability can be obtained.

The pattern formed by the photosensitive paste of the present invention is suitable for MC mounted on a notebook personal computer or a mobile phone.
M (multi-chip module) substrate electrode, CSP
(Chip size package) In addition to electrodes for substrates, chip inductors, chip components, and other chip component electrodes, module substrate electrodes, plasma-addressed liquid crystals, and plasma display panel electrodes It is not limited to use.

[0032]

EXAMPLES The present invention will be described in detail with reference to the following examples, but the present invention is not limited by these examples. For each composition (weight ratio) shown in Table 1,
The paste was adjusted in the manner described below, and a pattern workability test was performed. The raw materials used are shown below.

A. Inorganic powder a. Copper powder Monodisperse granular Average particle diameter 3.6 μm Specific surface area 1.0 (m ² / g) Tap density 4.5 (g / cm ³ ) (Dowa Mining Co., Ltd.)
B). Glass powder Monodispersed sphere Average particle size 2.7μm
Specific surface area 1.91 (m ² / g) Glass transition point 670
C. c. Ceramic powder Monodispersed sphere Average particle size 1.7
μm Specific surface area 2 (m ² / g) Alumina ceramic powder.

B. Polymer (in photosensitive organic component) Glycidyl methacrylate-modified methacrylic acid-methyl methacrylate copolymer a. Acid value 84 Weight average molecular weight 10000 (The weight average molecular weight in Examples and Comparative Examples was obtained by gel permeation chromatography (GPC) in terms of polystyrene.) Polyfunctional monomer Propylene oxide-modified trimethylolpropane triacrylate Trifunctional monomer Double bond equivalent 157 g / mol T
PA-330 (manufactured by Nippon Kayaku Co., Ltd.) Photoinitiator 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (Irgacure 369 manufactured by Ciba Specialty Chemicals, Inc .; hereinafter referred to as IC369).

E. Solvent γ-butyrolactone F. Dispersant Dispersant a: “NOPCOSPARSE 092” (manufactured by San Nopco Co., Ltd.) Leveling agent LC-951 (manufactured by Kusumoto Kasei Co., Ltd.) (effective concentration is 10% by weight, the remainder is solvent) Glass frit Glass frit a: ZrO ₂ (42), B ₂ O ₃ (2
4), SiO ₂ (21), Li ₂ O (7), Al ₂ O
₃ (4) Other oxides (2) Unit:% by weight Stabilizer a. Amino group-containing copolymer Methyl methacrylate / N, N-dimethylaminoethyl methacrylate copolymerization ratio 90/10 Weight average molecular weight in terms of polystyrene by GPC measurement 1
0000 b. Low molecular weight compound benzotriazole c. Copolymer without amino group Methyl methacrylate / methyl methacrylate copolymer Copolymerization ratio 90/10 Weight average molecular weight in terms of polystyrene by GPC measurement 1
0000 d. Polyethyleneimine average molecular weight 10,000 J.P. Developer Tetraethylammonium hydroxide 0.1% by weight
Aqueous solution.

The following operations were all performed under yellow light. In Examples 1, 3, 4, 5, and Comparative Examples 2, 3, 4, 5, and 7, before kneading the paste, the surface treatment of the inorganic powder was performed in advance by the following procedure.

Procedure for Surface Treatment of Inorganic Powder (1) 1 g of each stabilizer was dissolved in 100 g of 2-propanol. (2) A predetermined amount of an inorganic powder shown in Table 1 was mixed with the stabilizer solution. (3) After stirring for 10 minutes, 2-propanol was distilled off under reduced pressure.

In Comparative Examples 1, 6, and 8, no stabilizer was used. In Example 2, the surface treatment of the inorganic powder with the stabilizer was not performed, and the stabilizer a was mixed simultaneously with the preparation of the paste.

Preparation of Paste (1) A polymer and a solvent were mixed and heated at 60 ° C. for 3 hours to be dissolved. (2) The polymer solution was cooled to room temperature, the other organic composition, glass frit, and inorganic powder were mixed, and completely mixed at 200 rpm for 30 minutes at room temperature using a motor and a stirring blade. (3) The obtained slurry was rolled with three rolls (EXACT
Model 50) to obtain a paste.

Pattern Processing (1) The paste was applied on the entire surface of a 96% alumina substrate of 7.5 cm square (manufactured by Nikko Corporation) by screen printing.

The screen used was SUS # 325 mesh. (2) The printed substrate was dried in a hot air oven at 80 ° C. for 40 minutes. The film thickness after drying was 15 μm. (3) Using a high-pressure mercury lamp (15 mW / cm ² ), the paste was exposed through a pattern mask. The pattern mask used was a line / space pattern having a line width / interval = 30 μm / 30 μm. (4) The exposed substrate was immersed in an alkali developing solution (0.1% TMAH aqueous solution), developed by shaking, and then rinsed with a water shower. (5) The pattern was observed with an optical microscope.

Stability Test (1) The viscosity was measured immediately after the paste was prepared. (2) After standing at room temperature for one week, the viscosity was measured again. All the results are shown in Table 1.

Example 1 shows a case where the surface treatment was performed with an acrylic copolymer having an amino group in a side chain in the present invention. The stability of the paste was better than the untreated copper powder according to Comparative Example 1. Comparative Examples 2 to 4 are pastes using a benzotriazole compound which is a general copper rust inhibitor as a stabilizer. Although the stability was improved as compared with the untreated product of Comparative Example 1, a considerable increase in viscosity was observed at room temperature for one week, and the stabilizing effect did not reach that of Example 1 even when the amount of addition was increased. In addition, as the amount of addition increased, the pattern workability decreased. Comparative Example 5 is a case where a copolymer having no amine structure was used as a stabilizer. Compared to Comparative Example 1, almost no improvement in stability was observed.

In Example 2, a stabilizer a was used in the same manner as in Example 1.
However, the surface treatment of the copper powder was not performed, and the stabilizer a was mixed at the time of kneading the paste. Even in this case, the stability of the paste was better than Comparative Example 1. Example 3 is an example in which glass powder and stabilizer a were used, and the paste was more stable than Comparative Example 6 in which no stabilizer was used and Comparative Example 7 in which benzotriazole was used as a stabilizer. Sex was improving. Example 4 is an example in which ceramic powder and stabilizer a were used, and the paste stability was improved as compared with Comparative Example 8 in which no stabilizer was used.

From the results shown in Table 1, it was found that the copolymer having an amino group in the side chain according to the present invention significantly improved the stability of the photosensitive paste.

Example 5 is a case where polyethyleneimine which is a polymer having an amine structure in the main chain is used as a stabilizer. Also in this case, the stability of the paste was better than the untreated product of Comparative Example 1.

[0047]

[Table 1]

[0048]

According to the present invention having the above-described structure, the reactivity between the photosensitive resin and the inorganic powder in the photosensitive paste is suppressed, and the viscosity and solidification are effectively prevented, and the stable photosensitive composition is obtained. A paste can be obtained. Also,
According to the present invention, a photosensitive paste excellent in stability and pattern processability can be obtained.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 101/12 C08L 101/12 G03F 7/004 501 G03F 7/004 501 7/032 7/032 H05K 1 / 09 H05K 1/09 D

Claims (7)

[Claims] 1. A photosensitive paste comprising an inorganic powder and a photosensitive resin as essential components, comprising a polymer having an amine structure. 2. The photosensitive paste according to claim 1, wherein the polymer having an amine structure is an acrylic copolymer having an amine structure in a side chain. 3. The photosensitive paste according to claim 1, wherein the polymer having an amine structure is an acrylic copolymer containing aminoalkyl (meth) acrylate. 4. The photosensitive paste according to claim 1, wherein at least a part of the inorganic powder is a copper powder. 5. The photosensitive paste according to claim 1, wherein at least a part of the inorganic powder is a glass powder. 6. The photosensitive paste according to claim 1, wherein at least a part of the inorganic powder is a ceramic powder. 7. The photosensitive paste according to claim 1, wherein the photosensitive resin contains at least an alkali-soluble acrylic copolymer.