JP2000331974A - Substrate rotation processing equipment - Google Patents

Abstract

(57) Abstract: A substrate capable of reliably removing a coating solvent that has flowed to the back surface of a substrate during coating of the surface of the substrate held by suction on a spin chuck without forming a trace of the shape of the spin chuck. Provided is a rotation processing device. SOLUTION: A spin chuck 1 is provided on an upper surface for rotating while sucking and holding a substrate 2, and a processing liquid ejection hole 10 is provided at a position on the upper surface of the spin chuck opposed to the substrate back surface. The processing liquid is supplied to the back surface of the substrate 2 adsorbed on the upper surface of the spin chuck to perform the back surface processing of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate rotation processing apparatus that rotates by sucking a substrate. More specifically, the present invention relates to a substrate rotation processing apparatus suitable for performing a chemical treatment on the rear surface side of an adsorbed substrate.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, a spin coater is used to apply a resist or the like to a wafer surface. In this spin coater, a wafer is attracted to the upper surface of a spin chuck and rotated, and a resist is dropped from above and diffused on the wafer surface to apply the resist uniformly. During this resist coating, a coating solution such as a resist flows around the back surface of the substrate. In order to clean the resist that has wrapped around the back surface of the wafer, the resist is applied to the front surface of the wafer, and the cleaning solution is sprayed onto the back surface of the wafer while rotating while holding the wafer on a spin chuck to clean the back surface of the resist. ing.

FIG. 5 is a configuration diagram of a conventional spin coater (substrate rotation processing apparatus). A substrate 2 such as a semiconductor wafer to be processed is fixedly held on the upper surface of the spin chuck 1 by vacuum suction. The spin chuck 1 is rotatably driven by a motor 3 provided on the lower surface side of a base 5, and has a vacuum suction line 4 provided through a shaft thereof to suction the substrate 2. The base 5 is provided with a lower cover 6 surrounding the spin chuck 1. Upper cover 7 fitted to lower cover 6
Are provided so as to be movable up and down. A drain pipe 8 is connected to the lower cover 6. A treatment liquid (cleaning liquid) such as a chemical solution or pure water is provided on the back surface side of the substrate 2 outside the outer edge of the spin chuck 1.
Is provided.

In the substrate rotating apparatus having the above structure, the substrate 2 to be processed is rotated while being held by suction on the spin chuck 1, and a cleaning liquid is jetted from the nozzle 9 onto the back surface of the substrate 2 to perform the cleaning process on the substrate 2.

[0005]

However, in the above-described conventional substrate rotation processing apparatus such as a spin coater,
The cleaning liquid sprayed from the nozzle 9 to the back surface of the substrate enters the gap formed between the substrate and the spin chuck chucking surface or accumulates at the boundary to form a mark, which becomes dust in a later process and becomes wafer dust. Had the problem of affecting

On the other hand, a coating apparatus for coating a resist on a semiconductor wafer or the like is disclosed in Japanese Patent Laid-Open No. 5-160017. This publication discloses a coating apparatus for cleaning a coating liquid attached to a cup surrounding a spin chuck by spraying a cleaning liquid from an inner surface side of the spin chuck toward an inner surface of the outer cup.

However, the technique described in this publication is for cleaning the container of the spin chuck, not for cleaning the back surface of the wafer, and is therefore configured to spray the cleaning liquid from the side surface of the spin chuck to the outer periphery. Therefore, the supply of the cleaning liquid to the wafer suction surface on the upper surface of the spin chuck is not sufficient, and the problem of dust remaining on the back surface of the wafer cannot be solved.

The present invention has been made in consideration of the above-mentioned prior art, and is intended to remove the coating solvent that has flowed to the back surface of the substrate while coating the surface of the substrate held by suction on the spin chuck without forming a mark in the shape of the spin chuck. It is an object of the present invention to provide a substrate rotation processing device that can be reliably removed.

[0009]

In order to achieve the above object, the present invention has a spin chuck which rotates while adsorbing and holding a substrate on an upper surface, and ejects a processing liquid at a position on the upper surface of the spin chuck which faces the back surface of the substrate. A substrate rotation is performed by supplying a processing liquid from the processing liquid ejection hole to the back surface of the substrate that is adsorbed on the upper surface of the rotating spin chuck, and performing the back surface processing of the substrate. A processing device is provided.

According to this structure, the processing liquid for cleaning is supplied from the upper surface of the spin chuck to the back surface of the substrate sucked and held on the upper surface, and the processing liquid spreads in the outer peripheral direction by the centrifugal force of the spin chuck. Since the coating fluid flows outward from the gap between the substrate and the spin chuck, the coating liquid that has spilled and adhered to the back side of the substrate during the spin coating process is reliably removed, and the coating liquid in the shape of the outer edge of the spin chuck causes dust. Traces are minimized.

In a preferred configuration example, a plurality of processing liquid ejection holes are provided at positions on the circumference of the peripheral portion of the spin chuck.

According to this structure, since a plurality of processing liquid ejection holes are provided side by side along the circumference on the periphery of the upper surface of the spin chuck, the ejected processing liquid is uniformly distributed toward the outer periphery by the centrifugal force of the spin chuck. The back surface of the flow substrate can be uniformly cleaned.

In a further preferred configuration example, the processing liquid ejection hole penetrates obliquely from the back surface side of the spin chuck to an outer side of the upper surface, and the upper surface of the spin chuck radially outside of the opening is in contact with the back surface of the substrate. It is characterized in that a step is formed so that a gap is formed therebetween.

According to this structure, the processing liquid ejection hole penetrating from the back surface side to the upper surface side of the spin chuck is inclined upward and outward, and the opening on the upper surface of the spin chuck has an outer side. Since the processing liquid is formed lower due to the step, the processing liquid supplied from the back surface of the spin chuck is smoothly supplied to the upper surface of the spin chuck through the processing liquid ejection hole inclined outward, and further, from the opening thereof to the outside, the processing liquid is supplied by the step. The substrate can sufficiently be spread through the gap between the formed substrate back surface and the substrate back surface to be cleaned.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a spin coater as a substrate rotation processing apparatus according to an embodiment of the present invention. FIG. 2 is a top view of the spin chuck,
FIG. 3 is a longitudinal sectional view, and FIG. 4 is an enlarged sectional view of the edge.

In this embodiment, a substrate 2 such as a semiconductor wafer to be processed is fixedly held on the upper surface of the spin chuck 1 by vacuum suction, as in the example of FIG.
The spin chuck 1 is rotatably driven by a motor 3 provided on the lower surface side of a base 5, and has a vacuum suction line 4 provided through a shaft thereof to suction the substrate 2. The base 5 is provided with a lower cover 6 surrounding the spin chuck 1.
An upper cover 7 fitted to the lower cover 6 is provided movably up and down. A drain pipe 8 is connected to the lower cover 6.

In this embodiment, a nozzle 9 for injecting a processing liquid (cleaning liquid) such as a chemical solution or pure water to a position lower by, for example, several mm on the lower surface side of the spin chuck 1.
Is provided.

As shown in FIG. 2, a vacuum suction groove 11 connected to the vacuum suction line 4 is formed on the upper surface of the spin chuck 1. Vacuum suction groove 1 of this spin chuck 1
A plurality of processing liquid ejection holes 1 along the circumference of the outer peripheral portion of
0 is provided. As shown in FIG. 3 and FIG. 4, each processing liquid ejection hole 10 penetrates from the back side to the upper side of the spin chuck 1 so as to be inclined outward and upward. In addition, a step 12 is formed in the opening of each processing liquid ejection hole 10 on the upper surface of the spin chuck so that the outside of each opening is low.
Is formed. Thereby, a gap G is formed between the step surface outside the opening of each processing liquid ejection hole 10 and the back surface of the substrate 2.

In the spin coater having the above structure, the substrate 2 is rotated while being sucked and held on the spin chuck 1.
When the cleaning liquid is ejected from the nozzle 9, the cleaning liquid enters each processing liquid ejection hole 10 of the spin chuck 1, and rises through the inclined processing liquid ejection hole 10 due to the ejection pressure and the centrifugal force of the spin chuck 1, and the cleaning liquid flows upward. Out of the opening. The outflowing cleaning liquid diffuses outward through the gap G formed by the step 12 outside the opening to flow, and uniformly cleans the back surface of the substrate.

[0020]

As described above, according to the present invention, the processing liquid for cleaning is supplied from the upper surface of the spin chuck to the back surface of the substrate which is sucked and held on the upper surface, and the processing liquid is supplied by the centrifugal force of the spin chuck. Since it spreads in the outer peripheral direction and flows outward from the gap between the substrate and the spin chuck, the coating liquid and the like that has spilled and adhered to the back side of the substrate in the spin coating process is reliably removed, and the spin that causes dust is removed. Traces of the coating liquid in the shape of the outer edge of the chuck are minimized.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a spin coater according to an embodiment of the present invention.

FIG. 2 is a top view of a spin chuck of the spin coater of FIG.

FIG. 3 is a longitudinal sectional view of the spin chuck of FIG. 2;

FIG. 4 is an enlarged view of a peripheral portion of the spin chuck of FIG. 3;

FIG. 5 is a configuration diagram of a conventional spin coater.

[Explanation of symbols]

1: spin chuck, 2: substrate, 3: motor, 4: suction line, 5: base, 6: lower cover, 7: upper cover,
8: drainage pipe, 9: nozzle, 10: processing liquid ejection hole, 11:
Vacuum suction groove, 12: step.

Claims (3)

[Claims] A spin chuck configured to adsorb and hold a substrate on a top surface thereof and rotate the spin chuck; and a processing liquid ejection hole provided at a position opposite to a back surface of the substrate on the top surface of the spin chuck. A substrate rotation processing apparatus characterized in that a processing liquid is supplied to a back surface of a substrate that is adsorbed on an upper surface of a chuck to perform a back surface processing of the substrate. 2. The substrate rotation processing apparatus according to claim 1, wherein a plurality of processing liquid ejection holes are provided at positions on a circumference of a peripheral portion of the spin chuck. 3. The processing liquid ejection hole penetrates the back surface of the spin chuck at an angle from the back surface side to the outside of the top surface, and the top surface of the spin chuck radially outside of the opening has a gap between the spin chuck surface and the back surface of the substrate. The substrate rotation processing apparatus according to claim 1, wherein a step is formed so as to be formed.