JP2000332057A - Manufacturing method of wiring board on which wiring board and electronic component are mounted - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which is easy to manufacture and in which voids are not easily generated in the resin when the resin is injected between the wiring board and the electronic component after mounting the electronic component, and in the resin. Provided is a method for manufacturing a wiring board on which an electronic component in which voids are unlikely to be generated is mounted. SOLUTION: The wiring board 10 according to the present invention includes an IC chip 2
No. 0 is a wiring board that can be mounted on the mounting surface 10MA of the mounting portion 10M. The mounting surface 10MA is provided with solder bumps 17 and surface pads 15 which can be connected to the bumps 22 of the IC chip 20, and the mounting surface 10M is provided in the mounting portion 10M.
A communication hole 12H for communicating the MA with its back surface 11B is provided on the inner periphery, and the solder bump 17 and the surface pad 15
And a hollow cylindrical through-hole conductor 12 that conducts with the conductor.
After the IC chip 20 is mounted on the mounting surface 10MA, the communication holes 12
The resin R is injected while allowing air to escape from the H, thereby forming a filled resin layer 41 without voids.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which electronic components can be mounted, and a method of manufacturing a wiring board on which electronic components are mounted. The present invention relates to a method for manufacturing a wiring board on which electronic components are mounted and a wiring board in which no void remains in a resin when a component is fixed to the wiring board.

[0002]

2. Description of the Related Art Electronic components such as IC chips and capacitors are mounted on a wiring board by, for example, soldering. However, due to a difference in the coefficient of thermal expansion between the electronic component and the wiring board, external shock vibration, or the like, disconnection due to a crack generated in a soldered portion, breakage due to a crack generated in the electronic component, and the like may occur. Therefore, in order to prevent these problems, resin is injected into a gap between the electronic component and the wiring board to fix the electronic component to the wiring board. Furthermore, in addition to injecting the resin into the gap, the electronic component is covered with the resin, the electronic component is mounted in the concave portion formed in the wiring substrate, and the concave portion is filled with the resin. It is fixed and integrated.

[0003]

However, in general, the gap between the electronic component and the wiring board is small, and it is difficult to inject the resin so that the space between the two is reliably filled with the resin. Voids had occurred. When voids occur, the reliability of the connection between the electronic component and the wiring board decreases, for example, due to the difference in the coefficient of thermal expansion between the electronic component and the wiring board, stress is concentrated at this part and cracks are likely to occur in the solder. Let it. In particular, when forming a concave portion for accommodating electronic components on a wiring board and mounting electronic components on the bottom surface thereof,
As compared with the case where an electronic component is mounted on a flat wiring board, the method of injecting the resin itself is restricted, and it is more difficult to reliably inject the resin between the two.

Therefore, a communication hole is formed in a mounting portion of the wiring board for mounting an electronic component, the communication hole communicating between the mounting surface and the back surface thereof. It is possible to prevent it. However, on the mounting part for mounting electronic components on the wiring board, the terminals (pads, bumps, pins, etc.) of the electronic components are mounted on the mounting surface.
A connection terminal such as a pad or a bump is formed for connection to the substrate by soldering or the like. Further, the mounting portion is formed on a part of a wiring extending from the connection terminal to a terminal (pad, bump, pin, or the like) for connecting to a motherboard, an IC chip, or other electronic components, for example, on a mounting surface. Wiring layers, via conductors and through-hole conductors extending from the mounting surface in the mounting portion toward the back surface. For this reason, since connection terminals, wiring layers, via conductors, through-hole conductors, and the like may be formed at high density in the mounting portion, it may be difficult to form communication holes.

The present invention has been made in view of the above problems, and is easy to manufacture. When the resin is injected between the wiring board and the electronic component after the electronic component is mounted, a void is formed in the resin. It is an object of the present invention to provide a method for manufacturing a wiring board on which electronic components are unlikely to be generated and a wiring board on which electronic components in which voids are unlikely to be generated are mounted.

[0006]

Means for Solving the Problems, Functions and Effects The solution is to provide a wiring board having a mounting portion, in which an electronic component can be mounted on a mounting surface of the mounting portion. An electronic component connection terminal connectable to the terminal of the electronic component is provided, and a communication hole communicating the mounting surface and the back surface is provided in an inner periphery in the mounting portion, and furthermore, is electrically connected to the electronic component connection terminal. A wiring board comprising a hollow cylindrical through-hole conductor.

The wiring board of the present invention includes a hollow cylindrical through-hole conductor having a communication hole in a mounting portion. For this reason, after connecting the terminals of the electronic component to the electronic component connection terminals and mounting the electronic component on the mounting surface of the mounting portion, a resin for fixing the electronic component is injected between the electronic component and the mounting surface, and the electronic component is mounted. When sealing the component, air can escape from the communication hole of the cylindrical through-hole conductor. For this reason, the space between the electronic component and the mounting surface (mounting portion) can be completely filled with the electronic component fixing resin, and no void is generated in the resin. Moreover, this cylindrical through-hole conductor is electrically connected to the connection terminal of the electronic component, so that the terminal of the electronic component can be pulled out to the back surface or connected to the internal wiring. Also plays a role. It can be formed even when connection terminals, wiring layers, and the like are formed at high density on the mounting portion. Further, there is no need to separately form an air vent hole, and the wiring board can be formed at low cost. In addition, connecting the communication hole of the cylindrical through-hole conductor to negative pressure,
Injecting the resin while pulling the air between the electronic component and the wiring board (mounting surface) can more reliably prevent the generation of voids.

Conversely, by injecting the resin from the communication hole, the resin can be injected without expelling air from the inside so that the air can be injected without generating voids. Thus, the through-hole conductor also serves as a resin injection port, and can be formed even when connection terminals, wiring layers, and the like are formed in the mounting portion at high density. Further, there is no need to separately form a resin injection port, and the wiring board can be formed at low cost.

The electronic component may be any electronic component as long as it is mounted on a wiring board and fixed to the wiring board with a resin. For example, an IC chip, a transistor chip, a filter, a crystal oscillator, a resistor, Capacitors,
CSP with inductor, IC chip, etc.
And a wiring board on which these electronic components are mounted. Furthermore, on the wiring board of the present invention on which electronic components can be mounted, a resin insulating layer is further formed after the electronic components are mounted,
An electronic component-embedded wiring board is also included, for example, by embedding the electronic component with a resin after mounting, and includes, for example, a core wiring board and a wiring board having a concave portion for housing the electronic component. Further, the mounting portion is not necessarily located at the center of the wiring board, and includes a plurality of mounting portions for mounting a plurality of electronic components. The electronic component connection terminals only need to be arranged corresponding to the terminals of the electronic components to be mounted, and the form may be appropriately selected according to the terminals of the electronic components to be mounted. Accordingly, for example, a pad, a bump, or the like may be used.

Further, it is preferable that the wiring board is capable of housing the electronic component, and has at least a part of a bottom surface having an electronic component housing recess serving as the mounting surface.

In the wiring board of the present invention, at least a part of the bottom of the concave part for accommodating the electronic component is a mounting part, that is, at least a part of the bottom is a mounting surface. The electronic component is mounted on the mounting surface of the bottom surface and the electronic component is housed in the electronic component housing recess, and then the resin is injected between the electronic component and the mounting surface, and further, the electronic component is covered with the resin. When the resin is buried in the recess as described above, the method of injecting the resin itself is restricted. For this reason, it is particularly difficult to inject the resin between the electronic component and the mounting surface, and a void is easily generated between them.

On the other hand, in the wiring board of the present invention, since the mounting portion is provided with the cylindrical through-hole conductor, air is released from the communication hole of the cylindrical through-hole conductor during resin injection.
Alternatively, by injecting the resin from the communication hole, the resin can be reliably injected without generating a void, and the electronic component can be fixed or embedded in the concave portion.

[0013] Further, in the wiring board according to any one of the above, at least one cylindrical through-hole conductor having the communication hole opened is disposed at a substantially central portion of the mounting surface. It is good to use a wiring board that performs this.

In general, when a resin is injected between the electronic component and the mounting surface from the periphery of the electronic component, voids are likely to remain at substantially the center of the mounting area, and the voids in this portion are most difficult to remove. In the present invention, since the cylindrical through-hole conductor having the communication hole opened substantially in the center of the mounting surface, air can escape through the communication hole in the center, so that the generation of voids can be more reliably prevented. . Alternatively, even when the resin is injected from the communication hole, the resin spreads out around the central portion so as to expel the air, so that the generation of voids can be more reliably prevented.

Another solution is a method of manufacturing a wiring board on which an electronic component is mounted, wherein the terminal of the electronic component is connected to an electronic component connection terminal formed on a mounting surface of a mounting portion of the wiring board. An electronic component mounting step for mounting the electronic component, and a communication hole formed in the mounting portion and communicating with the mounting surface and the back surface on an inner periphery thereof, and furthermore, a hollow hole which is electrically connected to the electronic component connection terminal. A resin injecting step of injecting and filling a resin between the mounting surface and the electronic component while allowing air to escape from the communication hole of the cylindrical through-hole conductor; It is a manufacturing method of.

In the method of the present invention for manufacturing a wiring board on which electronic components are mounted, the inner periphery of the through-hole conductor formed on the mounting surface is not filled but is formed as a communication hole, and resin is injected while allowing air to escape from the communication hole. Because of the filling, voids hardly remain between the mounting surface and the electronic component. Moreover, the terminals of the electronic component can be pulled out from the mounting surface to the back surface or connected to the internal wiring by the cylindrical through-hole conductor. The resin to be injected may be appropriately selected in material, viscosity and the like in consideration of the coefficient of thermal expansion and the curing temperature of the electronic equipment and the wiring board, and examples thereof include an epoxy resin and a polyimide resin.

In the method of manufacturing a wiring board on which the electronic component is mounted, the electronic component mounting step may include the electronic component housing recess, wherein the electronic component can be stored and at least a part of a bottom surface is the mounting surface. It is preferable to provide a method for manufacturing a wiring board on which electronic components are mounted, wherein the method is a step of mounting the electronic components in a concave portion for mounting the electronic components.

When the resin is injected between the electronic component mounted in the electronic component housing recess and the mounting surface (bottom surface), the resin injection method itself is restricted, so that it is generally difficult to inject the resin. It is easy for voids to remain. In contrast,
In the manufacturing method of the present invention, since the resin is injected while releasing the air from the communication hole, the air between the electronic component and the mounting surface can be released, even when the electronic component is mounted in the concave portion, Generation of voids in the resin can be prevented.

Further, in the method for manufacturing a wiring board on which the electronic component is mounted, at least one cylindrical through-hole conductor having the communication hole opened at a substantially central portion of a mounting surface is provided.
It is preferable to provide a method of manufacturing a wiring board on which electronic components are mounted.

In the manufacturing method according to the present invention, the cylindrical through-hole conductor is arranged so as to open the communication hole substantially at the center of the mounting surface. For this reason, the generation of voids near the center, which tends to remain, can be reliably suppressed.

Further, in the method of manufacturing a wiring board on which the electronic component is mounted, in the resin injecting step, a resin is filled between the mounting surface and the electronic component while the communication hole is connected to a negative pressure. It is preferable to use a method for manufacturing a wiring board on which electronic components are mounted, which is characterized by injection.

In the manufacturing method of the present invention, the communication hole is connected to a negative pressure. For this reason, since air between the mounting surface and the electronic component can be more reliably released, no void is generated in the resin.

Still another solution is a method of manufacturing a wiring board on which an electronic component is mounted, wherein the terminal of the electronic component is connected to an electronic component connection terminal formed on a mounting surface of a mounting portion of the wiring board. An electronic component mounting step to be connected, and a hollow cylindrical through-hole conductor formed in the mounting portion and having a communication hole on the inner periphery for communicating the mounting surface and the back surface thereof, and electrically connected to the electronic component connection terminal. A resin injection step via a communication hole for injecting and filling a resin between the mounting surface and the electronic component from the communication hole.

In the method of the present invention for manufacturing a wiring board on which electronic components are mounted, the inner periphery of the through-hole conductor formed on the mounting surface is not filled but is formed as a communication hole, and the mounting surface and the electronic component are removed from the communication hole. The resin is injected and filled in between. For this reason,
The resin spreads around while extruding air between the mounting surface and the electronic component, so that voids hardly remain between the mounting surface and the electronic component. Moreover, with the cylindrical through-hole conductor,
Terminals of the electronic component can be pulled out from the mounting surface to the back surface, or connected to internal wiring.

Further, in the method of manufacturing a wiring board on which the electronic component is mounted, in the resin injecting step, the resin is injected from the cylindrical through-hole conductor having the communication hole opened at a substantially central portion of the mounting surface. And a method of manufacturing a wiring board on which electronic components are mounted.

When resin is injected from a cylindrical through-hole conductor having a communicating hole opened at the center, the injected resin can be injected in such a manner that the resin expands while expelling air from the center toward the periphery. Generation can be suppressed more reliably.

[0027]

(Embodiment 1) A first embodiment of the present invention will be described with reference to the drawings. The wiring board 10 shown in FIG. 1 is a wiring board on which an IC chip 20 shown by a broken line can be mounted, and can be further mounted on a motherboard 30. The wiring board 10 has a through hole 11H penetrating between a front surface 11A and a back surface 11B of a wiring board body 11 made of a glass-epoxy resin composite material, and a through-hole conductor 12 is formed on an inner peripheral surface thereof. I have.
The through-hole conductor 12 has a cylindrical shape, and the inside thereof is a hollow communication hole 12H. The front surface wiring layer 13 is formed on the front surface 11A, and the surface pads 15 are formed at positions corresponding to the bumps (terminals) 22 formed on the back surface 21B of the IC chip main body 21, and are formed thereon. Solder bump 17 and through-hole conductor 1
2 is connected. Similarly, on the back surface 11B, the back surface wiring layer 14 is formed, and the front surface 31 of the motherboard main body 31 is formed.
A back surface pad 16 formed at a position corresponding to each of the pads 32 formed at A, and the through-hole conductor 12 are connected. That is, the through-hole conductors 12 are connected to the solder bumps 17 and the front pads 15, which are drawn out to the back surface 11B and connected to the back pads 16.

In particular, in the wiring board 10, the through-hole conductor 12 is formed in the mounting portion 10M corresponding to the IC chip 20 indicated by the alternate long and short dash line, and particularly in the substantially central portion thereof. A communication hole 12H communicating with the mounting surface 11B is also opened at a substantially central portion of the mounting surface 10MA. Therefore, as will be described later, when the resin is injected from the periphery of the IC chip 20 after the IC chip 20 is mounted on the wiring board 10, air is released from the communication hole 12 </ b> H in the central portion, thereby forming a void in the resin. Is less likely to occur. Also, the resin can be injected without voids by injecting the resin through the communication hole 12H in the central portion.
Moreover, since the communication hole 12H is formed by the inner peripheral surface of the through-hole conductor 12, unlike the case where a separate communication hole is formed, the formation of the through hole 12 is sufficient, and the surface pad 15 and the surface wiring layer The 13 mounting surfaces 10M, which are likely to be dense, can also be easily formed.

Next, the IC chip 2 is
A method for forming an IC chip mounting wiring board by mounting the IC chip 0 will be described. First, in the IC chip mounting process,
The solder bumps 17 of the wiring board 10 and the bumps 22 of the IC chip 20 are aligned, the solder bumps 17 are melted, and the bumps 22 are connected with the solder 17M as shown in FIG. To be mounted on.

Further, as shown in FIG. 3, in the resin injection step, the contact surface VCA of the suction jig VC having a substantially U-shaped cross section is used.
Is sucked from the suction port VCM while the back surface 11B of the wiring board 10 is in contact with the suction board, the inside of the suction jig VC is set to a negative pressure, and the gap between the IC chip 20 and the wiring board 10 through the communication hole 12H. That is, the air between the back surface 21B and the mounting surface 10MA (the front surface 11B) is sucked. At the same time, by using the resin supply pipe RT, the IC chip 20 and the mounting surface 10M from the periphery of the IC chip main body 21, that is, from the vicinity of the side surface 21S.
An uncured epoxy resin R is supplied between the resin A and the resin A, and then the resin R is cured.

In general, air is difficult to escape simply by injecting the resin R from the periphery of the IC chip main body 21, and the mounting surface 1
Voids are likely to be formed in the central part on 0MA. But,
In the present embodiment, the IC chip 20 and the wiring board 10 are connected to each other through a communication hole 12H opened at a substantially central portion of the mounting surface 10MA.
As shown in FIG. 4, the filling resin layer 41 without voids can be formed between the IC chip 20 and the wiring board 10 by sucking the air between them.

In the above embodiment, the air is sucked from the communication hole 12H at the center and the IC chip 20 is sucked.
The resin R is injected and filled from the peripheral edge of the resin supply pipe. However, as shown in FIG. 5, the uncured resin R may be injected through the resin supply pipe RT2 and the communication hole 12H in the central portion brought into contact with the resin supply pipe RT2. The supplied resin is used for the IC chip 20 and the wiring board 1.
Since the filling is performed so as to expel air from the central portion toward the periphery and spread out from the center portion, the filling can be performed without generating voids.

(Embodiment 2) Next, a second embodiment of the present invention will be described. In the first embodiment, the IC chip 20 is mounted on the mounting surface 10MA of the flat wiring board 10. In the present embodiment, the capacitor is mounted in the recess of the core wiring board having the recess for incorporating the capacitor.
After fixing with resin, a resin insulating layer is further formed to obtain a wiring board with a built-in capacitor. That is, the wiring board 210 with a built-in capacitor of the present embodiment shown in FIG. 6 is generally mounted and built in a core wiring board 220 having a recessed part for capacitor built-in (hereinafter also simply referred to as a recessed part) 222, and a bottom surface 223A of the recessed part 222. The capacitor 230 includes an upper resin insulating layer 250 and a lower resin insulating layer 260 formed above and below the capacitor 230. This wiring board 21 with a built-in capacitor
0 indicates that an IC chip 270 having a large number of hemispherical bumps 272 can be mounted on the lower surface 271B of the IC chip main body 271 as indicated by a broken line.

Among them, the core wiring board 2 according to the present invention
Numeral 20 is made of a glass-epoxy resin composite material, has a substantially square plate shape, and has a capacitor-containing recessed portion 222 having a square shape in plan view and a bottomed recess at substantially the center thereof. As described above, the capacitor 230 can be mounted on the mounting surface 223MA which is the upper surface (the bottom surface of the concave portion) of the mounting portion 223M on the middle side of the bottom portion 223 of the concave portion 222. That is, a bottom through hole 223H is formed between the mounting surface 223MA and the core substrate lower surface 220B, and a cylindrical bottom through hole conductor 224 is formed on the inner peripheral surface thereof.
23MA, and a wiring layer 226 and a pad 2 formed on the core substrate lower surface 220B.
Conduction with 26P. The bottom through-hole conductor 224 has a cylindrical shape, and the inner peripheral surface thereof forms a communication hole 224H and communicates vertically.

The capacitor 230 has a lower capacitor pad 231 formed on the lower surface 230B thereof and the pad 2 described above.
25P is connected to the mounting surface 223MA at a substantially central portion of the bottom surface 223A by connecting with the solder 232.
Since the internal structure of the capacitor 230 will be described later (see FIG. 7), it is abbreviated in FIG. 6 and the like. On the other hand, a large number of upper capacitor pads 233 are also provided on the upper surface 230A of the capacitor 230. This upper capacitor pad 23
3 is formed at a position corresponding to a part of the bump 272 of the IC chip 270, and the bump 2 is formed by an IC connection capacitor bump 234 penetrating the upper resin insulating layer 250.
72 can be connected.

The core wiring board 220 and the capacitor 230 are connected to the filled resin 24 filled in the recess 222.
1A, they are fixed to each other and integrated. Further, the filling resin also covers the upper surface 230A of the capacitor and the upper surface 220A of the core substrate to form filling resin layers 241B and 241C, respectively. Filled resin layer 241
The wiring layer 242 and the pad 24
2P is formed on the lower surface 220B of the core substrate (lower in the figure).
Are formed with a wiring layer 243 and a pad 243P. Further, a through-hole conductor 244 that conducts between the wiring layer 242 and the wiring layer 243 is formed on the inner periphery of the through-hole 240H penetrating between the upper surface 241CA and the lower surface 240B of the core substrate. Filling resin 245
Is filled.

Further, in the upper resin insulating layer 250 made of epoxy resin, openings 251 and 25 are formed at positions corresponding to the upper capacitor pads 233 and the pads 242P.
2 are formed, and IC connection capacitor bumps 234 and bumps 253 are formed in these openings. Similarly, openings 254 and 255 are respectively formed at positions corresponding to pads 225P and 243P in lower resin insulating layer 260 made of epoxy resin, and bumps 256 and 257 are formed in these openings. I have. The upper resin insulating layer 250 and the lower resin insulating layer 260 also play a role of a solder resist layer when forming the bumps 253, 256, 257 and the IC connection capacitor bump 234, or when connecting these.

The schematic structure of the capacitor 230 built in the wiring board 210 with a built-in capacitor will be described with reference to FIG. The capacitor 230 shown in FIG.
This is a multilayer ceramic capacitor having a substantially square plate shape in which dielectric layers 235 mainly containing O ₃ and electrode layers 236 mainly containing Pd are alternately stacked. This capacitor 230
Is provided on the upper surface 230A with a number of upper capacitor pads 23.
3 (three in FIG. 7B). The upper capacitor pad 233 is connected to the bump 27 of the IC chip 270.
2 is formed at a position corresponding to the central part. On the other hand, the lower surface 230B is also provided with a number of lower capacitor pads 231 (three in FIG. 7B). The lower capacitor pad 231 is formed at a position corresponding to the pad 225P formed on the bottom surface 223A of the concave portion 222 for incorporating a capacitor.

As shown in FIG. 7 (b), each electrode layer 236 of the capacitor 230 has a pair of electrode layers 236E electrically connected to every other layer by via conductors 237EV and 237FV. , 236F. Moreover, since the electrode layer groups 236E and 236F are insulated from each other, the two (one pair) electrode groups 236E
E and 236F form two electrodes of the capacitor 230. Moreover, as can be easily understood from FIG.
Since these via conductors 237EV and 237FV are connected to upper capacitor pad 233 and lower capacitor pad 231 respectively, a pair of electrode groups 236 can be provided from either above or below capacitor 230.
E and 236F can be taken out.

Accordingly, the capacitor 230 and the wiring board 210 with a built-in capacitor are as shown in the circuit diagram of FIG. That is, a state where the upper capacitor pad 233 and the lower capacitor pad 231 are connected by the via conductor 237EV or the via conductor 237FV, and the capacitor 230 formed by the opposing electrode layer groups 236E and 236F is inserted therebetween. Become. Therefore,
Looking at the wiring board 210 with a built-in capacitor, the IC connection capacitor bump 234 and the bump 256 are connected by one via conductor 237EV or the bottom through-hole conductor 244, or the other via conductor 237FV or the bottom through-hole conductor 244, and During this time, the electrode layer capacitor 230 is inserted.

For this reason, from the bump 256 to the bottom through-hole conductor 244 and the electrode layer group 2 of the capacitor 230
36E, 236F and IC connection capacitor bump 23
4, the IC chip 2 with low resistance and low inductance
70 can be supplied with a power supply potential or a ground potential. In addition, noise during this period can be reliably removed by the capacitor 270. On the other hand, through the peripheral portion of the core wiring substrate 520, that is, from the bump 257, through the wiring layer 243, the through-hole conductor 244, the wiring layer 242, and the bump 253,
Signals can be input to and output from the IC chip 270.

Next, this capacitor-attached wiring board 21
0 will be described. The capacitor 230 is
A number of green sheets are formed by a known method, unfired via conductors and electrode layers are formed on the green sheets, and the green sheets are laminated in a predetermined order and then fired at the same time. The lower surface capacitor pad 231 of the capacitor 230 is formed by pressing and laminating an unfired dielectric layer on which an unfired via conductor and an unfired electrode layer are formed, and then forming a pattern corresponding to the lower surface capacitor pad 231 on the lower surface of the laminate. What is necessary is just to print with a Pd paste, and to form after that by simultaneous baking.

Next, a method of manufacturing the core wiring board 220 will be described. First, as shown in FIG. 8 (a), copper foil 322C is formed on both upper and lower surfaces 321A and 321B of a bottom core substrate body 321 made of a glass-epoxy resin composite material.
A double-sided copper-clad substrate 320 having 322D is prepared. Next, as shown in FIG. 8B, the double-sided copper-clad substrate 32 is placed at a predetermined position in a region where the recess 222 is formed.
A bottom through-hole 223H that penetrates 0 in the thickness direction is formed by a drill. When it is desired to reduce the interval and the diameter of the bottom through hole 223H, it is preferable to pierce the hole with a laser (CO ₂ , YAG, etc.).

Thereafter, the bottom through-hole conductor 224 is provided in the bottom through-hole 223H and the pads 225 are provided on the upper and lower surfaces 321A and 321B of the bottom core substrate body 321 by a known through-hole conductor forming technique and wiring forming technique.
P and the wiring layer 226 and the pad 226P are formed (see FIG. 8C). For example, specifically, electroless Cu plating and electrolytic Cu plating are applied to form a cylindrical Cu plating layer in the bottom through hole 223H, and copper foils 322C and 322D.
A Cu plating layer is also formed thereon. Thereafter, a resist film is attached and exposed and developed in a predetermined pattern. Then, the exposed Cu plating layer and the copper foils 322C and 322D are dissolved and removed, and the bottom through-hole conductor 224 and the pad 225 are removed.
P, forming the wiring layer 226 and the pad 226P

On the other hand, as shown in FIG. 8D, the wall core substrate main body 32, which is also made of a glass-epoxy resin composite material and is thicker than the bottom core substrate main body 321.
Prepare 3 In the core substrate 323 for the wall portion, a through hole 32 for the concave portion is previously provided at a position corresponding to the concave portion 222.
3H is formed by punching.

Next, as shown in FIG. 8 (e), the upper surface 321A of the bottom core substrate main body and the lower surface 323B of the wall core substrate main body are made of a semi-cured epoxy resin and conform to the through holes 323H for the concave portions. Then, the sheet is sandwiched via an adhesive sheet 324R molded into a substantially square shape, and heated and pressed. As a result, as shown in FIG.
The core wiring substrate 220 having the concave portion 222 adhered through the adhesive layer 324 can be formed. This core wiring board 22
In FIG. 0, a bottom through-hole conductor 224 having a communication hole 224H is formed in the mounting portion 223M on the middle side of the bottom portion 223 thinned by the concave portion 222. Further, as described below, the capacitor 230 and the mountable pad 22
5P is formed.

Next, the concave portion 22 of the core wiring substrate 220
The steps of arranging and mounting the capacitor 230 in the substrate 2 and forming the wiring board 210 with a built-in capacitor will be described. First, in the capacitor mounting step, as shown in FIG.
Mounting surface 223MA in recess 222 of core wiring substrate 220
Then, the above-mentioned capacitor 230 is replaced with a capacitor lower surface 230B.
Are arranged downward, and the lower surface capacitor pad 231 and the corresponding pad 225P are connected by soldering with solder 232 made of Ag-Sn, respectively. As a specific method, a solder paste is printed on the lower surface capacitor pad 231 in advance, and after overlapping with the pad 225P,
The solder paste is melted by passing through a reflow furnace and soldered.

After the flux in the concave portion 222 has been removed by washing, as shown in FIG. 9B, a filling resin 241 containing an epoxy resin as a main component is filled with the capacitor 230 and the mounting surface 22.
In addition to filling and filling the recesses 222 with the space between the 3MA and the upper surface of the core wiring substrate 220A and the capacitor upper surface 230A. At this time, the filling resin 241 is injected and filled between the capacitor lower surface 230B and the mounting surface 223MA while allowing air to escape from the communication hole 224H formed by the bottom through-hole conductor 224. Therefore, the resin can be easily injected and the capacitor 230 and the mounting surface 22
No voids remain in the filling resin 241 between 3MA. Thereafter, heating is performed to cure the filling resin 241.
Thus, the capacitor 230 is connected to the pad 225P and is fixed in the recess 222 by the void-free filling resin 241 (241A). When the capacitor 230 is fixedly attached to the core wiring board 220 in this way, even when heat, vibration, or the like is applied, problems such as breakage between the lower surface capacitor pad 230B and the pad 225P are prevented.

Further, as shown in FIG. 9C, the filling resin 241 on the upper surface 220A of the core wiring board and the upper surface 230A of the capacitor is polished flat, and
Resin layer 2 on the core wiring board upper surface 220A
41B and 241C are formed, and the upper capacitor pad 233 is exposed substantially flush with these. When the filling resin 241 is polished flat as described above, the core wiring substrate 22
The occurrence of a step due to the formation of the concave portion 222 of zero and the placement of the capacitor 230 therein is absorbed, and the influence of the step on the IC connection capacitor bumps 234 and 253 to be formed later is eliminated, and this is improved. It can have coplanarity.

Further, as shown in FIG. 10A, the upper surface 241CA of the filling resin layer 241C is formed on the periphery of the concave portion 222.
And a through hole hole 240H penetrating between the core wiring board lower surface 220B and the core wiring board 220B. Next, a through-hole conductor 244 made of Cu is formed in the through-hole 240H and the periphery thereof by a known method. Further, wiring layers 242 and 243 extending from the through-hole conductors 244 are formed on the upper surface 241CA of the filling resin layer and the lower surface 220B of the core substrate. In addition, the filling resin layer 2
Upper capacitor pad 233 flush with 41B is also
The thickness of the filled resin layer 241B is increased by u-plating.
It is in a state of projecting upward.

Further, as shown in FIG. 10B, the filling resin 245 is filled in the through-hole conductor 244. The upper resin insulating layer 250 made of epoxy resin and having openings 251 and 252 with the upper capacitor pad 233 or the pad 242P exposed at a predetermined position is formed by a known resin insulating layer forming method.
C, on the wiring layer 242 and the upper capacitor pad 233. Similarly, pads 225P and 243 are located at predetermined positions.
The lower resin insulating layer 260 having the openings 254 and 255 with the P
243.

In the present embodiment, the cylindrical through-hole conductor 244 is formed on the inner periphery of the through-hole 240H. However, the inside is filled with a filling resin capable of electrolytic plating, and the upper and lower portions thereof are closed with plating layers. May be. By doing so, the pads 242P and 243P can be formed directly above or directly below the through-hole holes 244.

Thereafter, solder paste is applied and melted in the openings 251, 252, 254 and 255, respectively, so that the IC connection capacitor bumps 234 and the bumps 25 are formed.
When 3, 256, 257 are formed, the wiring board 210 with a built-in capacitor shown in FIG. 6 is completed. As shown in FIG. 9C, the filling resin 241 on the upper surface 220A of the core wiring board and the upper surface 230A of the capacitor was polished and flattened.
Error in the dimensions of
The effect of deformation such as warpage can be eliminated. Therefore, it is possible to prevent disconnection or short circuit of the wiring layer 242, or to improve coplanarity of the IC connection capacitor bumps 234 and the bumps 252.

In the above, the present invention has been described with reference to the embodiments. However, it is needless to say that the present invention is not limited to the above embodiments, and can be appropriately modified and applied without departing from the gist thereof. Nor. For example, in the first embodiment, the wiring board main body 11 having no wiring layer formed therein is used. However, any type may be used as long as a wiring board body is used in which a through-hole conductor having a communication hole communicating vertically between the upper and lower surfaces of the wiring board body is formed on the inner periphery thereof. A build-up type wiring board main body having a resin insulating layer and a wiring layer above and below may be used. Although the IC chip 20 is used in the first embodiment and the capacitor 230 is used in the second embodiment as the electronic components to be mounted, other electronic components such as a transistor chip, a resistance element, and an inductance element may be used.

[Brief description of the drawings]

FIG. 1 is a sectional view of a wiring board according to a first embodiment.

FIG. 2 is a sectional view showing a state where an IC chip is mounted on the wiring board shown in FIG. 1;

FIG. 3 is a diagram showing a wiring board on which the IC chip shown in FIG. 2 is mounted;
FIG. 3 is an explanatory diagram showing a state where a resin is filled between an IC chip and a wiring board.

FIG. 4 is a sectional view of a wiring board on which an IC chip filled with resin is mounted between the IC chip and the wiring board;

FIG. 5 is an explanatory view showing a state in which a resin is injected from a communication hole to fill a space between the IC chip and the wiring board in the wiring board on which the IC chip shown in FIG. 2 is mounted.

FIG. 6 is a sectional view of a wiring board according to a second embodiment.

7A is a perspective view, FIG. 7B is a cross-sectional explanatory view, and FIG. 7C is a circuit diagram of a capacitor incorporated in the wiring board shown in FIG.

FIG. 8 is an explanatory view illustrating a step of forming a through-hole conductor at the bottom of the capacitor arrangement space in the method of manufacturing the wiring board shown in FIG. 6;

9 is an explanatory view illustrating a step of arranging and fixing a capacitor in a capacitor arrangement space in the method of manufacturing the wiring board shown in FIG. 6;

FIG. 10 is an explanatory diagram illustrating a step of forming a resin insulating layer on a wiring board and a capacitor by using a through-hole conductor of the wiring board in the method of manufacturing the wiring board shown in FIG. 6;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Wiring board 10M mounting part 10MA mounting surface 11 Wiring board main body 11H Through hole 12 Through hole conductor (tubular through hole conductor) 12H communication hole 17 Solder bump (electronic component connection terminal) 20 IC chip (electronic component) 21 IC chip main body 22 Bump (Terminal of electronic component) 30 Mother board 40 Wiring board for mounting IC chip 41 Injection resin layer 210 Wiring board with built-in capacitor 222 Concave recess for built-in capacitor 220 Core wiring board 223A Bottom surface 223M Mounting portion 223MA Mounting surface 225P Pad (electronic component connection terminal) 230 Capacitor (electronic component) 231 Lower capacitor pad (terminal) 250 Upper resin insulation layer 260 Lower resin insulation layer 270 IC chip 223H Bottom through hole 224 Bottom through hole conductor (tubular through hole conductor) 224H Hole 241A filled resin 241B, 241C filling resin layer

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H05K 3/40 H01L 23/12 L F term (reference) 5E317 AA24 BB01 BB02 BB11 BB12 CC15 CC32 CC33 CD25 CD32 CD34 GG16 GG20 5E336 AA04 AA08 BB03 BC15 BC26 CC31 CC53 EE03 GG12 GG16 GG30 5F044 KK10 KK27 RR19 5F061 AA01 BA04 CA04

Claims (7)

[Claims] 1. A wiring board having a mounting portion, wherein an electronic component can be mounted on a mounting surface of the mounting portion, and an electronic component connection terminal connectable to a terminal of the electronic component on the mounting surface. And a hollow cylindrical through-hole conductor that has a communication hole in the inner periphery thereof that communicates the mounting surface and the back surface thereof and that communicates with the electronic component connection terminal in the mounting portion. Wiring board. 2. The wiring board according to claim 1, wherein said electronic component can be accommodated, and at least a part of a bottom surface has an electronic component accommodating recess serving as said mounting surface. 3. The wiring board according to claim 1, wherein at least one of the cylindrical through-hole conductors having the communication holes opened substantially in a central portion of the mounting surface. A wiring board characterized by the above-mentioned. 4. A method of manufacturing a wiring board on which an electronic component is mounted, wherein the terminal of the electronic component is connected to an electronic component connection terminal formed on a mounting surface of a mounting portion of the wiring board. And a hollow cylindrical through hole formed in the mounting portion and communicating with the mounting surface and the back surface on an inner periphery thereof, and further connected to the electronic component connection terminal. A resin injecting step of injecting and filling a resin between the mounting surface and the electronic component while allowing air to escape from the communication hole of the conductor, a method for manufacturing a wiring board on which an electronic component is mounted. 5. The method for manufacturing a wiring board on which an electronic component is mounted according to claim 4, wherein, in the resin injecting step, the mounting surface is connected to the electronic component while the communication hole is connected to a negative pressure. A method for manufacturing a wiring board on which electronic components are mounted, wherein a resin is injected between the wiring boards. 6. A method of manufacturing a wiring board on which an electronic component is mounted, wherein the electronic component mounting terminal connects the terminal of the electronic component to an electronic component connection terminal formed on a mounting surface of a mounting portion of the wiring board. And a communication hole formed in the mounting portion and communicating with the mounting surface and the back surface on an inner periphery thereof, and from the communication hole of the hollow cylindrical through-hole conductor electrically connected to the electronic component connection terminal. And a resin injection step via a communication hole for injecting and filling a resin between the mounting surface and the electronic component. 7. The method for manufacturing a wiring board on which an electronic component is mounted according to claim 6, wherein, in the resin injecting step, the cylindrical through-hole conductor having the communication hole opened at a substantially central portion of a mounting surface. A method of manufacturing a wiring board on which electronic components are mounted, wherein the resin is injected from a substrate.