JP2000347206A - Liquid crystal display - Google Patents

Abstract

(57) Abstract: Provided is a liquid crystal display device which ensures a sufficient space between adjacent bumps of a driver integrated circuit 1 and reduces the size of the driver integrated circuit 1. SOLUTION: A liquid crystal display element substrate 2 in which a plurality of input terminals and a plurality of output terminals are arranged on a side edge portion, and a driver integrated circuit 1 in which a plurality of input bumps and a plurality of output bumps are arranged, are provided. A liquid crystal display device in which an output terminal, a plurality of input bumps, and a plurality of output bumps are bonded via an anisotropic conductive film, and a driver integrated circuit 1 is flip-chip mounted on a liquid crystal display element substrate 2. Any one of a triangular shape, a pentagonal shape, and a trapezoidal shape elongated in the array width direction, arranged in a staggered manner so as to form the output first bump row 4 or the output second bump row 5 every other, and the output second bump row At least a part of each output bump of the row 5 is arranged so as to enter between the output bumps of the output first bump row 4, and the plurality of terminals are at least partially corresponding to each of the plurality of bumps. The shape is similar to the shape of.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a driver integrated circuit (IC) via a plurality of terminals formed on a side edge of a liquid crystal display element substrate via an anisotropic conductive film. The present invention relates to a liquid crystal display device in which a driver integrated circuit is flip-chip mounted on a liquid crystal display element substrate by bonding to a plurality of formed bumps.

[0002]

2. Description of the Related Art In general, in a liquid crystal display device, a plurality of driver integrated circuits are mounted on a side edge of a liquid crystal display element substrate, and the liquid crystal display element is connected to the liquid crystal display element via these driver integrated circuits during a display operation of the liquid crystal display element. Is driving. A plurality of terminals are formed on the liquid crystal display element substrate along side edges, and a plurality of input bumps and a plurality of output bumps are formed on the plurality of driver integrated circuits at positions corresponding to the formation positions of the plurality of terminals. ing.

[0003] When a driver integrated circuit is flip-chip mounted, the bonding between the liquid crystal display element substrate and the plurality of driver integrated circuits is usually performed by using a conductive material made of particles or metal powder formed by metal-plating resin spheres in a binder material. This is performed by using an anisotropic conductive film containing fine particles. At this time, the anisotropic conductive film is interposed between a plurality of terminals formed on the liquid crystal display element substrate and a plurality of input bumps and a plurality of output bumps formed on the plurality of driver integrated circuits, respectively. A plurality of driver integrated circuits are adhered to a side edge of a liquid crystal display element substrate by an adhesive force of a binder material in an anisotropic conductive film, and simultaneously, a plurality of input bumps corresponding to a plurality of terminals are formed by conductive fine particles in an anisotropic conductive film. And a plurality of output bumps are conductively connected, and a plurality of driver integrated circuits are flip-chip mounted on the liquid crystal display element substrate.

In recent years, in a liquid crystal display device,
There is a demand for higher definition display screens. In this case, an effective means for increasing the definition of the display screen in the liquid crystal display device is to increase the number of outputs per driver integrated circuit (one chip) as described below.
It is known that the number of bumps formed on each driver integrated circuit should be increased.

For example, in the case of a color display using a super video graphic array (SVGA), 2400 signal lines connected to the drain of each thin film transistor (TFT) are provided, and the number of signal terminals corresponding to these signal lines is provided. It is necessary to provide. If the number of outputs per driver integrated circuit (1 chip) is 240 for such 2400 signal terminals, a total of 10 (10 chips) is required, and 1
If the number of outputs per unit (1 chip) is 300, 8 units (8 chips) are required in total.

Here, assuming that a driver integrated circuit having 240 outputs and a driver integrated circuit having 300 outputs have the same external dimensions, manufacturing unit price, and defect occurrence rate, respectively, a driver integrated circuit having 300 outputs is provided. When the driver integrated circuit is used, the manufacturing cost of the driver integrated circuit is 8 compared to the case where a driver integrated circuit having 240 outputs is used.
It will be 0%. In addition, when eight driver integrated circuits having 300 outputs are used, the number of outputs becomes 240
As compared with the case where ten driver integrated circuits are used, the mounting time and the repair time of the driver integrated circuit can be shortened, so that the manufacturing cost of the liquid crystal display device is similarly reduced. For this reason, it is cost-effective to increase the number of outputs of the driver integrated circuit, that is, the number of output bumps.

As means for increasing the number of outputs per unit length (the number of output bumps) in the driver integrated circuit, the output bumps are not arranged on the same column, but every other output bump is replaced by a first bump. Row and the second bump row,
It is known that the output bumps are arranged in a staggered manner as a whole.

FIG. 9 is a plan view showing an example of an arrangement of a plurality of bumps formed on a driver integrated circuit in a known liquid crystal display device. FIG. 10 is a plan view showing a plurality of bumps shown in FIG. It is an enlarged view of a part of output bump.

FIGS. 9 and 10 show a plurality of bumps formed on the driver integrated circuit and a plurality of terminals formed on the liquid crystal display element substrate.

9 and 10, reference numeral 41 denotes a driver integrated circuit (IC); 42, a liquid crystal display element substrate; 43, an input bump array; 44, an output first bump array; 45, an output second bump array; A dummy bump array, 47 is an input terminal array, 48 is an output first terminal array, and 49 is an output second terminal array.

The driver integrated circuit 41 has an input bump array 43 formed along one long side thereof, an output first bump array 44 on the outside along another long side, and an output first bump array on the inside. Two bump rows 45 are formed, and dummy bump rows 46 are formed along the short sides. Each of the input bumps in the input bump row 43, and each of the output bumps in the output first bump row 44 and the output second bump row 45 are elongated rectangles in the arrangement width direction, and each of the dummy bumps in the dummy bump row 46 is substantially square. The output bumps of the output first bump row 44 and the output second bump row 45 are arranged alternately in the arrangement direction in a staggered manner, and as a whole, the output first bump row 44,
The output second bump row 45 is formed inside.

In the liquid crystal display element substrate 42, an input terminal row 47 is formed at a position corresponding to a portion where the input bump row 43 of the driver integrated circuit 41 is formed.
An output first terminal row 48 and an output second terminal row 49 are formed at locations corresponding to respective formation portions of one output first bump row 44 and output second bump row 45. Note that a terminal row corresponding to the dummy bump row 46 of the driver integrated circuit 41 is not formed. Each input terminal of the input terminal row 47 is longer than each input bump in order to prevent a contact portion with each input bump of the corresponding input bump row 43 from becoming a fixed value or less. Similarly, each output terminal of the output first terminal row 48 and each output terminal of the output second terminal row 49 are connected to each output bump of the corresponding output first bump row 44 and each output bump of the output second bump row 45. The length is longer than each output bump in order to prevent the contact portion from becoming less than a certain value. In this case, each output terminal of the output first terminal row 48 is
Each output terminal of the output second terminal row 49 has a wide contact portion with each corresponding output bump and extends from one end of the wide portion. The non-contact portion is a narrow portion, and each narrow portion extends in parallel through between the output terminals of the output first terminal row 48.

Although not shown in FIGS. 9 and 10, each input terminal of the input terminal array 47 is connected to a corresponding output terminal of a control integrated circuit mounted and arranged on a control board, respectively. Each output terminal of the first output terminal row 48 and the second output terminal row 49 is connected to a signal line coupled to the drains of a large number of thin film transistors (TFTs) in the liquid crystal display device.

The driver integrated circuit 41 having the above configuration
The output bumps constituting the output bump rows 44 and 45 are arranged alternately in the arrangement direction in a staggered manner, and are divided into an outer output first bump row 44 and an inner output second bump row 45. They are arranged. With such a staggered arrangement,
Compared to the case where each output bump is arranged in one row, it is possible to arrange output bumps of other rows at intervals between adjacent output bumps, and shorten the arrangement dimension of each output bump in the column direction, The number of outputs (the number of output bumps) formed on the long side of the driver integrated circuit 41 can be increased.

In the above-described configuration, the reason why the dummy bump array 46 is provided on the driver integrated circuit 41 side is that the driver integrated circuit 41 is bonded to the liquid crystal display element substrate 42 using an anisotropic conductive film. This is for reducing the concentration of stress on the bumps disposed at the four corners 41 and balancing the amount of excess binder discharged.

[0016]

In the above-mentioned known liquid crystal display device, the output bumps of the driver integrated circuit 41 are formed in a staggered pattern every other one in the arrangement direction. Are arranged in the output second bump row 45, and if the dimensions of the output bumps are the same, the dimensions of the long side and the short side in the driver integrated circuit 41 are such that the output bumps are arranged in a line on the long side. Although the long side dimension can be shortened compared to the case, it is necessary to increase the short side dimension by an amount corresponding to two output bump rows and an interval between each output bump row. The dimensions of the integrated circuit 41 cannot be significantly reduced. When the chip size of the driver integrated circuit 41 is large, the number of chips of the driver integrated circuit 41 cut out from the semiconductor wafer decreases, and the manufacturing cost increases accordingly.

Further, in the known liquid crystal display device, when flip-chip mounting in which the driver integrated circuit 41 is bonded to the liquid crystal display element substrate 42, each terminal of the liquid crystal display element substrate 42 and each bump of the driver integrated circuit 41 are different. The driver integrated circuit 4 is bonded with an isotropic conductive film
When 1 is thermocompression-bonded to the liquid crystal display element substrate 42, the binder material containing the conductive fine particles of the anisotropic conductive film softens and flows out. When the flowing out binder material flows between adjacent bumps or between adjacent terminals, the conductive fine particles contained in the binder material stay and accumulate between adjacent bumps or between adjacent terminals, and are accumulated. The conductive fine particles may cause an electrical short between adjacent bumps or between adjacent terminals and between adjacent bumps.

An electric short circuit between adjacent bumps or between adjacent terminals may be caused by reducing the chip size of the driver integrated circuit 41 by reducing the distance between adjacent bumps, particularly, between adjacent output bumps. It occurs frequently when misalignment occurs, and with the reduction of the output bump and terminal area, the conductive fine particles in the binder material are used to secure the conductivity between the output bump and the output terminal. Increasing the amount of mixing also occurs with high frequency.

The present invention has been made in view of such a technical background, and it is an object of the present invention to reduce the size of a driver integrated circuit, secure a sufficient distance between adjacent output bumps, and It is an object of the present invention to provide a liquid crystal display device capable of preventing occurrence of an electrical short circuit at intervals.

[0020]

In order to achieve the above object, a liquid crystal display device according to the present invention comprises: a liquid crystal display element substrate having a plurality of input terminals and a plurality of output terminals arranged along a side edge; A driver integrated circuit in which a plurality of input bumps and a plurality of output bumps are arranged, and a plurality of corresponding input terminals and a plurality of output terminals, and a plurality of input bumps and a plurality of output bumps are interposed through an anisotropic conductive film. The driver integrated circuit is flip-chip mounted on the liquid crystal display element substrate, and the plurality of output bumps are triangular, pentagonal, or trapezoidal elongated in the arrangement width direction. Are arranged in a staggered manner so as to form an output first bump row or an output second bump row every other, and at least a part of each output second bump of the output second bump row is output. 1 is arranged so as to enter between the output first bump bump rows, the plurality of terminals, and constitutes the similar shape to the shape of the plurality of bump at least partially correspond.

According to the above configuration, the plurality of output bumps formed on the driver integrated circuit are formed into any one of an elongated triangular shape, a pentagonal shape, and a trapezoidal shape, and the output bumps are arranged alternately in the arrangement direction and output. Since the first bump row or the output second bump row is formed, and at least a part of each output second bump of the output second bump row is arranged so as to enter between the output first bumps of the output first bump row. , Output bump 1
The size in the long side direction of the driver integrated circuit is reduced as compared with the case where they are arranged in a row, and as compared with a known driver integrated circuit of this type in which the output first bump row and the output second bump row are simply arranged in parallel. Since the short side dimension can be reduced, it is possible to obtain a driver integrated circuit in which the dimensions of the long side and the short side are reduced as a whole without reducing the interval between adjacent output bumps.

Further, according to the above configuration, in each output bump, the output first bump and the output second bump of the output first bump row are provided.
Since the shape of the portion of the bump array facing the output second bump is formed into a vertex shape, a wedge shape, and a short side shape narrower than the shape of the other portions, an anisotropic conductive film is used. At the time of thermal bonding, the flow resistance to the binder material when flowing out of the binder material containing the conductive fine particles flowing between the adjacent output first bump and output second bump becomes relatively small. For this reason, the binder material flowing between the adjacent output first bumps and the output second bumps passes through without any stagnation, causing an electrical short circuit between the adjacent output first bumps and the output second bumps. Can be prevented beforehand, and the production yield of the liquid crystal display device can be improved.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show a first embodiment of the liquid crystal display device of the present invention. FIG. 1 is a plan view showing an arrangement state of a plurality of bumps formed on a driver integrated circuit. FIG. 3 is an enlarged plan view showing a part of the plurality of bumps shown in FIG. 1 and shows an example in which output bumps are triangular.

FIGS. 1 and 2 show a plurality of bumps formed on the driver integrated circuit and a plurality of terminals formed on the liquid crystal display element substrate.

1 and 2, reference numeral 1 denotes a driver integrated circuit (IC), 2 denotes a liquid crystal display element substrate, 3 denotes an input bump row, 4 denotes an output first bump row, 5 denotes an output second bump row,
Reference numeral 6 denotes a dummy bump row, 7 denotes an input terminal row, 8 denotes an output first terminal row, and 9 denotes an output second terminal row.

The driver integrated circuit 1 has an input bump row 3 formed along one long side, an output first bump row 4 on the outside and an output second bump row on the inside along the other long side. 5 are formed, and a dummy bump row 6 is formed along the short side.

In this embodiment, the input bump row 3 is configured by arranging a plurality of input bumps, and the dummy bump row is configured by arranging a plurality of dummy bumps, all of which are well known. It is a thing. On the other hand, the output first bump row 4 and the output second bump row 5 are formed by arranging a plurality of triangular output bumps elongated in the arrangement width direction. As shown in FIGS. 1 and 2, each of the triangular output bumps 5 has one apex relatively arranged, and each output bump of the output second bump row 5 corresponds to the output first bump row 4. The output bumps are arranged so as to be inserted between the output bumps, and the output bumps are arranged in a staggered manner as a whole. Such a configuration is unique to the present invention.

On the liquid crystal display element substrate 2, an input terminal array 7 is formed at a position corresponding to a portion where the input bump array 3 of the driver integrated circuit 1 is formed, and the output first bump array 4 and the output of the driver integrated circuit 1 are output. An output first terminal row 8 and an output second terminal row 9 are formed at locations corresponding to the respective formation portions of the second bump row 5.

Each output terminal of the output first terminal row 8 and the output second terminal
Each output terminal of the terminal row 9 includes a contact portion similar in shape to the corresponding output bump, and a non-contact portion extending from the contact portion, and the length of the contact portion and the length of the non-contact portion is the length of the corresponding output dump. It is longer than it is. In particular, each output terminal of the output first terminal row 8 has a triangular contact area (hereinafter, referred to as a first contact area) and a rectangular non-contact area extending outward from the driver integrated circuit 1 from the first contact area. And a contact area (hereinafter, referred to as a first non-contact area). Each output terminal of the output second terminal row 9 has a triangular contact area (hereinafter, referred to as a second contact area) and a non-contact slightly extending from the second contact area to the inside of the driver integrated circuit 1. An area (hereinafter, referred to as a second non-contact area) and a band-shaped non-contact area (hereinafter, referred to as a third non-contact area) extending from the second contact area to the outside of the driver integrated circuit 1. . Each of the first contact areas and each of the second contact areas are arranged in a staggered manner, and each of the first non-contact areas and each of the third non-contact areas are alternately arranged in parallel at an interval of every other. The lead terminals connected to the signal lines are formed.

Although not shown in FIGS. 1 and 2, each input terminal of the input terminal array 7 is connected to a corresponding output terminal of a control integrated circuit mounted and arranged on a control board. Each output terminal of the output first terminal row 8 and the output second terminal
Each output terminal of the terminal row 9 is connected to a signal line coupled to the drains of a large number of thin film transistors connected to a matrix drive circuit portion of the liquid crystal display device.

According to the first embodiment, each output bump of the output first bump row 4 and each output bump of the output second bump row 5 are formed into a triangular shape elongated in the arrangement width direction, and each of the triangular output bumps is formed. And one of the vertices is positioned relative to
Since the whole output bumps of the output second bump row 5 are arranged alternately in a staggered manner so as to enter between the output bumps of the output first bump row 4 in the arrangement width direction, the output first bump row 4 is arranged. And the number of output bumps that can be formed along the long side of the driver integrated circuit 1 is increased as compared with the case where the output bumps of the output second bump row 5 are arranged in a line, and the number of output bumps is the same. The long side dimension of the driver integrated circuit 1 can be reduced. Further, the short side dimension of the driver integrated circuit 1 can be reduced as compared with the case where the output bumps are simply arranged in two rows.

Further, according to the first embodiment, the angle of one of the vertices which is relatively arranged in each of the triangular output bumps is formed to be more acute than the angle of the other two vertices. During the thermal bonding using the conductive film, when the binder material containing the conductive fine particles that have flowed out passes between adjacent output bumps, the resistance to the binder material is reduced. For this reason, the binder material flowing between the adjacent output bumps passes between each output bump together with the conductive fine particles without staying, and the occurrence of an electric short circuit between the adjacent output bumps due to the stay of the conductive fine particles is prevented. Can be prevented.

FIGS. 3 and 4 show a liquid crystal display device according to a second embodiment of the present invention. FIG. 3 is a plan view showing the arrangement of a plurality of bumps formed on a driver integrated circuit. FIG. 4 is an enlarged plan view showing a part of the plurality of bumps shown in FIG. 3, and shows an example in which the output bump has a pentagonal shape.

FIGS. 3 and 4 show a plurality of bumps formed on the driver integrated circuit and a plurality of terminals formed on the liquid crystal display element substrate.

In FIGS. 3 and 4, reference numeral 10 denotes an output first bump row, 11 denotes an output second bump row, 12 denotes an output first terminal row, and 13 denotes an output second terminal row.

In addition, the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.

The second embodiment and the first embodiment are different from the first embodiment in that each output bump of the output first bump row 4 and the output second bump row 5 is formed into an elongated triangular shape. On the other hand, in the second embodiment, the output first bump row 10
And the point that each output bump of the output second bump row 11 is formed into an elongated pentagonal shape having one wedge-shaped portion, and the first embodiment is characterized in that the output first terminal row 7 and the output second terminal row 8 Each terminal is constituted by a triangular contact area and a non-contact area extending from the contact area. On the other hand, in the second embodiment, each of the output first terminal row 12 and the output second terminal row 13 There is a difference in that each terminal is formed of a pentagonal contact area and a non-contact area extending from the contact area.

Further, the second embodiment differs from the first embodiment in that the first embodiment differs from the first embodiment in that each output bump of the second output bump array 5 has a different shape. The bumps are arranged so as to enter between the output bumps of the output first bump row 4 in the entire arrangement width direction. On the other hand, in the second embodiment, the wedge-shaped portions of the output bumps of the second output bump row 11 are formed. The output first bump array 10 is arranged so as to enter between the wedge-shaped portions of the output bumps.
In connection with the difference in the arrangement of the output bumps in the second output bump row 11, the arrangement of the shapes of the terminals in the output first terminal row 12 and the terminals in the output second terminal row 13 is slightly different.

However, in other respects, there is no difference in configuration between the second embodiment and the first embodiment. For this reason, further description of the configuration of the second embodiment will be omitted.

Here, FIG. 5 shows a case where the bump area is 4000 μm ² (40 × 100 rectangular bump when the inclination a of the wedge-shaped portion is 0) in the second embodiment and the distance between adjacent bumps is 20 μm. FIG. 6 is a characteristic diagram showing a relationship between the inclination a of the wedge-shaped portion and the total arrangement width w of the output bumps when the electrodes are arranged in a staggered manner. FIG. 6 shows the inclination a and the total arrangement width w in the characteristic diagram shown in FIG. FIG. 3 is an explanatory diagram for explaining the method.

As shown in FIG. 5, as the inclination a of the wedge-shaped portion is increased, the total arrangement width w is gradually reduced. However, when the coefficient a is 5 or more, even if the coefficient a is further increased, the rate at which the total array width w is shortened is extremely small.

According to the second embodiment, the output first
Each output bump of the bump row 10 and the output second bump row 11
Each of the output bumps has a pentagonal shape elongated in the width direction of the array having a wedge-shaped portion, and the output bumps of the output first bump row 10 and the output bumps of the output bumps of the output second bump row 11 are relatively arranged. Since the wedge-shaped portions of the output bumps of the output second bump row 11 are arranged alternately in a staggered manner so as to enter between the wedge-shaped portions of the output bumps of the output first bump row 10,
Although the degree of achievement is slightly reduced as compared with the first embodiment, the short side dimension of the driver integrated circuit 1 can be reduced as compared with the case where the output bumps are simply arranged in two rows.

According to the second embodiment, a portion where each output bump of the output first bump row 10 and each output bump of the output second bump row 11 are close to each other is formed in a wedge-shaped portion. At the time of thermal bonding using an anisotropic conductive film, when the binder material containing the conductive fine particles that flowed out passes between adjacent output bumps, resistance to the binder material flowing between adjacent output bumps is reduced, The binder material does not stay there and passes as it is with the conductive fine particles, and it is possible to prevent an electrical short circuit between adjacent output bumps due to the stay of the conductive fine particles.

7 and 8 show a third embodiment of the liquid crystal display device according to the present invention. FIG. 7 is a plan view showing an arrangement state of a plurality of bumps formed on a driver integrated circuit. FIG. 8 is an enlarged plan view showing a part of the plurality of bumps shown in FIG. 7, and shows an example in which the output bumps are trapezoidal.

7 and 8, a plurality of bumps formed on the driver integrated circuit and a plurality of terminals formed on the liquid crystal display element substrate are shown together.

7 and 8, reference numeral 14 denotes an output first bump row, 15 denotes an output second bump row, 16 denotes an output first terminal row, and 17 denotes an output second terminal row. In addition, the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals.

The third embodiment and the first embodiment are different from each other in the shape of each output bump in the output first bump rows 4 and 14 and the output second bump rows 5 and 15 and each output bump. There is a structural difference in the shape of each output terminal in the output first terminal rows 7 and 16 and the output second terminal rows 8 and 17 corresponding to the shape. That is, in the first embodiment,
The output bumps of the output first bump row 4 and the output bumps of the output second bump row 5 are elongated triangular shapes each having one acute vertex. The output bumps of the output first bumps 14 and the output bumps of the output second bumps 15 each have an elongated trapezoidal shape. In the first embodiment, each output terminal of the output first terminal row 8 is provided. Comprises a first contact area having a triangular shape and a first non-contact area having a rectangular shape. Each output terminal of the output second terminal row 9 has a second contact area having a triangular shape, a second non-contact area having a short length, and In contrast to the belt-shaped third non-contact area,
In the third embodiment, each output terminal of the output first terminal row 16 is composed of a trapezoidal first contact area and a rectangular first non-contact area, and each output terminal of the output second terminal row 17 is There is a difference in that a trapezoidal second contact region, a second non-contact region having a shorter band-like length, and a band-like third non-contact region are provided.

Further, the third embodiment and the first embodiment have the following structural differences mainly related to the difference in the shape of each output bump. That is, in the first embodiment, the output bumps of the output second bump row 5 are arranged so as to enter between the output bumps of the output first bump row 4 in the entire arrangement width direction. In the embodiment, each output bump of the output second bump row 15 is arranged so that a part of each output bump enters between the output bumps of the output first bump row 14. The output terminals of the output first terminal row 16 and the output second bumps vary with the configuration of the bumps and the output bumps of the output second bump row 15.
Each output terminal of the terminal row 17 also has a slightly different arrangement state.

However, in other respects, there is no structural difference between the third embodiment and the first embodiment.
Therefore, further description of the configuration of the third embodiment will be omitted.

According to the third embodiment, the output first
Each output bump of the bump row 14 and the output second bump row 15
Each of the output bumps of the output second bump row 15 is disposed between the output bumps of the output first bump row 14 while the output bumps of Are arranged in every other zigzag so that part of the output bumps enter, although the degree of achievement is slightly lower than in the first embodiment, but compared to the case where the output bumps are arranged in a line. It is possible to increase the number of output bumps formed along the long side direction of the driver integrated circuit 1 or to reduce the size of the driver integrated circuit 1 in the long side direction when the number of output bumps is the same. In addition, the size of the driver integrated circuit 1 in the short side direction can be reduced as compared with the case where the output bumps are simply arranged in two rows.

Further, according to the third embodiment, the output bumps of the output first bump row 14 and the output bumps of the second bump row 15 are arranged so as to be close to the shorter side of the trapezoid. When the binder material containing the conductive fine particles that flowed out passes between adjacent output bumps during thermal bonding using an anisotropic conductive film, a short side is formed between adjacent output bumps. The resistance to the binder material flowing through the binder becomes smaller, and the binder material does not stay there and passes through as it is with the conductive fine particles, so that the stagnation of the conductive fine particles causes an electrical short circuit between adjacent output bumps. It can be prevented beforehand.

The means for arranging the output bumps of the output first bump row and the output second bump row in a zigzag pattern on the driver integrated circuit 1 in the above embodiment arranges the bumps on a tape carrier package (TCP). The same can be applied to the case.

[0054]

As described above, according to the present invention,
A plurality of output bumps to be formed on the driver integrated circuit are formed into one of an elongated triangular shape, a pentagonal shape, and a trapezoidal shape,
An output first bump row or an output second bump row is formed by staggering every other output row in the arrangement direction, and at least a part of each output second bump row of the output second bump row is output to the output first bump row. Of the driver integrated circuit can be reduced in size in the long side direction as compared with the case where the output bumps are arranged in a single row. Compared with a known driver integrated circuit of this type arranged in two rows in parallel, the dimension in the short side direction can be reduced, and the driver integrated circuit whose overall size is reduced without reducing the distance between adjacent output bumps can be obtained. There is an effect that it can be obtained.

Further, according to the present invention, the shape of the point where the first bump row and the second bump row in each output bump are close to each other is formed to have an acute angle, a wedge shape, and a short side. At the time of thermal bonding, when the binder material containing the conductive fine particles which flowed out passes between adjacent output bumps, the resistance to the binder material flowing between adjacent output bumps decreases due to the formation of acute angles, wedges, and short sides. The binder material flowing between adjacent output bumps passes through the conductive particles together with the conductive fine particles without stagnating, thereby preventing an electrical short circuit between the adjacent output bumps due to the stagnant conductive fine particles. This has the effect that the production yield of the liquid crystal display device can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an arrangement state of a plurality of bumps in a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a part of a plurality of output bumps in the first embodiment shown in FIG. 1;

FIG. 3 is a plan view showing an arrangement state of a plurality of bumps in a liquid crystal display device according to a second embodiment of the present invention.

FIG. 4 is an enlarged plan view showing a part of a plurality of output bumps in the second embodiment shown in FIG. 3;

FIG. 5 is a characteristic diagram showing a relationship between the inclination of a wedge-shaped portion and the entire arrangement width of each output bump in the second embodiment.

FIG. 6 is an explanatory diagram for explaining a tilt and an entire array width in the characteristic diagram shown in FIG. 5;

FIG. 7 is a plan view showing an arrangement state of a plurality of bumps in a liquid crystal display device according to a third embodiment of the present invention.

FIG. 8 is an enlarged plan view showing a part of a plurality of output bumps according to the third embodiment shown in FIG. 7;

FIG. 9 is a plan view showing an arrangement state of a plurality of bumps in an example of a configuration of a known liquid crystal display device.

FIG. 10 is an enlarged plan view showing a part of a plurality of output bumps in the known liquid crystal display device shown in FIG. 9;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Driver integrated circuit (IC) 2 Liquid crystal display element substrate 3 Input bump array 4, 10, 14 Output first bump array 5, 11, 15 Output second bump array 6 Dummy bump array 7 Input terminal array 8, 12, 16 Output 1 terminal row 9, 13, 17 output 2nd terminal row

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA48 GA49 GA51 GA55 GA60 HA26 JB23 JB32 MA32 MA35 NA16 NA25 NA27 NA29 PA06 5G435 AA16 AA17 AA18 BB12 EE37 EE41 EE42 HH12

Claims (4)

[Claims] 1. A liquid crystal display element substrate having a plurality of input terminals and a plurality of output terminals arranged along a side edge portion, and a driver integrated circuit having a plurality of input bumps and a plurality of output bumps arranged on one surface, The plurality of corresponding input terminals and the plurality of output terminals are bonded to the plurality of input bumps and the plurality of output bumps via an anisotropic conductive film, and the driver integrated circuit is flipped on the liquid crystal display element substrate. In the liquid crystal display device mounted on a chip, the plurality of output bumps are any of a triangular shape, a pentagonal shape, and a trapezoidal shape that are elongated in the arrangement width direction.
The output first bumps of the output first bump row are arranged in a staggered manner so as to form a bump row or an output second bump row, and at least a part of each output second bump of the output second bump row. The liquid crystal display device, wherein the plurality of terminals are arranged so as to penetrate therebetween, and at least a part of the plurality of terminals has a shape similar to the shape of the corresponding plurality of bumps. 2. The output bumps according to claim 1, wherein the plurality of output bumps have a triangular shape, and the output first bumps of the output first bump row and the output second bumps of the output second bump row have the triangular shape.
And the output second bumps of the output second bump row are arranged so as to enter between the output first bumps of the output first bump row over the entire array width direction. 2. The method according to claim 1, wherein
3. The liquid crystal display device according to 1. 3. The output bumps having a pentagonal shape having one wedge-shaped portion. The output first bumps of the output first bump row and the output second bumps of the output second bump row are different from each other. The wedge-shaped portions are arranged so as to face each other, and the wedge-shaped portions of the output second bumps of the output second bump row enter between the wedge-shaped portions of the output first bumps of the output first bump row. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is arranged in a liquid crystal display. 4. The output bumps of the output first bump row and the output second bump row, wherein the plurality of output bumps have a trapezoidal shape having short sides and long sides parallel to an array width direction. The output second bumps are arranged such that the short sides are opposed to each other, and a part of the short sides of the output second bumps of the output second bump row is the output first bumps of the output first bump row. 1
2. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is arranged so as to be inserted between a part of the short side of the bump.