JP2000349448A - Circuit module, multilayer wiring board, circuit component and semiconductor package used for this circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the circuit module which can suppress resistance of a current supply path small and prevent a voltage from dropping or varying even when a permissible current is increased. SOLUTION: The circuit module 11 is equipped with a wiring board 12 which has a power supply layer, a power supply circuit part 13 which is electrically connected to the power supply layer of the wiring board, and a CPU socket 14 having many power pins and many signal pins 24 which are electrically connected to the power supply layer. The power pins and signal pins are arranged in a pin array area off the center of a CPU socket while surrounding the center. The wiring board is fitted with conductors 30a and 30b for current supply which electrically connect the power circuit and power supply layer. The conductors for current supply are electrically connected to the power supply layer of the wiring board at the position corresponding to the center of the CPU socket.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit module in which circuit components are mounted on a multilayer wiring board, and to a multilayer wiring board, circuit components, and a semiconductor package used in the circuit module. Regarding the structure.

[0002]

2. Description of the Related Art For example, a CPU used in a desktop computer is mounted on a multilayer wiring board.
The input / output signal pins and power supply pins are electrically connected to conductor patterns on the wiring board.

[0003] In recent CPUs, the number of signal pins and power supply pins has been further increased due to higher integration and higher performance, and the pin density tends to increase. Therefore, even in the case of the conductor pattern connected to the signal pin or the power supply pin, the conductor pattern must be arranged so as to sew between the pins arranged at a high density, and the conductor pattern itself becomes extremely thin.

On the other hand, the current consumption of circuit components such as CPUs is steadily increasing, and some circuit components require an extremely large driving current of 10 A. For this reason, even a small resistance generated in the current supply path may cause a large voltage drop, and it may be difficult to suppress the power supply voltage drop or fluctuation within an allowable range.

In general, the resistance R of a conductor can be expressed as R = ρ × L / S where ρ is the resistivity of the conductor, S is the cross-sectional area, and L is the length. In this case, it is necessary to increase the cross-sectional area of the conductor and shorten the length L.

At this time, since the conductor pattern for supplying current to the power supply pins of the CPU must be arranged so as to avoid a large number of signal pins arranged at high density, it is necessary to shorten or thicken the conductor pattern. Is substantially impossible, and therefore, it is becoming difficult to suppress the resistance of the conductor pattern.

For this specific example, the PPGA shown in FIG.
The description will be made based on the CPU socket 1 of the Plastic Pin Grid Array type. The CPU socket 1 has a rectangular socket body 2, a number of power pins 3 and a number of signal pins 4. The power supply pins 3 and the signal pins 4 are placed in a pin array region 5 surrounding the central portion 2a of the socket body 2 for approximately 1.
They are arranged in six rows at an extremely narrow pitch P of 8 mm. As shown in FIG. 15, the power supply pins 3 are arranged in an irregularly distributed manner over the entire pin array region 5, and some of the power supply pins 3 are
Is located on the inner peripheral portion of the pin array region 5 facing the central portion 2a.

The wiring board 6 on which the CPU socket 1 is mounted has a large number of through holes 7 (shown in FIG. 16) in the mounting area of the CPU socket 1.
The power pin 3 and the signal pin 4 of the U socket 1 are inserted.

FIG. 16 shows a part of the power supply layer 8 of the wiring board 6 taken out, and this power supply layer 8 is electrically connected to a power supply circuit section (not shown) on the wiring board 6. Have been. The power supply layer 8 is solidly spread inside the wiring board 6, and is continuous with the plating layer on the inner surface of the through hole 7 at a position corresponding to the power supply pin 3. Therefore, the power supply layer 8 is electrically connected to the power supply pins 3 via the through holes 7.

[0010]

By the way, even when the power supply pin 3 is energized by using the power supply layer 8 which is spread in a solid shape, the power supply layer 8 is connected to signal pins other than the power supply pin 3. It is necessary to avoid contact with 4. Therefore, conventionally, a large number of escape holes 9 are formed in the power supply layer 8 to avoid the signal pins 4, and a ring-shaped insulating region 9 a is secured between the opening edge of the escape holes 9 and the signal pins 4.

At this time, since the power supply pins 3 located on the outer peripheral side of the pin array region 5 do not need to enter between many signal pins 4, the cross-sectional area of the power supply layer 8 is largely reduced by the escape holes 9. It will not be reduced. Therefore, at the position corresponding to the outer peripheral portion of the pin array region 5, the cross-sectional area of the power supply layer 8 can be ensured, and the resistance can be reduced.

However, since the power supply layer 8 is guided from the outer peripheral side to the inner peripheral side of the pin array region 5, the power supply layer 8 is located near the center or the inner peripheral side of the pin array region 5. By the time the power supply pin 3 is reached, a number of escape holes 9 will be positioned adjacent to each other on the power supply layer 8.
For this reason, as shown in FIG. 16, even in the solid power supply layer 8, many portions having extremely small width dimensions are formed due to the presence of the escape holes 9, and the current supply path to the power supply pin 4 is changed to the signal pin 4. It becomes a form that sewes between.

Therefore, it is not possible to secure a sufficient cross-sectional area of the power supply layer 8, so that the resistance of the current supply path to the power supply pins 3 located on the inner peripheral side of the pin array region 5 is particularly large. As a result, a voltage drop or a variation easily occurs, and the allowable current that can be supplied to the power supply pin 3 cannot be increased.

The present invention has been made in view of such circumstances, and a circuit module and a circuit module capable of suppressing the resistance of a current supply path and preventing a voltage drop or a fluctuation even when an allowable current is increased. An object is to provide a multilayer wiring board, a circuit component, and a semiconductor package used for a module.

[0015]

To achieve the above object, a circuit module according to the present invention comprises a multilayer wiring board having a power supply layer inside; a circuit board mounted on the wiring board and electrically connected to the power supply layer. A power supply circuit portion connected thereto; and a circuit component mounted on the wiring board and having a large number of power supply terminals and a large number of signal terminals electrically connected to the power supply layer. The signal terminals are arranged side by side so as to surround the central portion of the circuit component in a terminal arrangement region outside the central portion of the circuit component. Then, a current supply conductor for electrically connecting the power supply circuit portion and the power supply layer is attached to the circuit board, and the current supply conductor is attached to the wiring board at a position corresponding to a central portion of the circuit component. Are electrically connected to a power supply layer of

According to this structure, the current can be directly supplied to the position corresponding to the center of the circuit component surrounded by the large number of power supply terminals and signal terminals on the wiring board via the current supply conductor. And a power supply layer for receiving a current from the current supply conductor. Therefore, a current can be supplied from the inside of the terminal arrangement region to the power supply terminals located on the inner peripheral portion of the terminal arrangement region. It doesn't get complicated or narrow to avoid.

Further, even with a power supply terminal located at an intermediate portion between the inner peripheral portion and the outer peripheral portion of the terminal arrangement region, the power supply layer can be guided from both directions inside and outside the terminal arrangement region. Therefore, it is possible to sufficiently secure the cross-sectional area of the current supply path for all power supply terminals.

In order to achieve the above object, a multilayer wiring board according to the present invention comprises at least one signal layer having a conductor pattern to which a large number of signal terminals of a circuit component are electrically connected; A power supply layer to which a power supply terminal is electrically connected; forming a power supply conductor pattern on the signal layer avoiding the conductor pattern; connecting the power supply conductor pattern and the power supply layer in parallel; It is characterized by doing.

According to this configuration, since a plurality of current supply paths to the power supply terminal are prepared and the supply paths are connected in parallel, the inherent resistances of the power supply layer and the power supply conductor pattern are substantially parallel. Will be connected. For this reason, even if the individual resistances of the power supply conductor pattern and the power supply layer are large, the resistance when these are arranged in parallel becomes small, and the resistance of the current supply path to the power supply terminal can be suppressed low.

In order to achieve the above object, a multilayer wiring board according to the present invention is characterized in that at least one signal layer to which a number of signal terminals of a circuit component are electrically connected, and that a number of power terminals of the circuit component are electrically connected. A solid power supply layer and a ground layer, which are electrically connected, are laminated via an insulating layer, and the thickness of the power supply layer is set to be larger than the thickness of the signal layer.

According to this configuration, a sufficient cross-sectional area of the current supply path to the power supply terminal can be ensured, and the resistance can be reduced accordingly.

In addition, since the power supply layer is usually spread in a solid pattern between the insulating layers, the portion where no pattern is present is overwhelmingly reduced, and the portion where there is no pattern is less likely to occur. Therefore, even if the thickness dimension of the power supply layer is increased, the stress generated at the boundary between the portion having the pattern and the portion having no pattern does not become a problem, and does not adversely affect the strength of the wiring board.

In order to achieve the above object, a circuit component according to the present invention has a number of power terminals and a number of signal terminals electrically connected to a power layer of a wiring board, and a main body supporting these terminals. are doing. The power supply terminal and the signal terminal are arranged side by side so as to surround the central portion of the main body in a terminal arrangement region outside the central portion of the main body, and the power supply terminal is provided in at least one of the terminal arrangement regions. It is characterized in that the portions are continuously arranged so as to cross the terminal arrangement region.

According to this configuration, since a large number of power supply terminals are concentratedly arranged at a specific location without being irregularly distributed throughout the terminal arrangement region, the power supply terminals are arranged in the arrangement direction of these power supply terminals. A wide power supply layer extending along can be formed on the wiring board side. Therefore, it is not necessary to arrange the power supply layer so as to avoid a large number of signal terminals, and a sufficient cross-sectional area of the power supply layer can be secured.

In order to achieve the above object, a circuit component according to the present invention comprises a number of power terminals and a number of signal terminals electrically connected to a power layer of a wiring board, and a main body supporting these terminals. ing. The power supply terminal and the signal terminal are arranged side by side so as to surround the central portion of the main body in a terminal arrangement region outside the central portion of the main body, and the power supply terminal faces the central portion of the main body. It is characterized in that it is arranged on either the inner peripheral part of the terminal arrangement area or the outer peripheral part of the terminal arrangement area.

According to this structure, the power supply terminals are arranged in a concentrated manner at the inner peripheral portion or the outer peripheral portion without being irregularly distributed throughout the terminal arrangement region. Alternatively, a power supply layer spreading in a solid shape can be disposed at a position corresponding to the outside. Therefore, it is not necessary to dispose the power supply layer so as to avoid a large number of signal terminals, and a sufficient cross-sectional area of the power supply layer can be secured.

To achieve the above object, a semiconductor package according to the present invention comprises a package body in which an IC chip is sealed; a package body disposed on a surface of the package body facing a wiring board, and electrically connected to the IC chip. A plurality of signal terminals, and a power supply terminal is disposed on a surface of the package body opposite to the signal terminals.

According to this configuration, since the power supply terminal is isolated from the signal terminal, a thick conductor for supplying current can be directly connected to the power supply terminal. Therefore, even when the semiconductor package is mounted on a wiring board, current can be supplied to the power supply terminal through a path different from the power supply layer of the wiring board, and a sufficient cross-sectional area of the current supply path can be secured. In addition, a large current can be easily supplied to the power supply terminal.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a circuit module 11 used for a desktop computer, for example. The circuit module 11 includes a wiring board 12, a power supply circuit unit 13 mounted on the wiring board 12, and the wiring board 1.
And a CPU socket 14 of a PPGA type as a circuit component mounted on the CPU socket 2.

The wiring board 12 has a first mounting surface 15a,
And a second mounting surface 15b located on the opposite side of the first mounting surface 15a. The wiring board 12
Are the first to fourth signal layers 16a as shown in FIG.
16d, a power supply layer 17 and a ground layer 18 are laminated, and these layers 16a to 16d, 1
7 and 18 are electrically insulated by an insulating layer 19. The first signal layer 16a is located on the first mounting surface 15a, and the fourth signal layer 16d is located on the second mounting surface 15b. The power supply layer 17 includes a first signal layer 16a
Between the ground layer 1 and the second signal layer 16b.
8 is interposed between the third signal layer 16c and the fourth signal layer 16d. The power supply layer 17 and the ground layer 18 are solidly spread inside the wiring board 12.

The power supply circuit section 13 is mounted on the first mounting surface 15a of the wiring board 12. The output terminal of the power supply circuit section 13 is electrically connected to a power supply layer 17 inside the wiring board 12.

The CPU socket 14 has a rectangular socket body 21. The socket body 21 detachably supports a PPGA type semiconductor package 22 as a CPU. The semiconductor package 2 of the socket body 21
On the surface opposite to 2, a number of power pins 23 as power terminals and a number of signal pins 24 as signal terminals are arranged. These power pins 23 and signal pins 24
It is electrically connected to the semiconductor package 22.

As shown in FIG. 2, the power supply pins 23 and the signal pins 24 are arranged in six rows at an extremely narrow pitch P of about 1.8 mm in a frame-shaped pin arrangement area 25 surrounding the central portion 21a of the socket body 21. They are arranged side by side. The power supply pins 23 are irregularly distributed over the entirety of the pin arrangement area 25, and some of the power supply pins 23 are located on the inner peripheral portion of the pin arrangement area 25 facing the central portion 21 a of the socket body 21. It is located in.

The CPU socket 14 is connected to the first
Of the first mounting surface 1a.
5a, it is adjacent to the power supply circuit section 13.
The wiring board 12 has a large number of through holes 26 as shown in FIG. 3 in the mounting portion of the CPU socket 14, and power supply pins 23 and signal pins 24 are inserted into these through holes 26. The inner surface of the through hole 26 is covered with a conductive plating layer 27, and the power supply pin 23
And the signal pin 24 is in contact. The plating layer 27 of each through hole 26 is formed of a desired signal layer 16a to 16d,
7 and the ground layer 18.

As shown in FIG. 4, the power supply layer 17 to which the power supply pins 23 are connected has a solid conductor pattern 17a extending to a position corresponding to the central portion 21a of the socket body 21. The power supply layer 17 is connected to the wiring board 12.
It is necessary to avoid the signal pins 24 other than the power supply pins 23 inside the device. Therefore, a large number of relief holes 28 having a larger diameter than the signal pins 24 are provided at positions corresponding to the signal pins 24.
Therefore, a ring-shaped insulating region 29 is formed between the inner peripheral edge of the escape hole 28 and the signal pin 24, and the width of the power supply layer 17 is reduced in the adjacent escape hole 28. ing.

As shown in FIG. 1 and FIG.
2 on the second mounting surface 15b.
0a and 30b are attached. Current supply conductor 3
Reference numerals 0a and 30b are made of a metal material having excellent conductivity such as a copper-based alloy. This current supply conductor 30a,
Reference numeral 30b integrally includes a rod-shaped main portion 31, a first terminal portion 32a connected to one end of the main portion 31, and a second terminal portion 32b connected to the other end of the main portion 31.

Main parts 31 of current supply conductors 30a and 30b
Are arranged over one side of the pin array region 25. Therefore, the first terminal portions 32a of the current supply conductors 30a and 30b are connected to the power supply circuit portion 13 with the wiring substrate 12 interposed therebetween.
And the second terminal portion 32b
Central portion 21a of socket body 21 with wiring substrate 12 interposed
And face each other.

As shown in FIG. 5, the first and second terminal portions 32 are provided on the second mounting surface 15b of the wiring board 12.
A plurality of conductor patterns 34 corresponding to a and 32b are formed. The conductor pattern 34 is formed at a position avoiding the pattern of the fourth signal layer 16d. The conductor pattern 34 is electrically connected to the conductor pattern 17a of the power supply layer 17 via the plated layer 27 of the through hole 26 as shown in FIG. 3, and the current supply conductors 30a and 30b are connected to the conductor pattern 34. First and second terminal portions 3
2a and 32b are soldered respectively.

For this reason, the current supply conductors 30a, 30b
Are power pins 23 and signal pins 24 arranged in six rows.
And the second mounting surface 15b of the wiring board 12
These current supply conductors 30
a, 30b via the central portion 21 of the socket body 21
The conductor pattern 17a of the power supply layer 17 corresponding to “a” and the power supply circuit section 13 are directly electrically connected.

According to the circuit module 11 having such a configuration, the power supply pins 23 and the signal pins 24
The current from the power supply circuit unit 13 can be directly supplied via the pair of current supply conductors 30a and 30b to a position corresponding to the central portion 21a of the socket body 21 where no current exists, and the current supply conductors 30a and 30b The conductive pattern 17a electrically connected to the first conductive pattern 17a can be arranged.

For this reason, with respect to the power supply pins 23 located at the inner peripheral portion of the pin
Current can be supplied directly from the inside through the solid conductor pattern 17a, and the path for supplying current to these power supply pins 23 is complicatedly complicated or narrow to avoid a large number of signal pins 24. There is no.

For the power supply pin 23 located at an intermediate portion between the inner peripheral portion and the outer peripheral portion of the pin arrangement region 25,
The power supply layer 17 can be guided from both directions inside and outside the pin arrangement region 25. Therefore, even if the power supply pin 23 in the intermediate portion is surrounded by many signal pins 24 and the width of the power supply layer 17 is reduced, the cross-sectional area of the current supply path to the power supply pin 23 in the intermediate portion can be sufficiently increased. Can be secured.

Therefore, the resistance of the current supply path to all the power supply pins 23 can be kept low, and
It is possible to supply a large permissible current which cannot be realized only by the power supply layer 17 inside the power supply layer 2, and it is possible to reliably prevent a voltage drop or a fluctuation on a supply path even when a large current flows.

The present invention is not limited to the first embodiment, and FIG. 6 shows a second embodiment of the present invention.

The second embodiment differs from the first embodiment in the configuration of the current supply conductors 30a and 30b, and the basic configuration of the circuit module 11 is the same as that of the first embodiment. This is the same as the embodiment.

As shown in FIG. 6, the current supply conductor 30
a, 30b are first and second holders 40a, 40b
And the main body 41. First holder 40a
Are soldered to the conductor pattern 34 on the second mounting surface 15b and are electrically connected to the power supply circuit section 13. The second holder 40b is soldered to the conductor pattern 34 on the second mounting surface 15b and is electrically connected to the conductor pattern 17a of the power supply layer 17. And the first
And second holders 40a and 40b are formed with end portions 42 facing the power supply pins 23 and the signal pins 24 arranged in six rows.
a, 42b, and fitting grooves 43 are formed in these ends 42a, 42b, respectively.

The main body 41 includes the first and second holders 40.
It has a rod shape having a length straddling a and 40b. Both ends of the main body 41 are provided with first and second holders 40a,
40b, is removably fitted in the fitting groove 43,
By this fitting, the main body 41 and the first and second holders 4
0a and 40b are electrically connected.

For this reason, the main body 41 is mounted on the second mounting surface 15b of the wiring board 12 so as to straddle the power supply pins 23 and the signal pins 24.

In such a configuration, since the current supply conductors 30a and 30b are capable of supplying a large current with a low resistance, the current supply conductors 30a and 30b are made of a metal material having excellent conductivity such as a copper alloy. Therefore, the heat capacity is large. Therefore, the current supply conductor 3
When soldering 0a and 30b to the conductor pattern 34,
The current supply conductors 30a, up to the optimum temperature for this soldering,
The temperature of 30b may not reach, and soldering may be difficult.

However, according to the above configuration, the current supply conductors 30a and 30b are connected to the first and second holders 40.
Since it is divided into three parts a and 40b and the main body 41, only the first and second holders 40a and 40b need be actually soldered to the conductor pattern 34 on the wiring board 12. For this reason, the shape and heat capacity of the first and second holders 40a and 40b to be soldered are small, and the work of soldering to the wiring board 12 can be easily performed.

The main body 41 straddling the power pin 23 and the signal pin 24 is provided with first and second holders 40a, 40a.
4B, the fourth signal layer 16d at a position covered by the main body 41 can be exposed by removing the main body 41. Therefore, it is possible to easily cope with operations such as pattern check and change of the fourth signal layer 16d.

FIG. 7 and FIG. 8 disclose a third embodiment of the present invention.

The third embodiment makes it possible to supply a large current without using a special current supply conductor, and is characterized mainly by the internal structure of the wiring board 12. Therefore, the basic configuration of the circuit module 11 is
The same components as those of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 8 shows the first signal layer 16 of the wiring board 12.
a, a part of each pattern of the second signal layer 16b and the power supply layer 17 is shown. (A) of FIG.
Discloses a pattern of the first signal layer 16a. The first signal layer 16a includes a plurality of signal pins 24,
It has a number of linear conductor patterns 50 electrically connected to specific signal pins 24. The conductor pattern 50
The wiring is arranged so as to avoid the other signal pins 24 and the power supply pins 23, and the lands 51 at the ends thereof are connected to the specific signal pins 24.

FIG. 8B discloses a pattern of the second signal layer 16 b inside the wiring board 12. This second
Signal layer 16b is similar to the first signal layer 16a,
It has a large number of linear conductor patterns 52 electrically connected to specific signal pins 24. The conductor pattern 52
The wiring is arranged so as to avoid the other signal pins 24 and the power supply pins 23, and a land 53 at the tip is connected to a specific signal pin 24.

The second signal layer 16b has an empty area 54 where the conductor pattern 52 does not exist at a position corresponding to the pin arrangement area 25 of the socket body 21. A power supply conductor pattern 55 is formed in the empty area 54. The power supply conductor pattern 55 is formed on the second signal layer 1.
6b, it is spread solidly in the empty area 54 and is electrically connected to the power supply pin 23.

Further, since the power supply conductor pattern 55 needs to avoid the signal pins 24 other than the power supply pins 23, it has a large number of relief holes 56 at positions corresponding to the signal pins 24. Therefore, a ring-shaped insulating region 57 is formed between the inner peripheral edge of the escape hole 56 and the signal pin 24, and in the adjacent escape hole 56, the width dimension of the power supply conductor pattern 55 is reduced. Has been reduced.

FIG. 8C shows a pattern of the power supply layer 17 inside the wiring board 12. The power supply layer 17 is solidly spread inside the wiring board 12. Since the power supply layer 17 needs to avoid the signal pins 24 other than the power supply pins 23, similarly to the first embodiment, the power supply layer 17 has a large number of relief holes 28 at positions corresponding to the signal pins 24,
A ring-shaped insulating region 29 is formed between the inner peripheral edge of the escape hole 28 and the signal pin 24.

The power supply layer 17 and the second signal layer 1
6b is connected in parallel with the power supply conductor pattern 55. Due to the presence of the power supply conductor pattern 55, the current supply path inside the wiring board 12 is partially two-layered.

According to such a configuration, the power supply pin 23
Are electrically connected to the original power supply layer 17 and the power supply conductor pattern 55 added to the second signal layer 16b inside the wiring board 12, so that a plurality of current supply paths to the power supply pins 23 are prepared. Is done. Since the current supply paths are connected in parallel, the inherent resistances of the power supply layer 17 and the power supply conductor pattern 55 are substantially connected in parallel.

For this reason, even if the individual resistances of the power supply conductor pattern 55 and the power supply layer 17 are large, the resistance when they are paralleled is small, and the power supply conductor pattern 55 and the power supply layer 17 are connected. Thus, the resistance of the current supply path to the power supply pin 23 can be reduced.

Therefore, in order to correspond to the power supply pin 23 on the inner peripheral portion of the pin array region 25 where the resistance is particularly large,
If the power supply conductor pattern 55 is additionally provided inside the wiring board 12, a large allowable current can be supplied to the power supply pins 23 on the inner peripheral side of the pin array region 25, and even if a large current flows, the power supply pins 23 are not provided on the supply path. Voltage fluctuations and fluctuations can be reliably prevented.

FIG. 9 discloses a fourth embodiment of the present invention.

In the fourth embodiment, as in the third embodiment, a large current can be supplied without using a special current supply conductor. Is characterized by its internal structure.

In the fourth embodiment, the wiring board 12
Thickness T1 of the power supply layer 17 and the ground layer 18 is equal to the thickness T of the other first to fourth signal layers 16a to 16d.
It is set larger than 2. The thickness T1 of the power supply layer 17 and the ground layer 18 are set to be equal to each other.

According to such a configuration, a sufficient cross-sectional area of the current supply path to all the power supply pins 23 can be ensured, and the resistance of the current supply path can be reduced. For this reason, a large allowable current can be supplied, and even if a large current flows, a voltage drop or a fluctuation on a supply path can be reliably prevented.

Further, according to the above configuration, since the power supply layer 17 and the ground layer 18 are solidly spread inside the wiring board 12, the first to fourth signal layers 16a to 16d
When compared with the above, the number of portions where no pattern is present is significantly reduced, and the portion where no pattern is present is less likely to occur. For this reason, the power supply layer 17 and the ground layer 1
Even if the thickness dimension T1 of 8 is increased, the stress generated at the boundary between the portion having the pattern and the portion having no pattern does not cause a problem, and does not adversely affect the strength of the wiring board 12.
In the fourth embodiment, the thickness T1 of each of the power supply layer 17 and the ground layer 18 is set to be equal to that of the signal layers 16a to 16a.
Although the thickness T2 is larger than the thickness T2 of 6d, the present invention is not limited to this, and only the thickness T1 of the power supply layer 17 may be increased.

FIG. 10 and FIG. 11 show a fifth embodiment of the present invention.

In the fifth embodiment, the CPU socket 1
The fourth embodiment is characterized in that a large current can be supplied by devising the arrangement of the power supply pins 23. The other basic configuration of the CPU socket 14 is the same as that of the first embodiment.

As shown in FIG. 10, the pin array region 25 of the socket body 21 has four corners 60a to 60d, and a large number of power pins 23 are concentrated on one of the corners 60a. Are located. These power pins 2
Reference numerals 3 are arranged in three rows across the outer peripheral portion and the inner peripheral portion so as to cross the pin arrangement region 25.

Then, the power supply pin 23 is connected to the socket body 21.
11, the power supply layer 17 of the wiring board 12 moves from the outer peripheral portion of the pin arrangement region 25 along the arrangement direction of the power supply pins 23 as indicated by a two-dot chain line in FIG. It has a wide band-shaped conductive pattern 61 extending to the periphery, and all the power pins 23 are electrically connected to the conductive pattern 61.

According to such a configuration, a large number of power supply pins 23 are not irregularly distributed over the entirety of the pin arrangement region 25, and one corner 6
0a, these power supply pins 2
3 can be formed on the power supply layer 17 of the wiring board 12.

As a result, a large number of signal pins 2
It is not necessary to form an escape hole to avoid the power supply layer 1.
7 can be sufficiently secured. Therefore, CP
The supply of the current to the U socket 14 can be performed through a thicker and smaller resistance supply path, and a large allowable current can be supplied. Even if a large current flows, the voltage drop and fluctuation on the supply path can be reduced. It can be reliably prevented.

In the fifth embodiment, the power supply pins 23 are concentrated on one corner 60a of the pin array area 25. However, the present invention is not limited to this, and for example, The power supply pins 23 may be concentrated on the two corners 60a and 60b.

Further, the place where the power supply pin 23 is arranged is as follows.
The power supply pin 23 is not limited to the corners 60 a to 60 d of the pin array
It may be arranged in a band at one place or a plurality of places between 60 and 60d.

FIG. 12 discloses a sixth embodiment of the present invention.

The sixth embodiment is characterized in that, like the fifth embodiment, a large current can be supplied by devising the arrangement of the power supply pins 23 of the CPU socket 14. The other basic configuration of the CPU socket 14 is the same as that of the first embodiment.

In the sixth embodiment, a number of power pins 23 are arranged in a line along the inner periphery of a pin array area 25 facing the center 21a of the socket body 21. For this reason, a first pin row 70 defined by a large number of power pins 23 is formed in the inner peripheral portion of the pin array area 25, and the first pin row 70
Surrounding the central portion 21a.

The CPU socket 14 has a number of ground pins 71 electrically connected to a ground layer of a wiring board (not shown). These ground pins 71
They are arranged in a line along the outer periphery of the pin array region 25. For this reason, on the outer peripheral portion of the pin array region 25,
A second pin row 72 defined by a large number of ground pins 71 is formed, and the second pin row 72 and the first
A large number of signal pins 24 are located in an area sandwiched between
Are arranged in four rows.

According to such a configuration, the CPU socket 1
4 are arranged in a line along the inner peripheral portion of the pin array region 25 and the ground pins 7 are arranged.
Since the power pins 1 and the ground pins 71 are arranged in a line along the outer periphery of the pin array area 25, the power pins 23 and the ground pins 71 are not irregularly distributed throughout the pin array area 25.

For this reason, in the wiring board on which the CPU socket 14 is mounted, a solid power supply layer can be arranged inside and outside the pin array region 25 so as to correspond to each other. Therefore, it is not necessary to arrange the power supply layer of the wiring board so as to avoid the large number of signal pins 24, and it is possible to secure a sufficient cross-sectional area of the power supply layer.

In particular, when the power supply pins 23 are arranged along the inner peripheral portion of the pin mounting area 25, as shown by the two-dot chain line in FIG. , 30b to supply a current directly to the power supply layer inside the wiring board, there is no need to provide any cutouts or the like for avoiding the signal pins 24 in this power supply layer. 23 can be electrically connected.

Therefore, the current can be supplied to the power supply pin 23 through a thicker path having a smaller resistance, so that a larger permissible current can be supplied. Voltage fluctuations and fluctuations can be reliably prevented.

In the sixth embodiment, the power supply pins 23 are arranged on the inner periphery of the pin arrangement region 25, and the ground pins 71 are arranged on the outer periphery of the pin arrangement region 25.
However, the present invention is not limited to this, and the ground pin 71 is provided on the inner peripheral portion of the pin array region 25.
The power supply pins 23 may be arranged on the outer peripheral portion of the pin arrangement region 25.

In the first to sixth embodiments, the circuit components mounted on the wiring board are of the PPGA type.
It is not limited to the CPU socket, and may be, for example, a semiconductor package.

Further, the power supply terminal, the signal terminal, and the ground terminal are not limited to the pins, but may be balls.

FIG. 13 and FIG. 14 disclose a seventh embodiment of the present invention.

FIG. 13 shows a PPGA type semiconductor package 81 provided with a heat sink 80. The semiconductor package 81 has a rectangular package body 82, and an IC chip 83 is embedded in the package body 82. The package body 82 has a back surface 82a on which a large number of signal pins 84 are protruded, and a front surface 82b located on the opposite side of the back surface 82a. The semiconductor package 81 is fixed to the wiring board by inserting the signal pins 84 into through holes of a wiring board (not shown) and soldering.

A pair of power terminals 86a and 86b and one ground terminal 8 are provided on the surface 82a of the package body 82.
7 are formed. The power supply terminals 86a and 86b and the ground terminal 87 have a rectangular pad shape, and have a surface area much larger than that of the signal pin 84. The power terminals 86a and 86b are located at corners of the package body 82 that face diagonally. Ground terminal 8
7 is located at the center of the package body 82.

The heat sink 80 is made of a metal material having excellent heat conductivity and conductivity, such as an aluminum alloy. The heat sink 80 is fixed to the surface 82b of the package body 82 by bonding or the like, and the heat sink 80 is electrically connected to the ground terminal 87 by this fixing.

The heat sink 80 includes power supply terminals 86a, 8
A pair of escape portions 90 cut out to avoid 6b
a, 90b. Therefore, the power supply terminals 86a,
86b is exposed on the surface 82b of the package body 82 while being electrically insulated from the heat sink 80, and a thick conductor 91 for supplying a drive current to the power supply connection terminals 86a and 86b is directly connected. It has become.

On the side surface of the heat sink 80, a ground wiring connection terminal 92 is formed. The ground wiring connection terminal 92 has a rectangular pad shape, and has a surface area much larger than that of the signal pin 24. Since the heat sink 80 itself has conductivity, the ground wiring connection terminal 92 is electrically connected to the ground terminal 87 of the semiconductor package 81 via the heat sink 80. A thick conductor 93 for ground is directly connected.

According to the semiconductor package 81 having such a configuration, the power supply terminals 86a and 86b and the ground terminal 8
7 is located on the surface 82b of the package body 82 opposite to the signal pin 84, so that the power supply terminal 86
Thick conductors 91 for supplying current can be directly connected to a and 86b. Therefore, when the semiconductor package 81 is mounted on a wiring board, current can be supplied to the power terminals 86a and 86b through a path different from the power layer of the wiring board, and the current can be supplied to the power terminals 86a and 86b. The resistance of the path can be kept low.

Therefore, it is possible to supply a large permissible current which cannot be realized only by the power supply layer inside the wiring board, and it is possible to reliably prevent a voltage drop or fluctuation on the supply path even when a large current flows. can do.

[0096]

According to the present invention described in detail above, the resistance of the current supply path to the power supply terminal can be kept low, and a large allowable current that cannot be realized only by the power supply layer inside the wiring board can be realized. There is an advantage that supply is possible and voltage drop and fluctuation on the supply path can be reliably prevented even when a large current flows.

[Brief description of the drawings]

FIG. 1 is a sectional view of a circuit module according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a positional relationship among a CPU socket having a power supply pin and a signal pin, a power supply circuit unit, and a current supply conductor.

FIG. 3 is a sectional view of a wiring board.

FIG. 4 is a plan view showing a pattern of a power supply layer electrically connected to power supply pins.

FIG. 5 is a plan view showing a pattern of a fourth signal layer to which a current supply conductor is attached.

FIG. 6 is a sectional view of a circuit module according to a second embodiment of the present invention.

FIG. 7 is a sectional view of a circuit module according to a third embodiment of the present invention.

FIG. 8A is a plan view showing a pattern of a first signal layer of the wiring board. (B) is a plan view showing a pattern of the second signal layer. (C) is a plan view showing a pattern of a power supply layer.

FIG. 9 is a sectional view of a wiring board according to a fourth embodiment of the present invention.

FIG. 10 is a plan view of a CPU socket according to a fifth embodiment of the present invention.

FIG. 11 is an enlarged plan view showing an F11 part in FIG. 10;

FIG. 12 is a plan view of a CPU socket according to a sixth embodiment of the present invention.

FIG. 13 is a perspective view of a semiconductor package according to a seventh embodiment of the present invention.

FIG. 14 is a perspective view showing a state where a semiconductor package and a heat sink are separated from each other.

FIG. 15 is a plan view showing an arrangement state of power pins and signal pins of a conventional CPU socket.

FIG. 16 is a sectional view showing a pattern of a power supply layer of a conventional wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Circuit module 12 ... Wiring board 13 ... Power supply circuit part 14 ... Circuit components (CPU socket) 16a-16d ... First to fourth signal layers 17 ... Power supply layer 17a ... Conductor pattern 21 ... Main body (socket main body) 23, 86a, 86b: power supply terminal (power supply pin) 24, 84: signal terminal (signal pin) 25: terminal arrangement area (pin arrangement area) 30a, 30b: power supply conductor 50, 52 ... conductor pattern 55: power supply conductor pattern 81: semiconductor package 82: package body 83: IC chip

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E338 AA03 BB02 BB13 BB25 BB75 CC01 CC04 CC06 CD05 CD10 CD13 CD23 EE11 5E346 AA12 AA15 AA42 BB02 BB03 BB04 BB06 BB07 BB11 BB15 FF45 HH01

Claims (14)

[Claims] 1. A multilayer wiring board having a power supply layer therein; a power supply circuit unit mounted on the wiring board and electrically connected to the power supply layer; and a power supply circuit unit mounted on the wiring board and mounted on the power supply layer. A circuit component having a plurality of electrically connected power supply terminals and a plurality of signal terminals; and a power supply terminal and a signal terminal of the circuit component in a terminal arrangement region outside the center of the circuit component. A current supply conductor for electrically connecting the power supply circuit section and the power supply layer to the wiring board, wherein the current supply conductor is A circuit module electrically connected to a power supply layer of the wiring board at a position corresponding to a central portion of the circuit component. 2. The wiring board according to claim 1, wherein the wiring board has a first mounting surface and a second mounting surface located on a side opposite to the first mounting surface. A circuit module, wherein the power supply circuit portion and the circuit component are mounted side by side on a mounting surface of the device, and the current supply conductor is mounted on the second mounting surface. 3. The wiring board according to claim 2, wherein the wiring board has a conductor pattern to which the current supply conductor is electrically connected to the second mounting surface.
A circuit module electrically connected to the power supply layer via a through hole. 4. The wiring board according to claim 2, wherein the power supply terminal and the signal terminal are pins penetrating the wiring board, and the current supply conductor is a second pin of the wiring board.
A circuit module, which is arranged so as to straddle the arrangement portion of the pins on the mounting surface of (1). 5. The current supply conductor according to claim 1, wherein the current supply conductor is electrically connected to the first power supply layer and the first holder is electrically connected to the power supply circuit unit. A circuit module divided into a second holder and a main body straddling the first and second holders, wherein the first and second holders are soldered to the wiring board. 6. The circuit module according to claim 1, wherein the power supply terminal is arranged along an inner peripheral portion of the terminal arrangement region facing a central portion of the circuit component. 7. At least one signal layer having a conductor pattern to which a large number of signal terminals of a circuit component are electrically connected, and a power supply layer to which a large number of power terminals of the circuit component are electrically connected. A multilayer wiring board comprising: a power supply conductor pattern formed on the signal layer, avoiding the conductor pattern; and the power supply conductor pattern and the power supply layer are connected in parallel. . 8. At least one signal layer to which a number of signal terminals of a circuit component are electrically connected, and a solid power layer and a ground layer to which a number of power terminals of the circuit component are electrically connected. Wherein the thickness dimension of the power supply layer is set to be larger than the thickness dimension of the signal layer. 9. The multilayer wiring board according to claim 8, wherein the thickness of the ground layer and the thickness of the power supply layer are set to be equal. 10. A circuit component mountable on a wiring board having a power supply layer, comprising: a number of power terminals and a number of signal terminals electrically connected to the power layer; and a main body supporting these terminals. The power supply terminal and the signal terminal are arranged side by side so as to surround the central portion of the main body in a terminal arrangement region outside the central portion of the main body, and the power supply terminal is at least in the terminal arrangement region. A circuit component, which is continuously arranged at one place so as to cross the terminal arrangement region. 11. A circuit component mountable on a wiring board having a power supply layer, comprising: a plurality of power supply terminals and a plurality of signal terminals electrically connected to the power supply layer; and a main body supporting these terminals. The power supply terminal and the signal terminal are arranged side by side so as to surround the central portion of the main body in a terminal arrangement region outside the central portion of the main body, and the power supply terminal is provided at a central portion of the main body. A circuit component, which is arranged on either the inner periphery of the facing terminal arrangement region or the outer periphery of the terminal arrangement region. 12. The wiring board according to claim 11, wherein the wiring board has a ground layer insulated from the power supply layer.
Further, the signal terminals include a large number of ground terminals, and the ground terminals are arranged at any one of an inner peripheral portion and an outer peripheral portion of the terminal arrangement region avoiding the power supply terminal. Circuit components. 13. The package, comprising: a package body in which an IC chip is sealed; and a number of signal terminals disposed on a surface of the package body facing the wiring board and electrically connected to the IC chip. A semiconductor package, wherein a power supply terminal is arranged on a surface of the main body opposite to the signal terminal. 14. The package body according to claim 13, wherein the package body has a ground terminal on a surface opposite to the signal terminal, and a conductive heat sink in contact with the ground terminal is provided on the package body. And a heat sink provided with a ground connection terminal portion.