JP2000510534A - 蒸着装置 - Google Patents
蒸着装置Info
- Publication number
- JP2000510534A JP2000510534A JP11516068A JP51606899A JP2000510534A JP 2000510534 A JP2000510534 A JP 2000510534A JP 11516068 A JP11516068 A JP 11516068A JP 51606899 A JP51606899 A JP 51606899A JP 2000510534 A JP2000510534 A JP 2000510534A
- Authority
- JP
- Japan
- Prior art keywords
- mandrel
- substrate
- ring
- chamber
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims abstract description 13
- 239000013529 heat transfer fluid Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000010926 purge Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 238000005979 thermal decomposition reaction Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 33
- 229910052759 nickel Inorganic materials 0.000 description 18
- 239000007789 gas Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 5
- 229910002091 carbon monoxide Inorganic materials 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000282376 Panthera tigris Species 0.000 description 1
- 239000005662 Paraffin oil Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/16—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Road Signs Or Road Markings (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 気体状金属カルボニルを分解するための装置であって、 少なくとも1つの開口を有する基板と、 前記基板上に設けられ、前記基板とともにチャンバを形成するカバーと、 前記基板の開口内に設けられた基板リングと、 前記基板リング内にはめ込まれるとともにその内部に少なくとも1の流体導管 が設けられた、マンドレルを受け止めるマンドレルリングと、 気体状金属カルボニルを前記チャンバに導入するための手段と、を備えたこと を特徴とする、装置。 2. 熱伝達流体源が流動可能に前記流体導管に接続されていることを特徴と する、請求項1記載の装置。 3. 前記マンドレルが前記マンドレルリングに取り付けられていることを特 徴とする、請求項1記載の装置。 4. 前記マンドレルリングが基板の開口の上方に延びていることを特徴とす る、請求項1記載の装置。 5. 前記チャンバから気体状カルボニルを排気するための手段を含むことを 特徴とする、請求項1記載の装置。 6. 熱伝達流体を所定温度に維持するための手段を含むことを特徴とする、 請求項1記載の装置。 7. 前記マンドレルと前記基板との間に間隙が設けられていることを特徴と する、請求項6記載の装置。 8. パージ流路が前記基板内に設けられていることを特徴とする、請求項1 記載の装置。 9. 前記マンドレルを前記マンドレルリングから分離するための手段を含む ことを特徴とする、請求項1記載の装置。 10. 第1固定手段が前記基板を前記基板リングに取り付け、第2固定手段 が前記基板リングを前記マンドレルリングに取り付け、且つこれらの間にシール 手段が設けられていることを特徴とする、請求項1記載の装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/922,036 US6007634A (en) | 1997-09-02 | 1997-09-02 | Vapor deposition apparatus |
| US08/922,036 | 1997-09-02 | ||
| PCT/CA1998/000476 WO1999011838A1 (en) | 1997-09-02 | 1998-05-11 | Vapor deposition apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000510534A true JP2000510534A (ja) | 2000-08-15 |
| JP3325587B2 JP3325587B2 (ja) | 2002-09-17 |
Family
ID=25446395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51606899A Expired - Fee Related JP3325587B2 (ja) | 1997-09-02 | 1998-05-11 | 蒸着装置 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6007634A (ja) |
| EP (1) | EP1015658B1 (ja) |
| JP (1) | JP3325587B2 (ja) |
| KR (1) | KR20000070623A (ja) |
| AT (1) | ATE221141T1 (ja) |
| AU (1) | AU731555B2 (ja) |
| CA (1) | CA2276000C (ja) |
| DE (1) | DE69806776T2 (ja) |
| ES (1) | ES2179491T3 (ja) |
| RU (1) | RU2188252C2 (ja) |
| TW (1) | TW475001B (ja) |
| WO (1) | WO1999011838A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007501897A (ja) * | 2003-08-08 | 2007-02-01 | ウェーバー・マニュファクチュリング・リミテッド | 蒸着による中空のニッケル成形品 |
| JP2010059542A (ja) * | 2008-08-05 | 2010-03-18 | Tokyo Electron Ltd | 載置台構造、成膜装置及び成膜方法 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6185370B1 (en) * | 1998-09-09 | 2001-02-06 | Tokyo Electron Limited | Heating apparatus for heating an object to be processed |
| US6461434B1 (en) * | 1999-09-27 | 2002-10-08 | Advanced Micro Devices, Inc. | Quick-change flange |
| US6616870B1 (en) * | 2000-08-07 | 2003-09-09 | Shipley Company, L.L.C. | Method of producing high aspect ratio domes by vapor deposition |
| US6571821B2 (en) * | 2001-07-13 | 2003-06-03 | Varian, Inc. | Energy conserving gate valve |
| CA2430546A1 (en) * | 2003-05-30 | 2004-11-30 | Sig Ryka Inc. | Hollow nickel mold members for use in blow molding |
| ES2249745T3 (es) * | 2004-03-26 | 2006-04-01 | APPLIED FILMS GMBH & CO. KG | Procedimiento para hacer funcionar instalaciones de vacio con cambios de presion. |
| US20080232424A1 (en) * | 2007-03-23 | 2008-09-25 | Honeywell International Inc. | Hearth plate including side walls defining a processing volume |
| KR20090057729A (ko) * | 2007-12-03 | 2009-06-08 | 에이피시스템 주식회사 | 급속열처리장치의 히터블록 |
| US10454114B2 (en) | 2016-12-22 | 2019-10-22 | The Research Foundation For The State University Of New York | Method of producing stable, active and mass-producible Pt3Ni catalysts through preferential co etching |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2496054A (en) * | 1945-07-27 | 1950-01-31 | Rca Corp | Bell-jar vacuum evaporator |
| US4496609A (en) * | 1969-10-15 | 1985-01-29 | Applied Materials, Inc. | Chemical vapor deposition coating process employing radiant heat and a susceptor |
| GB9014430D0 (en) * | 1990-06-28 | 1990-08-22 | Weber Reinhart | Method of producing nickel shell molds |
| CA2076578A1 (en) * | 1992-08-21 | 1994-02-22 | Miroslav Milinkovic | Mandrel for use in nickel vapour deposition processes and nickel molds made therefrom |
| GB9309249D0 (en) * | 1993-05-05 | 1993-06-16 | Weber Manufacturing Limited | Method of producing nickel shell moulds |
| GB9402471D0 (en) * | 1994-02-09 | 1994-03-30 | Weber Manufacturing Limited | Nickel shell molds |
| RU2072180C1 (ru) * | 1994-07-12 | 1997-01-20 | Московский институт стали и сплавов | Устройство для нанесения защитных покрытий на малогабаритные изделия |
-
1997
- 1997-09-02 US US08/922,036 patent/US6007634A/en not_active Expired - Lifetime
-
1998
- 1998-05-11 CA CA002276000A patent/CA2276000C/en not_active Expired - Fee Related
- 1998-05-11 RU RU2000108491/02A patent/RU2188252C2/ru not_active IP Right Cessation
- 1998-05-11 ES ES98921302T patent/ES2179491T3/es not_active Expired - Lifetime
- 1998-05-11 AU AU74214/98A patent/AU731555B2/en not_active Ceased
- 1998-05-11 DE DE69806776T patent/DE69806776T2/de not_active Expired - Lifetime
- 1998-05-11 KR KR1019997006871A patent/KR20000070623A/ko not_active Abandoned
- 1998-05-11 WO PCT/CA1998/000476 patent/WO1999011838A1/en not_active Ceased
- 1998-05-11 JP JP51606899A patent/JP3325587B2/ja not_active Expired - Fee Related
- 1998-05-11 AT AT98921302T patent/ATE221141T1/de active
- 1998-05-11 EP EP98921302A patent/EP1015658B1/en not_active Expired - Lifetime
- 1998-07-09 TW TW087111104A patent/TW475001B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007501897A (ja) * | 2003-08-08 | 2007-02-01 | ウェーバー・マニュファクチュリング・リミテッド | 蒸着による中空のニッケル成形品 |
| JP2010059542A (ja) * | 2008-08-05 | 2010-03-18 | Tokyo Electron Ltd | 載置台構造、成膜装置及び成膜方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6007634A (en) | 1999-12-28 |
| EP1015658B1 (en) | 2002-07-24 |
| EP1015658A1 (en) | 2000-07-05 |
| RU2188252C2 (ru) | 2002-08-27 |
| KR20000070623A (ko) | 2000-11-25 |
| CA2276000A1 (en) | 1999-03-11 |
| JP3325587B2 (ja) | 2002-09-17 |
| ES2179491T3 (es) | 2003-01-16 |
| AU7421498A (en) | 1999-03-22 |
| WO1999011838A1 (en) | 1999-03-11 |
| CA2276000C (en) | 2005-12-27 |
| ATE221141T1 (de) | 2002-08-15 |
| AU731555B2 (en) | 2001-04-05 |
| DE69806776D1 (de) | 2002-08-29 |
| DE69806776T2 (de) | 2003-02-27 |
| TW475001B (en) | 2002-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6955725B2 (en) | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces | |
| US5968276A (en) | Heat exchange passage connection | |
| US6402806B1 (en) | Method for unreacted precursor conversion and effluent removal | |
| JP2000510534A (ja) | 蒸着装置 | |
| US5906683A (en) | Lid assembly for semiconductor processing chamber | |
| TWI524371B (zh) | 具有擴散板和注入器組件的批次處理腔 | |
| US6846514B2 (en) | Gas port sealing for CVD/CVI furnace hearth plates | |
| JP4327427B2 (ja) | 化学蒸着法装置及び方法 | |
| WO1996017106A1 (en) | Apparatus for growing thin films | |
| US20090084317A1 (en) | Atomic layer deposition chamber and components | |
| US20020072164A1 (en) | Processing chamber with multi-layer brazed lid | |
| US20020069970A1 (en) | Temperature controlled semiconductor processing chamber liner | |
| US20020100417A1 (en) | Heating-type trap device and film-deposition apparatus | |
| KR20050118245A (ko) | 유황회수 장치를 위한 밀폐형 관찰 요소 | |
| JP2003504884A (ja) | 溶着反応装置におけるシール手段およびその適用 | |
| CA2370153A1 (en) | Chamber for chemical vapour deposition | |
| US20090078203A1 (en) | Hot source | |
| CN100529202C (zh) | 用于纺制长丝的装置 | |
| MXPA99008185A (en) | Vapor deposition apparatus | |
| JP2000262841A (ja) | トラップ装置及び半導体製造装置 | |
| CN222008178U (zh) | 一种喷淋机构及化学气相沉积设备 | |
| JP4111269B2 (ja) | 基板処理装置 | |
| CN120138793A (zh) | 半导体设备及进气装置 | |
| JPS6364322A (ja) | 気相成長装置 | |
| JPH02278817A (ja) | Oリング |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080705 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090705 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090705 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100705 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110705 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110705 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110705 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110705 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120705 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130705 Year of fee payment: 11 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |