JP2001501774A5 - - Google Patents
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- Publication number
- JP2001501774A5 JP2001501774A5 JP1997529385A JP52938597A JP2001501774A5 JP 2001501774 A5 JP2001501774 A5 JP 2001501774A5 JP 1997529385 A JP1997529385 A JP 1997529385A JP 52938597 A JP52938597 A JP 52938597A JP 2001501774 A5 JP2001501774 A5 JP 2001501774A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/600,777 US5851852A (en) | 1996-02-13 | 1996-02-13 | Die attached process for SiC |
| US08/600,777 | 1996-02-13 | ||
| PCT/US1997/001790 WO1997030474A1 (en) | 1996-02-13 | 1997-01-31 | DIE ATTACHED SiC AND DIE ATTACH PROCEDURE FOR SiC |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001501774A JP2001501774A (ja) | 2001-02-06 |
| JP2001501774A5 true JP2001501774A5 (2) | 2004-10-28 |
| JP3971456B2 JP3971456B2 (ja) | 2007-09-05 |
Family
ID=24404995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52938597A Expired - Lifetime JP3971456B2 (ja) | 1996-02-13 | 1997-01-31 | 装着ＳｉＣダイ及びＳｉＣ用ダイ装着方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5851852A (2) |
| EP (1) | EP0880801B1 (2) |
| JP (1) | JP3971456B2 (2) |
| DE (1) | DE69711852T2 (2) |
| WO (1) | WO1997030474A1 (2) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6613978B2 (en) | 1993-06-18 | 2003-09-02 | Maxwell Technologies, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US5880403A (en) | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
| US6455864B1 (en) | 1994-04-01 | 2002-09-24 | Maxwell Electronic Components Group, Inc. | Methods and compositions for ionizing radiation shielding |
| US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| US6261508B1 (en) | 1994-04-01 | 2001-07-17 | Maxwell Electronic Components Group, Inc. | Method for making a shielding composition |
| US5916513A (en) * | 1997-08-04 | 1999-06-29 | Motorola | Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation |
| KR100303446B1 (ko) * | 1998-10-29 | 2002-10-04 | 삼성전자 주식회사 | 액정표시장치용박막트랜지스터기판의제조방법 |
| US7166320B1 (en) | 2000-02-14 | 2007-01-23 | Seagate Technology Llc | Post-deposition annealed recording media and method of manufacturing the same |
| US6368899B1 (en) * | 2000-03-08 | 2002-04-09 | Maxwell Electronic Components Group, Inc. | Electronic device packaging |
| US7382043B2 (en) | 2002-09-25 | 2008-06-03 | Maxwell Technologies, Inc. | Method and apparatus for shielding an integrated circuit from radiation |
| US7191516B2 (en) * | 2003-07-16 | 2007-03-20 | Maxwell Technologies, Inc. | Method for shielding integrated circuit devices |
| DE102004015017B4 (de) * | 2004-03-26 | 2006-11-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Erzeugung von mechanischen und elektrischen Verbindungen zwischen den Oberflächen zweier Substrate |
| US8318545B2 (en) * | 2010-01-28 | 2012-11-27 | Freescale Semiconductor, Inc. | Method of making a mounted gallium nitride device |
| US20130330571A1 (en) * | 2012-06-06 | 2013-12-12 | Northrop Grumman Systems Corporation | Method and apparatus for providing improved backside metal contacts to silicon carbide |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573568A (en) * | 1969-06-18 | 1971-04-06 | Gen Electric | Light emitting semiconductor chips mounted in a slotted substrate forming a display apparatus |
| US4042951A (en) * | 1975-09-25 | 1977-08-16 | Texas Instruments Incorporated | Gold-germanium alloy contacts for a semiconductor device |
| US4457976A (en) * | 1983-03-28 | 1984-07-03 | Rca Corporation | Method for mounting a sapphire chip on a metal base and article produced thereby |
| US4657825A (en) * | 1984-12-24 | 1987-04-14 | Ngk Spark Plug Co., Ltd. | Electronic component using a silicon carbide substrate and a method of making it |
| US4978052A (en) * | 1986-11-07 | 1990-12-18 | Olin Corporation | Semiconductor die attach system |
| EP0277645A1 (en) * | 1987-02-02 | 1988-08-10 | Sumitomo Electric Industries Limited | Ceramics-metal jointed body |
| US5368880A (en) * | 1989-12-06 | 1994-11-29 | Westinghouse Electric Corporation | Eutectic bond and method of gold/titanium eutectic bonding of cadmium telluride to sapphire |
| US5008735A (en) * | 1989-12-07 | 1991-04-16 | General Instrument Corporation | Packaged diode for high temperature operation |
| JP3293966B2 (ja) * | 1993-07-05 | 2002-06-17 | 太平洋セメント株式会社 | セラミックスとシリコン板との接合方法 |
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1996
- 1996-02-13 US US08/600,777 patent/US5851852A/en not_active Expired - Lifetime
-
1997
- 1997-01-31 WO PCT/US1997/001790 patent/WO1997030474A1/en not_active Ceased
- 1997-01-31 DE DE69711852T patent/DE69711852T2/de not_active Expired - Lifetime
- 1997-01-31 JP JP52938597A patent/JP3971456B2/ja not_active Expired - Lifetime
- 1997-01-31 EP EP97905753A patent/EP0880801B1/en not_active Expired - Lifetime