JP2002040468A - Liquid crystal devices and electronic equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a liquid crystal device which can be downsized by narrowing a frame without deteriorating display quality due to an increase in drawing resistance. SOLUTION: In the liquid crystal device of the present invention, a signal electrode 6 is provided on an inner surface of a lower substrate 2 of a pair of substrates, and a signal electrode wiring 11 penetrates through the lower substrate 2. 17 is provided over the outer surface of the substrate. On the other hand, the scanning electrodes 7 are provided on the inner surface of the upper substrate 3, and the wiring for the scanning electrodes is connected to the upper and lower conductive portions extending between the substrates, and further, through the through holes penetrating the lower substrate 2, the outer surface of the lower substrate 2 is formed. Is provided over. On the outer surface side of the lower substrate 2, a driving IC 10 electrically connected to the signal electrode wiring 11 and the scanning electrode wiring is mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device and an electronic apparatus, and more particularly to a structure of a liquid crystal display panel in which a region outside a display area is reduced as much as possible in miniaturizing the liquid crystal device.

[0002]

2. Description of the Related Art In recent years, liquid crystal display panels have been widely used as means for displaying various types of information in portable electronic devices such as notebook personal computers, mobile phones, wristwatches, and the like. In particular, in portable electronic devices and the like, a liquid crystal display panel is accommodated in a limited space inside a housing, and furthermore, there is a demand for increasing the amount of information that can be displayed. In this specification, this portion is called a non-display region or a frame).

Usually, in this type of liquid crystal display device, particularly a liquid crystal display device of a passive matrix (simple matrix) type, liquid crystal is sealed between two transparent substrates, and stripes orthogonal to each other are formed on opposing surfaces of the transparent substrates. Transparent electrodes are formed. In this liquid crystal display device, a portion in which transparent electrodes on two substrates intersect each other becomes a pixel, and a method of externally driving the liquid crystal for each pixel is employed.
In order to drive the liquid crystal from the outside, for example, a non-display area on each transparent substrate is extended outside the substrate facing each other, and a driving IC for supplying a signal to the transparent electrode of each substrate is provided in the area. A configuration has been adopted in which each of them is mounted and the terminals of each driving IC and each transparent electrode are routed and electrically connected using wiring.

However, in order to narrow the frame of the liquid crystal display panel and reduce the number of driving ICs, in the case of a small-sized panel having a relatively small number of pixels, all of the two transparent substrates are used. A method has been proposed in which this electrode is electrically connected to a large number of routing wirings provided in a non-display area on one substrate, and is driven by a single driving IC connected to these routing wirings. FIG. 27 and FIG. 28 show a configuration example of a liquid crystal display device of this system.

FIG. 27 shows a case where a chip component is formed into a film (flexibility).
A circuit board mounted on a board, which is a so-called COF (Chip On Film) mounting, is bonded to a liquid crystal display panel. One side of the lower substrate 100 is the upper substrate 10
1, and one driving I
Flexible printed circuit board 1 on which C102 is mounted
03 (Flexible Printed Circuit, hereinafter abbreviated as FPC) is electrically connected. On the opposing surfaces of the lower substrate 100 and the upper substrate 101, a number of striped electrodes 104, 105 are formed in a direction orthogonal to each other.

FIG. 28 shows a so-called COG (Chip On Glass) mounting in which chip components are mounted on a glass substrate, and one side of a lower substrate (glass substrate) 110 extends outside the upper substrate 111. The driving IC 112 is directly mounted on this portion, and further, an FPC 113 for supplying a driving signal to the driving IC 112 is electrically connected.

In either case, the wiring for the electrodes on the lower substrate and the wiring for the electrodes on the upper substrate are all collected on one side of the lower substrate on which the FPC and the driving IC are mounted. Have been.

FIG. 29 and FIG. 30 show an example of a connection structure of the lead wiring of the upper substrate and the lower substrate constituting the liquid crystal display panel.
This will be described in detail with reference to FIG. FIG. 29 is a plan view showing the arrangement of the electrodes and the routing wiring on the upper substrate 120, and FIG.
Reference numeral 0 is a plan view showing the arrangement of the electrodes and the routing wiring on the lower substrate 130. As shown in FIG.
At 0, a large number of strip-shaped scanning electrodes 121 extending in the horizontal direction in the figure are arranged in a stripe shape. here,
A region where a large number of scanning electrodes 121 are formed becomes a display region 122 as a liquid crystal display device. And the display area 12
In the non-display area outside (the right and left sides of the display area 122 in FIG. 2), a scanning electrode lead-out line 123 for supplying a signal to each scanning electrode 121 is arranged.
After being led out in the direction in which the electrodes extend, the lead-out wiring 123 is bent and collected at both ends on one side (the lower side in the figure) of the upper substrate 120.

On the other hand, as shown in FIG.
0, the scanning electrode 1 formed on the upper substrate 120
A large number of strip-like signal electrodes 131 extending in a direction orthogonal to 21 (vertical direction in the figure) are arranged in a stripe shape.
In addition, in the non-display area outside the display area 122 (the lower central part of the display area 122 in the drawing), the signal electrode lead-out wiring 132 for supplying a signal to each signal electrode 131 is arranged. . The upper substrate 12 is provided on both sides of the region where the signal electrode lead-out wiring 132 is disposed.
The scanning electrode lead-out line 133 for electrically connecting to the scan electrode lead-out line 123 is connected to the scan electrode 121.
As many as are arranged. Further, the pitch of the scanning electrode lead-out lines 133 matches the pitch of the scan electrode lead-out lines 123 on the upper substrate 120. In addition,
In the present configuration example, all the routing wirings 123, 13
2 is formed integrally with the scanning electrode 121 or the signal electrode 131, and is made of indium tin oxide (Indium Tin Oxid).
e, hereafter abbreviated as ITO).

[0010] The upper substrate 120 and the lower substrate 13 having the above configuration.
0, the outer shape of the upper substrate 120 is smaller than the outer shape of the lower substrate 130, and the lower end of the scanning electrode routing wiring 123 on the upper substrate 120 and the scanning electrode routing on the lower substrate 130. The upper end of the wiring 133 is positioned so as to face the upper and lower conductive portions indicated by reference numeral 134 in the drawing. For example, an anisotropic conductive film, a conductive paste, a conductive material containing conductive particles, or the like is provided in the upper / lower conductive portion 134.
23 and the lead-out wiring 13 for the scanning electrode on the lower substrate 130
3 are electrically connected. In this manner, all of the scanning electrode lead-out lines 133 and all of the signal electrode lead-out lines 132 are gathered on one side of the lower substrate 130, and this part is shown in FIG. 27, for example. By making such a connection with the COF-mounted substrate, a signal can be supplied to all the scanning electrodes 121 and the signal electrodes 131 from one driving IC on the COF-mounted substrate.

[0011]

However, the liquid crystal display device having the above configuration has the following problems.
In other words, the substrate constituting the conventional liquid crystal display device must have a region in which the wiring is formed outside the display region as described above. As described above, in recent liquid crystal display devices, the display capacity tends to increase more and more. As the display capacity (the number of pixels) increases, the number of the wirings increases, and the area for forming the wirings increases. This becomes an obstacle to narrowing the picture frame because the picture becomes wider.

In order to prevent the area for forming the lead wiring from becoming wide even if the display capacity is increased, it is conceivable to reduce the pitch of the lead wiring (wiring width + interval between wirings). This may increase the resistance and adversely affect the display quality. For example, when 100 wirings are formed at a pitch of 50 μm, a wiring forming area of about 5 mm is required. The routing resistance at this time reaches several kΩ to MΩ order, and a problem such as a rounded signal waveform may occur.

In order to suppress the increase in the resistance of the routing wiring, there are methods such as lowering the resistance of the transparent conductive film constituting the routing wiring and adding a low-resistance metal auxiliary wiring. However, in the case of the former method, it is important that the transparent conductive film has a sufficient light transmittance at the electrode portion, and it is difficult to reduce the resistance while maintaining a high transmittance. Further, in the case of the latter method, there is a problem that the load on the manufacturing process increases. After all, there has been no effective means for reducing the size of the routing wiring formation area without increasing the resistance of the routing wiring.

Further, as shown in FIGS. 27 and 28, the conventional liquid crystal display device requires a region for mounting an FPC and a driving IC, so that one substrate must be greatly extended from the other substrate. However, when the liquid crystal display device is housed in the housing of the electronic device, this portion is a useless space. Therefore, the non-display (frame) area of the liquid crystal display device is secured and expanded.

Japanese Patent Application Laid-Open No. 5-323354 discloses a technique for mounting an electronic circuit and a driving IC on the back side of a substrate for the purpose of narrowing the frame of the liquid crystal display device. Similarly, Japanese Patent Laid-Open No. Hei 7 (1999) discloses a technology in which one of the substrates has a function as both a pixel pattern wiring substrate and a drive circuit wiring substrate.
No. 159802. However, this publication describes that a drive line on the front side of one substrate is simply conducted to the back side via a via hole (contact hole) and connected to a drive circuit and a drive IC on the back side. However, the overall configuration of the liquid crystal display device is unknown.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a liquid crystal display device that can be reduced in size by reducing a frame without causing a decrease in display quality due to an increase in drawing resistance. It is an object to provide an apparatus and an electronic device using the same.

[0017]

In order to achieve the above object, a liquid crystal device according to the present invention is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates opposed to each other. In the first substrate, a first conductive portion is provided on an inner surface facing the liquid crystal layer, and a first routing conductive portion electrically connected to the first conductive portion is provided from the inner surface. In a second substrate having a light-transmitting property, the second conductive portion is provided on the inner surface facing the liquid crystal layer, and the second conductive portion is provided on the second substrate having a light-transmitting property. An electrically connected second routing conductive portion is provided from the inner surface of the second substrate to the inner surface of the first substrate, and further from the inner surface of the first substrate to the inside of the substrate and to the outer surface of the first substrate. When the light reflecting portion is provided on the inner surface side of the first substrate, Polarizing means is provided on the outer surface side of the second substrate, and electronic components electrically connected to the first wiring conductive portion and the second wiring conductive portion are provided on the outer surface side of the first substrate. It is characterized by being implemented.

That is, the liquid crystal device of the present invention is electrically connected to the first conductive portion on the inner surface of the first substrate and the second conductive portion on the inner surface of the second substrate on the outer surface side of the first substrate. Electronic components mounted. Here, the “first conductive portion” and “second conductive portion” are specifically defined as a scanning electrode in a passive matrix liquid crystal device, an electrode such as a signal electrode, or a scanning line in an active matrix liquid crystal device. Refers to wiring such as data lines. The “electronic component” specifically refers to a driving IC, a capacitor, and the like used in a driving circuit of a liquid crystal device.

More specifically, the first conductive portion is electrically connected to the electronic component via a first routing conductive portion provided from the inner surface of the first substrate, the inside of the substrate, and the outer surface of the first substrate. It is connected to the. On the other hand, the second conductive portion is provided from the inner surface of the second substrate to the inner surface of the first substrate across the substrates, and from the inner surface of the first substrate to the inner surface of the substrate through the inner surface of the first substrate. Also, it is electrically connected to the electronic component via the second routing conductive part.

Therefore, in the conventional configuration, the routing wiring is routed to a region (non-display region) outside the electrode formation region (in other words, the display region) on the inner surface of the first substrate. On the other hand, in the basic configuration of the present invention, the routing wiring (routing conductive portion) is routed from the inner surface of the first substrate to the outer surface through the inside of the substrate. Here, the present invention is a reflection type liquid crystal device in which the light reflecting portion is provided on the inner surface side of the first substrate and the polarizing means is provided on the outer surface side of the second substrate. After wiring to the outer surface side of the substrate, even if wiring is formed in an area equivalent to the display area in a plan view, there is no problem in display. Further, electronic components electrically connected to these wirings can be similarly arranged in a region corresponding to a display region on the outer surface of the first substrate.

Further, in the configuration of the present invention, the basic configuration of the routing conductive portion is not limited to the first routing conductive portion on the first substrate which is the substrate on which the electronic component is mounted.
The same applies to the second lead conductive portion from the second substrate facing the liquid crystal layer. In other words, all of the routing conductive portions of the pair of substrates are finally routed to the outer surface side of the first substrate through the inside of the first substrate, and are connected to the electronic components.

Therefore, according to the configuration of the present invention, the routing area provided outside the display area on the inner surface of the first substrate in the conventional configuration, and the mounting area for the FPC and the electronic components are not required. The frame portion can be significantly narrowed as compared with the related art. In addition, the conductive portions can be laid out on the entire outer surface of the first substrate including the display area, and the pitch between the conductive portions can be designed with a margin. Does not occur.

Further, in the present invention, the first substrate is not necessarily a light-transmitting substrate, and thus, as a material choice of the substrate, in addition to a conventional transparent substrate such as a glass substrate and a quartz substrate, for example, for example, A resin substrate such as a polyimide substrate, a ceramic substrate, or the like can also be used, and the degree of freedom in selecting a material for the first substrate is improved. In other words, in the liquid crystal device of the present invention, the first substrate functions as one of the substrates included in the liquid crystal device itself, and at the same time, functions as a mounting substrate for a driving circuit. Therefore, in some cases, the number of connection components such as a flexible tape can be reduced.

It is preferable that an external connection terminal electrically connected to an input terminal of an electronic component such as a driving IC is provided on a peripheral portion on an outer surface side of the first substrate.

If the external connection terminal is provided on the peripheral portion, when an FPC or the like for supplying a drive signal to the driving IC is further mounted, the positioning when the external connection terminal and the FPC terminal are joined is performed. Can be easily performed. Further, during or after the FPC bonding, stress may be generated at the bonding portion. However, if the position is a peripheral portion of the substrate that is out of the display area, the stress does not adversely affect the display.

The specific configuration of the first routing conductive portion of the first substrate is as follows. The first conductive portion is provided inside a hole provided between the inner surface side and the outer surface side of the first substrate. A first in-hole connection portion electrically connected to the first substrate, and a first on-outside connection portion for electrically connecting the first in-hole connection portion and the electronic component on the outer surface of the first substrate. Can be used. Further, the hole may be a through hole penetrating the inner surface side and the outer surface side of the first substrate.

With this configuration, through holes can be easily formed by performing operations such as laser processing and chemical etching on the first substrate. Further, by filling the through-hole with silver paste or the like, performing electrolytic plating, or the like, the first in-hole connecting portion made of a conductive material can be formed in the through-hole. On the other hand, the first outer surface connection portion can be easily formed by a normal wiring formation technique such as film formation and patterning of a conductive film. Note that the first in-hole connecting portion is provided in the first hole connection portion.
It is sufficient that the conductive portion and the first outer surface connection portion can be electrically connected, and it is not always necessary that the conductive portion is embedded in the entire inside of the hole. Further, the first in-hole connecting portion may be provided directly below the seal, or the first in-hole connecting portion may be arranged at a position separated from the seal. First below the seal
In the case where the connection portion in the hole is provided, for example, a conductive member is mixed in a sealing material, and polymerization can be performed, so that electrical connection can be made. Since the first connection portion in the hole may have a slightly raised shape on the first substrate for manufacturing reasons, if there is a problem with the display, the first connection portion in the outside of the seal is formed. There is no problem if the parts are arranged.

The first substrate includes a conductive layer forming a first conductive portion on the inner surface side, a conductive layer forming a first connection portion on the outer surface side, and one or more layers inside the substrate. A substrate having an internal conductive layer, that is, a substrate such as a so-called multilayer printed wiring board may be used. In this case, the hole extending from the inner surface to the outer surface of the first substrate is formed between the inner surface of the first substrate and the inner conductive layer, between the outer surface of the first substrate and the inner conductive layer, or the mutual inner conductive layer. It consists of a plurality of via holes provided between the layers.

When this type of substrate is used, for example, when the number of routing conductive portions increases and it becomes difficult to arrange a large number of routing conductive portions only on the outer surface of the first substrate, some of the routing conductive portions are difficult to be disposed. The routing conductive portion can also be routed by using the internal conductive layer, and the degree of freedom of routing is improved, so that it is possible to cope with an increase in display capacity.

In the case of the structure having the first connection portion on the outer surface,
The first conductive portion on the inner surface side and the first connection portion on the outer surface on the outer surface side can be made of the same conductive material.

According to this structure, after a conductive film is formed on the inner surface and the outer surface of the first substrate, photolithography and etching are performed on both the inner surface and the outer surface, and the conductive films on both surfaces are simultaneously patterned. As a result, the first conductive portion and the first outer surface connection portion can be formed, so that the manufacturing process can be simplified.

Conversely, the first conductive portion on the inner surface side and the first connecting portion on the outer surface on the outer surface side can be made of different conductive materials.

In this configuration, as will be described later, the first
In the case where the conductive portion of, for example, an electrode in a passive matrix type liquid crystal device also serves as a light reflecting portion, a metal material such as silver (or an alloy containing silver) and aluminum having a high light reflectance is used for the first conductive portion, Optimum for the functions of the first conductive portion and the first external connection portion, such as using a metal material such as copper which is a low-resistance material for reducing the drawing resistance for the first external connection portion. A suitable conductive material can be selected. As a result, the display quality can be improved instead of obtaining the above advantage of simplifying the manufacturing process.

On the other hand, with regard to a specific configuration of the second routing conductive portion, the second routing conductive portion is provided between the first substrate and the second substrate and is connected to the second conductive portion. An electrically connected inter-substrate connection, and a second hole provided inside the hole provided between the inner surface and the outer surface of the first substrate and electrically connected to the inter-substrate connection. The internal connection portion and a second external connection portion on the external surface of the first substrate for electrically connecting the second internal connection portion and the electronic component can be provided.

For the connection between the substrates, any means such as a conductive paste or conductive particles formed so as to extend between the two substrates can be used. Alternatively, conductive connection between substrates may be performed using a conductive material mixed in a sealant for sealing a liquid crystal layer.

Regarding the positional relationship between the inter-substrate connecting portion and the second inter-hole connecting portion, the second inter-hole connecting portion may be provided immediately below the inter-substrate connecting portion, You may arrange | position a 2nd connection part in a hole in the space | separated position. In that case,
It is desirable to provide a second on-inner connection portion for electrically connecting the inter-substrate connection portion and the second in-hole connection portion on the inner surface of the first substrate.

In the case where the second in-hole connecting portion is provided immediately below the inter-substrate connecting portion, for example, a conductive material can be mixed in a sealing material and polymerized, so that electrical connection can be made, so that the frame can be narrowed. At the same time, the structure becomes simple. Similarly to the first connection portion in the hole, the portion of the second connection portion in the hole may have a slightly raised shape on the first substrate for manufacturing reasons. If there is a problem in the relationship or display, there is no problem if the inter-substrate connecting portion and the second in-hole connecting portion are separated from each other.

Further, in that case, it is desirable that the second inner connection portion and the first conductive portion are formed of the same conductive material.

In this configuration, the second inner connecting portion and the first conductive portion can be simultaneously formed in one step, so that the manufacturing process does not become complicated.

As described above, in the liquid crystal device of the present invention,
Although there are many choices of substrate materials that can be used for the first substrate, one or both of the first substrate and the second substrate may be a flexible substrate such as a plastic film substrate. You may comprise.

According to this structure, the liquid crystal device can be made thinner and lighter, and breakage such as cracking of the substrate is less likely to occur.
Advantages such as curved surface display can be obtained by curving the substrate, which is suitable for electronic devices such as portable devices.

The liquid crystal device to which the present invention can be applied includes, for example, the following three types. One is a passive matrix type liquid crystal device. In that case, a first conductive portion on a first substrate is a plurality of electrodes formed in a stripe shape, and a second conductive portion on a second substrate is A plurality of electrodes are formed in a stripe shape so as to extend in a direction intersecting with the electrodes. Of course, either the first conductive part or the second conductive part may be a scanning electrode or a signal electrode.

When the present invention is applied to a passive matrix type liquid crystal device, the first conductive portion on the first substrate is made of a material having high light reflectivity, for example, a metal such as silver (or an alloy containing silver) or aluminum. In this case, the first conductive portion itself can be used as a reflection electrode that also serves as the light reflection portion. That is, the liquid crystal device of the present invention may be a reflective liquid crystal device having a reflective electrode or a reflective liquid crystal device having a reflective layer and a display electrode separately.

Another is an active matrix type liquid crystal device using a thin film diode (hereinafter abbreviated as TFD) as a switching element. In this case, a first conductive portion on a first substrate is used. Is a plurality of data lines or scanning lines, and the second conductive portion on the second substrate is a plurality of scanning lines or data lines formed in a stripe shape so as to extend in a direction intersecting the data lines or scanning lines. Becomes

Still another is an active matrix type liquid crystal device using a thin film transistor (hereinafter abbreviated as TFT) as a switching element, and in this case, a first conductive portion on a first substrate. Becomes at least one of a plurality of data lines or scanning lines, and the second conductive portion on the second substrate becomes one common electrode.

In the liquid crystal device of the present invention described above, a color filter may be provided on the inner surface of the first substrate or the second substrate.

With this configuration, it is possible to realize a color liquid crystal device having a high display quality with a narrow frame, and it is suitable for various electronic devices in which colorization is expected to further advance in the future.

An electronic apparatus according to the present invention includes the liquid crystal device according to the present invention. According to the present invention, by providing a small liquid crystal device with a narrow frame, it is possible to realize an electronic device having a wide display area and excellent portability, despite the small size of the entire device.

[0049]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to FIGS.

This embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device.
This is an example of a liquid crystal display device having a display electrode also serving as a light reflection portion, a so-called reflection electrode.

FIG. 1 is a perspective view of the entire liquid crystal display device of the present embodiment as viewed from above, FIG. 2 is a perspective view as viewed from below.
3 is a top view (electrode formation surface) of the lower substrate, FIG. 4 is a transmission plan view of the lower substrate viewed from the lower surface side (a transmission plan view of the electronic component mounting surface), and FIG. 5 is an upper substrate. 6 is a transparent plan view showing a state in which the upper substrate and the lower substrate are overlapped, FIG. 7 is a cross-sectional view taken along line AA ′ of FIG. 6, and FIG. FIG. 7 is a sectional view taken along line BB ′ of FIG. In all of the following drawings, the scale of each layer and each member is different in order to make each layer and each member have a size recognizable in the drawings.

As shown in FIG. 1, the liquid crystal display device 1 of the present embodiment has a lower substrate 2 (first substrate) and an upper substrate 3
And a liquid crystal layer (not shown in FIG. 1) is sandwiched between these substrates. In the present embodiment, an opaque substrate made of polyimide or the like is used as the lower substrate 2, and a transparent substrate made of polycarbonate, polyether sulfone, acrylic resin, or the like is used as the upper substrate 3. In the following description, the surface of both substrates facing the liquid crystal layer is referred to as “inner surface”, and the surface on the opposite side is referred to as “outer surface”. That is, the surface on both sides of the substrate on which the liquid crystal layer is arranged is called the "inner surface", and the surface on the opposite side is called the "outer surface". A phase difference plate 4 is provided on the outer surface of the upper substrate 3.
(Λ / 4 plate) and a polarizing plate 5 (polarizing means) are sequentially adhered. In the drawings after FIG. 2, the illustration of the phase difference plate 4 and the polarizing plate 5 is omitted.

On the inner surface of the lower substrate 2, a large number of signal electrodes 6
(First conductive portions) are provided in a stripe shape, and a number of scanning electrodes 7 (second conductive portions) extending in a direction orthogonal to the signal electrodes 6 are formed on the inner surface of the upper substrate 3 facing the stripes. It is provided in the shape. A portion where the signal electrode 6 intersects with the scanning electrode 7 becomes an individual pixel 8, and a region where a number of pixels 8 are arranged in a matrix becomes a display region 9. In the present embodiment, the electrode on the lower substrate 2 side is described as a signal electrode, and the electrode on the upper substrate 3 side is described as a scanning electrode. However, the order may be reversed. Further, in the present embodiment, the shape of the signal electrode 6 and the scanning electrode 7 is a stripe shape. However, the present invention is not limited to this shape, and can be applied to any electrode shape such as a multiplex matrix configuration and icons. It is.

As shown in FIG. 2, a driving IC 10 (electronic component) is mounted on an outer surface of the lower substrate 2 in a region corresponding to the display region 9 in a plane. This drive I
C10 is connected to an external connection terminal 26 from an external circuit (not shown).
The image signal is supplied to the signal electrode 6 and the scanning signal is supplied to the scanning electrode 7 in response to the signal inputted through the input terminal. Also, on the outer surface of the lower substrate 2, a signal electrode connection wire 12 (a first outer surface connection portion) which constitutes a part of a signal electrode lead wire (a first lead conductive portion) described later. , And scanning electrode connection wiring 14 constituting a part of the scanning electrode wiring (second wiring conductive portion)
(The second connection portion on the outer surface) are provided, and are electrically connected to the terminals of the driving IC 10 (not shown in FIGS. 2 and 4).

As shown in FIG. 3, on the inner surface of the lower substrate 2, a large number of signal electrodes 6 made of a metal thin film having a high light reflectivity such as aluminum or silver (or an alloy containing silver) are formed in a striped shape. Band-like). These signal electrodes 6 also serve as reflection layers. At the time of display, light enters from the outside of the upper substrate 3 via the polarizing plate 5 and the phase difference plate 4, and light transmitted through the liquid crystal layer reaches the inner surface of the lower substrate. These signal electrodes 6
The light is reflected on the surface of the camera and an image is displayed. One end of the signal electrode 6 is thinly extended in the extending direction of the electrode as it is, and the tip is formed in a circular shape, and serves as a land 16 for connecting to a connection portion in a hole (a first connection portion in a hole) described later. . The land 16 is formed on the signal electrode 6 on the lower substrate 2.
Are arranged at the ends along the side of the substrate in the extending direction. In the center of the land 16, a through hole is formed that penetrates between the inner surface and the outer surface of the lower substrate 2. This portion of the end portion of the signal electrode 6 serves as a signal electrode connection wiring 18 which forms a part of a signal electrode lead-out wiring for electrically connecting the signal electrode 6 and the driving IC 10.

In the case of the present embodiment, the signal electrode connection wirings 18 are arranged in the order of the left, right, left,... Therefore, the distance between the connection wirings adjacent in the vertical direction is wide, and the connection wirings are hardly short-circuited and the reliability is secured. However, if there is no problem particularly in the interval between the connection wirings, all the connection wirings may be pulled out in the same direction, or, for example, the upper half of the connection wirings may be left-
The connection wiring may be drawn in any direction, such as drawing out the lower half of the connection wiring separately from the right side. Also, instead of arranging through holes in a straight line, zigzag (staggered arrangement)
By arranging them at a narrow pitch, it becomes possible to cope with a narrow pitch. Further, a configuration in which a through-hole is simply provided at an end of the signal electrode 6 may be used without particularly forming a portion thinner than the signal electrode 6 as a connection wiring.

In the lower substrate 2, an end of another substrate side adjacent to the substrate side where the land 16 is disposed at the end is provided with an up-down conductive portion (substrate connection portion) to be described later and a hole in the hole. A large number of scanning electrode connection wirings 21 (second connection portions on the inner surface) for electrically connecting the connection portions (second connection portions in the hole) are formed. These scanning electrode connection wirings 21 are electrically connected to the respective scanning electrodes 7 of the upper substrate 3 and the lands 22 by vertical conduction between the upper and lower substrates. In the case of the present embodiment, one end of each scanning electrode connection wiring 21 is a rectangular land 22 in contact with the upper and lower conductive portions, and the other end is a circular land 23 in contact with the in-hole connection portion. In the center, a through-hole penetrating between the inner surface and the outer surface of the lower substrate 2 is formed. These scanning electrode connection lines 21
Is also formed of the same material as the signal electrode 6 such as aluminum.

FIG. 4 shows a state where the lower substrate 2 shown in FIG. 3 is turned upside down. On the outer surface of the lower substrate 2, through holes formed in the lands 16 of the signal electrode connection wiring 18 shown in FIG.
Circular lands 24 and 25 are provided respectively corresponding to the positions of the through holes formed in 3. Further, on the outer surface of the lower substrate 2, the signal electrode connection wirings 12 extend from the lands 24 corresponding to the through holes formed in the lands 16 of the signal electrode connection wiring 18 toward the mounting region of the driving IC 10. Similarly, the scanning electrode connection wiring 14 is provided from each land 25 corresponding to the through hole formed in the land 23 of the scanning electrode connection wiring 21 to the mounting area of the driving IC 10. I have.

Out of the four sides (four substrate sides) of the peripheral portion of the lower substrate 2, the lands 24 and 25 are arranged along three sides (three substrate sides). A large number of external connection terminals 26 are formed along the remaining one side opposite to the side of the substrate (the side of the substrate on which the lands 25 are disposed) where electrical connection (vertical conduction) with the scanning electrodes 7 formed on the inner surface is made. Have been. That is, the external connection terminals 26 formed on the outer surface of the lower substrate 2 are connected to the ends of the lower substrate 2 located in the direction in which the scanning electrodes 7 formed on the inner surface of the upper substrate 3 extend. It is formed in an array. External connection terminal 26
Is a terminal for connecting the liquid crystal display device 1 to a driving external circuit or the like using a connecting part such as an FPC or an anisotropic conductive connector (or a rubber connector) with a terminal of the FPC. . Then, from each of these external connection terminals 26 toward the mounting area of the driving IC 10,
A signal input wiring 41 for supplying a drive signal to the drive IC 10 is provided. In the case of the present embodiment, the signal electrode connection wiring 12, the scanning electrode connection wiring 14, the external connection terminal 26, the signal input wiring 41, and the like formed on the outer surface of the lower substrate 2 are all internal signal electrodes. 6, like the connection wirings 18 and 21, etc., are formed of a material such as aluminum or silver (or an alloy containing silver). That is, the wiring and electrodes other than the scanning electrodes 7 formed on the inner surface of the upper substrate 3 are formed of the same material.

The outer surface of the lower substrate 2 is
It is desirable to cover the area where the wiring is exposed, except for the mounting area of No. 0 and the area where the external connection terminal 26 is formed, with a resin such as polyimide or resist. When such a coating layer is formed, corrosion of wirings such as the signal electrode connection wiring 12, the scanning electrode connection wiring 14, and the signal input wiring 41,
Problems such as disconnection and short-circuit can be prevented.

As shown in FIG. 5, a large number of scanning electrodes 7 made of a transparent conductive thin film such as ITO are provided on the inner surface of the upper substrate 3 in a stripe shape (strip shape). The end in the length direction (wiring forming direction) of each scanning electrode 7 in FIG. 5 is a portion connected to the vertical conducting portion. The outer surface of the upper substrate 3 (not shown) is a flat surface on which nothing is formed.

When the lower substrate 2 and the upper substrate 3 having the above structure are superposed, the result is as shown in FIG. In FIG. 6, 2
A member indicated by a dotted line 27 is a sealant for bonding the two substrates and sealing the liquid crystal layer between the substrates.
The portion where the signal electrode 6 and the scanning electrode 7 intersect each other is a pixel 8
The area where many pixels 8 are arranged in a matrix is the display area 9. In the case of the present embodiment, the outer shape of the upper substrate 3 is smaller than the outer shape of the lower substrate 2,
Are protruding outside the upper substrate 3. The lands 16 at the tips of the signal electrode connection wirings 18 on the inner surface of the lower substrate 2 protrude outside the upper substrate 3. In other words, each signal electrode connection wiring 18 derived from each signal electrode 6 penetrates through the formation portion of the sealing material, is formed so as to extend outside the outer shape (outer periphery) of the upper substrate 3, and is formed at the tip portion. The land 16 is arranged. On the other hand, each scanning electrode connection wiring 21 on the inner surface of the lower substrate 2 has a rectangular land 22
Is located at the portion of the sealing material 27, and the portion of the circular land 23 provided with the through hole is located outside the upper substrate 3.

FIG. 7 is a cross-sectional view taken along the line AA ′ of FIG. 6, that is, a cross-sectional view cut in a direction along the signal electrode 6. As shown in this figure, a sealing material 27 is sandwiched between the lower substrate 2 and the upper substrate 3, and the lower substrate 2 and the upper substrate 3
A liquid crystal layer 28 is sandwiched in a space sealed by the sealing material 27 and the sealing material 27. Here, for example, S
A general liquid crystal such as a TN (Super Twisted Nematic) liquid crystal can be used.

On the inner surface of lower substrate 2, signal electrode 6 and signal electrode connection wiring 18 integrally formed with signal electrode 6 are formed, and on the outer surface of lower substrate 2, signal electrode connection wiring 12 is formed. Is formed, and both signal electrode connection wirings 1 are formed.
Through holes 17 penetrating the substrate are formed in the lands at the tips of the ends 2 and 18. The inside of the through-hole 17 is filled with a conductive material such as a silver paste, and the conductive material electrically connects the signal electrode connection wiring 18 on the inner surface and the signal electrode connection wiring 12 on the outer surface. The connection part 15 in a hole which connects is comprised.

Here, as a more detailed structure of the connection portion 15 in the hole, for example, as shown in FIG. 11A, a conductive material such as silver paste is embedded in the through hole 17 to connect the connection portion in the hole. By forming the coating layer 29 by, for example, coating the surface of the conductive material with an insulating resin after forming 15, the corrosion of the conductive material can be prevented. Alternatively, as shown in FIG. 11B, after the conductive material is embedded in the through hole 17 to form the connection portion 15 in the hole first, the lower portion is formed so as to cover the upper surface and the lower surface of the connection portion 15 in the hole. The connection wirings 18 and 12 for signal electrodes may be formed on the inner surface and the outer surface of the side substrate 2, respectively.

Alternatively, the connection portion in the hole is only required to be capable of electrically connecting the signal electrode connection wirings on the inner surface side and the outer surface side, and may not necessarily be embedded in the entire inside of the hole. Therefore, as shown in FIG. 12, a conductive material may be adhered only to the inner wall of the through hole 17 using an electrolytic plating method to form the connection portion 30 in the hole.

As shown in FIG. 7, the driving IC 1 is provided at the end of the signal electrode connection wiring 12 formed on the outer surface of the lower substrate 2 on the side opposite to the side where the through hole 17 is provided.
0 terminal 31 is connected. By employing the above wiring structure, the image signal output from the driving IC 10 is connected to the signal electrode connection wiring 1 on the outer surface of the lower substrate 2.
2. It is supplied to each signal electrode 6 via the connection portion 15 in the hole and the signal electrode connection wiring 18 on the inner surface of the lower substrate 2. Therefore, the connection wiring 12 for signal electrodes on the outer surface of the lower substrate 2, the connection portion 15 in the hole, and the connection wiring 18 for signal electrodes on the inner surface of the lower substrate 2 constitute the wiring 11 for signal electrodes. become.

The mounting form of the driving IC 10 shown in FIG.
The so-called face-down mounting (or ILB (Inner Lead B) with the surface (terminal formation surface) side of the IC facing the substrate side
onding), for example, a BG that forms the terminal 31 by solder balls arranged in a matrix.
A (Ball Grid Array) type semiconductor elements and bump electrodes
A semiconductor element or the like arranged along the periphery of the outer shape of C is used.

Alternatively, as shown in FIG.
So-called face-up mounting (or OLB (Outer Lead Bonding) mounting) in which the back surface side of C32 is fixed on the lower substrate 2 and the electrode pads 33 on the IC surface side and the signal electrode connection wiring 12 are bonded by wires 34. The driving IC may be mounted by a mounting mode called “driver IC”.

As shown in FIG. 7, a large number of scanning electrodes 7 are formed on the inner surface of the upper substrate 3. Then, alignment films 35 and 36 are formed on the uppermost layers of both the lower substrate 2 and the upper substrate 3 on the side in contact with the liquid crystal layer 28, respectively. The alignment films 35 and 36 are made of a film such as polyimide, and have been subjected to an alignment process such as rubbing. Also, the lower substrate 2
Spacers 37 for keeping the distance between the substrates (hereinafter referred to as a cell gap) constant are dispersed between the upper substrate 3 and the upper substrate 3.

FIG. 8 is a cross-sectional view taken along the line BB ′ of FIG. 6, that is, a cross-sectional view cut in a direction along the scanning electrode 7, showing the configuration of the scanning electrode lead-out wiring 13. I have. As shown in this figure, the scanning electrode 7 is formed on the inner surface of the upper substrate 3 so as to be in contact with the upper surface of the sealing material 27 at the end of the scanning electrode 7. A large number of signal electrodes 6 are formed on the inner surface of the lower substrate 2, and the scanning electrode connection wiring 2 is so contacted with the lower surface of the sealing material 27.
1 is formed. Here, metal particles and conductive material such as particles obtained by metal-plating the surface of a plastic ball are mixed in a binder such as a resin inside the sealing material 27, and the scanning is performed in contact with the upper and lower surfaces of the sealing material 27, respectively. The electrode 7 and the scanning electrode connection wiring 21 are electrically connected with anisotropy to form the upper / lower conducting portion 19.

Hereinafter, the structure of electrical connection from the inner surface to the outer surface of the lower substrate 2 is the same as that of the signal electrode wiring 11. That is, the scanning electrode connection wiring 14 is formed on the outer surface of the lower substrate 2, and the through holes 38 are formed in the lands 23, 25 at the tips of the scanning electrode connection wirings 21, 14 on both the inner surface and the outer surface. Have been. The inside of the through hole 38 is filled with a conductive material such as a silver paste, and the conductive material forms the connection portion 20 in the hole, and the connection wirings 21 and 14 for the scanning electrodes on the inner surface and the outer surface.
Are electrically connected to each other.

Further, a through hole 38 is provided at one end of the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, and a terminal 31 of the driving IC 10 is connected to the opposite end. By adopting the above-described wiring structure, the scanning signal output from the driving IC 10 is connected to the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the connection portion 20 in the hole, and the inner surface of the lower substrate 2. Scanning electrode connection wiring 21, upper and lower conductive portion 1
9 and is supplied to each scanning electrode 7. Therefore, the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the connection portion 20 in the hole, the scanning electrode connection wiring 21 on the inner surface of the lower substrate 2, and the vertical conducting portion 19 are routed for the scanning electrode. The wiring 13 is configured.

It is to be noted that, instead of mixing a conductive material into the inside of the sealing material 27 and forming this portion as the upper and lower conductive portion 19, for example, as shown in FIG. The scanning electrode 7 is extended to a position above the through hole 38 of the lower substrate 2, an arbitrary vertical conductive material 39 is formed above the through hole 38 of the lower substrate 2, and this portion is It may be. The upper and lower conductive members 39 can be formed by printing, for example, silver paste or the like. In the case of this configuration, although there is no electrical conduction at the portion of the sealing material 27, conduction between the substrates is performed at the portion where the upper and lower conductive materials 39 are formed, and the conduction path is almost the same as the arrangement and connection structure of FIG. .

Hereinafter, a method of manufacturing the liquid crystal display device having the above configuration will be described.

A polyimide substrate is prepared as a material of the lower substrate 2, and a conductive thin film made of a metal material such as aluminum is formed on both surfaces of the substrate. Next, after a photosensitive resist is applied on the conductive thin film on both surfaces of the substrate, a photomask is arranged on both surfaces of the substrate, and exposure is performed simultaneously. Next, by simultaneously patterning the conductive thin films on both the front and back surfaces of the lower substrate using well-known photolithography and etching techniques, the signal electrodes 6 on the inner surface side of the lower substrate 2 are formed.
Connection wirings 18 and 21, connection wiring 1 for signal electrode on outer surface side
2. The scanning electrode connection wiring 14, the signal input wiring 41, the external connection terminal 26, and the like are collectively formed.

Next, through holes 17 and 38 penetrating the substrate are formed by irradiating a predetermined portion of each connection wiring end portion on the substrate with a CO2 laser or the like. As another method of forming the through hole, chemical etching or the like using a resist pattern as a mask may be used. afterwards,
The insides of the through holes 17 and 38 are filled with a conductive material such as silver paste to form the connection portions 15 and 20 in the holes, and the connection wirings on both surfaces of the lower substrate 2 are electrically connected. Also,
As another method of forming the connection portion in the hole, a method of attaching a conductive material to the inner wall of the through hole using an electrolytic plating process or the like may be used. In any case, in the case of the present embodiment,
Since the same conductive thin film material is used on both the front and back surfaces of the substrate, the signal electrodes and the like on the inner surface side of the lower substrate 2 and various connection wirings and the like on the outer surface side can be simultaneously formed in one photolithography and etching process. The process can be greatly simplified.

On the other hand, a transparent substrate such as polycarbonate, polyethersulfone, or acrylic resin is prepared as a material for the upper substrate 3, and an IT (inner surface) is provided on one side of the substrate.
A transparent conductive film such as O is formed. Next, the transparent conductive film is patterned using well-known photolithography and etching techniques to form a stripe-shaped scanning electrode 7.

Next, after coating and baking polyimide or the like on the inner surfaces of both the lower substrate 2 and the upper substrate 3, an alignment process such as a rubbing method is performed to form alignment films 35 and 36, respectively. Next, a spacer 37 for maintaining a cell gap on one of the lower substrate 2 and the upper substrate 3
After printing the resin material to be the sealing material 27,
The lower substrate 2 and the upper substrate 3 are attached to each other,
Is cured to produce an empty cell. In the case of the present embodiment, a conductive material such as metal particles is mixed in a resin material to be the sealing material 27 in order to make the sealing material 27 a vertical conductive portion.

Next, a liquid crystal is injected into the empty cell from a liquid crystal injection port of a sealing material by a vacuum injection method or the like, and the liquid crystal injection port is sealed, whereby a liquid crystal cell is manufactured. Further, after the retardation plate 4 and the polarizing plate 5 are sequentially attached to the outer surface side of the upper substrate 3,
The driving IC 10 is mounted on the outer surface side of the lower substrate 2 in a form such as face-down mounting or face-up mounting. Through the above steps, the liquid crystal display device 1 of the present embodiment is completed.

In the liquid crystal display device 1 of the present embodiment, the signal electrodes 6 on the inner surface of the lower substrate 2
And a driving IC 10 electrically connected to the scanning electrodes 7 on the inner surface of the upper substrate 3 and supplying signals to these electrodes.
Has been implemented. In the conventional configuration, the lead wiring of each electrode is led, for example, to the outside of the display area on the inner surface of the lower substrate, whereas in the configuration of the present embodiment, the lead wiring for the signal electrode is provided. 11, both of the scanning electrode routing wiring 13 are routed from the inner surfaces of the lower substrate 2 and the upper substrate 3 to the outer surface of the lower substrate 2 through the inside of the lower substrate 2.

Therefore, according to the present embodiment, the routing area provided outside the display area on the inner surface of the lower substrate and the mounting area for the FPC and the electronic components in the conventional configuration are not required, and accordingly, it becomes unnecessary. Only the frame can be significantly narrowed compared with the conventional case. Also, a large number of connection wirings can be laid out on the entire outer surface of the lower substrate 2 including the display area 9 and the pitch between the connection wirings can be designed with a margin, so that the drawing resistance is reduced. The problem of increase does not occur.

Further, as in the present embodiment, the lower substrate 2 is not necessarily a transparent substrate as in the case of using polyimide as the material of the lower substrate 2, so that a conventional substrate material for a liquid crystal display device is generally used. In addition to a transparent substrate such as glass or quartz, a resin substrate such as polyimide, a ceramic substrate, or the like can be used, and the degree of freedom in selecting the material of the lower substrate 2 is improved. For example, when a ceramic substrate is used for the lower substrate 2,
Since the rigidity of the lower substrate is improved, the deformation of the substrate is less likely to occur, and a liquid crystal display device having excellent cell gap uniformity and thus excellent display uniformity can be obtained. Further, both the upper and lower substrates may be formed of a flexible substrate such as a plastic film substrate. With this configuration, the liquid crystal display device can be made thinner and lighter, breakage such as breakage of the substrate is less likely to occur, and a curved surface can be displayed by bending the substrate. And the like.

Further, since the external connection terminals 26 are provided at the peripheral portion of the outer surface of the lower substrate 2, when an FPC or the like for supplying a drive signal to the drive IC 10 is further mounted, the external connection terminals 26 are provided. Alignment when connecting the terminals of the FPC and the FPC can be easily performed. Also, FPC
At the time of joining or after joining, stress may be generated in the joined portion. However, if the position is a peripheral portion of the substrate that is out of the display area 9, the stress does not adversely affect the display.

In the case of the present embodiment, since the positions of the through holes 17 and 38 of the lower substrate 2 are arranged outside the sealing material 27, the connection portions 15 and 2 of the through holes 17 and 38 in the holes.
Even if the portion of “0” has a slightly raised shape on the lower substrate 2, the display area 9 inside the sealing material 27 is affected by the influence.
The cell gap does not change, and there is no problem in displaying images.

In the present embodiment, as described above,
Since the signal electrodes 6 and the like on the inner surface of the lower substrate 2 and the various connection wirings and the like on the outer surface are made of the same material such as aluminum,
Although the manufacturing process can be simplified, the signal electrodes 6 and the like on the inner surface of the lower substrate 2 and various connection wirings and the like on the outer surface may be formed of different materials. For example, the signal electrode 6 on the inner surface side
, A metal material such as silver (or an alloy containing silver) or aluminum having a high light reflectance may be used, and a metal material such as copper which is a low-resistance material may be used for the connection wiring on the outer surface side. By doing so, the above advantage of simplifying the manufacturing process cannot be obtained, but the routing resistance can be further reduced.

As for the structure of the lower substrate 2, not only a substrate for forming a conductive layer on the inner and outer surfaces of the substrate and through holes penetrating the substrate to establish conduction of the conductive layer on the inner and outer surfaces but also, for example, as shown in FIG. As described above, a substrate having one or more internal conductive layers 42 inside the lower substrate 2, that is, a substrate such as a so-called multilayer printed wiring board may be used. In this case, the electrical conduction between the inner surface and the outer surface of the lower substrate 2 is performed by connecting the inner connection portion 44 in the via hole 43 that penetrates and conducts between the inner surface of the lower substrate 2 and the internal conductive layer 42. And a connection portion 46 in a via hole 45 that penetrates and conducts between the outer surface of the lower substrate 2 and the internal conductive layer 42 (or penetrates between the internal conductive layers when there are two or more internal conductive layers). The connection is made by a connection portion in a conductive via hole.

If this type of substrate is used as the lower substrate 2, for example, the number of routing wires increases, and it becomes difficult to route a large number of routing wires only on the outer surface of the lower substrate. The wiring of the portion can also be routed via the internal conductive layer. Then, the degree of freedom of routing is improved, so that it is possible to cope with an increase in display capacity.

[Second Embodiment] Hereinafter, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS.

This embodiment is also similar to the first embodiment.
This is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, and is an example of a liquid crystal display device having a display electrode also serving as a light reflection portion, a so-called reflective electrode. First
The difference from the third embodiment is that the upper substrate and the lower substrate have substantially the same shape, and that the positions of the through holes and the positions of the external connection terminals on the lower substrate are different. In the first embodiment, the lower substrate is made larger than the outer shape of the upper substrate, and the through holes are arranged outside the sealing material.
While the external connection terminals are arranged on the outer surface of the lower substrate along the substrate side in a region where the lower substrate extends from the upper substrate, in the present embodiment, the upper substrate and the lower substrate are approximately equal in size. The through-hole is located immediately below the sealing material. That is, the through holes are arranged in the formation region of the sealing material. Further, the external connection terminals are arranged in an area where the upper and lower substrates overlap on the outer surface of the lower substrate.

As described above, since the schematic configuration of the liquid crystal display device of the present embodiment is common to that of the first embodiment, illustration and description of the common configuration will be omitted. FIG. 14 is a view corresponding to FIG. 6 of the first embodiment, and is a perspective view showing a state in which the upper substrate and the lower substrate are superimposed,
14 is a sectional view taken along the line AA 'of FIG. 14, and FIG. 16 is a sectional view taken along the line BB' of FIG. In these drawings, the same components as those in FIGS. 1 to 13 are denoted by the same reference numerals.

[0092] The liquid crystal display device 50 of the present embodiment is similar to that of FIG.
As shown in FIG. 4, a large number of signal electrodes 6 (first conductive portions) are provided on the inner surface of the lower substrate 2 in a stripe shape.
One end of each signal electrode 6 in the length direction (wiring forming direction)
A signal electrode connection wire 18 having a through hole is provided at the center of the land 16 at the tip. On the inner surface of the upper substrate 3 facing this, a number of scanning electrodes 7 (second conductive portions) are provided in a stripe shape in a direction orthogonal to the signal electrodes 6. Then, as shown in FIGS. 15 and 16, the signal electrode lead-out wiring 11 is provided on the outer surface of the lower substrate 2.
One of the signal electrode connection wiring 12 (first external connection part) and the scanning electrode wiring 13 (second wiring conductive part), which constitute a part of the (first wiring conductive part). The scanning electrode connection wirings 14 (the second outer surface connection portions) constituting the units are provided, and are electrically connected to the driving IC 10. Further, on the outer surface of the lower substrate 2, external connection terminals 26, signal input wires 41, and the like are provided. The above configuration is the same as in the first embodiment.

Further, in the case of the first embodiment, since the position of the through hole 38 is located outside the position of the seal member 27 (upper and lower conductive portions), the position of the lower substrate 2 outside the seal member is reduced. On the inner surface, the scanning electrode connection wiring 21 for electrically connecting between the sealing material 27 and the through-hole connection portion 20 in the through hole 38 was formed. On the other hand, in the case of the present embodiment, since the through hole 38 and the sealing material 27 are located at the same position, it corresponds to the scanning electrode connection wiring 21 on the inner surface of the lower substrate 2 in the first embodiment. There is no need for anything. Therefore, in the area where the sealing material 27 is arranged on the inner surface of the lower substrate 2, the rectangular lands 22 of the number corresponding to the number of the respective scanning electrodes 7 on the upper substrate 3 arranged at the position opposed thereto are provided. Is provided. In the center of these lands 22, a through hole 38 penetrating between the inner surface and the outer surface of the lower substrate 2 is formed.

That is, comparing FIG. 6 with FIG. 14 again, in the first embodiment, as shown in FIG. 6, the lands 16 of the signal electrode connection wiring 18 on the inner surface of the lower substrate 2 are formed.
Portion protrudes outside the seal material 27 (outside the upper substrate 3), and the portion of the circular land 23 provided with the through hole 38 at the end of each scanning electrode connection wiring 21 corresponds to the seal material 27. It protrudes outside (outside the upper substrate 3). On the other hand, in the present embodiment, as shown in FIG. 14, the land 16 of each signal electrode connection wiring 18 on the inner surface of the lower substrate 2 is
, And a portion of a rectangular land 22 for vertical conduction provided for each scanning electrode 7 is also located immediately below the sealing material 27. That is, the lands 22 for conducting between the upper and lower substrates, the lands 16 and 23 for conducting from the inner surface to the outer surface of the lower substrate 2, and the through holes 17 and 38 are all disposed in the formation region of the sealing material 27. Have been.

This structure is viewed in a sectional structure as shown in FIGS. That is, when cut in a direction along the signal electrode 6, as shown in FIG. 15, the signal electrode 6 on the inner surface of the lower substrate 2 and the signal electrode connection wiring 18 integrated with the signal electrode 6 are formed, The connection wiring 12 for signal electrodes is formed on the outer surface of the lower substrate 2. Further, through holes 17 penetrating the substrate are formed in the portions of the lands 16 and 24 of the signal electrode connection wirings 18 and 12 immediately below the sealing material 27. The inside of the through hole 17 is filled with a conductive material such as a silver paste, and the conductive material is connected to the signal electrode connection wiring 18 on the inner surface side.
And the connection wiring 12 for signal electrodes on the outer surface side to form an in-hole connection portion 15. The terminal 3 of the driving IC 10 is provided at the end of the outer surface of the lower substrate 2 opposite to the side on which the through hole 17 of the signal electrode connection wiring 12 is provided.
1 is connected. As in the first embodiment, various structures shown in FIGS. 11A, 11B, and 12 can be employed as a specific configuration of the connection portion in the hole.

By adopting the above wiring structure,
The image signal from the driving IC 10 is transmitted through the signal electrode connection wiring 12 on the outer surface of the lower substrate 2, the connection portion 15 in the hole, and the signal electrode connection wiring 18 on the inner surface of the lower substrate 2. It is supplied to the electrode 6. Therefore, the connection wiring 12 for signal electrodes on the outer surface of the lower substrate 2, the connection portion 15 in the hole, and the connection wiring 18 for signal electrodes on the inner surface of the lower substrate 2 constitute the wiring 11 for signal electrodes. become.

On the other hand, when cut in the direction along the scanning electrode 7, the scanning electrode 7 is formed on the inner surface of the upper substrate 3 so as to be in contact with the upper surface of the sealing material 27 as shown in FIG. In addition, on the inner surface of the lower substrate 2, lands 22 for connection with the scanning electrodes 7 are formed so as to be in contact with the lower surface of the sealing material 27 together with a large number of signal electrodes 6. A conductive material such as metal particles is mixed in the sealing material 27, and the scanning electrode 7 and the land 22 that are in contact with the upper surface and the lower surface of the sealing material 27 are electrically connected to each other to form the upper / lower conductive portion 19. are doing.

Further, the land 2 on the inner surface side of the lower substrate 2
2. Land 2 at the end of the scanning electrode connection wiring 14 on the outer surface side
A through hole 38 is formed at a portion 5. The inside of the through hole 38 is filled with a conductive material such as a silver paste, and the conductive material forms the connection portion 20 in the hole, and electrically connects the land 22 on the inner surface and the connection wiring 14 for the scanning electrode on the outer surface. Connected. Further, a terminal 31 of the driving IC 10 is connected to an end of the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2 opposite to a side where the through hole 38 is provided. By adopting the wiring structure as described above, the scanning signal output from the driving IC 10 is connected to the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2 and the in-hole connection portion 2.
0, lands 22 on the inner surface of the lower substrate 2,
Is supplied to each scanning electrode 7 via Therefore, the connection wiring 14 for the scanning electrode on the outer surface of the lower substrate 2, the connecting portion 20 in the hole, the land 22 on the inner surface of the lower substrate 2, and the vertical conducting portion 19 constitute the wiring 13 for the scanning electrode. Will do.

In the case of the present embodiment, the connection wirings 18 for the signal electrodes on the inner surface of the lower substrate 2 as in the first embodiment.
Since the land 16 and the land 22 connected to the scanning electrode 7 do not protrude outside the sealing material 27, the outer shape of the lower substrate 2 and the outer shape of the upper substrate 3 can be made substantially the same. As a result, it is possible to further narrow the frame as compared with the first embodiment.

[Third Embodiment] Hereinafter, a third embodiment of the present invention will be described.
Will be described with reference to FIG. 17 and FIG.

This embodiment is also an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, similarly to the first and second embodiments, and is a display electrode which also serves as a light reflection portion, a so-called display electrode. It is an example of a liquid crystal display device having a reflective electrode. The liquid crystal display device of the present embodiment is an example in which a color filter is provided on the lower substrate to realize a reflective color liquid crystal display device.

The schematic configuration of the liquid crystal display device of this embodiment is common to the first and second embodiments, and illustration and description of the common configuration will be omitted. FIG. 17 is a cross-sectional view corresponding to FIG. 7 (a cross-sectional view taken along line AA ′ in FIG. 6) of the first embodiment, and FIG. 18 is a cross-sectional view of FIG. FIG. 14 is a cross-sectional view corresponding to (a cross-sectional view taken along line B ′). In these drawings, the same components as those in FIGS. 7 and 8 are denoted by the same reference numerals.

In the liquid crystal display device 52 of the present embodiment, as shown in FIGS. 17 and 18, an insulating film 53 is formed over the entire display region so as to cover the signal electrode 6 of the lower substrate 2, and the insulating film 53 is formed. A color filter 54 is formed on the film 53. The color filter 54 includes three color material layers 55 of three colors of red (R), green (G), and blue (B) formed corresponding to each pixel, and a lattice-shaped light shielding made of a metal film, a black resist, or the like. And a film 56 (black matrix). Then, the alignment film 35 is formed on the color filter 54.
Are formed. The electrode configuration such as the signal electrode 6 and the scanning electrode 7 and the wiring configuration such as the signal electrode wiring 11 and the scanning electrode wiring 13 are exactly the same as those in the first embodiment.

In the liquid crystal display of the present embodiment,
Since the color filter 54 is provided on the inner surface of the lower substrate 2, it is possible to reduce the size by using a narrow frame, and to realize a color liquid crystal display device having a high display quality. Suitable for portable electronic devices and the like. Further, in the present embodiment, the color filter is formed on the lower substrate side, but may be formed on the upper substrate side, and the effect thereof is not affected at all.

[Fourth Embodiment] Hereinafter, a fourth embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. 19 and 20.

This embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, as in the first to third embodiments. However, the first to third
Embodiment 1 is an example of a reflective liquid crystal display device having a reflective electrode, whereas the liquid crystal display device of the present embodiment is a reflective liquid crystal device having a reflective layer and a display electrode separately. It is an example of a display device.

Since the overall configuration of the liquid crystal display device of this embodiment is common to the first and second embodiments, illustration and description of the common configuration will be omitted. FIG. 19 is a cross-sectional view corresponding to FIG. 7 (a cross-sectional view taken along line AA ′ in FIG. 6) of the first embodiment, and FIG. 20 is a cross-sectional view of FIG. FIG. 14 is a cross-sectional view corresponding to (a cross-sectional view taken along line B ′). In these drawings, the same components as those in FIGS. 7 and 8 are denoted by the same reference numerals.

In the liquid crystal display device 58 of the present embodiment, as shown in FIGS. 19 and 20, light reflection of aluminum, silver (or an alloy containing silver), or the like is performed over the entire display region on the lower substrate 2. Reflective layer 59 made of high-efficiency metal thin film
Are formed. Then, an insulating film 60 is formed so as to cover the reflective layer 59, and a number of signal electrodes 6 are formed on the insulating film 60 in a stripe shape. Signal electrode 6
Is formed directly on the lower substrate 2 outside the region where the insulating film 60 and the reflective layer 59 are formed. Therefore, the connection structure of the through holes 17 and 38 is completely the same as that of the first embodiment. The same is true.

As shown in FIG. 21, the signal electrode connection wiring 18 is formed at the same time when the reflection layer 59 is formed.
An insulating film 60 is formed on at least the surface of the reflective layer 59 in the display area, a number of signal electrodes 6 are formed on the insulating film 60 in a stripe shape, and the signal electrodes 6 are extended to electrically connect with the signal electrode connection wiring 18. It is good also as a structure made to conduct.

In the case of the present embodiment, the signal electrode 6 does not double as a light reflection layer, and a reflection layer 59 is separately formed below the signal electrode 6. Therefore, at the time of display, light incident from outside of the upper substrate 3 and transmitted through the liquid crystal layer 28 is reflected on the surface of the reflective layer 59 to display an image. The signal electrode 6 to be used must be transparent. Therefore, in the present embodiment, the signal electrode 6 has the same
It is formed of a transparent conductive film such as O. Also, as in the first embodiment, as shown in FIG. 20, on the inner surface of the lower substrate 2, the upper and lower conductive portions 19 of the sealing material 27 and the in-hole connecting portion 20 of the through hole 38 are formed. Is provided, and the scanning electrode connection wiring 21 is made of a metal such as aluminum, silver (or an alloy containing silver), which is the same material as the reflection layer 59. It may be formed of a film, or may be made of the same material as the signal electrode 6.
It may be formed of a transparent conductive film such as TO. In any case, as long as the same material as the reflective layer 59 or the signal electrode 6 is used, the number of manufacturing steps does not increase.

On the other hand, on the outer surface of the lower substrate 2, there are provided signal electrode connection wirings 12, scanning electrode connection wirings 14, signal input wirings, and the like. As in the embodiment, a low-resistance metal material such as copper is used as a wiring material.

Also in the liquid crystal display device 58 of the present embodiment, the through holes 17 and 38 are provided in the lower substrate 2 and the wiring lines 11 and 13 for the signal electrode 6 and the scanning electrode 7 are provided.
The same effect as in the first to third embodiments can be obtained in that the frame can be narrowed by extending the wire to the outer surface side of the lower substrate 2 and mounting the driving IC 10.

Further, in the case of the present embodiment, since the reflection layer 59 and the signal electrode 6 are provided separately, characteristics necessary for the reflection layer and characteristics required for the signal electrode can be considered separately. The degree of freedom in electrode design can be increased. In addition, in the case of the present embodiment, a low-resistance metal material such as copper is used for various connection wirings and the like on the outer surface of the lower substrate 2, so that the manufacturing process is slightly complicated because the material is different from the conductive layer material on the inner surface. In addition, the routing resistance is reduced, and the display quality can be improved.

[Fifth Embodiment] Hereinafter, a fifth embodiment of the present invention will be described.
Will be described with reference to FIG.

In the first to fourth embodiments, examples of the passive matrix type liquid crystal display device have been described. In the present embodiment, however, the present invention is applied to an active matrix type reflection type liquid crystal display device using a TFD as a switching element. The following shows an application example of the present invention. FIG. 22A is a perspective view showing the entire configuration of the liquid crystal display device of the present embodiment, and FIG.
It is an enlarged view of one pixel in (a).

The liquid crystal display device 61 of the present embodiment is similar to that of FIG.
As shown in FIG. 2A, two substrates, that is, an element substrate 62 (first substrate) on which a TFD element is formed and a counter substrate 63 (second substrate) are arranged to face each other. A liquid crystal (not shown) is sealed between them. Although not shown, an alignment film is actually formed on the inner surface of each substrate in contact with the liquid crystal. A large number of data lines 64 (first conductive portions) are provided on the inner surface side of the element substrate 62, and a large number of pixel electrodes 65 are connected to each data line 64 via a TFD element 66. . On the other hand, on the inner surface side of the opposing substrate 63, a number of strip-shaped scanning lines 67 (second conductive portions)
Are formed in a direction crossing the data lines.

On the outer surface of the element substrate 62, connection lines for data lines and connection lines for scanning lines (both not shown) are provided.
Are provided, and a data line driving circuit and a scanning line driving circuit (both not shown) for respectively driving the data line 64 and the scanning line 67 are formed.

As shown in FIG. 22B, the TFD element 66 includes a first conductive film 68 made of, for example, a tantalum film,
An insulating film 69 made of a tantalum oxide film formed on the surface of the first conductive film 68 by anodic oxidation, and a second film made of a metal film of chromium, aluminum, titanium, molybdenum or the like formed on the surface of the insulating film 69. And a conductive film 70. Then, the first conductive film 68 of the TFD element 66
Are connected to the data line 64, and the second conductive film 70 is connected to the pixel electrode 65. In the case of the present embodiment, the pixel electrode 65 is a reflection electrode also serving as a light reflection layer, and is formed of a metal thin film having a high light reflectance such as aluminum. Alternatively, as in the fourth embodiment, the pixel electrode 65 is
A transparent conductive film such as TO may be used, and a reflective layer may be separately formed below the pixel electrode 65. On the other hand, the scanning lines 67 on the inner surface of the counter substrate 63 are formed of a transparent conductive film such as ITO.

The liquid crystal display device 61 of the present embodiment
In the case of (1), one end of each data line 64 on the inner surface of the element substrate 62 is formed in a rectangular shape, and a through hole 71 penetrating the inner surface side and the outer surface side of the element substrate 62 is formed in this portion.
The cross-sectional structure is the same as that in FIGS. 7 and 8 of the first embodiment except that the signal electrode 6 is replaced with the data line 64 of the present embodiment.

That is, the data lines 64 are formed on the inner surface of the element substrate 62, while the connection lines for the data lines are formed on the outer surface of the element substrate 62. A hole 71 is formed. The inside of the through hole 71 is filled with a conductive material such as a silver paste, and the conductive material forms a connection portion in the hole by connecting the data line on the inner surface and the connection wire for the data line on the outer surface. I do. A driving IC is connected to the other end of the data line connection wiring. With the above wiring structure, the image signal output from the driving IC is
The data lines 64 are supplied to the data lines 64 via connection lines for data lines on the outer surface of the element substrate 62 and connection portions in the holes. That is, the connection lines for data lines and the connection portions in the holes on the outer surface of the element substrate 62 constitute the wiring lines for data lines.

On the other hand, on the scanning line 67 side of the counter substrate 63, the scanning line 67 is formed so as to be in contact with the upper surface of the sealing material. A conductive material such as metal particles is mixed in the seal material, and the upper and lower surfaces of the seal material are electrically connected to form a vertical conductive portion. A land and a through hole are formed in a portion corresponding to a lower portion of the upper and lower conductive portions of the element substrate 62. A conductive material such as a silver paste is filled in the through hole, and the conductive material forms a connection portion in the hole. , And the inner and outer scanning line connection wirings are electrically connected. A driving IC is connected to the other end of the scanning line connection wiring on the outer surface of the element substrate. By adopting the wiring structure as described above, the scanning signal output from the driving IC is transmitted to the opposing substrate 63 via the scanning line connection wiring on the outer surface of the element substrate 62, the connection portion in the hole, and the vertical conduction portion.
It is supplied to each scanning line 67 above. In other words, the connection lines for the scanning lines, the connection portions in the holes, and the upper and lower conductive portions on the outer surface of the element substrate 62 constitute the wiring lines for the scanning lines.

This embodiment is an example of an active matrix type liquid crystal display device using a TFD element. In this case, too, the same as the example of the passive matrix type liquid crystal display device of the first to fourth embodiments is used. The effect can be obtained. In other words, there is no need for a space for laying out the wiring outside the display area on the inner surface of the element substrate 62.
A region for forming a data line driving circuit, a scanning line driving circuit, and the like necessary for an active matrix liquid crystal display device is formed on the element substrate 62
Can be arranged on the outer surface side, so that the frame can be significantly narrowed. Further, since the entire area on the outer surface side of the element substrate 62 can be used as a space for the wiring, a sufficient wiring pitch can be secured, and the wiring resistance does not increase.

[Sixth Embodiment] Hereinafter, a sixth embodiment of the present invention will be described.
The embodiment will be described with reference to FIG.

In this embodiment, an application example of the present invention to an active matrix type reflection type liquid crystal display device using a TFT as a switching element will be described. FIG. 23A is a perspective view showing the overall configuration of the liquid crystal display device of the present embodiment, and FIG. 23B is an enlarged view of one pixel in FIG.

The liquid crystal display device 73 of the present embodiment is similar to that of FIG.
As shown in FIG. 3A, the TFD type liquid crystal display device has a configuration substantially similar to that of the fifth embodiment. That is,
An element substrate 74 (first substrate) on the side on which the TFT element is formed and a counter substrate 75 (second substrate) are arranged to face each other,
Liquid crystal (not shown) is sealed between these substrates. On the inner surface side of the element substrate 74, a large number of source lines 76 (data lines, first conductive parts) and a large number of gate lines 77 (scanning lines, first conductive parts) are provided in a grid pattern so as to intersect each other. Have been. A TFT element 78 is formed near the intersection of each source line 76 and each gate line 77,
The pixel electrode 79 is connected via the T element 78. On the other hand, a common electrode 80 (second conductive portion) is formed on the entire inner surface of the counter substrate 75 so as to correspond to the display area.

On the outer surface of the element substrate 74, source line connection lines and gate line connection lines (both not shown).
Are provided, and a source line driving circuit and a gate line driving circuit (both not shown) for driving the source line 76 and the gate line 77 respectively are formed.

As shown in FIG. 23B, the TFT element 78 includes a gate electrode 81 extending from the gate line 77, an insulating film (not shown) covering the gate electrode 81, and a polycrystalline film formed on the insulating film. A semiconductor layer 82 made of silicon, amorphous silicon, or the like; a source electrode 83 extending from a source line 76 connected to a source region in the semiconductor layer 82; and a drain electrode 8 connected to a drain region in the semiconductor layer 82
And 4. The drain electrode 84 of the TFT element 78 is connected to the pixel electrode 79. In the present embodiment, as in the fifth embodiment, the pixel electrode 79 is a reflection electrode also serving as a light reflection layer, and is formed of a metal thin film having a high light reflectance such as aluminum. Alternatively, as in the fourth embodiment, the pixel electrode 79 may be formed of a transparent conductive film such as ITO, and the reflection layer may be separately formed below the pixel electrode 79. On the other hand, the common electrode 80 on the counter substrate 75 side is formed of a transparent conductive film such as ITO.

The liquid crystal display device 73 of the present embodiment
In the case of (1), one end of each source line 76 on the inner surface of the element substrate 74 is formed in a rectangular shape, and a through hole 85 penetrating through the inner surface and the outer surface of the element substrate 74 is formed in this portion.
Similarly, one end of each gate line 77 is also formed in a rectangular shape, and a through hole 86 penetrating through the inner side and the outer side of the element substrate 74 is formed in this portion. Through holes 85, 8
The cross-sectional structure of the portion 6 is similar to that of the first embodiment shown in FIGS. 7 and 8 except that the signal electrode 6 is connected to the source line 7 of the present embodiment.
6 or a gate line 77.

That is, the source lines 76 are formed on the inner surface of the element substrate 74, while the connection lines for source lines are formed on the outer surface of the element substrate 74, and the through-holes penetrating the substrate are formed at the ends of both lines. A hole 85 is formed. The inside of the through hole 85 is filled with a conductive material such as a silver paste, and the conductive material is filled with the source line 76 on the inner surface side.
And a connection line for a source line on the outer surface side to form a connection portion in the hole. A driving IC is connected to the other end of the source line connection wiring. With the above-described wiring structure, the image signal output from the driving IC is supplied to each source line 76 via the connection wiring for the source line on the outer surface of the element substrate 74 and the connection portion in the hole. You. Therefore, the connection wiring for the source line and the connection part in the hole on the outer surface of the element substrate 74 constitute the wiring for the source line.

The gate line side has the same wiring structure, and the scanning signal output from the driving IC is applied to the element substrate 7.
4 is supplied to each gate line 77 via the gate line connection wiring on the outer surface and the connection portion in the hole. Therefore, the connection wiring for the gate line and the connection portion in the hole on the outer surface of the element substrate 74 constitute the wiring for the gate line.

On the other hand, the common electrode 80 of the counter substrate 75 is formed so that a part of the common electrode 80 contacts the upper surface of the sealing material. A conductive material such as metal particles is mixed in the seal material, and the upper and lower surfaces of the seal material are electrically connected to form a vertical conductive portion. Element substrate 74
A land and a through hole are formed in a portion corresponding to a lower portion of the upper and lower conductive portions of the conductive material, such as a silver paste, and the inside of the through hole is filled with the conductive material. The connection wiring for the common electrode on the outer surface side is electrically connected. The connection wiring for the common electrode is grounded at an arbitrary position on the outer surface side of the element substrate 74.

This embodiment is an example of an active matrix type liquid crystal display device using TFT elements. In this case, the same effects as those of the active matrix type liquid crystal display device of the fifth embodiment can be obtained. be able to. In other words, there is no need for a space for laying out the wiring outside the display area on the inner surface of the element substrate 74, and the drive circuit formation areas such as the source line drive circuit and the gate line drive circuit required for the TFT active matrix type liquid crystal display device are eliminated. Since it can be arranged on the outer surface side of the element substrate 74, the frame can be significantly narrowed. Further, since the entire area on the outer surface side of the element substrate 74 can be used as a space for wiring, a sufficient wiring pitch can be secured, and the wiring resistance does not increase.

[Electronic Apparatus] An example of an electronic apparatus including the liquid crystal display device of the above embodiment will be described. FIG.
It is the perspective view which showed an example of the mobile telephone. In FIG. 24, reference numeral 1000 denotes a mobile phone main body, and reference numeral 1001
Denotes a liquid crystal display unit using the above liquid crystal display device.

FIG. 25 is a perspective view showing an example of a wristwatch-type electronic device. In FIG. 25, reference numeral 1100 denotes a watch main body, and reference numeral 1101 denotes a liquid crystal display unit using the above liquid crystal display device.

FIG. 26 is a perspective view showing an example of a portable information processing device such as a word processor or a personal computer. 26, reference numeral 1200 denotes an information processing device, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing device main body, and reference numeral 1206 denotes a liquid crystal display unit using the above liquid crystal display device.

Since the electronic apparatus shown in FIGS. 24 to 26 includes the liquid crystal display portion using the liquid crystal display device of the above embodiment, the entire device is provided with a small liquid crystal panel with a narrow frame. An electronic device with a wide display area and excellent portability can be realized in spite of its small size.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the first and second embodiments, examples in which the positions of the through holes are different in a passive matrix type liquid crystal display device having a reflective electrode, and in the third embodiment, examples of a liquid crystal display device having a color filter, In the fourth embodiment, an example of a liquid crystal display device having a reflective layer and a display electrode separately,
In the fifth embodiment, an example of a TFD active matrix type liquid crystal display device is described, and in the sixth embodiment, an example of a TFT active matrix type liquid crystal display device is described. The features of these embodiments are appropriately combined. It may be something.

Further, it is needless to say that specific descriptions such as constituent materials, shapes, and manufacturing methods of the respective liquid crystal display devices exemplified in the above embodiments can be appropriately changed. Also,
The liquid crystal device of the present invention can be applied to a liquid crystal light valve of a projection type liquid crystal device (projector) as well as a direct view type.

[0139]

As described above in detail, according to the structure of the liquid crystal device of the present invention, the wiring area and the mounting area for FPCs, electronic components, etc., which have conventionally been provided outside the display area on the inner surface of the substrate, are reduced. Since it becomes unnecessary, the frame portion can be made much narrower than before. In addition, the conductive portions can be laid out over the entire outer surface side of the first substrate including the display region, and the pitch between the conductive portions can be designed with a margin, and the resistance of the wiring can be reduced. The problem of increase does not occur. Further, the degree of freedom in selecting a substrate material is improved, and at the same time, one of the substrates also functions as a mounting substrate for a driving circuit, so that the number of connection components can be reduced. As described above, by providing a small liquid crystal device with a narrow frame, an electronic device with a wide display area and excellent portability can be realized despite the small size of the entire device.

[Brief description of the drawings]

FIG. 1 is a perspective view of an entire liquid crystal display device according to a first embodiment of the present invention as viewed from above.

FIG. 2 is a perspective view of the same liquid crystal display device as viewed from below.

FIG. 3 is a top view (electrode formation surface) of a lower substrate constituting the liquid crystal display device.

FIG. 4 is a bottom view of the lower substrate.

FIG. 5 is a bottom view (electrode formation surface) of the upper substrate constituting the liquid crystal display device.

FIG. 6 is a perspective view showing a state where the upper substrate and the lower substrate are overlapped with each other.

FIG. 7 is a diagram showing a cross-sectional structure of the liquid crystal display device, which is a cross-sectional view taken along line AA ′ of FIG. 6;

FIG. 8 is a sectional view taken along the line B-B ′ of FIG. 6;

FIG. 9 is a cross-sectional view showing another example of the upper and lower conductive portion of the liquid crystal display device.

FIG. 10 is a cross-sectional view showing another example of the mounting form of the driving IC of the liquid crystal display device.

FIG. 11 is a view showing an example of a connection portion in a hole of the lower substrate.

FIG. 12 is a view showing another example of the in-hole connecting portion.

FIG. 13 is a view showing still another example of the in-hole connecting portion.

FIG. 14 is a perspective view showing a state in which an upper substrate and a lower substrate are overlapped in the liquid crystal display device according to the second embodiment of the present invention.

15 is a diagram showing a cross-sectional structure of the same liquid crystal display device, which is a cross-sectional view taken along line AA ′ of FIG. 14;

FIG. 16 is a sectional view taken along the line BB ′ of FIG. 14;

FIG. 17 is a view showing a cross-sectional structure of a liquid crystal display device according to a third embodiment of the present invention, and is a cross-sectional view corresponding to line AA ′ of FIG.

18 is a view showing a cross-sectional structure of the same liquid crystal display device, and is a cross-sectional view corresponding to line BB ′ of FIG. 6;

FIG. 19 is a diagram illustrating a cross-sectional structure of a liquid crystal display device according to a fourth embodiment of the present invention, and is a cross-sectional view corresponding to line AA ′ in FIG.

20 is a diagram showing a cross-sectional structure of the liquid crystal display device, which is a cross-sectional view corresponding to line BB ′ of FIG. 6;

21 shows another example of the connection structure between the signal electrode and the connection wiring for the signal electrode in the embodiment,
It is sectional drawing corresponding to A 'line.

FIGS. 22A and 22B are diagrams illustrating a liquid crystal display device according to a fifth embodiment of the present invention, in which FIG. 22A is a perspective view of the whole when viewed from the top, and FIG.

FIGS. 23A and 23B are views showing a liquid crystal display device according to a sixth embodiment of the present invention, wherein FIG. 23A is a perspective view of the whole as viewed from the top, and FIG. 23B is an enlarged view of one pixel.

FIG. 24 is a perspective view illustrating an example of an electronic apparatus of the invention.

FIG. 25 is a perspective view illustrating another example of the electronic apparatus of the invention.

FIG. 26 is a perspective view showing still another example of the electronic apparatus of the invention.

FIG. 27 is a perspective view showing an example of a conventional liquid crystal device to which COF mounting is applied.

FIG. 28 is a perspective view showing an example of a conventional liquid crystal device to which COG mounting is applied.

FIG. 29 is a plan view showing a configuration of an upper substrate in a conventional passive matrix liquid crystal device.

FIG. 30 is a plan view showing the configuration of the lower substrate.

[Explanation of symbols]

1, 50, 52, 58, 61, 73 Liquid crystal display device (liquid crystal device) 2 Lower substrate (first substrate) 3 Upper substrate (second substrate) 5 Polarizing plate (polarizing means) 6 Signal electrode (first 7 Scanning electrode (second conductive part) 10, 32 Driving IC (electronic component) 11 Signal electrode wiring (first wiring conductive part) 12 Signal electrode connection wiring (first Connection portion on outer surface 13 Leading wiring for scanning electrode (second leading conductive portion) 14 Connection wiring for scanning electrode (second connecting portion on outer surface) 15, 30, 44, 46 Connection portion in hole (first) 17, 38 Through hole 18 Connection wiring for signal electrode 19, 40 Upper and lower conduction part (connection part between substrates) 20 Connection part in hole (second connection part in hole) 21 Connection wiring for scanning electrode ( (Second inner surface connection part) 26 External connection terminal 27 Sealing material 28 Liquid Layer 42 Internal conductive layer 43, 45 Via hole 54 Color filter 59 Reflective layer 62, 74 Element substrate (first substrate) 63, 75 Counter substrate (second substrate) 64 Data line (first conductive part) 66 TFD element 67 scanning line (second conductive part) 76 source line (data line, first conductive part) 77 gate line (scanning line, first conductive part) 78 TFT element 80 common electrode (second conductive part)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoichi Momose 3-5-5 Yamato, Suwa-shi, Nagano Inside Seiko Epson Corporation (72) Inventor Takaaki Tanaka 3-5-5 Yamato, Suwa-shi, Nagano Seiko-Epson (72) Inventor Kenichi Honda 3-3-5 Yamato, Suwa City, Nagano Prefecture Seiko Epson Corporation F-term (reference) 2H090 JA05 LA01 LA02 LA04 LA06 LA09 LA15 LA20 2H091 FA02Y FA07X FA07Z FA11X FA11Z FA14Z FC06 GA01 GA02 GA08 GA11 GA13 LA11 LA30 2H092 GA05 GA32 GA33 GA39 GA48 GA49 GA50 GA60 JA01 JA24 JA46 JB22 MA15 MA17 MA30 NA25 PA01 PA03 PA06 PA08 PA10 PA11 PA12

Claims (19)

[Claims] 1. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates disposed to face each other, wherein a first substrate of the pair of substrates has a first surface on an inner surface facing the liquid crystal layer. A first conductive portion electrically connected to the first conductive portion, and a first conductive portion electrically connected to the first conductive portion is provided from the inner surface through the inside of the substrate to an outer surface opposite to the inner surface, and In the second substrate having the property, a second conductive portion is provided on an inner surface facing the liquid crystal layer, and a second routing conductive portion electrically connected to the second conductive portion is provided with the second conductive portion. A light reflecting portion is provided from the inner surface of the second substrate to the inner surface of the first substrate, further from the inner surface of the first substrate to the inner surface of the first substrate through the inside of the substrate, and to the inner surface of the first substrate. And a polarized light on the outer surface side of the second substrate. A step is provided, and electronic components electrically connected to the first routing conductive portion and the second routing conductive portion are mounted on an outer surface side of the first substrate. Liquid crystal devices. 2. The liquid crystal device according to claim 1, wherein an external connection terminal electrically connected to an input terminal of the electronic component is provided on an outer peripheral edge of the first substrate. 3. The first conductive portion provided in the first substrate is provided inside a hole provided between an inner surface side and an outer surface side of the first substrate. A first in-hole connection portion electrically connected to the first substrate, and a first on-outside connection for electrically connecting the first in-hole connection portion and the electronic component on an outer surface of the first substrate. The liquid crystal device according to claim 1, further comprising a unit. 4. The liquid crystal device according to claim 3, wherein the hole is a through hole penetrating through the inner surface and the outer surface of the first substrate. 5. The liquid crystal device according to claim 1, wherein the first substrate is a substrate having one or more internal conductive layers inside the substrate. 6. The hole is formed between an inner surface of the first substrate and the inner conductive layer, between an outer surface of the first substrate and the inner conductive layer, or between mutual inner conductive layers. 6. The semiconductor device according to claim 5, comprising a plurality of via holes provided.
3. The liquid crystal device according to claim 1. 7. The first substrate according to claim 3, wherein the first conductive portion on the inner surface and the first connection portion on the outer surface on the outer surface are made of the same conductive material. 7. The liquid crystal device according to claim 6. 8. The first substrate according to claim 3, wherein the first conductive portion on the inner surface and the first connection portion on the outer surface on the outer surface are made of different conductive materials. 7. The liquid crystal device according to claim 6. 9. The second routing conductive part extending from the second substrate to the first substrate is provided between the first substrate and the second substrate, and the second conductive part is provided between the first substrate and the second substrate. An electrically connected inter-substrate connection portion, and a second inter-substrate connection portion provided inside a hole provided between an inner surface side and an outer surface side of the first substrate and electrically connected to the inter-substrate connection portion. And a second external connection portion for electrically connecting the second internal connection portion and the electronic component on the outer surface of the first substrate. The liquid crystal device according to claim 1. 10. The liquid crystal device according to claim 9, wherein the inter-substrate connecting portion is made of a conductive material mixed in a sealing material for sealing the liquid crystal layer between the two substrates. 11. A second on-inner connection portion for electrically connecting between the inter-substrate connection portion and the second in-hole connection portion is provided on an inner surface of the first substrate. The liquid crystal device according to claim 9, wherein: 12. The liquid crystal device according to claim 11, wherein, in the first substrate, the second connection portion on the inner surface and the first conductive portion are made of the same conductive material. 13. The liquid crystal device according to claim 1, wherein the first substrate and / or the second substrate is formed of a flexible substrate. 14. The first conductive portion on the first substrate is a plurality of electrodes formed in a stripe shape, and the second conductive portion on the second substrate is arranged in a direction crossing the electrodes. A plurality of electrodes formed in a stripe shape so as to extend,
14. The liquid crystal device according to claim 1, wherein the liquid crystal device constitutes a passive matrix type liquid crystal device. 15. A first conductive portion on the first substrate is a plurality of data lines or scanning lines, and a second conductive portion on the second substrate crosses the data lines or scanning lines. 14. An active matrix type liquid crystal device comprising a plurality of scanning lines or data lines formed in a stripe shape so as to extend in a direction, and using a thin film diode as a switching element. The liquid crystal device according to claim 1. 16. The first conductive portion on the first substrate is at least one of a plurality of data lines or scanning lines, and the second conductive portion on the second substrate is a single common electrode. 14. The liquid crystal device according to claim 1, wherein an active matrix type liquid crystal device using a thin film transistor as a switching element is configured. 17. The light-emitting device according to claim 17, wherein the first conductive portion on the first substrate is formed of a material having light reflectivity, and the first conductive portion is a reflection electrode also serving as the light reflection portion. The liquid crystal device according to claim 14. 18. The liquid crystal device according to claim 1, wherein a color filter is provided on an inner surface of the first substrate or the second substrate. 19. An electronic apparatus comprising the liquid crystal device according to claim 1. Description: