JP2002304902A - Light source device - Google Patents

Abstract

(57) [Summary] To provide a light source device in which LEDs can be replaced. A light emitting diode element module (LED module) 3 in which a plurality of light emitting diode elements 2 are arranged on one surface of a printed circuit board 1 is provided.
As the light emitting diode element 2, a bare chip that emits white light is used. Electronic components (not shown) such as transistors and resistors for controlling the current flowing through the light emitting diode element 2 are mounted on the substrate 1. In addition, the light source device is provided with a board-side connection portion 5 that is detachably connected to a power-supply-side connection portion (not shown) that supplies power to the LED module 3 and is electrically connected to the light-emitting diode element 2. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device using a light emitting diode.

[0002]

2. Description of the Related Art Conventionally, a light source device using a light emitting diode (hereinafter, referred to as an LED) has been provided as a light source device that can be downsized and have a long life. This type of conventional light source device mainly includes a lighting device intended for auxiliary lighting (for example, a foot light or the like) using an orange LED or a red LED.
It is used as an indicator light using ED.

In recent years, blue LEDs and white LEDs have been developed.
EDs have been put into practical use, and white light can be obtained by LEDs, and LEDs have also been used for spot lighting and the like.

[0004]

In order to obtain a high light output from a white LED currently in practical use, the temperature of the white LED becomes too high and the white LED becomes too hot.
However, there is a problem that the resin covering the bare chip is rapidly deteriorated and the light output is reduced. However, a lighting device using a conventional white LED has a disadvantage that the lighting device must be replaced when the light output is reduced. That is, in the lighting fixture using the white LED, at present, only the member provided with the white LED cannot be replaced.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light source device capable of replacing a light emitting diode.

[0006]

According to a first aspect of the present invention, there is provided a light emitting diode module having a plurality of light emitting diode elements mounted on a substrate, and a power supply for supplying power to the light emitting diode element module. And a substrate-side connection portion detachably connected to the side connection portion and electrically connected to the light-emitting diode element. The provision of the board-side connection portion which is detachably connected and which is electrically connected to the light emitting diode element allows the light emitting diode element to be replaced by replacing the light emitting diode element module.

According to a second aspect of the present invention, in the first aspect of the present invention, the board-side connecting portion is a connecting pin protruding from the board, and the power-supply-side connecting portion is a plug into which the pin is inserted. A hole is formed in the body, and the board-side connection portion is electrically connected by inserting a pin into the insertion hole, so that by removing the pin from the insertion hole, the board-side connection portion is connected to the power supply. The light emitting diode can be electrically insulated from the side connection portion, and the board side connection portion can be electrically and mechanically connected to the power supply side connection portion by inserting a pin into the insertion hole. The replacement work of the element module is easy.

According to a third aspect of the present invention, in the first aspect of the present invention, the board-side connecting portion is a connecting pin protruding from the board, and the power-supply-side connecting portion is an insertion into which the pin is inserted. A hole is formed in the body, and the board-side connection portion is electrically connected by rotating or moving the board-side connection portion to a predetermined position after inserting the pin into the insertion hole. It is possible to prevent the board side connection portion from coming off from the power supply side connection portion due to vibration, impact, or the like in a state where the board side connection portion is connected to the side connection portion.

According to a fourth aspect of the present invention, in the first aspect of the present invention, a recess is formed in at least one of the substrate-side connection portion and the power supply-side connection portion, and the other body is fitted in the recess. The substrate-side connection portion and the power supply-side connection portion are electrically connected to each other by fitting the protrusion into the recess. Therefore, the substrate is removed by removing the protrusion from the recess. Connecting the substrate-side connection with the power-supply-side connection by electrically connecting the substrate-side connection with the power-supply-side connection by fitting the protrusion into the recess. Therefore, the replacement work of the light emitting diode element module is easy.

According to a fifth aspect of the present invention, in the first aspect, a male screw portion is formed on at least one of the board side connection portion and the power supply side connection portion, and a female screw portion is formed on the other body portion. Since the board side connection part and the power supply side connection part are electrically connected by screwing a male screw part into a female screw part, a mechanical connection between the board side connection part and the power supply side connection part is made. The connection strength can be increased, and it is possible to prevent the board-side connection portion from coming off from the power-side connection portion due to vibration or impact in a state where the board-side connection portion is connected to the power-side connection portion. Becomes

According to a sixth aspect of the present invention, in the first aspect of the present invention, the board-side connection portion is a power supply hole penetrating through the board, and the power supply-side connection portion is inserted into the power supply hole. Since the board-side connection portion is electrically connected by inserting the pin into the power supply hole, the board-side connection portion is inserted and removed by inserting the pin into the power supply hole. Is attached to and detached from the power supply side connection part, the replacement work of the light emitting diode element module is easy, and since there is no need to mount another member on the board as the board side connection part, The number of parts can be reduced.

According to a seventh aspect of the present invention, in the first aspect, the power supply side connection portion has an electrode, and the substrate side connection portion comprises a connection piece made of a conductive material elastically contacting the electrode. Since the power supply side connection portion and the substrate side connection portion are electrically connected by elastically contacting the piece with the electrode,
The power supply side connection portion and the board side connection portion can be reliably connected.

According to an eighth aspect of the present invention, in the first aspect, the light emitting diode element module includes an electronic component in addition to the light emitting diode element, and the electronic component is mounted on a different mounting surface from the light emitting diode element. Since the electronic component is mounted on a different mounting surface from the light emitting diode element, the temperature increase of the light emitting diode element due to the influence of the electronic component can be suppressed. A decrease in output can be suppressed, and as a result, the life of the light emitting diode element module can be extended.

According to a ninth aspect of the present invention, in accordance with the eighth aspect of the present invention, since the electronic component is covered with a heat-radiating resin, the heat-radiating area is increased and the heat generated by the electronic component is reduced by the heat-radiating resin. Therefore, the temperature rise of the light emitting diode due to the influence of the electronic component can be further suppressed, and as a result, the life of the light emitting diode element module can be extended.

According to a tenth aspect of the present invention, in the first or the eighth aspect of the present invention, since the heat radiating plate for radiating the heat of the substrate is provided on the substrate, the heat of the substrate is transmitted through the heat radiating plate. As a result, the heat is efficiently dissipated, the temperature rise of the light emitting diode element can be suppressed, and the decrease in the light output of the light emitting diode element can be suppressed. As a result, the life of the light emitting diode element module can be extended. .

According to an eleventh aspect of the present invention, in the first or the eighth aspect of the present invention, the substrate is provided with a cooling device for radiating heat of the substrate. As a result, the temperature rise of the light emitting diode can be suppressed, and the light output of the light emitting diode element can be suppressed from lowering. As a result, the life of the light emitting diode element module can be extended.

According to a twelfth aspect of the present invention, in the first or the eighth aspect of the present invention, a cooling device for radiating heat of the substrate is provided near the substrate, so that the heat of the substrate is reduced by the cooling device. Will be dissipated more efficiently,
A rise in the temperature of the light emitting diode can be suppressed, and a decrease in the light output of the light emitting diode element can be suppressed. As a result, the life of the light emitting diode element module can be extended.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) First, the basic configuration of a light source device according to the present embodiment will be described with reference to FIGS. 1 and 2, and then FIG. It will be described with reference to FIG.

The light source device of the present embodiment is shown in FIGS.
As shown in FIG. 1, a light emitting diode element module (hereinafter, referred to as an LED module) 3 in which a plurality of light emitting diode elements 2 are arranged on one surface of a printed circuit board 1
It has. As the light emitting diode element 2, a bare LED chip that emits white light is used. Also, substrate 1
The electronic component 4 (see FIG. 2) such as a transistor and a resistor for controlling a current flowing through the light emitting diode element 2 (for example, making the current constant). The light-emitting diode element 2 is not limited to a bare chip, but may be a light-emitting diode element with a lens.
Light emitting in other colors (for example, red, blue, green, etc.) may be used.

By the way, the light source device of this embodiment is an LE
A power supply side connection portion 6 described later for supplying power to the D module 3
(See FIG. 3). A board-side connection portion 5 is provided, which is detachably connected to the light-emitting diode element 2 (see FIG. 3).

Illustrating a lighting device using the above-described LED module 3, the LED module 3 is a device main body 1 having one surface (the lower surface in FIG. 3) open as shown in FIG.
0, and power is supplied through a power supply side connection portion 6 provided in the instrument body 10. LED module 3
A lens body 30 provided with a lens 31 for controlling the light distribution of light from each light emitting diode element 2 at a position corresponding to the light emitting diode element 2 is provided on the front side (the mounting surface side of the light emitting diode element 2 on the substrate 1). Will be arranged. Lens body 30
Is a front cover 2 having an opening window 20a formed in the center of the front surface.
0 is fixed to the device main body 10 by being connected thereto. The appliance body 10 converts, for example, the power supplied via the power supply line 12 into a predetermined power and outputs the LED via the power supply side connection portion 6.
A power supply circuit for supplying power to the module 3 is housed therein, and is configured to be mounted on a ceiling or the like.

In the light source device of this embodiment, as shown in FIG. 4, the light emitting diode element 2 and the electronic component 4 are mounted on the same surface of the substrate 1, and the mounting of the light emitting diode element 2 and the electronic component 4 is performed. The board-side connection part 5 is provided on the surface opposite to the surface. The board side connection part 5 is composed of two connection pins 5 a and 5 b projecting vertically from the mounting surface of the board 1.
a, 5b are inserted into the insertion holes 61a, 61b, and the pins 5a, 5b are respectively inserted into the insertion holes 61a, 6b.
1b, the board side connection part 5 and the power supply side connection part 6 are electrically connected. Here, the power supply side connection portion 6 can hold the pins 5a and 5b,
The D module 3 can be held. The pins 5a and 5b are provided at a predetermined pitch in the center of the substrate 1, and the pitch of the pins 5a and 5b and the insertion holes 61a and 6b
The pitch of 1b is set equal.

However, in the light source device of this embodiment, L
The provision of the board-side connection section 5 which is detachably connected to the power supply-side connection section 6 for supplying power to the ED module 3 and which is electrically connected to the light-emitting diode element 2 enables the L
By replacing the ED module 3, the light emitting diode element 2 can be replaced. Therefore, when the luminous flux is reduced due to the deterioration of the light emitting diode element 2 with time, it is only necessary to replace the LED module 3 instead of replacing the lighting fixture. In this embodiment,
By pulling out the pins 5a and 5b from the insertion holes 61a and 61b, the board side connection portion 5 can be electrically insulated from the power supply side connection portion 6, and the pins 5a and 5b can be connected to the insertion holes 61a and 61b.
b, the board-side connection part 5 can be electrically and mechanically connected to the power-supply-side connection part 6.
The replacement work of the LED module 3 is easy.

(Embodiment 2) The basic configuration of the light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG.
Is formed on the peripheral portion of the. The power supply side connection portion 6 includes a container body 62 having an insertion hole 62a into which the pin 5a is inserted, and an insertion hole 63 into which the pin 5b is inserted.
a is formed, and a pin 5 is formed.
By inserting a and 5b into the insertion holes 62a and 63a, the board side connection part 5 and the power supply side connection part 6 are electrically connected. The shape of the substrate 1 is a disk shape, and the pins 5a,
5b are spaced apart in the radial direction, so that the pins 5a,
By inserting the 5b into the insertion holes 62a and 63a, the LED module 3 can be stably held by the power supply side connection portion 6. Since other configurations are the same as those of the first embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

(Embodiment 3) The basic configuration of the light source device of this embodiment is substantially the same as that of Embodiment 1,
6 in that the pins 5a and 5b are protruded along the mounting surface of the substrate 1 as shown in FIG. 6 (note that only the pins 5a are shown in FIG. 6 and the pins 5b are not shown). ). Therefore, the projection directions of the pins 5a and 5b with respect to the LED module 3 are different from those of the first embodiment. Since the configuration is the same as that of the first embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

(Embodiment 4) The basic configuration of the light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. 7, the lengths of the pins 5a and 5b constituting the board side connection portion 5 Are different. In this embodiment,
A recess 61c is provided on the surface of the body 61 of the power supply side connection portion 6 facing the substrate 1, and an insertion hole 61a into which the long pin 5a is inserted is formed on the bottom surface of the recess 61c. An insertion hole 61b into which the short pin 5b is inserted is formed in a portion other than the recess 61c. However, each insertion hole 61a,
By setting the distance to the bottom of 61b to the same size,
The depth of the insertion hole 61a is smaller than the depth of the insertion hole 61b. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the shorter pin 5b is used.
Is set to be shorter than the depth of the recess 61c, so that the shorter pin 5b is inserted into the insertion hole 61a even if the pins 5a and 5b have polarity. Erroneous connection can be prevented.

(Embodiment 5) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 4, and as shown in FIG.
Is formed on the peripheral portion of the. The power supply side connection portion 6 includes a container body 62 having an insertion hole 62a into which the pin 5a is inserted and connected, and a container body 63 having an insertion hole 63a into which the pin 5b is inserted and connected. It is composed of Here, a concave portion 62b is formed on the surface of the body 62 facing the substrate 1.
Are formed, and the insertion hole 62a is formed on the bottom surface of the recess 62b. The shape of the substrate 1 is disk-shaped, and the pins 5a and 5b are arranged apart from each other in the radial direction. Therefore, the pins 5a and 5b are inserted into the insertion holes 62a and 63a to connect to the power supply side. The LED module 3 can be stably held by the unit 6. Note that the same components as those in the fourth embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, similarly to the fourth embodiment, the length of the shorter pin 5b is changed to the length of the recess 62b.
Is set to be shorter than the depth dimension of the pin 5a, by disposing the body 62 and the body 63 on the same surface.
Even if the pin 5b has a polarity, it is possible to prevent an erroneous connection in which the shorter pin 5b is inserted into the insertion hole 62a.

(Embodiment 6) The basic configuration of the light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. 9, the thickness of the pins 5a and 5b constituting the board side connection portion 5 (Outer diameter) is different. In the present embodiment, the inside diameters of the insertion holes 61a and 61b formed in the body 61 of the power supply side connection portion 6 are set according to the outside diameters of the pins 5a and 5b, respectively. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, the outer diameter of the pin 5b having a large outer diameter is set to be larger than the inner diameter of the insertion hole 61a having a small inner diameter. A large diameter pin 5b is inserted into a small inner diameter insertion hole 61a.
It is possible to prevent an erroneous connection, such as being inserted into the device.

(Embodiment 7) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 6, and as shown in FIG. Is formed on the peripheral portion of the. The power supply side connection portion 6 includes a body 62 having an insertion hole 62a into which the pin 5a is inserted, and the insertion hole 6 into which the pin 5b is inserted.
3a is formed. In addition,
The shape of the substrate 1 is disk-shaped, and the pins 5a and 5b are arranged apart from each other in the radial direction. Therefore, the pins 5a and 5b are inserted into the insertion holes 62a and 63a, so that the power supply side connection portion 6 is formed.
Thus, the LED module 3 can be stably held. The same components as those in the sixth embodiment are denoted by the same reference numerals, and description thereof is omitted.

In this embodiment, similarly to the sixth embodiment, the outer diameter of the pin 5b having the larger outer diameter is set to be larger than the inner diameter of the insertion hole 62a having the smaller inner diameter. Erroneous connection in which the larger pin 5b is inserted into the insertion hole 62a can be prevented.

(Eighth Embodiment) The basic configuration of a light source device of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 11, the tips of the pins 5a and 5b constituting the board-side connection portion 5. Are formed with hooking claws 5c, 5d.
After the substrate 1 is inserted into the insertion holes 61a and 61b, which are insertion holes, the board 1 is rotated to a predetermined position (that is, rotated by a predetermined angle) to thereby engage the hooks 5 of the pins 5a and 5b.
The difference is that c and 5d are locked by the hooking grooves 61d and 61e to prevent them from coming off, and that the board side connection part 5 and the power supply side connection part 6 are electrically connected. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the pins 5a, 5a
By inserting the b into the insertion holes 61a and 61b and then rotating the board 1 to a predetermined position, the pins 5a and 5b are electrically and mechanically connected. In the connected state, it is possible to prevent the board-side connection section 5 from coming off the power-supply-side connection section 6 due to vibration, impact, or the like.

In the present embodiment, the pins 5a and 5b are inserted into the insertion holes 61a and 61b and then rotated to a predetermined position, so that the board-side connecting portion 5 and the power-side connecting portion 6 are rotated.
Are electrically connected to each other. The pins 5a and 5b are inserted into the insertion holes 61a and 61b, and then linearly moved to a specified position (moved by a predetermined distance), so that the substrate is moved. The side connection part 5 and the power supply side connection part 6 may be configured to be electrically connected.

(Embodiment 9) The basic configuration of a light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. The power supply side connection portion 6 is provided with a concave portion 64 in which the convex portion 52 is fitted and a convex portion 65 in which the concave portion 53 is fitted. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, the protrusion 5 of the substrate side connection portion 5
2 and the concave portion 53 are fitted into the concave portion 64 and the convex portion 65 of the power supply side connection portion 6, respectively, whereby the board side connection portion 5 is formed.
And two contact portions (not shown) provided on each of the power supply side connection portions 6 are arranged so as to be electrically connected to each other.

In this embodiment, however, the projections 52, 6
5 is pulled out of the recesses 53 and 64, so that
Can be electrically insulated from the power supply side connection portion 6, and the board side connection portion 5 can be electrically and mechanically connected to the power supply side connection portion 6 by fitting the convex portions 52, 65 into the concave portions 53, 64. Since the connection can be made, the replacement work of the LED module 2 is easy. In addition, the power supply side connection part 6 is the same as the first embodiment.
May be attached to the appliance main body 10 (see FIG. 3) described above, may be mounted on another substrate, or may be provided at the tip of an electric wire (not shown) derived from the appliance main body 10. Good.

(Embodiment 10) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 9, and as shown in FIG. Two connectors 66 and 67 are also used as the connection portion 6.
Is different. Here, connectors 56 and 6
6 are formed with concave portions 56a and 66a in which connectors 67 and 55 are fitted into concave and convex. In short, also in the present embodiment, the board-side connection part 5 and the power-supply-side connection part 6 provided on the board 1 of the LED module 3 are fitted into the board-side connection part 5 and the power-supply-side connection part 6 with concave and convex. Electrical and mechanical connections are made. Here, the connectors 55 and 67 constitute convex portions. In addition,
The same components as those in the ninth embodiment are denoted by the same reference numerals, and description thereof will be omitted.

(Embodiment 11) The basic structure of the light source device of this embodiment is substantially the same as that of the tenth embodiment, and as shown in FIG. 14, the connectors 55 and 56 described in the tenth embodiment.
Are located at different locations. That is, in the tenth embodiment,
As shown in FIG. 13, the connector 56 is arranged so that the opening surface of the concave portion 56 a is orthogonal to the thickness direction of the substrate 1, and the thickness direction of the substrate 1 is set as the fitting / removing direction. As shown in the figure, the recess 55a is disposed so that the opening surface faces outward, and the left-right direction in FIG. Note that the same components as those in the tenth embodiment are denoted by the same reference numerals, and description thereof will be omitted.

(Embodiment 12) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. A male screw portion 58 is formed on the body, a female screw portion 69 is formed on the body 61 of the power supply side connection portion 6,
By screwing the male screw portion 58 into the female screw portion 69, the board side connection portion 5 and the power supply side connection portion 6 are electrically and mechanically connected. Here, the board side connection part 5
A contact portion 57 protrudes from the distal end surface of the body, and a contact portion 68 with which the contact portion 57 contacts is formed on the bottom surface of the female screw portion 69 of the body 61 of the power supply side connection portion 6. Connection part 5
The male screw part 58 and the female screw part 69 are electrically connected to the power supply side connection part 6 and the contact part 57 and the contact part 68.
And are electrically connected.

Since the board-side connection portion 5 and the power supply-side connection portion 6 are electrically connected by screwing the male screw portion 58 into the female screw portion 69, the board-side connection portion 5 and the power supply-side connection portion 6 are connected to each other. Mechanical connection strength can be increased, and the board side connection part 5 is prevented from coming off from the power supply side connection part 6 due to vibration or impact while the board side connection part 5 is connected to the power supply side connection part 6. It is possible to do.

(Embodiment 13) The basic structure of the light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG.
The power supply side connection portion 6 is provided with two connection pins 81a and 81b inserted into the power supply holes 71a and 71b. Here, a conductive film made of a conductive material (for example, a metal such as copper) is adhered to the inner peripheral surfaces of the power supply holes 71a and 71b, and the pins 81a and 81b are brought into contact with the conductive film. Thus, the board side connection part 5 and the power supply side connection part 6 are electrically connected. A holding hole 72 into which the holding pin 82 provided in the power supply side connection portion 6 is inserted is formed in the board side connection portion 5, and the holding pin 82 is inserted into the holding hole 72 for holding. The LED module 3 is held by the power supply side connection part 6 by the peripheral part of the rear surface of the truncated cone-shaped hook part 83 provided at the tip part of the pin 82 abutting on the peripheral part of the holding hole 72. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

(Embodiment 14) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. 17, the power supply side connection portion 6 has two electrodes 84a and 84b. The substrate-side connecting portion 5 is disposed on the surface opposite to the surface on which the light emitting diode element 2 and the electronic component 4 are mounted.
The difference is that the connecting pieces 73a and 73b are elastically contacted with the connecting pieces 73a and 84b, respectively. Here, the connecting piece 73
a and 73b are formed by cutting and raising a part of a metal plate electrically connected to the conductive pattern of the substrate 1. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The connecting pieces 7 are connected to the electrodes 84a and 84b.
In order to make the 3a and 73b elastically contact, for example, as shown in FIG. 18, the LED module 3 is held on the instrument body 10 side and the connection pieces 73a and 73b are urged so as to elastically contact the electrodes 84a and 84b. A spring 15 may be provided to sandwich the LED module 3, or a holding groove 14 may be formed on the inner peripheral surface of the instrument body 10 as shown in FIG. After mounting, the mounting portion 1b protruding from the outer peripheral edge of the substrate 10 is
When the LED module 3 is rotated by a specified angle after being inserted into the mounting portion 4, the mounting portion 1b is locked in the holding groove 14, and the connection pieces 73a, 73b are connected to the electrodes 84a, 84b.
You may be made to contact with. Although not shown, the connecting pieces 73a and 73b are
May be elastically contacted with the electrodes 84a and 84b.

In this embodiment, however, the connection piece 73
Since a and 73b are in elastic contact with the electrodes 84a and 84b, the power supply side connection portion 6 and the substrate side connection portion 5 can be reliably connected.

(Embodiment 15) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 14, and Embodiment 1
The difference is that the connection pieces 73a and 73b described in 4 are protruded from the peripheral portion of the substrate 1 as shown in FIG. Accordingly, in the fourteenth embodiment, the connection pieces 73a, 73b are elastically contacted with the electrodes 84a, 84b by displacing the LED module 3 in the thickness direction of the substrate 1, whereas in the present embodiment, the LED module 3 is displaced. The connection piece 73 is displaced in the in-plane direction of the substrate 1 (to the right in FIG. 20).
The difference is that a and 73b are elastically contacted with the electrodes 84a and 84b. Note that the same components as those in the fourteenth embodiment are denoted by the same reference numerals, and description thereof is omitted.

(Embodiment 16) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and the light emitting diode element 2 and the electronic component 4 in the LED module 3 are different as shown in FIG. The feature is that it is mounted on the surface. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Also, FIG. 21 omits illustration of the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment, but the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown).

In this embodiment, since the electronic component 4 and the light emitting diode element 2 are mounted on different mounting surfaces, the temperature rise of the light emitting diode element 2 due to the heat generated by the electronic component 4 is suppressed. Therefore, since the decrease in the light output of the light emitting diode element 2 can be suppressed, the number of replacements of the LED module 3 can be reduced. Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2.

(Embodiment 17) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. 22, an electronic component 4 is connected to a substrate 1 on which a light emitting diode element 2 is mounted. Is mounted on another substrate 7.
Here, the substrate 1 and the substrate 7 are connected to a wiring member 8 made of a conductive wire.
Are electrically connected to each other. Here, the substrate 1
And the substrate 7 are arranged such that the surface on which the light emitting diode element 2 is not mounted and the surface on which the electronic component 4 is not mounted face and are separated from each other. In FIG. 22, the board-side connecting portion 5 provided in the LED module 3 is not shown, but the board-side connecting portion 5 is, for example, a lead wire (not shown) connected to a conductive pattern (not shown) of the board 1. )). Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the substrate 7 on which the electronic component 4 is mounted and the substrate 1 on which the light emitting diode element 2 is mounted can be thermally insulated (spatially separated). Since the temperature rise of the light emitting diode element 2 due to the influence of heat generation of the electronic component 4 can be suppressed, and the decrease in the light output of the light emitting diode element 2 can be suppressed,
The number of replacements of the module 3 can be reduced. Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2.

In the present embodiment, the board 1 and the board 7 are electrically connected by the wiring member 8, but a connector may be used instead of the wiring member 8.

(Embodiment 18) The basic configuration of a light source device of this embodiment is substantially the same as that of Embodiment 1, and the LED module 3 differs from the electronic component 4 in the LED module 3, as shown in FIG. Mounted on the surface, and filled with a heat radiation resin 91 so as to cover the electronic component 4.
It is characterized in that the transparent resin 100 is filled so as to cover the light emitting diode element 2. Here, since the resin 91 and the resin 100 are intended to dissipate heat, it is necessary to use a material having a relatively high thermal conductivity. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 23, the illustration of the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment is omitted, but the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown).

In this embodiment, however, the electronic component 4 and the light emitting diode element 2 are mounted on different mounting surfaces, and the electronic component 4 is covered with a resin 91 for heat radiation, and the light emitting diode element 2 is formed of a transparent resin. Because it is covered with 100
The heat radiation area of the electronic component 4 and the heat radiation area of the light emitting diode element 2 can be increased, and the temperature rise of the light emitting diode element 2 due to the heat generated by the electronic component 4 and the temperature rise caused by the heat generated by the light emitting diode element 2 itself are suppressed. Since the light output of the light emitting diode element 2 can be prevented from lowering, the number of times of replacement of the LED module 3 can be reduced. Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2. Although the electronic component 4 is covered with the resin 91 in the present embodiment, the electronic component 4 may be covered with an insulating sheet having a relatively high thermal conductivity instead of the resin 91.

(Embodiment 19) The basic structure of a light source device according to this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. Is characterized in that a heat radiating plate 9 for radiating the heat of the substrate 1 is provided on the surface opposite to the surface on which is mounted. The heat radiating plate 9 is formed in a comb shape (fins are formed) so that the heat radiating area is larger than the area of the contact surface with the substrate 1. In FIG. 24, the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment is not shown, but the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown). Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, since the heat generated in the electronic component 4 is efficiently radiated through the substrate 1 and the heat radiating plate 9, the temperature of the light emitting diode element 2 due to the heat generated by the electronic component 4 is increased. Since the rise can be suppressed and the decrease in the light output of the light emitting diode element 2 can be suppressed, LE
The number of replacements of the D module 3 can be reduced.

(Embodiment 20) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and the light emitting diode element 2 and the electronic component 4 are different in the LED module 3 as shown in FIG. It is characterized in that it is mounted on a surface, the electronic component 4 is covered with a resin 91 for heat dissipation, and a heat sink 9 is provided on the resin 91. Here, since the resin 91 is intended to dissipate heat, it is necessary to use a material having a relatively high thermal conductivity. The heat radiating plate 9 is formed in a comb shape (fins are formed) so that the heat radiating area is larger than the area of the contact surface with the resin 91. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Further, FIG. 25 omits the illustration of the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment, but the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown).

According to the present embodiment, the electronic component 4 and the light emitting diode element 2 are mounted on different mounting surfaces, and the heat generated by the electronic component 4 is efficiently dissipated through the substrate 1, the resin 91 and the heat radiating plate 9. Since the heat can be dissipated from the light, the temperature rise of the light emitting diode element 2 due to the influence of the heat generation of the electronic component 4 can be suppressed.
Can be efficiently dissipated through the substrate 1, the resin 91, and the heat radiating plate 9, and a decrease in the light output of the light emitting diode element 2 can be suppressed. Therefore, the number of replacements of the LED module 3 can be reduced. Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2. Although the electronic component 4 is covered with the resin 91 in the present embodiment, the electronic component 4 may be covered with an insulating sheet having a relatively high thermal conductivity instead of the resin 91.

(Embodiment 21) The basic structure of the light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. Is characterized in that a cooling device 92 composed of a Peltier element for dissipating heat of the substrate 1, for example, is attached to the surface opposite to the surface on which is mounted. Although the illustration of the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment is omitted in FIG. 26, the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown). Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, the heat generated by the electronic component 4 and the heat generated by the light emitting diode element 2 are efficiently radiated through the substrate 1 and the cooling device 92. The temperature rise of the light emitting diode element 2 due to the influence of the above can be suppressed, and the decrease in the light output of the light emitting diode element 2 can be suppressed.

(Embodiment 22) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and the LED module 3 differs from the electronic component 4 in the LED module 3, as shown in FIG. It is characterized in that it is mounted on a surface, the electronic component 4 is covered with a resin 91 for heat dissipation, and a cooling device 92 composed of a Peltier element is provided on the resin 91. Here, since the resin 91 is intended to dissipate heat, it is necessary to use a material having a relatively high thermal conductivity. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Although the illustration of the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment is omitted in FIG. 27, the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown).

In this embodiment, however, the electronic component 4 and the light emitting diode element 2 are mounted on different mounting surfaces, and the heat generated by the electronic component 4 and the light emitting diode element 2 is transferred to the substrate 1, the resin 91 and the cooling device. Since the heat can be efficiently dissipated through the LED 92, the temperature rise of the light emitting diode element 2 due to the influence of the heat generation of the electronic component 4 can be suppressed, and the decrease in the light output of the light emitting diode element 2 can be suppressed. Exchange times can be reduced.
Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2. Although the electronic component 4 is covered with the resin 91 in the present embodiment, the electronic component 4 may be covered with an insulating sheet having a relatively high thermal conductivity instead of the resin 91.

(Embodiment 23) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and as shown in FIG. It is characterized in that a cooling device 93 such as a fan is mounted on the side opposite to the surface on which is mounted. In FIG. 28, the board-side connecting portion 5 provided in the LED module 3 described in the first embodiment is not shown, but the board-side connecting portion 5 is connected to, for example, a conductive pattern (not shown) of the board 1. Connected to a lead wire (not shown). Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

According to the present embodiment, the heat generated by the electronic component 4 and the light emitting diode element 2 is
Since the heat can be more efficiently dissipated, the electronic component 4
As a result, it is possible to suppress a rise in the temperature of the light emitting diode element 2 due to the influence of the heat generation, and to suppress a decrease in the light output of the light emitting diode element 2, so that the number of replacements of the LED module 3 can be reduced.

(Embodiment 24) The basic structure of a light source device of this embodiment is substantially the same as that of Embodiment 1, and the LED module 3 differs from the electronic component 4 in the LED module 3 as shown in FIG. The electronic component 4 is mounted on a surface, the electronic component 4 is covered with a resin 91 for heat dissipation, and a cooling device 93 such as a fan is provided on the resin 91. Here, since the resin 91 is intended to dissipate heat, it is necessary to use a material having a relatively high thermal conductivity. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. FIG. 29 shows the LE described in the first embodiment.
Although the illustration of the board-side connecting portion 5 provided in the D module 3 is omitted, the board-side connecting portion 5 is connected to, for example, a lead wire (not shown) connected to a conductive pattern (not shown) of the board 1. It is good.

In this embodiment, the electronic component 4 and the light emitting diode element 2 are mounted on different mounting surfaces, and the heat generated in the electronic component 4 is efficiently radiated through the resin 91 and the cooling device 93. Since the temperature rise of the light emitting diode element 2 due to the heat generated by the electronic component 4 can be suppressed, the heat of the light emitting diode element 2 can also be efficiently radiated through the substrate 1, the resin 91 and the cooling device 93. Since the decrease in the light output of the light emitting diode element 2 can be suppressed, the number of replacements of the LED module 3 can be reduced. Further, it is possible to obtain a light source device with high luminance by increasing the arrangement density of the light emitting diode elements 2. Although the electronic component 4 is covered with the resin 91 in the present embodiment, the electronic component 4 may be covered with an insulating sheet having a relatively high thermal conductivity instead of the resin 91.

[0068]

According to the first aspect of the present invention, there is provided a light emitting diode module having a plurality of light emitting diode elements mounted on a substrate, and a light emitting diode which is detachably connected to a power supply side connection portion for supplying power to the light emitting diode element module. A substrate-side connection part electrically connected to the element, the substrate being detachably connected to a power-source-side connection part for supplying power to the light-emitting diode element module, and electrically connected to the light-emitting diode element The provision of the side connection portion has an effect that the light emitting diode element can be replaced by replacing the light emitting diode element module.

According to a second aspect of the present invention, in the first aspect of the present invention, the board-side connecting portion is a connecting pin protruding from the board, and the power-side connecting portion is a plug-in into which the pin is inserted. A hole is formed in the body, and the board-side connection portion is electrically connected by inserting a pin into the insertion hole, so that by removing the pin from the insertion hole, the board-side connection portion is connected to the power supply. The light emitting diode can be electrically insulated from the side connection portion, and the board side connection portion can be electrically and mechanically connected to the power supply side connection portion by inserting a pin into the insertion hole. There is an effect that the replacement operation of the element module is easy.

According to a third aspect of the present invention, in the first aspect of the present invention, the board-side connecting portion is a connecting pin protruding from the board, and the power-supply-side connecting portion is an insertion portion into which the pin is inserted. A hole is formed in the body, and the board-side connection portion is electrically connected by rotating or moving the board-side connection portion to a predetermined position after inserting the pin into the insertion hole. There is an effect that it is possible to prevent the board-side connection portion from being detached from the power-supply-side connection portion due to vibration, impact, or the like in a state where the board-side connection portion is connected to the side connection portion.

According to a fourth aspect of the present invention, in the first aspect of the present invention, a recess is formed in at least one of the substrate side connection portion and the power supply side connection portion, and the other body is fitted in the recess. The substrate-side connection portion and the power supply-side connection portion are electrically connected to each other by fitting the protrusion into the recess. Therefore, the substrate is removed by removing the protrusion from the recess. Connecting the substrate-side connection with the power-supply-side connection by electrically connecting the substrate-side connection with the power-supply-side connection by fitting the protrusion into the recess. Therefore, there is an effect that the replacement work of the light emitting diode element module is easy.

According to a fifth aspect of the present invention, in the first aspect, a male screw portion is formed on at least one of the board side connection portion and the power supply side connection portion, and a female screw portion is formed on the other body portion. Since the board side connection part and the power supply side connection part are electrically connected by screwing a male screw part into a female screw part, a mechanical connection between the board side connection part and the power supply side connection part is made. The connection strength can be increased, and it is possible to prevent the board-side connection portion from coming off from the power-side connection portion due to vibration or impact in a state where the board-side connection portion is connected to the power-side connection portion. This has the effect of becoming

According to a sixth aspect of the present invention, in the first aspect of the present invention, the board side connection portion is a power supply hole penetrating through the board, and the power supply side connection portion is inserted into the power supply hole. Since the board-side connection portion is electrically connected by inserting the pin into the power supply hole, the board-side connection portion is inserted and removed by inserting the pin into the power supply hole. Is attached to and detached from the power supply side connection part, the replacement work of the light emitting diode element module is easy, and since there is no need to mount another member on the board as the board side connection part, There is an effect that the number of parts can be reduced.

According to a seventh aspect of the present invention, in the first aspect, the power supply side connection portion has an electrode, and the substrate side connection portion comprises a connection piece made of a conductive material elastically contacting the electrode. Since the power supply side connection portion and the substrate side connection portion are electrically connected by elastically contacting the piece with the electrode,
There is an effect that the power supply side connection part and the board side connection part can be reliably connected.

According to an eighth aspect of the present invention, in the first aspect, the light emitting diode element module includes an electronic component in addition to the light emitting diode element, and the electronic component is mounted on a different mounting surface from the light emitting diode element. Since the electronic component is mounted on a different mounting surface from the light emitting diode element, the temperature increase of the light emitting diode element due to the influence of the electronic component can be suppressed. It is possible to suppress a decrease in output, and as a result, it is possible to prolong the life of the light emitting diode element module.

According to a ninth aspect of the present invention, in accordance with the eighth aspect of the present invention, since the electronic component is covered with a heat-radiating resin, the heat-radiating area is increased and the heat generated by the electronic component is reduced. Therefore, the temperature rise of the light emitting diode due to the effect of the electronic component can be further suppressed, and as a result, the life of the light emitting diode element module can be extended.

According to a tenth aspect of the present invention, in the first or the eighth aspect of the present invention, since the heat radiating plate for radiating the heat of the substrate is provided on the substrate, the heat of the substrate is transmitted through the heat radiating plate. As a result, the heat is efficiently dissipated, the temperature rise of the light emitting diode element can be suppressed, and the decrease in the light output of the light emitting diode element can be suppressed. As a result, the life of the light emitting diode element module can be extended. This has the effect.

According to an eleventh aspect of the present invention, in the first or the eighth aspect of the present invention, a cooling device for dissipating heat of the substrate is provided on the substrate. Heat can be suppressed, the temperature rise of the light emitting diode can be suppressed, the decrease in the light output of the light emitting diode element can be suppressed, and as a result, the life of the light emitting diode element module can be extended. is there.

According to a twelfth aspect of the present invention, in the first or eighth aspect of the present invention, a cooling device for radiating heat of the substrate is provided near the substrate, so that the heat of the substrate is reduced by the cooling device. Will be dissipated more efficiently,
An increase in the temperature of the light emitting diode can be suppressed, and a decrease in the light output of the light emitting diode element can be suppressed. As a result, the life of the light emitting diode element module can be extended.

[Brief description of the drawings]

1A and 1B show a basic configuration of a first embodiment, in which FIG. 1A is a perspective view seen from a front side, and FIG. 1B is a perspective view seen from a back side.

FIG. 2 is a basic configuration diagram of the above.

FIG. 3 is a schematic exploded perspective view of a lighting device using the above.

FIG. 4 is a schematic configuration diagram of the above.

FIG. 5 is a schematic configuration diagram showing a second embodiment.

FIG. 6 is a schematic configuration diagram showing a third embodiment.

FIG. 7 is a schematic configuration diagram showing a fourth embodiment.

FIG. 8 is a schematic configuration diagram showing a fifth embodiment.

FIG. 9 is a schematic configuration diagram showing a sixth embodiment.

FIG. 10 is a schematic configuration diagram showing a seventh embodiment.

FIG. 11 is a schematic configuration diagram showing an eighth embodiment.

FIG. 12 is a schematic configuration diagram showing a ninth embodiment.

FIG. 13 is a schematic configuration diagram showing a tenth embodiment.

FIG. 14 is a schematic configuration diagram showing an eleventh embodiment.

FIG. 15 is a schematic configuration diagram showing a twelfth embodiment.

FIG. 16 is a schematic configuration diagram showing a thirteenth embodiment.

FIG. 17 is a schematic configuration diagram showing a fourteenth embodiment.

FIG. 18 is a schematic configuration diagram of the above.

FIG. 19 is a schematic configuration diagram of the above.

FIG. 20 is a schematic configuration diagram showing a fifteenth embodiment.

FIG. 21 is a schematic configuration diagram showing a sixteenth embodiment.

FIG. 22 is a schematic configuration diagram showing a seventeenth embodiment.

FIG. 23 is a schematic configuration diagram showing an eighteenth embodiment.

FIG. 24 is a schematic configuration diagram showing a nineteenth embodiment.

FIG. 25 is a schematic configuration diagram showing a twentieth embodiment.

FIG. 26 is a schematic configuration diagram showing a twenty-first embodiment.

FIG. 27 is a schematic configuration diagram showing a twenty-second embodiment.

FIG. 28 is a schematic configuration diagram showing a twenty-third embodiment.

FIG. 29 is a schematic configuration diagram showing a twenty-fourth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting diode element 3 Light emitting diode element module (LED module) 5 Substrate side connection part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // F21Y 101: 02 F21S 5/00 A (72) Inventor Yoshiro Goto 1048 Odaka, Kazuma, Kadoma, Osaka Matsushita F term in Denko Corporation (reference) 3K014 LB01 5F041 DA13 DA20 DA83 EE11 FF11

Claims (12)

[Claims] 1. A light emitting diode element module having at least a plurality of light emitting diode elements mounted on a substrate, and a power supply side connection portion for supplying power to the light emitting diode element module, which is detachably connected to the light emitting diode element and electrically connected to the light emitting diode element. A light source device, comprising: 2. The board-side connection part is a connection pin protruding from the board, and the power-supply-side connection part has an insertion hole into which a pin is inserted, formed in a body. The light source device according to claim 1, wherein the board-side connection portion is electrically connected by inserting the connection portion into the insertion hole. 3. The board-side connection section is a connection pin protruding from the board, and the power-supply-side connection section has an insertion hole formed in a body for inserting a pin, 2. The light source device according to claim 1, wherein the substrate-side connection portion is electrically connected by rotating or moving the substrate-side connection portion to a predetermined position after inserting the substrate-side connection portion into the insertion hole. 3. 4. A method according to claim 1, wherein at least one of the substrate-side connection portion and the power-supply-side connection portion has a recess formed therein, and the other body has a protrusion fitted to the recess. The connection part and the power supply side connection part are electrically connected by fitting a convex part into a concave part.
The light source device according to claim 1. 5. The board-side connection portion and the power supply, wherein at least one of the board-side connection portion and the power-supply-side connection portion has a male screw portion formed on the other body and a female screw portion formed on the other body. The light source device according to claim 1, wherein the side connection portion is electrically connected to the side connection portion by screwing a male screw portion into the female screw portion. 6. The board-side connection section is a power supply hole penetrating through the board, and the power-supply-side connection section has a connection pin inserted into the power supply hole, and supplies power to the pin. The light source device according to claim 1, wherein the substrate-side connection portion is electrically connected by being inserted into a hole. 7. The power supply side connection portion has an electrode, and the substrate side connection portion is formed of a connection piece made of a conductive material which is elastically contacted with the electrode, and the connection piece is elastically contacted with the electrode to thereby form the power supply side connection portion. The light source device according to claim 1, wherein a connection portion and the board-side connection portion are electrically connected. 8. The light emitting diode element module according to claim 1,
The light source device according to claim 1, further comprising an electronic component in addition to the light emitting diode element, wherein the electronic component is mounted on a different mounting surface from the light emitting diode element. 9. The light source device according to claim 8, wherein said electronic component is covered with a resin for heat radiation. 10. The light source device according to claim 1, wherein a heat radiating plate for radiating heat of the substrate is provided on the substrate. 11. A cooling device for radiating heat of the substrate to the substrate.
Alternatively, the light source device according to claim 8. 12. The light source device according to claim 1, further comprising a cooling device provided near the substrate for radiating heat of the substrate.