JP2003094323A - Retainer material of polishing object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems of a retainer material of a polishing object wherein bubbles are produced in polishing the polishing object due to dispersion stabilizer and wet type solidification auxiliary of various types of surfactant to reduce the quality of the polishing object and deteriorate the yield of the product. SOLUTION: This retainer material of the polishing object is characterized in that the quantity of the surfactant included in the retainer material of 5.0 mg/g retainer material or less or the bubbles produced from the retainer material during the polishing are 5 bubbles/5400 mm<2> or less. A skin layer formed on the bubble layer surface of the retainer material is buffed.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an LCD glass,
The present invention relates to a holding material for a member to be polished such as a color filter, a ceramic substrate, a reflecting mirror, a crystal oscillator, and a semiconductor wafer.

[0002]

2. Description of the Related Art Generally, a member to be polished such as a color filter for LCD glass, a ceramic substrate, a reflecting mirror, a crystal oscillator, and a semiconductor wafer is polished by a polishing machine such as a rotating machine. In that case, the member to be polished is fixed to the surface plate of the polishing machine, and the polishing cloth is relatively rotated on the surface plate arranged so as to face the surface plate, and an abrasive grain or the like is contained between them. The member to be polished is polished by supplying the polishing liquid.

At this time, as a method for holding the member to be polished, a polymeric elastic foam suitable for holding the member to be polished is used. When the member to be polished is strongly pressed through a liquid such as water, the holding member adsorbs to the member to be polished and fixes the member to be polished.

Further, in order to prevent the member to be polished from jumping out of the surface plate during the polishing process, JP-A-61-2308.
A method of providing a template such as 66 having a recess hole into which a member to be polished is fitted is also adopted.

The holding material used in these methods is generally produced by wet coagulation using a urethane resin composition.
In this wet coagulation method, after the urethane resin composition is prepared, the urethane resin composition is applied to a support, and then wet coagulation treatment is performed in a mixed solution of water and dimethylformamide (DMF) to foam on the support. A layer is formed and then dried, and in some cases, the outermost surface is buffed to obtain a holding material.

Further, as in JP-A-2000-42909, by laminating a thermoplastic resin layer containing the composition of the support and the composition of the wet foam layer between the support and the wet foam layer, the peel strength is strong. A holding material can be obtained.

[0007]

Such a holding material is
When forming the foam layer on the support by the wet coagulation treatment,
In order to make the foam cells in the foam layer uniform in size, a urethane resin composition, water, dimethylformamide (DM
F) A dispersion stabilizer such as various surfactants and a wet coagulation aid are added to the mixed solution. When this additive remains in the foam layer, bubbles are generated during polishing of the member to be polished, which deteriorates the quality of the member to be polished and deteriorates the yield of products.

[0008]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a holding material for a member to be polished in which the amount of bubbles generated during polishing is small.

That is, the amount of the surfactant contained in the holding material is 5.0 mg / g or less, and the holding material of the member to be polished or the bubbles generated from the holding material during polishing is 5 /
The problem can be solved by the holding material for the member to be polished, which is characterized in that it is 5400 mm ² or less.

Further, the skin layer formed on the surface of the foamed layer of the holding material is a buffed holding material, or an angular or circular shape having a recess hole into which a member to be ground is fitted on the surface of the holding material. The problem can be solved by the holding material provided with a template having a shape.

Here, the skin layer refers to a hard coating layer formed on the surface of the foam layer formed by the wet solidification method, and the template has sufficient flatness, and has impact resistance, toughness and resistance. It means a frame material having a recess hole into which a workpiece made of an engineering plastic having excellent wear resistance is fitted. As the material, a semi-rigid material such as glass-filled epoxy, bakelite, hard vinyl chloride, or a filled resin composite material having higher hardness is used. The recess hole means a hole for fitting and removing a member to be polished.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION In the production of the holding material of the present invention, the amount of the surfactant contained in the mixed solution for forming the wet foam layer is reduced, or the foam layer of the holding material is formed, but the foaming itself does not occur. This is achieved by using a weak surfactant and further reducing the amount of the surfactant in the obtained holding material in a subsequent step. As the surfactant used in the present invention, for example, a mixed solution for forming a wet foam layer containing a surfactant is applied on a support to form a foam layer, and then dried to form a foam cell of the wet foam layer. It is desirable that the surface active agent has a uniform size, the surface of the wet foam layer is smooth, and the surface of the wet foam layer is not dispersed or uneven color due to residual surface of the additive does not occur.

Examples of commercially available surfactants include PL
-210 (trade name glycerin ethylene oxide polyoxide compound manufactured by Kao Corporation) can be used. Further, the surfactant is usually added in an amount of about 3 to 10 parts, but in the present invention, the addition amount is 0.01 to 2.00 parts, and more preferably 0.1 to 1.00 parts. The material is manufactured. As a method of removing the surfactant after production, there is a method of eluting it with water, an organic solvent such as dimethylformamide, methyl ethyl ketone, toluene, methanol, ethanol, acetone, or a solution such as a mixed solution thereof.

The surfactant to be added to the foam layer composition used in the present invention is appropriately added to the foam layer composition, and its content is 0.01 per 100 parts by weight of the urethane composition. The amount is preferably ˜2.00 parts by weight, more preferably 0.1 to 1.00 parts by weight.

The urethane composition used in the present invention is
It is generally composed of an organic diisocyanate, polyols and a chain extender.

Examples of the organic diisocyanate include diphenylmethane-4,4'-diisocyanate, xylylenediisocyanate, dichlorohexylmethane-4,4.
Examples thereof include'-diisocyanate, hexamethylene diisocyanate and the like, or a mixture thereof.

As the polyol, polyethylene adipate glycol, polypropylene adipate glycol, polyethylene propylene adipate glycol,
Polybutylene adipate glycol Polyethylene butylene adipate glycol, polyester polyols such as polypentamethylene adipate glycol, polyether polyols such as polyethylene ether glycol, polypropylene ether glycol, and polytetramethylene ether glycol, or polyenes obtained by ring-opening polymerization of lactone ring Examples thereof include glycols having a hydroxyl group at both ends of caprolactone and a molecular weight of 500 to 8000, polyhexamethylene carbonate, and polyhexamethylene carbonate combined with the above-mentioned polyols and copolymerized.

As the chain extender, a low molecular weight compound containing an active hydrogen group, for example, glycols such as ethylene glycol, propylene glycol, butylene glycol and diethylene glycol, for example, diamines such as ethylenediamine, propylenediamine and butylenediamine, or amino. Alcohol etc. can be mentioned.

Examples of the solvent for dissolving the urethane composition having the above composition include water-miscible organic solvents such as dimethylformamide, dimethylsulfoxide, etrahydrofuran, dimethylacetamide, ethylacetate and dioxane. It is not particularly limited to these.

The solid content concentration of the urethane composition is preferably 10 to 40% by weight, more preferably 15 to 30% by weight.
Is. If the solid content concentration is too low, a large amount of waviness occurs on the surface of the urethane layer after wet coagulation and the smoothness deteriorates. Further, if the solid content is too high, air may be easily entrained, and a large depression may occur on the urethane surface after the wet solidification.

The urethane composition adjusted to the above composition is coated on the already coated thermoplastic resin layer by using an appropriate coating means such as a reverse coater or a knife coater. The coat amount is not particularly limited, but 1
50g-1200g / m < ² > is suitable.

Then, after wet coagulation in a mixed solution of water and DMF (dimethylformamide), washing with water for solvent removal and drying are performed to obtain a foam layer in the coat layer. The surface of the obtained holding material can be used as a holding material sufficiently even if it is as it is. In the case of liquid crystal glass or the like, glass is fixed to the holding material by surface tension of water and polished.

On the surface of the holding material, for example, sandpaper is used, clearance is 0.3 to 0.6 mm, line speed is 1 to 10 m / min, and paper rotation speed is 500 to 3
Buffing is performed under the condition of 000 rpm.

In the case of a silicon wafer, the holding material thus surface-treated is used, and a template formed mainly of glass epoxy resin, which is open to the size of the wafer, is arranged, and a template to be polished is placed therein. A silicon wafer is adsorbed with water and polished.

At this time, an angular or circular template having a recess hole into which the member to be polished is fitted may be provided on the surface of the holding material.

In the obtained holding material, the smaller the amount of the surfactant contained in the holding material, the better.
A mg / g holding material or less, more preferably 3.5 mg / g holding material or less, 2.0 mg / g holding material or less is preferable. Further, the number of bubbles generated from the holding material during the conditions of Example 1 or during polishing was 5/5400 mm ² or less, and further 3/5400 mm ²
The following are preferred:

[0027]

EXAMPLES The present invention will be presented below with reference to Examples and Comparative Examples. In addition, "part" in Examples and Comparative Examples means "part by weight" which is a ratio per weight unless otherwise specified.

Evaluation Method of Bubble Generation Condition 6 is placed on an iron or stainless steel table with a smooth surface and rigidity.
The holding material having a size of 0 mm × 90 mm is fixed to the back surface with a double-sided tape interposed. 3 cc of water is dripped on the surface of the holding material so that the holding material is well blended with the water. 80 mm x 100 m
2.5 gf / cm ^{2 by} placing a glass plate of m on the holding material.
The glass plate and the holding material are forcibly rubbed at a speed of 150 reciprocations / minute for each 20 mm on the right and left while applying the load.

At a predetermined time, the glass plate is peeled off from the holding material, and a lump of bubbles attached to the glass plate (an aggregate of 1 to several hundred bubbles with a size of 1 mm or less). And the time until the bubbles disappear. Regarding the number of bubbles, measure the number of bubbles remaining even after 30 seconds or more after separating the glass plate from the holding material. Regarding the time until the bubbles disappear, the time when the holding material is released is 0 second, and the time until the bubbles completely disappear.

The evaluation results were evaluated by ◯ when the number of bubbles was 5 or less and the time until the bubbles disappeared within 5 minutes, and by x when the others were not. [Example 1] First, in order to bond a support and a wet foam layer, a polyester sheet obtained by diluting a polyester-polyurethane copolymer with methyl ethyl ketone (manufactured by Toyobo Co., Ltd., Crisper G1212 (thickness 0.188) was used.
mm)) with a knife coater clearance 0.15m
It was applied at m. Then, it was dried at 80 ° C. for 15 minutes to obtain a sheet on which a thermoplastic layer of about 35 μm was formed and coated. Polytetramethylene ether glycol (PTM
G) as a polyol component, diphenyl-4,4
'-Diisocyanate and diamine were solution polymerized in dimethylformamide to obtain a polyurethane elastomer solution having a concentration of 30%. To 100 parts of this polyurethane elastomer solution, 3 parts of carbon black powder, 100 parts of dimethylformamide, and 1 part of PL-210 (glycerin ethylene oxide polyoxide compound) as a surfactant were added to obtain a coating solution. The obtained coating solution was applied on the above sheet by a reverse coater at 800 g / m ² , coagulated in a coagulation bath at 35 ° C. (water: dimethylamide = 90: 10 weight ratio), and sufficiently desolvated with warm water. Then, hot air drying was performed at 150 ° C. to obtain a holding material having a thickness of 0.8 mm. [Comparative Example 1] A holding material was produced in the same manner as in Example except that the amount of the surfactant added to the coating liquid was 10 parts. [Comparative Example 2] A holding material was produced in the same manner as in Example except that the amount of the surfactant added to the coating liquid was 3 parts.
The produced holding material was evaluated according to the foam generation state evaluation method. The results are shown in Table 1. As is clear from the examples,
It can be seen that bubbles generated from the elastic polymer foam produced by reducing the amount of the surfactant are very small, and even if they are attached to the member to be polished, they are very likely to disappear.

[0031]

[Table 1]

[0032]

According to the present invention, by using the holding material of the present invention in the polishing step, bubbles generated from the holding material can be suppressed, the deterioration of the quality of the member to be polished can be suppressed, and the member to be polished as a product can be suppressed. The yield can be improved.

[0033]

Claims (3)

[Claims] 1. The amount of the surfactant contained in the holding material is 5.
A holding material for a member to be polished having a holding amount of 0 mg / g or less. 2. The number of bubbles generated from the holding material during polishing is 5/5.
A holding material for a member to be polished, which is 400 mm ² or less. 3. The holding material according to claim 1, wherein the skin layer formed on the surface of the foamed layer of the holding material is buffed.