JP2003183881A5 - - Google Patents

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Publication number: JP2003183881A5
Authority: JP; Japan
Prior art keywords: conductive substrate; conductive; porous; cobalt; substrate
Prior art date: 2002-08-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2002225337A

Other languages

English (en)

Japanese (ja)

Other versions

JP2003183881A (ja

Filing date

2002-08-01

Publication date

2005-10-27

2001-08-02 Priority claimed from GBGB0118870.5A external-priority patent/GB0118870D0/en

2002-08-01 Application filed filed Critical

2003-07-03 Publication of JP2003183881A publication Critical patent/JP2003183881A/ja

2005-10-27 Publication of JP2003183881A5 publication Critical patent/JP2003183881A5/ja

Status Pending legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims 23
238000000034 method Methods 0.000 claims 11
229910017052 cobalt Inorganic materials 0.000 claims 5
239000010941 cobalt Substances 0.000 claims 5
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 5
-1 cobalt (III) ions Chemical class 0.000 claims 4
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 3
YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims 2
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
238000004140 cleaning Methods 0.000 claims 2
238000009713 electroplating Methods 0.000 claims 2
238000005530 etching Methods 0.000 claims 2
229910052751 metal Inorganic materials 0.000 claims 2
239000002184 metal Substances 0.000 claims 2
238000001465 metallisation Methods 0.000 claims 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
239000000243 solution Substances 0.000 claims 2
239000002904 solvent Substances 0.000 claims 2
239000004094 surface-active agent Substances 0.000 claims 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 1
229910019142 PO4 Inorganic materials 0.000 claims 1
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
239000000956 alloy Substances 0.000 claims 1
229910045601 alloy Inorganic materials 0.000 claims 1
229910052787 antimony Inorganic materials 0.000 claims 1
WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
239000007864 aqueous solution Substances 0.000 claims 1
229910052797 bismuth Inorganic materials 0.000 claims 1
JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims 1
230000003750 conditioning effect Effects 0.000 claims 1
229910052802 copper Inorganic materials 0.000 claims 1
239000010949 copper Substances 0.000 claims 1
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 1
GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 claims 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
229910052737 gold Inorganic materials 0.000 claims 1
239000010931 gold Substances 0.000 claims 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
229910052738 indium Inorganic materials 0.000 claims 1
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
229910052742 iron Inorganic materials 0.000 claims 1
150000002576 ketones Chemical class 0.000 claims 1
150000002596 lactones Chemical class 0.000 claims 1
239000011133 lead Substances 0.000 claims 1
229910052744 lithium Inorganic materials 0.000 claims 1
239000000203 mixture Substances 0.000 claims 1
229910052759 nickel Inorganic materials 0.000 claims 1
229910017464 nitrogen compound Inorganic materials 0.000 claims 1
229910052763 palladium Inorganic materials 0.000 claims 1
239000010452 phosphate Substances 0.000 claims 1
229910052697 platinum Inorganic materials 0.000 claims 1
229920001451 polypropylene glycol Polymers 0.000 claims 1
229910052700 potassium Inorganic materials 0.000 claims 1
239000011591 potassium Substances 0.000 claims 1
RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims 1
229910052703 rhodium Inorganic materials 0.000 claims 1
239000010948 rhodium Substances 0.000 claims 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
229910052707 ruthenium Inorganic materials 0.000 claims 1
229910052709 silver Inorganic materials 0.000 claims 1
239000004332 silver Substances 0.000 claims 1
229910052708 sodium Inorganic materials 0.000 claims 1
239000011734 sodium Substances 0.000 claims 1
229910052715 tantalum Inorganic materials 0.000 claims 1
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
229910052718 tin Inorganic materials 0.000 claims 1
239000011135 tin Substances 0.000 claims 1
229910052720 vanadium Inorganic materials 0.000 claims 1
LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
229910052725 zinc Inorganic materials 0.000 claims 1
239000011701 zinc Substances 0.000 claims 1

JP2002225337A 2001-08-02 2002-08-01 複合接着性促進および直接金属化法 Pending JP2003183881A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GBGB0118870.5A GB0118870D0 (en)	2001-08-02	2001-08-02	A combined adhesion promotion and direct metallization process
GB0118870.5		2001-08-02

Publications (2)

Publication Number	Publication Date
JP2003183881A JP2003183881A (ja)	2003-07-03
JP2003183881A5 true JP2003183881A5 (2)	2005-10-27

Family

ID=9919686

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2002225337A Pending JP2003183881A (ja)	2001-08-02	2002-08-01	複合接着性促進および直接金属化法

Country Status (7)

Country	Link
US (1)	US6790334B2 (2)
EP (1)	EP1281792A3 (2)
JP (1)	JP2003183881A (2)
KR (1)	KR20030013321A (2)
CN (1)	CN1266314C (2)
GB (1)	GB0118870D0 (2)
TW (1)	TW593791B (2)

Families Citing this family (10)

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GB0104503D0 (en) *	2001-02-23	2001-04-11	Shipley Co Llc	Solvent swell for texturing resinous material and desmearing and removing resinous material
GB0225012D0 (en) *	2002-10-28	2002-12-04	Shipley Co Llc	Desmear and texturing method
JP4101705B2 (ja) *	2003-06-18	2008-06-18	三菱伸銅株式会社	金属層形成方法
US8491816B2 (en)	2008-02-07	2013-07-23	Mitsubishi Chemical Corporation	Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
DE102010012204B4 (de) *	2010-03-19	2019-01-24	MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware)	Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
CN103220884A (zh) *	2012-01-18	2013-07-24	光宏精密股份有限公司	线路基板结构及其制作方法
CN115110070B (zh) *	2022-07-13	2023-10-27	上海天承化学有限公司	一种用于离子钯活化工艺的预浸液及其应用
US12336113B2 (en)	2023-03-28	2025-06-17	Infinitum Electric Inc.	Method of printed circuit board dielectric molding or machining and electrolytic metallization
US12004306B1 (en) *	2023-03-28	2024-06-04	Infinitum Electric Inc.	Method of printed circuit board dielectric molding and electrolytic metallization
US11800640B1 (en)	2023-03-28	2023-10-24	Infinitum Electric, Inc.	Printed circuit board dielectric molding and electrolytic metallization

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US3523875A (en) *	1967-03-15	1970-08-11	Hooker Chemical Corp	Process for metal coating substrate pretreated with alkali metal sulfide and resultant product
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2001
- 2001-08-02 GB GBGB0118870.5A patent/GB0118870D0/en not_active Ceased
2002
- 2002-08-01 JP JP2002225337A patent/JP2003183881A/ja active Pending
- 2002-08-01 TW TW091117272A patent/TW593791B/zh not_active IP Right Cessation
- 2002-08-01 EP EP02255413A patent/EP1281792A3/en not_active Withdrawn
- 2002-08-02 KR KR1020020045744A patent/KR20030013321A/ko not_active Withdrawn
- 2002-08-02 US US10/210,535 patent/US6790334B2/en not_active Expired - Fee Related
- 2002-08-02 CN CNB021529132A patent/CN1266314C/zh not_active Expired - Fee Related

Publication	Publication Date	Title
EP0797380B1 (en)	2004-04-28	Method for enhancing the solderability of a surface
JP2003183881A5 (2)	2005-10-27
TWI658135B (zh)	2019-05-01	於其他金屬存在下選擇性處理銅的方法
TW583349B (en)	2004-04-11	Method for enhancing the solderability of a surface
CN101730391B (zh)	2012-01-04	避免伽凡尼腐蚀效应的电路板微蚀方法
JPH10507229A (ja)	1998-07-14	連結された金属構造の層を電気的に非伝導性の表面に形成するための方法
CN101706703B (zh)	2011-06-22	一种电容式触摸屏四边边缘金属膜的制作方法
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JP2009530502A (ja)	2009-08-27	ポリイミド基板及びそれを使用するプリント基板の製造方法
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