JP2003280207A5 - - Google Patents

Download PDF

Info

Publication number
JP2003280207A5
JP2003280207A5 JP2002081328A JP2002081328A JP2003280207A5 JP 2003280207 A5 JP2003280207 A5 JP 2003280207A5 JP 2002081328 A JP2002081328 A JP 2002081328A JP 2002081328 A JP2002081328 A JP 2002081328A JP 2003280207 A5 JP2003280207 A5 JP 2003280207A5
Authority
JP
Japan
Prior art keywords
layer
resist
intermediate layer
forming
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002081328A
Other languages
English (en)
Japanese (ja)
Other versions
JP3813890B2 (ja
JP2003280207A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002081328A priority Critical patent/JP3813890B2/ja
Priority claimed from JP2002081328A external-priority patent/JP3813890B2/ja
Priority to US10/392,814 priority patent/US6884571B2/en
Publication of JP2003280207A publication Critical patent/JP2003280207A/ja
Publication of JP2003280207A5 publication Critical patent/JP2003280207A5/ja
Application granted granted Critical
Publication of JP3813890B2 publication Critical patent/JP3813890B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002081328A 2002-03-22 2002-03-22 3層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法 Expired - Fee Related JP3813890B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002081328A JP3813890B2 (ja) 2002-03-22 2002-03-22 3層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法
US10/392,814 US6884571B2 (en) 2002-03-22 2003-03-21 Intermediate layer composition for three-layer resist process and pattern formation method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002081328A JP3813890B2 (ja) 2002-03-22 2002-03-22 3層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法

Publications (3)

Publication Number Publication Date
JP2003280207A JP2003280207A (ja) 2003-10-02
JP2003280207A5 true JP2003280207A5 (2) 2005-04-07
JP3813890B2 JP3813890B2 (ja) 2006-08-23

Family

ID=29230004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002081328A Expired - Fee Related JP3813890B2 (ja) 2002-03-22 2002-03-22 3層レジストプロセス用中間層材料組成物及びそれを用いたパターン形成方法

Country Status (2)

Country Link
US (1) US6884571B2 (2)
JP (1) JP3813890B2 (2)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6743885B2 (en) * 2001-07-31 2004-06-01 Sumitomo Chemical Company, Limited Resin composition for intermediate layer of three-layer resist
US7365023B2 (en) * 2003-04-17 2008-04-29 Nissan Chemical Industries, Ltd. Porous underlayer coating and underlayer coating forming composition for forming porous underlayer coating
US7901864B2 (en) * 2004-09-23 2011-03-08 International Business Machines Corporation Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition
US7375172B2 (en) * 2005-07-06 2008-05-20 International Business Machines Corporation Underlayer compositions containing heterocyclic aromatic structures
JP2007218943A (ja) * 2006-02-14 2007-08-30 Shin Etsu Chem Co Ltd 基板及びパターン形成方法
WO2009047151A1 (en) 2007-10-10 2009-04-16 Basf Se Sulphonium salt initiators
JP2009215423A (ja) * 2008-03-10 2009-09-24 Chisso Corp かご型シルセスキオキサン構造を含む重合体とそれを含むネガ型レジスト材料
JP5493689B2 (ja) * 2008-12-10 2014-05-14 Jnc株式会社 重合性液晶組成物およびホモジニアス配向液晶フィルム
US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
US8444768B2 (en) 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
JP5324361B2 (ja) * 2009-08-28 2013-10-23 東京応化工業株式会社 表面処理剤及び表面処理方法
KR101813298B1 (ko) 2010-02-24 2017-12-28 바스프 에스이 잠재성 산 및 그의 용도
US9029268B2 (en) 2012-11-21 2015-05-12 Dynaloy, Llc Process for etching metals
EP3019559A4 (en) 2013-08-22 2017-04-05 Sony Corporation Water soluble fluorescent or colored dyes and methods for their use
KR101829159B1 (ko) 2014-01-16 2018-02-13 소니 주식회사 수용성 형광 또는 유색 염료
US9994538B2 (en) 2015-02-02 2018-06-12 Basf Se Latent acids and their use
US11827661B2 (en) 2015-02-26 2023-11-28 Sony Group Corporation Water soluble fluorescent or colored dyes comprising conjugating groups
KR102646956B1 (ko) * 2015-02-26 2024-03-14 소니그룹주식회사 페닐에티닐나프탈렌 염료 및 이의 사용 방법
CN107709470B (zh) 2015-05-11 2021-01-29 索尼公司 超亮二聚或多聚染料
CN109415574B (zh) 2016-04-01 2021-05-28 索尼公司 具有刚性间隔基团的超亮二聚体或聚合物染料
AU2017240154B2 (en) 2016-04-01 2021-08-12 Sony Group Corporation Ultra bright dimeric or polymeric dyes
WO2017177065A2 (en) 2016-04-06 2017-10-12 Sony Corporation Ultra bright dimeric or polymeric dyes with spacing linker groups
JP7527537B2 (ja) 2016-05-10 2024-08-05 ソニーグループ株式会社 ペプチド骨格を有する超明色ポリマー染料
EP3455299B1 (en) 2016-05-10 2024-01-17 Sony Group Corporation Compositions comprising a polymeric dye and a cyclodextrin and uses thereof
EP3455300A1 (en) 2016-05-11 2019-03-20 Sony Corporation Ultra bright dimeric or polymeric dyes
EP3464477A1 (en) 2016-06-06 2019-04-10 Sony Corporation Ionic polymers comprising fluorescent or colored reporter groups
JP7312929B2 (ja) 2016-07-29 2023-07-24 ソニーグループ株式会社 超明色二量体またはポリマー色素およびその調製のための方法
WO2019071153A1 (en) 2017-10-05 2019-04-11 Sony Corporation PROGRAMMABLE DENDRITIC MEDICINES
KR20260011205A (ko) 2017-10-05 2026-01-22 소니그룹주식회사 프로그램가능한 중합체성 약물
CN111836645A (zh) 2017-11-16 2020-10-27 索尼公司 可编程的聚合药物
CN111565756A (zh) 2018-01-12 2020-08-21 索尼公司 包含生物活性化合物的具有刚性间隔基团的聚合物
US12539334B2 (en) 2018-01-12 2026-02-03 Sony Group Corporation Phosphoalkyl polymers comprising biologically active agents
EP3737417B1 (en) 2018-01-12 2025-08-27 Sony Group Corporation Phosphoalkyl ribose polymers comprising biologically active compounds
KR102742386B1 (ko) 2018-03-19 2024-12-16 소니그룹주식회사 형광 신호 향상을 위한 2가 금속의 사용
CN118480073A (zh) 2018-03-21 2024-08-13 索尼公司 具有连接体基团的聚合串联染料
JP7580689B2 (ja) 2018-06-27 2024-11-12 ソニーグループ株式会社 デオキシリボースを含むリンカー基を有するポリマー色素
KR20210032434A (ko) 2018-07-13 2021-03-24 소니 주식회사 유기인산염 단위를 포함하는 백본을 갖는 중합체성 염료
WO2021062176A2 (en) 2019-09-26 2021-04-01 Sony Corporation Polymeric tandem dyes with linker groups
EP4038081A1 (en) 2019-09-30 2022-08-10 Sony Group Corporation Nucleotide probes
CN111533860B (zh) * 2020-06-10 2021-10-01 青岛天祥环保工程有限公司 水性涂料超疏水改性剂及其制备方法
EP4256078A1 (en) 2020-12-07 2023-10-11 Sony Group Corporation Spacing linker group design for brightness enhancement in dimeric or polymeric dyes
US12568803B2 (en) * 2023-03-03 2026-03-03 Applied Materials, Inc. Methods of forming interconnect structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2573371B2 (ja) 1989-10-11 1997-01-22 沖電気工業株式会社 3層レジスト法用の中間層形成材
JPH0443264A (ja) 1990-06-08 1992-02-13 Hitachi Zosen Corp 吸収式熱源装置
JPH0444741A (ja) 1990-06-12 1992-02-14 Toshiba Corp ステレオx線テレビ装置
JP2641644B2 (ja) 1991-05-16 1997-08-20 東京応化工業株式会社 多層レジスト法用積層材料の製造方法
JPH0638400A (ja) 1992-07-17 1994-02-10 Hitachi Ltd 小型情報処理装置のバッテリ装置
JP2901044B2 (ja) 1993-12-08 1999-06-02 沖電気工業株式会社 三層レジスト法によるパターン形成方法
US6743885B2 (en) * 2001-07-31 2004-06-01 Sumitomo Chemical Company, Limited Resin composition for intermediate layer of three-layer resist

Similar Documents

Publication Publication Date Title
JP2003280207A5 (2)
JP2000159758A5 (2)
JP2021162865A (ja) 半導体フォトレジスト用組成物およびこれを利用したパターン形成方法
CN111933329B (zh) 一种双面金属网格柔性导电膜及其制作方法
CN1092244C (zh) 直接沉积含金属的图案化膜的方法
JP2004094029A5 (2)
JP2019163463A5 (2)
CN1542547A (zh) 光敏树脂组合物和应用该组合物形成树脂图形的方法
DE112016000434T5 (de) Hybride topgraphische und chemische Vorstrukturen zur geführten Selbstorganisation von Block-Copolymeren
JP2006502837A5 (2)
DE2246020B2 (de) Verfahren zur Herstellung von Reliefoberflächen und Verwendung des Verfahrens zur Herstellung von Druckformen
JP2004117688A5 (2)
JP5078475B2 (ja) ポリオルガノシロキサン
EP1164435B1 (en) Photosensitive polysilazane composition and method of forming patterned polysilazane film
JP5241241B2 (ja) 感光性樹脂組成物
JP2004038143A5 (2)
JP2018123103A5 (2)
JP2004002753A5 (2)
TW200927825A (en) Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board
JP2004526844A5 (2)
JP2009109541A5 (2)
TW201232182A (en) Positive photosensitive resin composition and permanent resist
JP2010021190A (ja) めっき用めっき未析出材料、ならびにプリント配線板
JP4799429B2 (ja) 感光性樹脂組成物
JP2007527333A5 (2)