JP2004103652A5 - - Google Patents
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- Publication number
- JP2004103652A5 JP2004103652A5 JP2002260072A JP2002260072A JP2004103652A5 JP 2004103652 A5 JP2004103652 A5 JP 2004103652A5 JP 2002260072 A JP2002260072 A JP 2002260072A JP 2002260072 A JP2002260072 A JP 2002260072A JP 2004103652 A5 JP2004103652 A5 JP 2004103652A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- printed circuit
- heat
- plated printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006015 heat resistant resin Polymers 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002260072A JP2004103652A (ja) | 2002-09-05 | 2002-09-05 | ３層型メッキプリント回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002260072A JP2004103652A (ja) | 2002-09-05 | 2002-09-05 | ３層型メッキプリント回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004103652A JP2004103652A (ja) | 2004-04-02 |
| JP2004103652A5 true JP2004103652A5 (2) | 2005-11-04 |
Family
ID=32260895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002260072A Pending JP2004103652A (ja) | 2002-09-05 | 2002-09-05 | ３層型メッキプリント回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004103652A (2) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006001185A (ja) * | 2004-06-18 | 2006-01-05 | Dowa Mining Co Ltd | プラスチックフィルム、金属被覆基板、及び、それらの製造方法 |
| JP5126735B2 (ja) * | 2006-12-28 | 2013-01-23 | 東レ・デュポン株式会社 | フレキシブルプリント配線板 |
| JP5541122B2 (ja) * | 2010-11-30 | 2014-07-09 | 山一電機株式会社 | フレキシブル配線板 |
| JP2015046530A (ja) * | 2013-08-29 | 2015-03-12 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
-
2002
- 2002-09-05 JP JP2002260072A patent/JP2004103652A/ja active Pending
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