JP2004200726A - Substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of performing a predetermined inspection while reducing a burden on an operator and reducing contamination and breakage of a substrate.
An inspection device (4) for performing a predetermined inspection on a pattern obtained by a developing process is disposed at an end of a transfer path (71) for delivery of an indexer unit (70). The substrate developed by the substrate processing unit 80 is transferred from the processing unit substrate transfer robot 81 to the transfer substrate transfer robot 73 provided in the transfer transfer path 71. The transfer substrate transfer robot 73 transfers the substrate to the inspection device 4. The substrate after the inspection is stored in the cassette 74 by the transfer substrate transfer robot 73.
[Selection] Fig. 6

Description

  The present invention relates to a substrate processing apparatus that performs at least a development process and a heat treatment in a photolithography process.

  A series of processes in the photolithography process are performed by a substrate processing apparatus that performs various types of resist processing before and after the exposure processing and an exposure apparatus that performs the exposure processing. In this photolithography process, the pattern obtained by the development process, such as the overlay position accuracy of the upper and lower patterns formed in multiple stages on the surface of the substrate after the development process and the line width accuracy of the formed pattern, A predetermined inspection may be performed. In this inspection, conventionally, an operator takes out the substrate after the development processing from the substrate processing apparatus, transports the substrate manually to the inspection apparatus, and carries it into the inspection apparatus to perform the inspection. Also, when returning the inspected substrate to the substrate processing apparatus, the operator removes the inspected substrate from the inspection apparatus, transports the substrate to the substrate processing apparatus by hand, and returns the substrate to the substrate processing apparatus.

  However, as described above, loading and unloading the substrate into and out of the substrate processing apparatus and the inspection apparatus, and transporting the substrate between the substrate processing apparatus and the inspection apparatus by hand, burdens the operator, Further, there is a problem that there is a high risk of contaminating the substrate or dropping and damaging the substrate.

 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of reducing a burden on an operator, reducing contamination and breakage of a substrate, and performing a predetermined inspection. And

  The present invention has the following configuration to achieve such an object.

That is, the substrate processing apparatus according to the first aspect of the present invention includes a delivery path extending in a predetermined direction, a cassette mounting table disposed on one side of the delivery path, An indexer unit including a transfer substrate transfer robot provided in a transfer path for
A developing unit for performing a developing process for obtaining a pattern printed on the substrate by the exposure process, a thermal processing unit for performing a thermal process, and a substrate transport robot for a processing unit configured to transport the substrate to these processing units; A substrate processing unit disposed on the other side of the transfer path for the unit,
An inspection device for performing a predetermined inspection on the pattern obtained by the development process,
The inspection device is arranged at an end of the delivery path of the indexer unit.

  [Operation] According to the invention described in claim 1, in the substrate processing section, the processing section substrate transfer robot transfers the substrate to the development processing unit and the heat treatment unit, and the development processing and the heat treatment are performed. The substrate that has completed the development process or the substrate that has completed the heat treatment after the development process is transferred from the processing unit substrate transfer robot to the delivery substrate transfer robot of the indexer unit. The transfer substrate transfer robot transfers the received substrate to an inspection device arranged at an end of the transfer transfer path. The substrate that has undergone a predetermined inspection by the inspection device is stored in a cassette placed on a cassette mounting table by the transfer substrate transfer robot.

  According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the inspection apparatus transfers the substrate directly to the transfer substrate transfer robot.

  According to the second aspect of the present invention, the transfer substrate transfer robot directly transfers the substrate to and from the inspection apparatus.

  According to the first aspect of the present invention, an inspection device for performing a predetermined inspection on the pattern obtained by the development processing is disposed at an end of the delivery path of the indexer unit, and the delivery of the substrate to the inspection device is performed by the delivery substrate. Because the transfer robot is used, the transfer of the substrate between the substrate processing unit and the inspection device can be performed automatically, reducing the burden on the operator and reducing the risk of contamination and breakage of the substrate. can do.

  According to the second aspect of the present invention, since the transfer substrate transfer robot directly transfers the substrate to and from the inspection device, the IF unit is omitted and the inspection device is disposed adjacent to the transfer transfer path. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Reference example>
FIG. 1 is a plan view showing the entire configuration of a substrate processing apparatus according to a reference example of the present invention and a substrate processing system including the substrate processing apparatus.

  This substrate processing system corresponds to a substrate processing apparatus 1, an exposure apparatus 2, a first interface (IF) unit 3 for transferring a substrate between the substrate processing apparatus 1 and the exposure apparatus 2, and an inspection unit. The inspection apparatus includes an inspection apparatus 4 and a second interface (IF) unit 5 for transferring a substrate between the substrate processing apparatus 1 and the inspection apparatus 4.

  The substrate processing apparatus 1 includes a loader unit 11, first to fourth heat treatment units 12 to 15 for performing various heat treatments, a resist coating unit 16 for performing a resist film coating process, and a development processing unit for performing a development process. 17, a substrate transport mechanism (not shown) constituted by a conveyor or the like, and an unloader section 18. The loader section 11, the unloader section 18, and the processing units 12 to 17 are arranged in a two-row configuration. .

  That is, in the first column, a loader unit 11, a first heat treatment unit 12, a resist coating unit 16 and a second heat treatment unit 13 are arranged in this order from the left in the figure. In the second row adjacent to the processing units 11, 12, 16, and 13, a third heat treatment unit 14, a development processing unit 17, a fourth heat treatment unit 15, and an unloader unit 18 are arranged in order from the right in the figure. Are located.

  The substrate transport mechanism is provided in each of the first and second rows.

  The substrate transport mechanism provided in the first column converts the unprocessed substrate loaded from the loader unit 11 into the first heat treatment unit 12, the resist coating unit 16, the second substrate as shown by the arrow P1 in the figure. The wafers are conveyed in the order of the heat treatment unit 13, and the respective processing units 12, 16, and 13 perform each processing before the exposure processing. Further, the substrate transport mechanism provided in the second column, as shown by the arrow P2 in the drawing, converts the exposed substrate received from the first IF unit 3 into the third heat treatment unit 14, the development processing unit 17 and the like. Then, the substrate is transported in the order of the fourth heat treatment unit 15, each of the processing units 14, 17, and 15 is subjected to each processing after the exposure processing, and the substrate after the series of the photolithography process is unloaded from the unloader unit 18. Let it.

  Each of the first to fourth heat treatment units 12 to 15 includes a heat treatment unit and a cooling treatment unit. In each of the heat treatment units 12 to 15, after performing a predetermined heat treatment in the heat treatment unit, The substrate heated by the cooling processing unit is cooled to a predetermined temperature. The first heat treatment unit 12 performs a heat treatment (such as an adhesion enhancer application process (HMDS treatment)) before the resist coating process, and the second heat treatment unit 13 performs a heat treatment (soft bake) after the resist coating process. In the heat treatment unit 14, heat treatment after exposure processing is performed, and in the fourth heat treatment unit 15, heat treatment (hard bake) after development processing is performed.

  The exposure apparatus 2 includes an exposure machine such as a stepper, an alignment mechanism for positioning, a substrate transport robot for transporting the substrate in the exposure apparatus 2, and the like (all not shown). An exposure process for printing a predetermined pattern on the applied resist film is performed. The exposure apparatus 2 is arranged near the second and third heat treatment units 13 and 14 of the substrate processing apparatus 1 with the first IF unit 3 interposed therebetween.

  The first IF unit 3 has one side surface adjacent to the second and third heat treatment units 13 and 14 of the substrate processing apparatus 1 and the other side surface disposed adjacent to the exposure apparatus 2. A substrate between exposure apparatuses for receiving the substrate from the second heat treatment unit 13 and delivering the substrate to the exposure apparatus 2 and delivering the exposed substrate received from the exposure apparatus 2 to the third heat treatment unit 14 of the substrate processing apparatus 1 A substrate transfer robot 31 is provided as transfer means.

  The substrate transfer robot 31 includes a substrate holding arm 31a that holds a substrate, and an arm support 31b that supports the substrate holding arm 31a. The substrate holding arm 31a is configured to be able to advance and retreat in a horizontal direction (a direction parallel to the plane of FIG. 1) with respect to the arm support base 31b. Further, in this reference example, the arm support base 31b is reciprocated in the Y direction in FIG. 1 (change of the position of the forward / backward movement of the substrate holding arm 31a in the Y direction) or in the vertical direction (perpendicular to the plane of FIG. 1). (Change of the height position of the substrate holding arm 31a), turning around the axis R1 in the vertical direction (change of the forward / backward movement direction of the substrate holding arm 31a in the horizontal plane), and the like. ing.

  The substrate transfer robot 31 combines the operations of the arm support table 31b and the substrate holding arm 31a as appropriate to transfer the substrate from the second heat treatment unit 13 to the exposure apparatus 2, and to transfer the substrate from the exposure apparatus 2 to the third heat treatment unit. 14 is provided.

  Although only one substrate transfer robot 31 is shown in the drawing, two or more substrate transfer robots 31 are provided in the first IF unit 3 and the plurality of substrate transfer robots 31 cooperate. Thus, the transfer of the substrate between the substrate processing apparatus 1 and the exposure apparatus 2 may be performed.

  Further, the first IF unit 3 is provided with a substrate storage unit 32 for temporarily storing the substrate, and the timing of the transfer of the substrate between the substrate processing apparatus 1 and the exposure apparatus 2 is shifted. In such a case, the gap is absorbed by temporarily storing the substrate in the substrate storage section 32 to prevent the transfer of the substrate between the devices 1 and 2 from being stagnated.

  For example, when the substrate transfer robot 31 receives a substrate from the second heat treatment unit 13 and intends to deliver the substrate to the exposure apparatus 2, if the exposure apparatus 2 is not at the substrate reception timing, the substrate transfer robot 31 Stores the substrate received from the second heat treatment unit 13 in the substrate storage section 32, and when the exposure apparatus 2 side receives the substrate, the substrate transfer robot 31 takes out the substrate stored in the substrate storage section 32 and retrieves the exposure apparatus 2 Hand over to Similarly, when the substrate transfer robot 31 receives the substrate from the exposure apparatus 2 and intends to transfer the substrate to the third heat treatment unit 14, the third heat treatment unit 14 is not in the timing of receiving the substrate. The substrate transfer robot 31 stores the substrate received from the exposure apparatus 2 in the substrate storage unit 32, and when the third heat treatment unit 14 comes to receive the substrate, the substrate transfer robot 31 deletes the substrate stored in the substrate storage unit 32. It is taken out and delivered to the third heat treatment unit 14. Note that the substrate storage unit 32 is configured to simultaneously store a plurality of substrates waiting to be delivered in consideration of a case where the timing of delivery of the substrate between the substrate processing apparatus 1 and the exposure apparatus 2 is large. ing.

  The inspection apparatus 4 includes an alignment mechanism for positioning, an appropriate inspection mechanism including a pattern reading head and the like, a substrate transport robot that transports the substrate in the inspection apparatus 4, and the like, like the conventional single inspection apparatus. (Neither is shown), and relates to the pattern obtained by the developing process, such as the overlay position accuracy of the upper and lower patterns formed by multi-layering on the substrate surface and the line width accuracy of the formed pattern. It is configured to perform a predetermined inspection. The inspection device 4 is disposed near the development processing unit 17 of the substrate processing apparatus 1 with the second IF unit 5 interposed therebetween.

  The second IF unit 5 has one side surface adjacent to the development processing unit 17 of the substrate processing apparatus 1 and the other side surface disposed adjacent to the inspection device 4. A substrate transfer robot 51 is provided as an inter-inspection unit substrate transfer unit for receiving and transferring the substrate to the inspection device 4 and transferring the inspected substrate received from the inspection device 4 to the development processing unit 17.

  The substrate transfer robot 51 includes a substrate holding arm 51a for holding a substrate, and an arm support table 51b for supporting the substrate holding arm 51a. The substrate holding arm 51a is configured to be able to move forward and backward in the horizontal direction with respect to the arm support base 51b. Further, in this reference example, the arm support base 51b is configured to be able to move up and down, turn around the vertical axis R2, and the like.

  The substrate transfer robot 51 transfers the substrate between the substrate processing apparatus 1 (developing processing unit 17) and the inspection apparatus 4 by appropriately combining the operations of the arm support table 51b and the substrate holding arm 51a. It is configured.

  Although only one substrate transfer robot 51 is shown in the drawing, as in the case of the first IF unit 3, two or more substrate transfer robots 51 are provided in the second IF unit 5, The two substrate transfer robots 51 may cooperate to transfer a substrate between the substrate processing apparatus 1 and the inspection apparatus 4.

  Further, the second IF unit 4 also includes a substrate storage unit 52 for temporarily storing the substrate, and absorbs a deviation in the timing of transferring the substrate between the substrate processing apparatus 1 and the inspection apparatus 4. Thus, the delivery of the substrate between these devices 1 and 4 is prevented from being stagnated.

  FIG. 2 is a block diagram showing a schematic configuration of the control system of the reference example.

  The substrate processing apparatus 1, the exposure apparatus 2, and the inspection apparatus 4 are interconnected via a host computer 6, and data can be transmitted between the apparatuses 1, 2, and 4 via the host computer 6. It is configured as follows.

  The substrate processing apparatus 1 includes a main controller (CPU) 19 that manages the operation of the entire apparatus. Further, each of the processing units 12 to 17 is provided with a controller (CPU) Ct for controlling each process, and the substrate transport mechanism is provided with a controller (CPU) Ct for controlling a substrate transport operation and the like. The main controller 19 and each controller Ct are connected, and the substrate is transported based on the control information of the main controller 19 and the like, and the processing in each of the processing units 12 to 17 is performed.

  The board transfer robot 31 in the first IF unit 3 and the board transfer robot 51 in the second IF unit 5 are also provided with a controller (Ct) for controlling the transfer operation of each board. The controller Ct is also connected to the main controller 19. Then, for example, timing information on the exposure apparatus 2 side regarding the delivery of the substrate is provided from the exposure apparatus 2 to the controller Ct of the substrate delivery robot 31 in the first IF unit 3 via the host computer 6 and the main controller 19. Based on the information, the substrate transfer robot 31 performs a substrate transfer operation to the exposure apparatus 2. Further, the delivery operation of the substrate to the substrate processing apparatus 1 is performed based on timing information or the like given from the main controller 19. The substrate transfer operation by the substrate transfer robot 5 in the second IF unit 5 is also performed in the same configuration as the substrate transfer operation by the substrate transfer robot 31 in the first IF unit 3.

  In addition, since data can be transmitted between the apparatuses 1, 2, and 4 mutually, the inspection result of the inspection apparatus 4 is given to the substrate processing apparatus 1 (main controller 19) and the exposure apparatus 2 via the host computer 6. It is also possible. The inspection result given to the main controller 19 of the substrate processing apparatus 1 can be given from the main controller 19 to the third and fourth heat treatment units 14 and 15 and the development processing unit 17.

  The operation of this reference example is as follows.

  That is, the substrate carried in from the loader unit 11 is subjected to a heat treatment before the resist coating treatment in the first heat treatment unit 12, and then is subjected to the resist film coating treatment in the resist coating treatment unit 16. The second heat treatment unit 13 performs a heat treatment after the resist coating process, and is delivered to the exposure apparatus 2 via the first IF unit 3 and subjected to an exposure process. The substrate that has been subjected to the exposure processing in the exposure apparatus 2 is transferred from the exposure apparatus 2 to the third heat treatment unit 14 via the first IF unit 3, and subjected to a heat treatment after the exposure processing in the third heat treatment unit 14. Then, when the inspection is performed after the development processing is performed in the development processing unit 17, the inspection is transferred to the inspection device 4 via the second IF unit 5 and the inspection is performed. Then, the inspected substrate is returned to the substrate processing apparatus 1 (developing processing unit 17) again via the second IF unit 5, and is conveyed to the fourth thermal processing unit 15 where the thermal processing after the development processing is performed. , From the unloader unit 18. The substrate not subjected to the inspection is subjected to the development processing in the development processing unit 17, and then is transported to the fourth heat treatment unit 15, subjected to the heat treatment after the development processing, and is carried out from the unloader unit 18.

  The above-described series of operations are continuously performed, that is, unprocessed substrates are successively carried in from the loader unit 11, and transfer and transfer operations of the substrates are performed in cooperation with each other, and the processing units 12 to 17 and the devices 2 and 4 are performed. Are performed simultaneously and in parallel, and the substrates that have been subjected to the predetermined processing (and inspection) are unloaded one after another from the unloader unit 18.

  As described above, according to the configuration of this reference example, since the first IF unit 5 (substrate transfer robot 51) that transfers the substrate between the substrate processing apparatus 1 and the inspection apparatus 4 is provided, the inspection is performed. The loading and unloading of substrates to and from the apparatus 4 and the substrate processing apparatus 1 and the transfer of substrates between the substrate processing apparatus 1 and the inspection apparatus 4 can be performed automatically, so that the burden on the operator can be reduced and Risks such as contamination and breakage can be reduced.

  In addition, by changing a program or the like executed by the main controller 19, it is possible to perform an operation including each processing performed by the substrate processing apparatus 1 and an inspection performed by the inspection apparatus 4 in various patterns. For example, it is possible to operate so as to inspect all the substrates that have completed the developing process (inspection of all the substrates) or to deliver only a predetermined substrate to the inspection device 4 to inspect (periodic inspection). is there.

  In addition, by displaying the inspection result of the inspection device 4 on an appropriate display device or storing the inspection result in an appropriate storage device, it is possible to manage the state of the substrate processing. Further, if the inspection result is given to the substrate processing apparatus 1 (main controller 19) and the exposure apparatus 2, the exposure apparatus 2, the development processing unit 17 in the substrate processing apparatus 1, and the third and fourth heat treatments after the exposure processing are performed. Inspection results can be used in the heat treatment units 14 and 15 of the present invention, and the processing conditions of future exposure processing, heating processing, and development processing (exposure processing conditions such as alignment conditions and exposure amount in exposure processing, heating during heating processing) Heat treatment conditions such as temperature and heating time, and development processing conditions such as the development time during the development process and the temperature of the developing solution).

  In addition, according to the configuration of this reference example, since the first IF unit 3 (substrate transfer robot 31) that transfers a substrate between the substrate processing apparatus 1 and the exposure apparatus 2 is provided, a photolithography process is performed. Each process can be performed automatically and continuously.

(Modification of Reference Example)
As shown in FIGS. 3A and 3B, the processing unit provided in the substrate processing apparatus 1 has only the third and fourth heat treatment knits 14 and 15 for performing the heat treatment after the exposure processing and the development processing unit 17. It may be. In the configuration of FIG. 3A, the substrate after the exposure processing is carried into the substrate processing apparatus 1 from the loader unit 11. Further, in the configuration of FIG. 3B, a substrate that has been subjected to a predetermined process before the exposure process is carried in from the loader unit 11 and delivered to the exposure apparatus 2 via the first IF unit 3, where the exposure process is performed. Then, the exposed substrate is transferred to the third heat treatment unit 14 via the first IF unit 3.

  As shown in FIG. 4A, one side surface of the second IF unit 5 is arranged adjacent to the development processing unit 17 and the fourth heat treatment unit 15 of the substrate processing apparatus 1 and the substrate transfer robot 51 The (arm support 51b) is configured to be reciprocally movable in the X direction in the figure, and the substrate after the development processing is delivered from the development processing unit 17 to the inspection device 4 via the second IF unit 5, and the inspection is completed. The substrate may be delivered to the fourth heat treatment unit 15 via the second IF unit 5 so that the fourth heat treatment unit 15 performs heat treatment after the development processing. Further, as shown in FIG. 4B, one side surface of the first IF unit 5 is arranged adjacent to the fourth heat treatment unit 15 of the substrate processing apparatus 1, and the heat treatment after the development processing is completed. Is transferred from the fourth heat treatment unit 15 to the inspection device 4 via the second IF unit 5, and the inspected substrate is transferred to the fourth heat treatment unit 15 via the second IF unit 5 and is sent to the unloader section 18. You may comprise so that it may be conveyed and carried out from there. Further, as shown in FIG. 4C, one side surface of the first IF unit 5 is arranged adjacent to the fourth heat treatment unit 15 and the unloader section 18 of the substrate processing apparatus 1, and the substrate transfer robot is provided. 51 (arm support table 51 b) is configured to be reciprocally movable in the X direction in the figure, and the substrate subjected to the heat treatment after the development processing is inspected from the fourth heat treatment unit 15 via the second IF unit 5 by the inspection device 4. And the inspected board may be delivered to the unloader section 18 via the second IF unit 5 and carried out therefrom. In addition, the modification shown in each figure of FIG. 4 can be similarly applied to the modification shown in each figure of FIG.

  As shown in FIG. 5, the inspection apparatus 4 is unitized and incorporated into the substrate processing apparatus 1, and is provided between the developing processing unit 17 and the fourth heat treatment unit 15 (FIG. 5A) or the fourth heat treatment. You may comprise so that it may be arrange | positioned between the unit 15 and the unloader part 18 (FIG.5 (b)). The modification shown in each drawing of FIG. 5 can be similarly applied to the modification shown in each drawing of FIG.

<First embodiment>
FIG. 6 is a plan view showing the entire configuration of the substrate processing apparatus and the substrate processing system including the substrate processing apparatus according to the first embodiment of the present invention. In the first embodiment, the same reference numerals as in FIG. 1 denote parts common to the above-described reference examples or parts having similar functions, and a description thereof will be omitted unless it is particularly necessary.

  In the first embodiment, the configuration of the substrate processing apparatus 1 and the arrangement of the exposure apparatus 2 and the inspection apparatus 4 are different from those of the reference example.

  The substrate processing apparatus 1 according to the first embodiment includes an indexer unit 70 and a substrate processing unit 80. The indexer unit 70 includes a transfer path 71 extending in a predetermined direction, a cassette mounting table 72 disposed on one side of the transfer path 71, and a transfer board transfer unit provided in the transfer path 71. The transfer substrate transfer robot 73 is provided. The substrate processing section 80 is arranged on the other side of the transfer path 71. The exposure apparatus 2 is disposed near one end of the transfer path 71 with the first IF unit 3 interposed therebetween. 71 is arranged adjacent to one end and the other side surface is arranged adjacent to the exposure apparatus 2. Further, the inspection device 4 is disposed near the other end of the delivery transport path 71 with the second IF unit 5 interposed therebetween. 71 is arranged adjacent to the other end, and the other side surface is arranged adjacent to the inspection device 4.

  The cassette mounting table 72 of the indexer unit 70 is configured such that a plurality of (four in the figure) cassettes 74 for transporting between apparatuses as a substrate storage unit can be mounted. Each cassette 74 is configured such that a plurality of substrates W can be stacked in a vertical direction (a direction perpendicular to the plane of FIG. 6) in multiple stages and stored in a horizontal posture. Each of these cassettes 74 is mounted on the cassette mounting table 72 along the longitudinal direction (Y direction in FIG. 6) of the transfer path 71 for delivery.

  The transfer substrate transfer robot 73 includes a substrate holding arm 73a that holds the substrate W and an arm support 73b that supports the substrate holding arm 73a. The substrate holding arm 73a has a substantially I-shape in plan view, and is configured to be able to advance and retreat in a horizontal direction (a direction parallel to the paper surface of FIG. 6) with respect to the arm support 73b. Further, the arm support base 73b reciprocates in the Y direction along the longitudinal direction of the transfer path 71 for transfer (change of the position of the forward and backward movement of the substrate holding arm 73a in the Y direction) and moves up and down in the vertical direction ( In addition to being capable of changing the height position of the substrate holding arm 73a), it is also configured to be capable of turning around the axis Q1 in the vertical direction (changing the moving direction of the substrate holding arm 73a in the horizontal plane). .

  The transfer substrate transfer robot 73 transfers the substrate W in the transfer path 71 and stores a predetermined substrate W in a desired cassette 74 by appropriately combining the operations of the arm support table 73b and the substrate holding arm 73a. The transfer of the substrate W to / from the place, the transfer of the substrate W to / from the processing unit substrate transfer robot 81 provided in the substrate processing unit 80, and the transfer of the substrate W to / from the substrate transfer robot 31 in the first IF unit 3. And the transfer of the substrate W to and from the substrate transfer robot 51 in the second IF unit 5.

  The substrate processing unit 80 includes a processing unit substrate transfer robot 81 corresponding to a processing unit substrate transfer unit at the center, and a resist coating processing unit 16 and a development processing unit around the processing unit substrate transfer robot 81 so as to surround the processing unit substrate transfer robot 81. 17, a heat treatment unit TP is provided. In each of the processing units 16, 17, and TP, a resist coating processing unit 16 and a development processing unit 17 (two each in FIG. 6) are arranged in the first stage, and a plurality of heat treatment units TP are stacked thereon. . In this embodiment, an arbitrary heat treatment unit TP is selected, and various heat treatments such as heat treatment before and after resist coating, heat treatment after exposure, and heat treatment after development are performed.

  The substrate transfer robot 81 for a processing unit includes a substrate holding arm 81a for holding a substrate W and an arm support table 81b for supporting the substrate holding arm 81a. The substrate holding arm 81a has a substantially U-shape in plan view, and is configured to be able to advance and retreat in the horizontal direction with respect to the arm support 81b. Further, in this embodiment, the arm support 73b can move up and down (change the height position of the substrate holding arm 81a), and can turn around the vertical axis Q2 (the substrate holding arm 81a in a horizontal plane). (Change of the forward / backward moving direction) is also possible.

  The processing unit substrate transfer robot 81 transfers the substrate W between the processing units 16, 17, and TP arranged in the substrate processing unit 80 by appropriately combining the operations of the arm support base 81 b and the substrate holding arm 81 a. And the transfer of the substrate W to and from each of the processing units 16, 17 and TP, and the transfer of the substrate W to and from the transfer substrate transfer robot 73.

  The configuration of the control system of the first embodiment also has the same configuration as that of the reference example (see FIG. 2).

  The operation of the first embodiment is as follows.

  First, the transfer substrate transfer robot 73 takes out the unprocessed substrate W from the cassette 74, transfers the unprocessed substrate W through the transfer transfer path 71, and sends the unprocessed substrate W to the processing unit substrate transfer robot 81 in the substrate processing unit 80. The unprocessed substrate W is delivered.

  The processing unit substrate transport robot 81 transports the received unprocessed substrate W between the processing units 16 and TP, and performs a heat treatment before the resist coating processing, a heat treatment unit TP, the resist coating processing unit 16, and a heat treatment after the resist coating processing. Are sequentially delivered to the heat treatment unit TP for performing the series of processes before the exposure process. The substrate W which has completed the processing before the exposure processing is transferred from the processing section substrate transfer robot 81 to the delivery substrate transfer robot 73.

  The transfer substrate transfer robot 73 having received the substrate W before the exposure processing transfers the substrate W to the exposure apparatus 2 via the first IF unit 3 (substrate transfer robot 31). Then, the exposed substrate W subjected to the exposure processing by the exposure device 2 is transferred from the exposure device 2 to the transfer substrate transfer robot 73 via the first IF unit 3.

  The transfer substrate transfer robot 73 that has received the exposed substrate W transfers the substrate W to the processing unit substrate transfer robot 81. The processing unit substrate transport robot 81 transports the received exposure-processed substrate W between the processing units 17 and TP and performs a heat treatment after the exposure processing, a development processing unit 17, and a heat treatment after the development processing. The substrate W is sequentially delivered to the heat treatment unit TP to be performed, and a series of processes after the exposure process are performed. The substrate W after the processing after the exposure processing is delivered from the processing section substrate transport robot 81 to the delivery substrate transport robot 73.

  If the substrate W after the exposure processing is not the inspection target substrate W, the substrate W is stored in the cassette 74 by the transfer substrate transport robot 73.

  On the other hand, if the substrate W after the exposure processing is the substrate W to be inspected, the substrate W is inspected from the transfer substrate transfer robot 73 via the second IF unit 5 (substrate transfer robot 51). After being delivered to the device 4 and undergoing a predetermined inspection by the inspection device 4, the inspected substrate W is delivered from the inspection device 4 to the delivery substrate transport robot 73 via the second IF unit 5 and is delivered. Is stored in the cassette 74 by the substrate transfer robot 73.

  In the first embodiment, the above-described series of operations are continuously performed, that is, the unprocessed substrates W are sequentially taken out of the cassette 74, and the substrate transfer robots 73 and 81 and the substrate transfer robots 31 and 51 cooperate. The processing and inspection in each of the processing units 16 and 17 and the TP and each of the devices 2 and 4 are performed simultaneously and in parallel, and the substrates W that have been subjected to the predetermined processing (and inspection) are successively stored in the cassette 74. It will be stored.

  In the first embodiment, the following operation is performed when inspecting the substrate W after the development processing.

  That is, the same processing as described above is performed up to the development processing. When the development processing is completed, the substrate W after the development processing is delivered from the processing unit substrate transport robot 81 to the delivery substrate transport robot 73, and the delivery substrate is delivered. It is delivered to the inspection device 4 from the transfer robot 73 via the second IF unit. After the inspection device 4 has undergone a predetermined inspection, the inspected substrate W is transferred from the inspection device 4 to the transfer substrate transfer robot 73 via the second IF unit 5, and the transfer substrate transfer robot 73 From 73, the substrate is transferred to the processing unit substrate transfer robot 81. The processing unit substrate transport robot 81 transfers the received inspected substrate W to the heat treatment unit TP that performs the heat treatment after the development processing, and performs the heat treatment after the development processing. The processed substrate W is transferred from the processing section substrate transfer robot 81 to the transfer substrate transfer robot 73, and is stored in the cassette 74 by the transfer substrate transfer robot 73.

  According to the configuration of the first embodiment, the same effect as that of the reference example can be obtained. In addition, according to the configuration of the first embodiment, the cassette 74 and the substrate processing unit 80 are arranged with the transfer path 71 interposed therebetween. Since the transfer of the substrate W to and from the processing unit substrate transfer robot 81 is performed by the transfer substrate transfer robot 73, the size of the substrate processing apparatus can be reduced. In addition, since the first IF unit 3 and the exposure device 2 and the second IF unit 5 and the inspection device 4 are disposed at each end of the transfer path 71, the exposure device 2 and the inspection device 4 can be compactly installed.

<Second embodiment>
FIG. 7 is a plan view showing the configuration of the substrate processing apparatus according to the second embodiment of the present invention. In the second embodiment, portions common to the above-described reference example and the first embodiment or portions having similar functions are denoted by the same reference numerals as in FIGS. 1 and 6, and unless otherwise required. , The description of which is omitted. In FIG. 7, the transfer substrate transfer robot 73 and the substrate transfer robots 31 and 51 in each of the IF units 3 and 5 are shown in a simplified manner. The configuration is similar to that of the first embodiment.

  The second embodiment is different from the first embodiment in the configuration of the substrate processing unit 80 of the substrate processing apparatus 1.

  The substrate processing unit 80 of the substrate processing apparatus 1 according to the second embodiment includes a processing unit transfer path 82 extending in a direction (X direction in FIG. 7) orthogonal to the transfer path 71 for transfer. The processing units 16, 17, and TP are arranged along the processing unit transport path 82 on both sides of the path 82. In this configuration, a heat treatment unit TP related to heat treatment is arranged on one side of the transfer path 82 for the processing unit, and the resist coating unit 16 related to the non-heat treatment is arranged on the other side of the transfer path 82 for the processing unit. And a developing unit 17 are arranged.

  Further, the processing unit substrate transfer robot 81 performs the horizontal movement of the substrate holding arm 81a with respect to the arm support base 81b, the vertical movement of the arm support base 81b, and the rotation around the axis Q2. It is configured such that horizontal movement (reciprocal movement in the X direction in FIG. 7) along the longitudinal direction of the transfer path 82 can also be performed.

  According to the configuration of the second embodiment, the same effect as that of the first embodiment can be obtained.

<Third embodiment>
FIG. 8 is a plan view showing a configuration of an indexer section which is a main part of the substrate processing apparatus according to the third embodiment of the present invention, and FIG. 9 is a plan view of the indexer section of the substrate processing apparatus according to the third embodiment. FIG. 10 is a vertical sectional view of the indexer unit of the substrate processing apparatus according to the third embodiment as viewed from the substrate processing unit side. In the third embodiment, portions common to the first and first embodiments or portions having the same functions are denoted by the same reference numerals as in FIGS. 1 and 6, and unless otherwise required. , The description of which is omitted.

  In the third embodiment, the transfer substrate transfer means is constituted by a plurality of substrate transfer robots. Although the configuration of the substrate processing unit 80 is omitted in the figure, the substrate processing unit 80 may have the configuration shown in the first embodiment or the configuration shown in the second embodiment. You may.

  In the third embodiment, the transfer substrate transfer means of the indexer unit 70 of the substrate processing apparatus 1 is constituted by six first to sixth substrate transfer robots 91 to 96.

  The first substrate transfer robot 91 disposed on the cassette mounting table 72 side has the same configuration as the transfer substrate transfer robot 73 of the first embodiment. Reference numerals 91a and 91b in the figure indicate a substrate holding arm and an arm support corresponding to the substrate holding arm 73a and the arm support 73b of the transfer substrate transfer robot 73.

  The second to sixth substrate transfer robots 92 to 96 are arranged closer to the substrate processing unit 80 than the reciprocating movement area of the first substrate transfer robot 91 in the Y direction. The second substrate transfer robot 92 is disposed on the front side of the processing unit substrate transfer robot 81 at the lowest first level H1 of the three levels set in the vertical direction (Z direction). Have been. The third substrate transfer robot 93 is disposed above the second substrate transfer robot 92 on the second height level H2 having an intermediate height, and the fourth substrate transfer robot 94 is disposed above the third substrate transfer robot 93 at the highest position. It is arranged on the third higher level H3. The second to fourth substrate transfer robots 92 to 94 have the same structure. As shown in FIG. 11, each of the substrate transport robots 92 to 94 includes a substrate holding frame 97a and an arm support base 97b that supports the substrate holding frame 97a. The substrate holding frame 97a is configured to be capable of moving forward and backward with respect to the arm support base 97b toward the processing unit substrate transfer robot 81. The arm support base 97b is configured to be able to move up and down (change the height position of the substrate holding arm 97a) in each of the height levels H1 to H3. Four board holding pins 97c are provided upright on the board holding frame 97a. These substrate support pins 97c are configured in a stepped structure, and place and support the outer peripheral portion of the substrate W, and contact the outer peripheral edge of the substrate W to restrict the horizontal movement of the substrate W, so that the substrate holding frame 97a The substrate W is held in a state where the substrate W is floated.

  The fifth substrate transfer robot 95 is disposed on the second IF unit 5 side of the third substrate transfer robot 93 in the second height hierarchy H2, and the sixth substrate transfer robot 96 is connected to the third height H3. In the layer H3, the fourth substrate transfer robot 94 is arranged on the side of the first IF unit 3 side. The fifth and sixth substrate transfer robots 95 and 96 have the same structure. Each of the substrate transfer robots 95 and 96 includes a substrate holding arm 98a having a substantially I shape in plan view, and an arm support base 98b that supports the substrate holding arm 98a. The substrate holding arm 98a is configured to be capable of moving forward and backward with respect to the arm support base 98b, and the arm support base 98b is capable of moving up and down (changing the height position of the substrate holding arm 98a) and has a vertical axis. Turning around Q3 and Q4 (changing the direction of movement of the substrate holding arm 98a in the horizontal plane) is also possible.

  In the third embodiment, the transfer and delivery of the substrate W are performed as follows.

  The substrate W is taken out of the cassette 74 by the first substrate transfer robot 91. The substrate W is transferred from the first substrate transfer robot 91 to the second substrate transfer robot 92, and is processed by the second substrate transfer robot 92. The substrate is transferred to the substrate transfer robot 81, and a series of processing before exposure processing is performed in the substrate processing unit 80. The substrate W that has completed the processing before the exposure processing is transferred from the processing section substrate transfer robot 81 to the fourth substrate transfer robot 94, transferred from the fourth substrate transfer robot 94 to the sixth substrate transfer robot 96, and The wafer is transferred from the transfer robot 96 to the substrate transfer robot 31 in the first IF unit 3 and transferred to the exposure apparatus 2. The substrate W that has been subjected to the exposure processing is transferred in the reverse flow to the substrate transfer robot for the processing unit via the substrate transfer robot 31, the sixth substrate transfer robot 96, and the fourth substrate transfer robot 94 in the first IF unit 3. The substrate is transferred to the robot 81 and subjected to a series of processes after the exposure process in the substrate processing unit 80. When the substrate W after the exposure processing is not inspected, the substrate W is transferred from the processing substrate transfer robot 81 to the second substrate transfer robot 92, and is transferred from the second substrate transfer robot 92 to the first substrate transfer robot 91. Then, it is stored in the cassette 74 by the first substrate transfer robot 91. On the other hand, when inspecting the substrate W after the processing after the exposure processing, the substrate W is transferred from the processing substrate transfer robot 81 to the third substrate transfer robot 93, and is transferred from the third substrate transfer robot 93 to the fifth substrate transfer robot 95. It is delivered from the fifth substrate transfer robot 95 to the substrate delivery robot 51 in the second IF unit 5 and delivered to the inspection device 4. The substrate W after the inspection is transferred from the substrate transfer robot 51 in the second IF unit 5 to the first substrate transfer robot 91, and is stored in the cassette 74 by the first substrate transfer robot 91.

  When inspecting the substrate W after the development processing, the substrate W after the development processing is transferred from the processing substrate transport robot 81 to the third substrate transport robot 93, the fifth substrate transport robot 95, and the second IF. The substrate W, which has been delivered to the inspection device 4 via the substrate transfer robot 51 in the unit 5 and has been inspected, has a reverse flow, and the substrate transfer robot 51 in the second IF unit 5 and the fifth substrate transfer robot 95, is transferred to the processing substrate transfer robot 81 via the third substrate transfer robot 93, and is subjected to a heat treatment after the development processing in the heat treatment unit TP in the substrate processing unit 80. Then, the substrate W after the series of processes in the photolithography process is delivered from the processing substrate transport robot 81 to the second substrate transport robot 92, and is delivered from the second substrate transport robot 92 to the first substrate transport robot 91. Are stored in the cassette 74 by the first substrate transfer robot 91.

  According to the configuration of the third embodiment, the transfer of the substrate W into and out of the cassette 74, the transfer of the substrate W to and from the processing unit substrate transfer robot 81, and the transfer of the substrate W by the substrate transfer robot 31 in the first IF unit 3 And the transfer of the substrate W to and from the substrate transfer robot 51 in the second IF unit 5 is performed by sharing the plurality of substrate transfer robots 91 to 96. The transfer of the substrates W can be performed smoothly without causing overwork of the substrate transport robot, and the operations such as the transfer of each substrate W can be performed simultaneously, thereby improving the throughput.

[Modification of First to Third Embodiments]
In the drawings of the following modified examples, the configuration of the substrate processing apparatus 1 is shown by the configuration of the first embodiment, but the configuration of the substrate processing apparatus 1 of the second and third embodiments is similarly modified. Can be implemented.

  The processing unit provided in the substrate processing unit 80 of the substrate processing apparatus 1 may be configured to include only the heat treatment unit TP for performing the heat treatment after the exposure processing and the development processing unit 17. In this modified example, the cassette 74 stores a substrate W that has been processed before the exposure processing or a substrate W that has been subjected to the exposure processing. When the substrate W after the processing before the exposure processing is stored in the cassette 74, if the first IF unit 3 is provided as in the above embodiment, the exposure processing and the heat treatment and the development processing after the exposure processing are performed. A series of processes can be performed automatically and continuously. On the other hand, when the exposed substrate W is stored in the cassette 74, the first IF unit 3 is omitted.

  As shown in FIG. 12A, the inspection device 4 and the second IF unit 5 may be arranged on the side of the substrate processing unit 80 opposite to the indexer unit 70. In this case, the processing unit substrate transfer robot 81 transfers the substrate W to and from the substrate transfer robot 51 in the second IF unit 5. Further, in this configuration, the exposure device 2 and the first IF unit 3 may be arranged only on one end side of the transfer path 71 for transfer, but as shown in FIG. The exposure device 2 and the first IF unit 3 may be arranged on both ends of the transport path 71, respectively. With the configuration shown in FIG. 12A, the exposure processing can be distributed to two exposure apparatuses 2. Further, as shown in FIG. 12B, the exposure apparatus 2 and the first IF unit 3 may be arranged on the side of the substrate processing unit 80 opposite to the indexer unit 70.

  In addition, the inspection device 4 includes a delivery substrate transfer robot 73 (in the first and second embodiments), a fifth substrate transfer robot 95 (in the third embodiment), and a processing unit substrate transfer robot 81 (see FIG. In the case of a configuration in which the transfer of the substrate W can be performed directly with the case of the modified example of the twelfth embodiment, the second IF unit 5 is omitted and the end portion (first to first) of the transfer path 71 for transfer is omitted. The inspection apparatus 4 may be arranged adjacent to the side of the substrate processing unit 80 opposite to the indexer unit 70 (in the case of the modification in FIG. 12). Similarly, the exposure apparatus 2 includes a transfer substrate transfer robot 73 (in the first and second embodiments), a sixth substrate transfer robot 96 (in the third embodiment), When the configuration is such that the substrate W can be directly transferred to and from the substrate transfer robot 81 (in the case of the modified example of FIG. 12), the first IF unit 3 is omitted and the end of the transfer path 71 for transfer is omitted. The exposure apparatus 2 is arranged adjacent to the exposure unit 2 (in the case of the first to third embodiments) or the side of the substrate processing unit 80 opposite to the indexer unit 70 (in the case of the modification of FIG. 12). You may comprise.

FIG. 1 is a plan view illustrating an overall configuration of a substrate processing apparatus according to a reference example of the present invention and a substrate processing system including the substrate processing apparatus. FIG. 4 is a block diagram illustrating a configuration of a control system of a reference example. It is a top view showing the composition of the modification of a reference example. It is a top view which shows the principal part structure of another modification of a reference example. It is a top view which shows the principal part structure of another modification of a reference example. FIG. 1 is a plan view illustrating an overall configuration of a substrate processing apparatus according to a first embodiment of the present invention and a substrate processing system including the substrate processing apparatus. It is a top view showing the composition of the substrate processing device concerning a 2nd example of the present invention. FIG. 11 is a plan view illustrating a configuration of an indexer unit that is a main part of a substrate processing apparatus according to a third embodiment of the present invention. FIG. 13 is a vertical cross-sectional view of an indexer unit of a substrate processing apparatus according to a third embodiment as viewed from a first IF unit side. FIG. 13 is a vertical cross-sectional view of an indexer unit of the substrate processing apparatus according to the third embodiment as viewed from the substrate processing unit side. It is a perspective view showing the composition of the 2nd-4th substrate conveyance robot. It is a top view showing the composition of the modification of a 1st-3rd example.

Explanation of reference numerals

1: substrate processing apparatus 2: exposure apparatus 3: first interface unit 4: inspection apparatus 5: second interface unit 12 to 15, TP: heat treatment unit 16: resist coating processing unit 17: development processing unit 71: delivery Transfer path 73: Transferring substrate transfer robot 74: Cassette 80: Substrate processing unit 81: Processing unit substrate transfer robot 91 to 96: First to sixth substrate transfer robot W: Substrate

Claims (2)

A transfer path extending in a predetermined direction, a cassette mounting table arranged on one side of the transfer path, and a transfer substrate transfer robot provided in the transfer path. Indexer part,
A developing unit for performing a developing process for obtaining a pattern printed on the substrate by the exposure process, a thermal processing unit for performing a thermal process, and a substrate transport robot for a processing unit configured to transport the substrate to these processing units; A substrate processing unit disposed on the other side of the transfer path for the unit,
An inspection device for performing a predetermined inspection on the pattern obtained by the development process,
The substrate processing apparatus, wherein the inspection device is disposed at an end of the delivery path of the indexer unit. 2. The substrate processing apparatus according to claim 1, wherein the inspection device transfers the substrate directly to the transfer substrate transfer robot.

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