JP2004231331A - Substrate transfer method and substrate transfer device - Google Patents

Abstract

Provided is a transfer device capable of transferring a substrate between a plurality of stages in a short time.
A transfer device for transferring a substrate has a plurality of stages provided with a plurality of holes on an upper surface, a gas supply device for sending gas to the holes. A holder 4 capable of holding the substrate 100 facing the upper surface 2a of the plurality of stages 2A to 2E and movable between the plurality of stages 2A to 2E along the arrangement direction of the plurality of stages 2A to 2E. And
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for transporting a substrate and an apparatus for transporting a substrate.
[0002]
[Prior art]
Conventionally, when a substrate such as a color filter is transferred between a plurality of stages, a transfer device including a robot hand capable of supporting the substrate and a pin capable of moving up and down between a position protruding above the stage and a position within the stage. Was used. In this transfer device, the substrate is lifted by pushing up a pin of a stage on which the substrate is placed, and a robot hand is inserted below the substrate to scoop up the substrate. Then, after placing the substrate on the pins protruding on the other stage, the robot hand is retracted from below the substrate, and the pins of the other stage are driven downward to place the substrate on the other stage. I was
[0003]
[Problems to be solved by the invention]
However, in the above-described transfer device, a plurality of types of operations of pins and robot hands are combined, so that it takes a long time to transfer the substrate.
[0004]
Therefore, an object of the present invention is to provide a transfer device capable of transferring a substrate between a plurality of stages in a short time.
[0005]
[Means for Solving the Problems]
Hereinafter, the present invention will be described. In addition, in order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are added in parentheses, but the present invention is not limited to the illustrated embodiment.
[0006]
In the method of transporting a substrate according to the present invention, a gas is ejected from an upper surface (2a) of each of a plurality of stages (2A to 2E) to float the substrate (100) on the stage, and the plurality of stages (2A to 2E) are lifted. The above-described problem is solved by moving the substrate between the plurality of stages by moving the substrate in the arrangement direction of the stages.
[0007]
According to the transfer method of the present invention, the substrate is levitated by the gas ejected from the stage, and the substrate is moved while being levitated. Therefore, the substrate is moved between the stages only by applying a horizontal force to the substrate. Can be relocated. Therefore, there is no need to combine a plurality of types of motions of the pin and the robot hand. Therefore, the transfer time of the substrate is reduced as compared with the related art. Further, when transferring between a large number of stages, it is not necessary to place a substrate on each stage as in the conventional case, so that it is also possible to continuously transfer between a large number of stages.
[0008]
The substrate transfer apparatus (1) of the present invention includes a plurality of stages (2A to 2E) provided with a large number of ejection holes (6c... 6c) on an upper surface, and a gas supply for sending gas to the large number of ejection holes. Means (3) and a holder (10) capable of holding the substrate (100) in opposition to the upper surfaces of the plurality of stages and moving between the plurality of stages along the arrangement direction of the plurality of stages ( 4) solves the above-described problem.
[0009]
According to the substrate transfer apparatus of the present invention, the above-described transfer method can be realized. Note that the holder may be any holder that can restrict the horizontal movement of the substrate. For example, it may be one that grips the substrate or one that sucks and holds the substrate. A claw portion may be provided on the substrate, and the claw portion may simply be hooked.
[0010]
The transfer device of the present invention may include a control unit (12) for controlling the pressure and temperature of the gas sent from the gas supply unit to the ejection holes. In this case, the temperature of the gas sent to the ejection hole is controlled, including the influence of the temperature change accompanying the gas pressure change. Therefore, it is possible to prevent thermal deformation of the substrate. The pressure may be adjusted by, for example, adjusting the pressure (original pressure) of the gas sent from the gas supply means, and it is desirable that the original pressure be 1 atm or less in gauge pressure.
[0011]
The transfer device of the present invention may include an exhaust means (8) for exhausting gas from the ejection holes. In this case, the gas can be exhausted from the ejection holes, and the substrate can be suction-held on the stage. Thereby, for example, predetermined processing such as exposure can be executed in each stage. Further, since the ejection hole and the hole for sucking the substrate are shared, the configuration of the stage is simplified. In addition, when adsorbing, from the viewpoint of preventing the substrate from being thermally deformed due to a temperature change accompanying a change in gas pressure, the vacuum created by the exhaust means should be set to a gauge pressure of -0.5 atm or more. Is desirable.
[0012]
In the transfer device according to the aspect of the invention, the plurality of stages may include a mounting stage (2C) on which the substrate is mounted, and the holder may move the plurality of substrates in a direction in which the plurality of stages are arranged. A plurality of substrates are provided so as to be able to be held along the stage, and the stage on the upstream side in the transport direction of the plurality of substrates (2B) is transferred to the stage (2D) on the downstream side in the transport direction of the plurality of substrates. A driving means for driving the plurality of holders may be provided so as to transfer the substrate of the above) to the mounting stage. In this case, when a predetermined process such as exposure is performed on the substrate on the mounting stage, the discharge of the processed substrate and the supply of the next substrate are performed simultaneously (in one operation). Be shortened.
[0013]
In the transfer device of the present invention, a stage holding means (6) provided on at least one stage (2C) of the plurality of stages and holding the substrate mounted on the stage; And a specifying means (12) for specifying a position of the substrate on the stage provided with the stage holding means, wherein the stage holding means holds the substrate while the substrate is held by the holding tool. Starting from the state described above, the specifying means performs the holding for the stage based on the position when the substrate is held by the holding tool at a stage upstream of the holding means for the stage in the transport direction of the substrate. The position of the substrate on the stage provided with the means may be specified. In this case, since the substrate starts to be held on the stage while being held by the holding device, the substrate is always held by the holding device or the stage until the substrate is transported from the upstream stage and held by the stage holding means. Is held by at least one of the holding means. Therefore, unlike a conventional transfer device that transfers a substrate between a robot hand and a pin, the position of the substrate does not become unstable when the substrate is transferred between stages. Further, since the substrate is floating, no resistance is generated in the substrate during transportation, and there is no possibility that the holder and the substrate are displaced. Therefore, the position of the substrate on the stage holding the substrate is accurately specified based on the position of the substrate on the upstream stage, and various processes such as exposure are properly performed on the stage. Furthermore, since there is no need to specify the position of the substrate on the stage that holds the substrate, the tact time is reduced. The specification of the position of the substrate on the stage holding the substrate may be the positioning of the substrate on the stage, or may be the recognition of the position of the substrate after the substrate is held on the stage. The substrate position on the upstream stage may be detected by a camera or the like, or may be specified by positioning the substrate at a specific position.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a side view showing the configuration of the transfer device 1 of the present invention, and FIG. 2 is a top view of the transfer device 1. The transfer device 1 is configured as a device that transfers the substrate 100. The substrate 100 is formed as a glass substrate such as a color filter or a TFT substrate, and has an area of, for example, about 4 m ² .
[0015]
The transfer device 1 includes a plurality of stages 2A to 2E arranged along the transfer direction of the substrate 100 (however, only 2B to 2D are shown in FIG. 1. When there is no need to distinguish the stages 2A to 2E, 2), a gas supply device 3 for ejecting gas onto the stages 2... 2, holders 4 and 4 for holding the substrate 100 facing the upper surface of the stage 2, and holders. 4, 4 which can drive the stages 2 along the arrangement direction of the stages 2.
[0016]
The stages 2... 2 are arranged in a U-shape at intervals smaller than the width of the substrate 100, for example, as shown in FIG. The stages 2... 2 are arranged such that their upper surfaces 2a have the same height. Note that an adjusting device for adjusting the height of the stages 2... 2 may be provided in the transfer device 1.
[0017]
Each stage 2 includes a plurality of ejection parts 6. Each ejection portion 6 includes a groove 6a formed in the stage 2 in a concave shape, and a lid 6b for closing an upper opening of the groove 6a. The groove 6 a is connected to the gas supply device 3 via the gas passage 7. The lid 6b is formed of, for example, a porous ceramic, and has a large number of holes 6c,. The hole 6c has a diameter of several mm, for example. The upper surface of the lid 6b forms the upper surface 2a of the stage 2. The stage 2B includes pins 20, 20, as shown in FIG. The pins 20, 20 are provided on the outer peripheral side of the stage 2B, respectively, and protrude above the stage.
[0018]
The gas supply device 3 includes, for example, an air compressor, and is capable of sending air into the gas passage 7 at a desired pressure (original pressure). The gas passage 7 extends from the gas supply device 3, and branches off into branch passages 7 a to 7 a on the way to each stage 2. Further, each branch passage 7a branches to branch passages 7b... 7b on the way and extends to each ejection portion 6. Further, the gas supply device 3 includes a filter (not shown) for removing foreign matter from the gas to be sent.
[0019]
As shown in FIG. 2, the holder 4 includes a main body 4a extending along one side of the substrate 100, and grips 4b, 4b attached near both ends of the main body 4a. Each grip part 4b is configured to be able to grip the substrate 100 vertically. The driving device 5 includes, for example, an electric motor (not shown) and an arm (not shown) driven by the motor, and the holder 4 attached to the arm is arranged in the direction in which the stages 2. Can be driven along.
[0020]
The transport device 1 further includes a vacuum pump 8 for creating a vacuum at a desired pressure, and a gas passage 9 connecting the vacuum pump 8 and the gas passage 7. The gas passage 9 is connected to a branch passage 7a corresponding to the stage 2C. A valve 10 for opening and closing the branch passage 7a is provided on the gas supply device 3 side of the branch passage 7a. The gas passage 9 is also provided with a valve 11 for opening and closing the gas passage 9. In addition, the transport device 1 includes a gas supply device 3, a driving device 5, a vacuum pump 8, and a control device 12 that controls the operations of the valves 10 and 11.
[0021]
The operation of the transport device 1 having the above configuration will be described. Although the transport device 1 includes two holders 4, the transport method is the same for any of the holders 4, and only one of them will be described. When the transfer device 1 is started, the control device 12 drives the gas supply device 3 to send air into the gas passage 7. At this time, the pressure of the air sent from the gas supply device 3 is controlled so as to be 1 atm or less as a gauge pressure. Next, the control device 12 transports the substrate 100 held by the holder 4 onto the stage 2A. The substrate 100 transported onto the stage 2A is levitated by air blown out from the holes 6c... 6c. Then, the control device 12 drives the driving device 5 to move the holder 4, and moves the substrate 100 from the stage 2A to the stage 2B as shown in FIG.
[0022]
In the stage 2B, the control device 12 controls the driving device 5 so as to press the substrate 100 against the pins 20, 20. Then, the substrate 100 is kept on standby until the transfer time to the stage 2C comes.
[0023]
When the transfer time to the stage 2C comes, the control device 12 controls the driving device 5 to transfer the substrate 100 from the stage 2B to the stage 2C. At this time, the control device 12 positions the substrate 100 on the stage 2C by moving the substrate 100 from a position where the substrate 100 is pressed against the pins 20 and 20 by a predetermined moving amount. Next, the control device 12 closes the valve 10 and opens the valve 11 to drive the vacuum pump 8. The vacuum pump 8 sucks air between the substrate 100 and the stage 2C through the holes 6c... 6c of the stage 2C, and sucks and holds the substrate 100 on the stage 2C. At this time, the vacuum pump 8 is controlled to generate a vacuum of -0.5 atm or more in gauge pressure. After holding the substrate 100 by suction, the holding of the substrate 100 by the holder 4 may be temporarily released. While the substrate 100 is placed on the stage 2C, predetermined processing such as exposure is performed on the substrate 100. In addition, while the predetermined processing is being performed on the substrate 100 on the stage 2C, the air continues to be blown out from the holes 6c of the other stages 2... The substrate 100 is left floating.
[0024]
Thereafter, the control device 12 opens the valve 10 and closes the valve 11, and causes the substrate 100 to float again. Then, the driving device 5 is controlled to transfer the substrate 100 from the stage 2C to the stage 2E. If there is another substrate 100 waiting on the stage 2B while processing such as exposure is being performed on the substrate 100 on the stage 2C, the control device 12 transmits the information to the substrate 100 on the stage 2C. Is moved to the stage 2D, and at the same time, the driving device 5 is controlled so that the substrate 100 on the stage 2B is moved to the stage 2C.
[0025]
As described above, in the transfer apparatus 1, the substrate 100 is levitated by the air ejected from the stages 2 and 2. The substrate 100 is moved while being levitated. Therefore, only a horizontal force is applied to the substrate 100. The substrate 100 can be transferred between the stages 2. Therefore, there is no need to combine a plurality of types of movements of the pin and the robot hand as in the related art. Therefore, the substrate 100 can be moved only by providing the holder 4 for gripping the end of the substrate 100 and moving the holder 4, and the transport time of the substrate 100 can be reduced as compared with the related art. Further, since it is not necessary to mount the substrate 100 on each stage 2 as in the related art, it is also possible to continuously transfer between the many stages 2.
[0026]
In the exposure apparatus 1, the position of the substrate 100 on the stage 2B is specified by pressing the substrate 100 against the pins 20, 20 and positioning the substrate. Therefore, there is no need to provide a means for detecting the position of the substrate 100 such as a camera.
[0027]
Further, by controlling the pressure of the air so that the pressure of the air sent from the gas supply device 3 becomes 1 atm or less in gauge pressure and the pressure of the vacuum created by the vacuum pump 8 becomes -0.5 atm or more in gauge pressure, Temperature changes due to changes in air pressure are suppressed, and thermal deformation of the substrate 100 is prevented.
[0028]
The pressure may be controlled, for example, as follows. The gas supply device 3 is provided with a compressor, a reserve tank for accumulating air compressed by the compressor, a pressure sensor for detecting the pressure in the reserve tank, and a pressure regulating valve for discharging the air in the reserve tank to the atmosphere. The control device 12 performs feedback control of the pressure regulating valve based on the pressure detected by the pressure sensor such that the pressure in the reserve tank becomes 1 atm or less in gauge pressure. In this way, the control of the air to be sent out may be realized. In addition, various methods can be used.For example, when the pressure in the reserve tank becomes equal to or higher than a predetermined pressure, the pressure control valve is pushed and opened by the pressure, so that the control device 12 and the pressure sensor are used. Alternatively, the pressure in the reserve tank may be maintained at a predetermined pressure to control the air to be sent. Further, a pressure sensor and a valve for opening and closing the gas passage 7 are provided in the gas passage 7, and the control device 12 controls the valve based on the pressure sensor to control the pressure in the gas passage 7, so that Control may be implemented. Similarly, when a vacuum is created by the vacuum pump 8, a pressure sensor or a pressure adjusting valve is provided, and the controller 12 controls the pressure adjusting valve based on the pressure detected by the pressure sensor. Control of the pressure may be realized.
[0029]
The present invention is not limited to the above embodiments, and may be implemented in various forms as long as the technical idea of the present invention is substantially the same.
[0030]
In each of the stages 2..., A predetermined process may be performed on the substrate 100 as in the stage 2C. Conversely, a specific process may not be performed on the substrate 100 in any of the stages 2..., And the transfer apparatus 1 may be used as a pure transfer means. The substrate 100 may be supplied to various devices such as an aligner or a coater, or the substrate 100 may be received from various devices, for example, at an end or an intermediate position in the arrangement direction of the stages 2... That is, it may be used as a substrate supply / discharge device for an aligner or a coater. The setting regarding the arrangement of the stages 2... 2 such as the number of the stages 2, the arrangement direction, the interval between the stages, and the like may be appropriately determined.
[0031]
The number of the ejection parts 6 is not limited to one provided on one stage 2, and one ejection part 6 having a size extending over the upper surface 2 a of the stage 2 may be provided. The lid 6b having the hole 6c need not be fitted to the stage 2, and the hole 6c may be provided directly on the upper surface of the stage 2.
[0032]
The gas sent by the gas supply device 3 is not limited to air. For example, an inert gas such as nitrogen may be sent to prevent the quality of the photosensitive material or the like applied to the substrate 100 from being deteriorated, or an ionized gas may be sent to peel off the substrate 100 from the stage 2. May be prevented.
[0033]
The pressure of the air sent from the gas supply device 3 may be appropriately set according to various purposes. The pressure of the air sent into each stage or each ejection section 6 may be set to be different from each other. The load on the gas supply device 3 may be reduced by restricting the supply of gas to a stage where the substrate is not arranged on the upper surface.
[0034]
A device for adjusting the temperature of the air may be provided in the gas supply device to control the temperature of the air to be sent. In this case, it is possible to more accurately prevent thermal deformation of the substrate.
[0035]
The holder 4 may be any as long as it can restrict the horizontal movement of the substrate 100. For example, one that adsorbs and holds one surface of the substrate 100 may be used, or a claw may be provided on the substrate 100 and the claw may be hooked. There may be play between the substrate 100 and the holder 4. The holder 4 is not limited to one that holds one side of the substrate 100, and may hold two or more sides. The number of the holders 4 may be set appropriately. For example, one holder 4 may be provided for one transfer device 1, or the same number of holders 4... 4 as the number of stages 2. When a plurality of holders 4 are provided, the moving speeds of the holders 4 may be the same speed or different speeds.
[0036]
The method of specifying the position of the substrate 100 on the stage 2B is not limited to the method of pressing the substrate 100 against the pins 20, and various methods can be used. For example, an imaging unit may be provided above the stage 2B to detect the position of the substrate 100. In this case, when patterning has already been performed on the substrate 100, the pattern can be detected, and the position of the substrate 100 can be adjusted based on the position of the pattern.
[0037]
【The invention's effect】
As described above, according to the transfer method of the present invention, the substrate is levitated by gas ejected from the stage, and the substrate is moved while being levitated, so that a horizontal force is applied to the substrate. The substrate can be transferred between stages simply by giving. Therefore, there is no need to combine a plurality of types of motions of the pin and the robot hand. Therefore, the transfer time of the substrate is reduced as compared with the related art. Further, when transferring between a large number of stages, it is not necessary to place a substrate on each stage as in the conventional case, so that it is also possible to continuously transfer between a large number of stages.
[Brief description of the drawings]
FIG. 1 is a side view showing a configuration of a transport device of the present invention.
FIG. 2 is a top view of the transfer device of FIG. 1;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Conveying device 2 Stage 3 Gas supply device 4 Holder 6c Hole 12 Control device 100 Substrate

Claims (6)

In a state in which a gas is ejected from the upper surface of each of the plurality of stages to float the substrate on the stage, the substrate is moved in the arrangement direction of the plurality of stages, and the substrate is transferred between the plurality of stages. A method for transporting a substrate, comprising: A plurality of stages provided with a large number of ejection holes on the upper surface,
Gas supply means for sending gas to the plurality of ejection holes,
A holder capable of holding a substrate facing the upper surfaces of the plurality of stages, and being movable between the plurality of stages along an arrangement direction of the plurality of stages,
A substrate transfer device, comprising: 3. The substrate transfer device according to claim 2, further comprising a control unit that controls a pressure and a temperature of the gas sent from the gas supply unit to the ejection hole. 4. The substrate transfer device according to claim 2, further comprising an exhaust unit that exhausts gas from the ejection holes. The plurality of stages include a mounting stage on which the substrate is mounted,
A plurality of the holders are provided so as to be able to hold the plurality of substrates along the arrangement direction of the plurality of stages,
While transferring the substrate on the mounting stage to a stage on the downstream side in the transport direction of the plurality of substrates, transferring the substrate of the stage on the upstream side in the transport direction of the plurality of substrates to the mounting stage. The transport device according to any one of claims 2 to 4, further comprising a driving unit that drives the plurality of holders. Stage holding means provided on at least one stage of the plurality of stages, holding the substrate mounted on the stage,
Specifying means for specifying the position of the substrate on the stage provided with the stage holding means,
With
The stage holding means starts holding the substrate in a state where the substrate is held by the holding tool,
A stage provided with the stage holding unit based on a position when the substrate is held by the holding tool at a stage on the upstream side of the substrate holding direction in the transport direction of the substrate with respect to the stage holding unit; The transfer device according to any one of claims 2 to 5, wherein the position of the substrate in (1) is specified.

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